Plural Fiber/device Connections Patents (Class 385/89)
  • Patent number: 11178473
    Abstract: A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: November 16, 2021
    Assignee: MARVELL ASIA PTE, LTD.
    Inventors: Radhakrishnan L. Nagarajan, Liang Ding, Mark Patterson, Roberto Coccioli, Steve Aboagye
  • Patent number: 11143831
    Abstract: A light-emitting row-type connection line assembly, which includes two connectors, a plurality of light-emitting lines, a plurality of connection lines and a plurality of light sources to make the plurality of light-emitting lines emit light. Each of the two connectors is provided with a plurality of ports for connecting the plurality of connection lines, and the plurality of ports are arranged spaced apart and in multiple rows. Each of the two connectors is provided with a light-emitting portion. The light-emitting portion is provided with a plurality of slots for connecting the plurality of light-emitting lines. The number of the plurality of slots is the same with that of ports in each row. A spacing between adjacent two slots is the same with that between adjacent two ports. The plurality of light-emitting lines are covered by a coating layer to form a light-emitting line row.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: October 12, 2021
    Assignee: DONGGUAN QINGHAI ELECTRONICS TECHNOLOGY CO., LTD
    Inventor: Donghai Mei
  • Patent number: 11139208
    Abstract: A semiconductor device includes a semiconductor wafer chip, a semiconductor device layer, and a reflectance reducing layer. The semiconductor wafer chip includes a device region and a peripheral region around the device region. The peripheral region includes a plurality of voids aligned along a side surface of the semiconductor wafer chip at a predetermined depth from a first surface of the semiconductor wafer chip. The semiconductor device element layer is on the first surface in the device region. The reflectance reducing layer is on the first surface of the semiconductor wafer chip in the peripheral region, that reduces a reflection of laser light incident from a second surface of the semiconductor wafer chip.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: October 5, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takanobu Ono, Tsutomu Fujita, Ippei Kume, Akira Tomono
  • Patent number: 11032020
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for clock synchronizing an optical system and multiple leaf systems. In some implementations, an apparatus includes a receiver comprising: a local oscillator laser providing a local oscillator signal, a detector circuit operable to receive a first optical signal and detect first data carried by the first optical signal based on the local oscillator signal, a reference clock circuit supplying a clock signal, a digital signal processor (DSP) operable to receive the first data and supply a control signal to the reference clock circuit based on the first data, the reference clock circuit being operable to adjust the clock signal based on the control signal; and a transmitter operable to output a second optical signal carrying second data, the second data having an associated rate that is based on the clock signal.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: June 8, 2021
    Assignee: Infiriera Corporation
    Inventors: Han H. Sun, Kuang-Tsan Wu, John D. McNicol
  • Patent number: 11018709
    Abstract: Accordingly, there are disclosed herein active cables and methods that enable direct connection between different generations of network interface ports or ports supporting different standards. One illustrative embodiment is an active 1:N breakout cable that includes a unary end connector connected by electrical conductors to each of multiple split end connectors. The unary end connector is adapted to fit into a network interface port of a primary host device to provide output PAM4 electrical signals that convey a multi-lane outbound data stream to the primary host device and to accept input PAM4 electrical signals that convey multi-lane inbound data stream from the primary host device.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: May 25, 2021
    Assignee: CREDO TECHNOLOGY GROUP LIMITED
    Inventors: Yattung Lam, Baohua Chen, Yifei Dai, William J. Brennan
  • Patent number: 10955616
    Abstract: An alignment coupler is provided to facilitate active alignment of the optical bench to the optical connector. The optical bench and the coupler together form an optical bench based connector.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: March 23, 2021
    Assignee: CUDOQUANTA FLORIDA, INC.
    Inventors: Yang Chen, Robert Ryan Vallance
  • Patent number: 10917190
    Abstract: Methods and systems for CWDM MUX/DEMUX designs for silicon photonics interposers are disclosed and may include an optical transceiver including a silicon photonics interposer, a polarization splitter, a lens array, and a prism with a coarse wavelength division multiplexing (CWDM) coating and a high reflectivity (HR) coating. The polarization splitter, lens array, and prism are coupled to the silicon photonics interposer. An input optical signal of a plurality of different wavelengths and polarizations may be received. Signals of different polarization may be spatially separated using the polarization splitter and signals of a first wavelength range may be reflected into the lens array using the CWDM coating while signals in a second wavelength range may be passed through. Signals of the second wavelength range may be reflected to the lens array using the HR coating, and optical signals may be coupled into the silicon photonics interposer using the lens array.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: February 9, 2021
    Assignee: Luxtera LLC
    Inventor: Subal Sahni
  • Patent number: 10897308
    Abstract: An electronic device and a method for transmitting electromagnetic radiation are disclosed. The electronic device includes (a) a component carrier with a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; (b) a component embedded in the component carrier and configured for providing an electric radio frequency signal; (c) an antenna structure formed in the component carrier and configured for emitting electromagnetic radiation in response to receiving the provided electric radio frequency signal; and (d) a radiation lens formed in the component carrier and configured for spatially manipulating the emitted electromagnetic radiation and directing the spatially manipulated emitted electromagnetic radiation to an environment of the component carrier. Further described is an electronic device and a method for receiving electromagnetic radiation.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: January 19, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Jonathan Silvano de Sousa, Gernot Grober
  • Patent number: 10877233
    Abstract: A cable, a manufacturing method, and a communications method, employing preset transmit-side equalization to provide enhanced performance and/or to reduce receive-side equalization requirements. One illustrative cable embodiment includes: a first data recovery and re-modulation (DRR) device that exchanges inbound and outbound multi-lane data streams with a first host interface port via a first end connector plug; a second DRR device that exchanges inbound and outbound multi-lane data streams with a second host interface port via a second end connector plug; and electrical conductors connecting the first and second DRR devices to convey electrical transit signals therebetween. The first DRR device converts between said electrical transit signals and said inbound and outbound multi-lane data streams for the first host interface port, and the second DRR device converts between said electrical transit signals and said inbound and outbound multi-lane data streams for the second host interface port.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: December 29, 2020
    Assignee: CREDO TECHNOLOGY GROUP LIMITED
    Inventors: Yifei Dai, Yattung Lam, Rajan Pai
  • Patent number: 10855369
    Abstract: A mobile device comprises a plurality of transmitters and receivers, each configured for optical wireless communication, wherein the plurality of transmitters and/or receivers are arranged on at least three surfaces of the mobile device such that each of the three surfaces has a respective at least one of the transmitters and/or each of the three surfaces has a respective at least one of the receivers.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: December 1, 2020
    Assignee: PURELIFI LIMITED
    Inventor: Steven Ritchie
  • Patent number: 10812193
    Abstract: An optical transceiver comprises an optical port, paired transmitter optical sub-assemblies (TOSAs), paired receiver optical sub-assemblies (ROSAs) and a printed circuit board (PCB) including an electrical circuit electrically connected to the paired TOSAs and the paired ROSAs. And the optical transceiver comprises a housing configured to house the optical port, the paired ROSAs, the paired TOSAs, and the PCB, so that the paired ROSAs are arranged between the optical port and the PCB in the first direction and the paired TOSAs are arranged between the paired ROSAs and the PCB in the first direction.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: October 20, 2020
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Matsui, Hiromi Kurashima
  • Patent number: 10807574
    Abstract: An electrical harness including at least one upstream connector arranged to be electrically connected to a computer, at least one downstream connector arranged to be connected to a complementary connector of an electromechanical actuator, and at least one electric wire electrically connecting the upstream connector and the downstream connector, the electric wire configured such that primary digital control signals produced or transferred by the computer travel over the electric wire via the upstream connector. The electrical harness may also include an electronic unit integrated in the electrical harness, the electronic unit configured to transform the primary digital control signals into analog control signals and to transmit the analog control signals to the electromechanical actuator via the downstream connector.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: October 20, 2020
    Assignee: SAFRAN LANDING SYSTEMS
    Inventor: Olivier Frey
  • Patent number: 10732366
    Abstract: An optical interconnect device may include a multi-fiber connector at a first end of the optical interconnect device. The optical interconnect device may include an edge coupled connector at a second end of the optical interconnect device. The optical interconnect device may include a plurality of optical fibers disposed inside the multi-fiber connector and the edge coupled connector to optically couple the multi-fiber connector to the edge coupled connector, wherein the multi-fiber connector and the edge coupled connector rigidly interconnect to structurally support the optical interconnect device.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: August 4, 2020
    Assignee: Lumentum Operations LLC
    Inventor: Georges Turcotte
  • Patent number: 10690866
    Abstract: An optical connector according to the present disclosure includes: optical transmission paths that have end faces aligned in a predetermined region, and transmit optical signals. The optical transmission paths correspond to transmission channels or reception channels. The optical transmission paths of the transmission channels and the reception channels are arranged to have point symmetry about a center of the predetermined region. This configuration allows for a connection even if a direction of an optical connector is changed.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: June 23, 2020
    Assignee: SONY CORPORATION
    Inventors: Yasuhisa Nakajima, Masanari Yamamoto
  • Patent number: 10677995
    Abstract: One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: June 9, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Terrel L Morris, Raymond G Beausoleil, Jason Pelc, Marco Fiorentino, Charles M Santori, Michael W Cumbie
  • Patent number: 10638088
    Abstract: A transfer control apparatus transfers video data obtained by image capturing in an image capturing and displaying apparatus to an image processing apparatus, and transfers video data generated by the image processing apparatus to the image capturing and displaying apparatus. In the transfer control apparatus, a first converter outputs an optical signal converted from an electrical signal representing the video data, an optical fiber transfers the optical signal, a second converter outputs an electrical signal converted from the optical signal transferred by the optical fiber, and a metal wire transfers a control signal indicating whether it is possible to communicate the video data by a communication unit of the image capturing and displaying apparatus. Operations of the first and second converters are controlled based on the control signal.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: April 28, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventor: Kaoru Ogino
  • Patent number: 10585258
    Abstract: A fiber optic cassette includes a housing with a base and a cover. The base defines an open front between first and second sidewalls, which transition into first and second curved rear wall portions. The first and second curved rear wall portions define an adapter mount therebetween forming at least one pocket. A signal entry location defined by at least one MPO adapter is positioned within the pocket and defines an exterior port and an interior port. A fiber optic cable connectorized by an MPO format connector is mated to the exterior port. An adapter block defining a plurality of second fiber optic adapters is mounted to the base via a first snap-fit interlock to close the open front, each second fiber optic adapter including an exterior port and an interior port.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: March 10, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Michael J. Wentworth, Douglas G. Elliot, Thomas Marcouiller, Scott C. Sievers
  • Patent number: 10555435
    Abstract: Provided is a patch panel, comprising: a circuit board; and an SFP, SFP+, or QSFP+ connector connected to a plurality of radio frequency coaxial (RF coaxial) connections via conductive traces of the circuit board, the RF coaxial connections configured to extend functionality of the SFP, SFP+, or QSFP+ socket of a computing device coupled to the patch panel from a rear end of the computing device to a front end of the computing device.
    Type: Grant
    Filed: October 30, 2016
    Date of Patent: February 4, 2020
    Assignee: Vapor IO Inc.
    Inventor: Steven White
  • Patent number: 10551582
    Abstract: A transceiver printed circuit board (PCB) includes an integrated circuit (IC) with at least two different functionality, a photodiode and a laser. The IC has a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and a fourth side opposite to the third side. The photodiode and the laser are both located in a first space beside the first side. The functionality of a transimpedance amplifier, a laser driver, and a clock and data recovery is integrated into the IC.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: February 4, 2020
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Andrew Engel, Paul Yu, Klaus Giessler, Omid Momtahan, David Meadowcroft, Michael John Brosnan
  • Patent number: 10481346
    Abstract: An optical connection member is used for optical connection of a plurality of optical fibers, the optical connection member including: an end surface facing another optical connection member at the time of the optical connection; and a holding portion holding the plurality of optical fibers, wherein the holding portion is provided with a plurality of holding holes which are opened in the end surface, extend from the end surface in a first direction intersecting with the end surface, and hold the plurality of optical fibers, the end surface includes a first area, a second area, and a third area which are sequentially arranged along a second direction intersecting with the first direction, openings of the plurality of holding holes are arranged in a row in the second direction in the first area and the third area.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: November 19, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Masaki Ohmura
  • Patent number: 10461066
    Abstract: An optical package containing optical sensor/detector pairs co-housed with a non-optical sensor and processes for fabricating the optical package are described herein. Traditional package structures require the use of clear mold compounds to protect the sensitive dies, but such compounds degrade with time and temperature. The optical package described herein uses a special glass top cover that is transparent in the entire electro-magnetic spectral region required by the contained dies.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: October 29, 2019
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Kumar Nagarajan, Seshasayee S. Ankireddi
  • Patent number: 10444450
    Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: October 15, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Takayoshi Matsumura, Naoaki Nakamura, Kenji Fukuzono, Norio Kainuma, Takashi Kubota, Takumi Masuyama, Yuki Hoshino, Hidehiko Kira
  • Patent number: 10409006
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: September 10, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jeffrey P. Gambino, Wolfgang Sauter, Christopher D. Muzzy, Charles L. Arvin, Robert Leidy
  • Patent number: 10388588
    Abstract: An electrical connector assembly includes an electrical connector mounted upon a printed circuit board, and a heat sink fastening seat mounted upon the printed circuit board and beside the connector. The heat sink fastening seat includes a pair of metallic mounting bars spaced from each other and located by two lateral sides of the connector in the transverse direction. A pair of alignment posts are formed on the corresponding mounting bars, respectively. A pair of metallic spring blades are respectively, in the vertical direction, aligned with and mounted upon the corresponding mounting bars for cooperation with the corresponding components of the heat sink for fastening.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: August 20, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Heng-Kang Wu, Fu-Jin Peng
  • Patent number: 10379302
    Abstract: The following steps are provided: encapsulating a series of connector components arranged in a column direction among multiple connector components on a support member that are arranged in each direction, respectively, in a row direction and in a column direction, in a state of substantial isolation from connector components adjacent to the series of connector components in the row direction using a first resin member; dicing the multiple connector components on the support member encapsulated using the first resin member into row units in the row direction; molding the multiple connector components on the support member, which have been encapsulated using the above-mentioned first resin member and diced, using a second resin member on a column-by-column basis; and dicing off the multiple molded connector components on the support member in the column direction one by one.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: August 13, 2019
    Assignee: HIROSE ELECTRIC CO., LTD.
    Inventor: Yoshiaki Sano
  • Patent number: 10371908
    Abstract: The following steps are provided: encapsulating a series of connector components arranged in a column direction among multiple connector components on a support member that are arranged in each direction, respectively, in a row direction and in a column direction, in a state of substantial isolation from connector components adjacent to the series of connector components in the row direction using a first resin member; dicing the multiple connector components on the support member encapsulated using the first resin member into row units in the row direction; molding the multiple connector components on the support member, which have been encapsulated using the above-mentioned first resin member and diced, using a second resin member on a column-by-column basis; and dicing off the multiple molded connector components on the support member in the column direction one by one.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: August 6, 2019
    Assignee: HIROSE ELECTRIC CO., LTD.
    Inventor: Yoshiaki Sano
  • Patent number: 10355179
    Abstract: An LED package structure includes a carrier mounted with a plurality of LED chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second glue-layer is stacked on the first glue-layer. The second glue-layer has a height higher than that of the first glue-layer. The second glue-layer has a volume greater than that of the first glue-layer. The present invention also provides a method of LED package structure to stably produce a dam structure with uniform shape and high ratio of height/width.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: July 16, 2019
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventor: Kuo-Ming Chiu
  • Patent number: 10347960
    Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: July 9, 2019
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hidekazu Kikuchi, Takayuki Mogi, Yoshiyuki Akiyama, Hirofumi Kawamura
  • Patent number: 10281661
    Abstract: This optical receptacle is provided with: an optical receptacle main body provided with a plurality of first optical surfaces and a plurality of second optical surfaces; and an optical filter. Light emitted from a photoelectric conversion element becomes incident on the first optical surfaces. The second optical surfaces allow light which becomes incident on the first optical surfaces, and passes through the inside, to exit towards an end surface of an optical transmission body. The optical filter is disposed so as to face some of the plurality of second optical surfaces, and attenuates the amount of light from the facing second optical surfaces. The optical filter is disposed with respect to at least one of the one or more second optical surfaces facing the optical filter, such that positional deviation between the first optical surfaces and the second optical surfaces is taken into consideration.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: May 7, 2019
    Assignee: ENPLAS CORPORATION
    Inventor: Ayano Kon
  • Patent number: 10254490
    Abstract: In an optical module including an optical axis adjustment mechanism, the reliability of fixation of a movable portion is enhanced while an adhesive is prevented from flowing out to an unintended portion. An optical module includes an element portion, a manipulation lever, a bank, a support spring, and a reservoir portion. The bank includes a lever-opposing portion having a step face facing a longitudinal side face of the manipulation lever. The support spring is connected at both ends to the element portion and the bank. The reservoir portion is surrounded in a bay shape, in a plan view, by the manipulation lever, the element portion, the support spring, and the bank and stores the adhesive fixing the lever to the substrate. The reservoir portion includes, in the vicinity of a handle of the manipulation lever, an outflow blocking portion blocking the outflow of the adhesive before curing.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: April 9, 2019
    Assignee: Oclaro Japan, Inc.
    Inventor: Takanori Suzuki
  • Patent number: 10247890
    Abstract: A method of adjusting the parallelism of a surface of a block of optical fibers with a surface of a semiconductor chip or wafer laid on an XY table, including the steps of: a) providing a sensor rigidly attached to the XY table and a handling arm supporting the block, said surface facing the XY table; b) for each of three non-aligned points of the surface of the block, displacing with respect to each other the XY table and the block in the X and/or Y directions to place the sensor opposite the point, and estimating, with the sensor, the distance along the Z direction between the point and the sensor; and c) modifying the orientation of the block by means of the handling arm to provide the desired parallelism.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: April 2, 2019
    Assignee: Commissariat à l'Energie Atomique et aux Energies Alternatives
    Inventor: Philippe Grosse
  • Patent number: 10230168
    Abstract: A co-frequency full-duplex antenna structure includes a receiving antenna, a transmitting antenna for transmitting a signal of a predetermined wavelength, and a signal reflection apparatus for reflecting the signal transmitted by the transmitting antenna, so as to realize that a path difference between a reflected signal formed when the signal transmitted by the transmitting antenna reaches the receiving antenna after being reflected and a direct signal formed when the signal transmitted by the transmitting antenna directly reaches the receiving antenna is an odd number of times as much as one half of the predetermined wavelength.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: March 12, 2019
    Assignee: Nanchang Coolpad Intelligent Technology Company Limited
    Inventor: Yiqing Cao
  • Patent number: 10219379
    Abstract: A stacked flexible printed circuit board assembly with a side connection section is provided, including a first flexible printed circuit board, a second flexible printed circuit board, and a curved connection section. The curved connection section is integrally connected to and between side edges of the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board is folded in a direction toward and thus stacked on the second flexible printed circuit board such that a plurality of first contact pads of the first flexible printed circuit board correspond respectively to a plurality of second contact pads of the second flexible printed circuit board. A height adjustment layer or an adhesive layer is provided between the first flexible printed circuit board and the second flexible printed circuit board to suit the need of thickness in plugging or soldering.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: February 26, 2019
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Chih-Heng Chuo, Kuo-Fu Su
  • Patent number: 10215928
    Abstract: A unitary fiber optic ferrule reflects light off an interior lens and through the fiber optic ferrule. Optical fibers can be easily secured in the unitary fiber optic ferrule. An adapter to secure the unitary fiber optic ferrule to a optical component assembly is also presented. The adapter provides a sealing function for the lenses and to provide routing for optical fibers from other assemblies of unitary fiber optic ferrules and adapters.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: February 26, 2019
    Assignee: US Conec, Ltd.
    Inventors: Joseph P. Howard, Darrell R. Childers, Russell J. Granger
  • Patent number: 10215624
    Abstract: An integrated optical tap monitor takes the form of a highly-reflective outer coating disposed over the active region of an associated photodetector. The coating is of a material that allows for a majority of the impinging optical signal to be re-directed into an output path, while passing a small portion of the signal into the photodetector's active region for monitoring purposes. The integrated configuration is small enough to be housed within a standard TO can, and additional optical components (filters, attenuators, etc.) may be co-located with the integrated tap monitor. By virtue of incorporating the monitoring function with a reflective surface, the integrated tap monitor may be substituted for a turning mirror at any place along a signal path and provide the benefit of power monitoring while also performing signal re-direction.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: February 26, 2019
    Assignee: II-VI Incorporated
    Inventor: Michael Cahill
  • Patent number: 10209453
    Abstract: A water-cooled package of an optical fiber head comprising a delivery optical fiber (DOF), a front optical end cap (OEC), a rear OEC, a glass ferrule, and a housing operates for delivering the laser light from DOF to free space. The rear OEC is fusion-spiced with a section of DOF with a cladding exposed whereas the section of DOF is enclosed in a bore of the glass ferrule. When the glass ferrule is connected and sealed between the front OEC and the rear OEC, cooling water in the water-cooled package is prevented from immersing the section of DOF to maintain reliability of DOF. It is, therefore, not needed to bond the section of DOF in a bore of the front OEC to be waterproof, minimizing varying stress-induced speckle patterns and ultimately maintaining beam quality of the laser light exiting from DOF to free space.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: February 19, 2019
    Assignee: LIGHTEL TECHNOLOGIES, INC.
    Inventors: Chungho Hsia, Pai-Sheng Shen
  • Patent number: 10205519
    Abstract: A method for simulating insertion of a pluggable active optical module includes: detecting whether a state of an optical adapter of a pluggable active optical module regarding connection of a fiber optic cable has changed; obtaining/generating physical layer management information regarding the fiber optic cable in response to detection of a change in state of the optical adapter; toggling a voltage state of a module present pin of a host device to which the pluggable active optical module is connected in response to obtaining/generating the physical layer management information, wherein the host device is configured to determine whether a pluggable active optical module is present based on the voltage state of the module present pin; receiving a read command from the host device in response to toggling the switch; and providing the physical layer management information to the host device in response to the read command.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: February 12, 2019
    Assignee: CommScope Technologies LLC
    Inventors: Joseph C. Coffey, Paul John Pepe, Joseph Polland
  • Patent number: 10197748
    Abstract: The application provides a connector device for connecting at least one optical fiber endpiece to an electric terminal. The connector device comprises a printed circuit board and an electric connector plug connectable to an electric terminal. A fiber end piece holder is mounted or mountable in an orientation enabling light propagation parallel to the printed circuit board, whereas an optoelectronic chip comprising optoelectronic active elements enables emission and/or detection of light substantially normal to the printed circuit board. A layered optical stack is provided on the printed circuit board, which layered optical stack comprises a reflection surface for changing the propagation direction between parallel and normal to the printed circuit board.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 5, 2019
    Assignee: Corning Optical Communications LLC
    Inventors: Wojciech Piotr Giziewicz, Christopher Paul Lewallen, James Phillip Luther, Jerald Lee Overcash
  • Patent number: 10168492
    Abstract: Optical coupling assemblies for silicon-based optical sources are disclosed. In one embodiment, an optical coupling assembly includes an optical coupling carrier frame and a jumper cable assembly. The optical coupling carrier frame includes a frame portion defining an integrated circuit opening operable to receive an integrated circuit assembly, and a connector portion extending from the frame portion. The connector portion includes a channel operable to receive an optical connector of an optical cable assembly. The jumper cable assembly is disposed within the connector portion. The jumper cable assembly includes a plurality of jumper optical fibers, a jumper ferrule coupled to a first end of the plurality of jumper optical fibers, and an optical turn assembly coupled to a second end of the plurality of jumper optical fibers. The optical turn assembly is operable to optically turn optical signals propagating within the optical turn assembly.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: January 1, 2019
    Assignee: Corning Optical Communications LLC
    Inventors: Douglas Llewellyn Butler, Ying Geng, Christopher Paul Lewallen, James Phillip Luther, Jerald Lee Overcash, James Scott Sutherland
  • Patent number: 10146009
    Abstract: Optical apparatus connecting a Silicon Photonics (SiP) device, which comprises multiple optical waveguides to an array of collimating lenses, configured to collimate light of the multiple optical waveguides into collimated beams. The optical apparatus includes a deflection element, distinct from the SiP device, including a light deflection surface which deflects light from the waveguides by an angle greater than 30 degrees, to the array of collimating lenses.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: December 4, 2018
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Avner Badihi, Yaara Kavdiel
  • Patent number: 10101543
    Abstract: Aspects of the present disclosure relates to an indexing terminal including a multi-fiber ruggedized de-mateable connection location, a first single-fiber ruggedized de-mateable connection location and a second single-fiber ruggedized de-mateable connection location. The multi-fiber ruggedized de-mateable connection location includes a plurality of fiber positions with one of the fiber positions optically coupled to the first single fiber ruggedized de-mateable connection location.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: October 16, 2018
    Assignee: CommScope Technologies LLC
    Inventors: Thomas Marcouiller, Oscar Fernando Bran de León, Thomas G. LeBlanc, Todd Loeffelholz
  • Patent number: 10033464
    Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: July 24, 2018
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Luca Maggi, Antonio Fincato, Salvatore Mario Rotolo, Matteo Alessio Traldi, Luigi Verga, Mark Andrew Shaw
  • Patent number: 10014949
    Abstract: Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations an optical communication device includes an optical data port configured to support an optical fiber in a fixed position. The optical communication device may further include a plurality of optical communication circuits, each oriented to communicate optical signals at a respective position of a cross section of the optical fiber connected to the optical data port and a control circuit, responsive to optical signals communicated on the optical fiber connected to the optical data port and configured to determine ones of the plurality of optical communication circuits that are misaligned with the optical fiber and disable the determined ones of the plurality of optical communication circuits.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: July 3, 2018
    Assignee: XILINX, INC.
    Inventors: Stephen M. Trimberger, Austin H. Lesea
  • Patent number: 10012806
    Abstract: The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. One method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: July 3, 2018
    Assignee: Corning Optical Communications LLC
    Inventors: Michael de Jong, Davide Domenico Fortusini, Andreas Matiss, Martin Spreemann, Eric Stephan ten Have
  • Patent number: 9891386
    Abstract: A hybrid plug connector including an insulative housing defining a cavity to receive an optical fiber assembly therein, and a plurality of passageways to receive a plurality of terminals therein. A printed circuit board is located behind the terminals and connected to the terminals. An electrical cable is mounted to a rear portion of the circuit board. The whole optical fiber assembly is received within the housing and is somewhat back and forth moveable along a front-to-back direction for buffering for compliantly coupling with another optical fiber assembly built within the complementary receptacle connector when the plug connector is inserted into the complementary receptacle connector. A lens module is formed on the optical fiber assembly for collimating the light beams from the optical fibers.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: February 13, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Yuan Zhang, An-Jen Yang, Paul Chen
  • Patent number: 9866329
    Abstract: A multi-channel optical transmitter or transceiver includes transmitter optical subassembly (TOSA) modules optically coupled to and directly aligned with mux input ports of an optical multiplexer without using optical fibers. The optical multiplexer may include an arrayed waveguide grating (AWG) or a reversed planar lightwave circuit (PLC) splitter and may be located in a multiplexer housing having at least one side wall with input apertures aligned with the mux input ports. The TOSA modules may include a base supporting at least a laser, laser driving circuitry, and a lens for focusing the light output from the laser. Z-rings may be used to facilitate alignment and to mount the TOSA bases to the side wall of the multiplexer housing, for example, by laser welding.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: January 9, 2018
    Assignee: Applied Orthoelectronics, Inc.
    Inventors: I-Lung Ho, YongXuan Liang, Stella Liang Chen
  • Patent number: 9817196
    Abstract: An optical sub-assembly cartridge for use in a multi-channel receiver optical sub-assembly (ROSA) is disclosed and includes pre-aligned demultiplexing optics. The optical sub-assembly cartridge may include a plurality of sidewalls which define a cartridge body and at least partially enclose a cavity therein. A sidewall of the cartridge body may include a sidewall opening configured to allow light to enter the cavity. A first optical filter disposed opposite the sidewall opening may receive light entering the cavity and be configured to pass unassociated channel wavelengths out of the cavity while reflecting associated channel wavelengths to a mirror disposed in the cavity. The mirror may then reflect the received channel wavelengths to a second optical filter within or external to the cavity. The second optical filter may emit a narrow spectrum of channel wavelengths to a photodiode package to convert the same to a proportional electrical signal.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 14, 2017
    Assignee: Applied Optoelectronics, Inc.
    Inventors: I-Lung Ho, Jun Zheng, Chong Wang
  • Patent number: 9818918
    Abstract: An LED package structure includes a carrier mounted with a plurality of LED chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second glue-layer is stacked on the first glue-layer. The second glue-layer has a height higher than that of the first glue-layer. The second glue-layer has a volume greater than that of the first glue-layer. The present invention also provides a method of LED package structure to stably produce a dam structure with uniform shape and high ratio of height/width.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: November 14, 2017
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventor: Kuo-Ming Chiu
  • Patent number: 9766416
    Abstract: There is provided an optical module, which includes a substrate; one or more optical devices disposed on the substrate; an integrated circuit (IC) device disposed on the substrate for driving the one or more optical devices; one or more optical fibers in optical communications with the one or more optical devices, respectively; an optical bench that attaches to the substrate and concentrates a direction of the light transmitted between the one or more optical devices and the one or more optical fibers; and a cover that attaches to the optical bench with the one or more optical fibers fixed therebetween. The optical bench changes a direction of the concentrated light.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: September 19, 2017
    Assignee: Yottahn, Inc.
    Inventor: Hyogyeom Kim
  • Patent number: 9753881
    Abstract: A computing platform includes an array of interconnected field programmable gate arrays (FPGAs), memory, and external input/output interfaces. The platform is in the form of a blade conforming to the Advanced Telecommunications Computing Architecture (ATCA) standard. The platform is especially useful for telecommunications and networking applications.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: September 5, 2017
    Assignee: NATIONAL INSTRUMENTS CORPORATION
    Inventors: Chen Chang, Kevin B. Camera, John C. Wawrzynek, Robert W. Brodersen