Abstract: A cable fixation structure for fixing at least a portion of a fiber optic cable to a telecommunications fixture against strain relief includes a base portion configured to be mounted to the telecommunications fixture and a removable cable holder portion that is slidably inserted into the base portion, wherein the cable holder portion is configured for fixing the at least a portion of the fiber optic cable.

Abstract: An optical ferrule includes an optical coupling member with a light redirecting element that redirects input light from a waveguide toward an output window. The optical coupling member has a mating surface configured to slidably mate with a mating optical coupling member along a longitudinal axis of the optical ferrule. The optical ferrule also includes at least one stacking member along a longitudinal edge of the optical coupling member. The stacking member has a distal end extending beyond one of the mating surface and a top surface opposed to the mating surface. The stacking member also has a contact surface opposed to the distal end. The contact surface is configured to rotatably interface with a corresponding distal end of a of an adjacently stacked optical ferrule.

Abstract: A method for manufacturing a photoelectric composite circuit board, includes providing a copper-clad carrier and an intermediate circuit, the copper-clad carrier includes a substrate layer and a bottom copper layer, a first groove is defined on the intermediate circuit. Forming an optical fiber in the first groove. Forming a first accommodating groove and a second accommodating groove at each end the optical fiber. Accommodating a first coupling element in the first accommodating groove. Removing the substrate layer. Removing the bottom copper layer corresponding to the optical fiber, the intermediate circuit on one side of the optical fiber and the bottom copper layer forming a first circuit substrate, the intermediate circuit on another side of the optical fiber and the bottom copper layer forming a second circuit substrate. Electrically connecting a chip to the first circuit substrate, and electrically connecting an electronic component to the second circuit substrate.

Abstract: An electrical communication system includes a plurality of cable connectors that are configured to mate with the same electrical connector or electrical connectors having substantially identical mating interfaces. The cable connectors can be configured as an electrical cable connector, an optical cable connector, and a hybrid cable connector that includes both optical and electrical communication.

Abstract: An electronic device according to an embodiment includes: a housing including a frame, a first temple connected to one side of the frame, and a second temple connected to the other side of the frame, a first printed circuit board (PCB) positioned in the first temple, and a flexible printed circuit board electrically connected to the first PCB, and the flexible printed circuit board includes a first rigid portion connected to the first PCB, a first flexible portion extending from the first rigid portion in a first direction, and a second flexible portion extending from the first rigid portion in a second direction different from the first direction, the second flexible portion being bent in a first bending area to overlap at least a portion of the first flexible portion.

Abstract: A printed circuit board (PCB) includes a substrate including a first insulating layer and first wiring patterns disposed on the first insulating layer, an optical sensing chip including a vertical cavity surface emitting laser (VCSEL) and a photodiode, disposed on the first insulating layer to be in contact with at least one of the first wiring patterns, a transimpedance amplifier (TIA) chip disposed to be spaced apart from the optical sensing chip on the first insulating layer and disposed to be in contact with at least one first wiring pattern, different from the first wiring pattern connected to the optical sensing chip, among the first wiring patterns, and a dielectric layer stacked on the substrate and having a hole exposing the VCSEL and the photodiode of the optical sensing chip. The optical sensing chip and the transimpedance amplifier chip are connected through a wiring pattern disposed on the dielectric layer.

Abstract: An optical transceiver assembly includes an optical transmitter, an optical receiver, and a first multi-fiber ferrule exclusively connected to the optical transmitter via a first set of at least two optical fibers operable to transport respective optical signals away from the optical transmitter. The assembly includes a second multi-fiber ferrule exclusively connected to the optical receiver via a second set of at least two optical fibers operable to transport respective optical signals to the optical transmitter. The first set of at least two optical fibers is separate from the second set of at least two optical fibers.

Abstract: An optical module includes a circuit board, a light emitting device and a data processor. The data processor is disposed on the circuit board. The data processor includes a reverse gearbox and a gearbox. The reverse gearbox is connected to the light emitting device, and is configured to receive a high-speed electrical signal from the circuit board, and decode the high-speed electrical signal into a plurality of channels of low-speed electrical signals. The plurality of channels of low-speed electrical signals drive the light emitting device to emit the plurality of channels of optical signals. The gearbox is connected to the light receiving device, and is configured to receive a plurality of channels of low-speed electrical signals output by the light receiving device, encode the plurality of channels of low-speed electrical signals into a high-speed electrical signal, and transmit the high-speed electrical signal to the circuit board.

Abstract: A surgical lighting system includes a light head housing, a handle, a camera, and an optical fiber cable. The light head housing includes a plurality of light emitting elements therein that are arranged to emit light downward to a region of interest. The handle is mounted to the light head housing and protrudes downward from the light head housing, the handle including a handle housing having a sufficient size to be gripped by the human hand. A camera is mounted within the handle housing, the camera having a field of view that encompasses at least a portion of the region of interest. An optical fiber cable extends from a location within the handle housing and to the light head housing, the optical fiber cable being configured to transmit optical video signals associated with video data captured by the camera to the light head housing.

Abstract: A configurable board mount light pipe array is provided which includes four rails and one or more adapters. Each rail extends longitudinally and includes first and second ends which are connectable to the first and second ends of other rails to form a rectangular frame. The adapters are affixed within the middle of the rectangular frame. Each adapter includes a vertically extending center channel which extends entirely through the adapter. The top of each adapter's center channel includes a light pipe receptacle, and the bottom of the center channel includes an LED receptacle. The configurable board mount light pipe array further includes one or more light pipes which include first and second ends. The light pipes' first ends are positioned within a press-fit engagement within an adapter's light pipe receptacle and the light pipes' second ends are constructed to project through the holes of an electronic device panel.

Abstract: A method of manufacturing a laser light source includes: providing a submount, the submount having a principal surface on which a laser diode chip is to be fixed, and comprising a pair of lens supports each including an end surface, the end surfaces located at opposite sides with respect to an emission end surface of the laser diode chip; providing a lens having a bonding surface; performing adjustment such that end surfaces of the pair of lens supports of the submount are parallel to a reference plane; performing adjustment such that the bonding surface of the lens is parallel to the reference plane; and while maintaining the end surfaces of the pair of lens supports and the bonding surface of the lens so as to be parallel to the reference plane, bonding the end surfaces with the bonding surface of the lens using an inorganic bonding member.

Abstract: An opto-electronic probe system is disclosed. The probe system has a probe element including at least one microelectrode, with the probe element being implantable in tissue of an anatomy to receive electrical signals generated within the anatomy. A subsystem is included for at least one of generating excitation signals to be used in stimulating the anatomy, or for receiving electrical signals received from the anatomy. An interface portion is included which is in communication with the subsystem for communicating at least one of electrical signals or optical signals indicative of the electrical signals received by the microelectrode.

Abstract: A multi-module fiber laser capable of monitoring abnormalities of optical modules in real time. In the multi-module fiber laser, the CAN bus is employed to directly obtain whether each of the slave control modules or the master control module is in normal working condition, so that the CAN bus is at the status level corresponding to whether all modules are in normal working state, namely, the CAN bus that is configured to transmit the light control signal issued by the master control module. The status level of the slave control module or the combiner module is also transmitted via the CAN bus, so that all the slave control modules can quickly put themselves in the corresponding working state according to the status level of the CAN bus.

Abstract: A network interface device which may include: an elongated frame having a first end, a second end, and, between the first and second ends, a top wall, a bottom wall opposing the top wall, a first lateral wall, and a second lateral wall opposing the first lateral wall; wherein the top wall includes: a first longitudinal portion that is adjacent to the first end of the frame; and a second longitudinal portion that is adjacent to the second end of the frame and whose outer surface slopes towards its inner surface in a direction of the second end of the frame.

Abstract: An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector.

Abstract: A fiber optic adapter assembly is provided with a floating adapter module. The adapter assembly includes a housing, an adapter module, and a single biasing member disposed in the housing and concentrically aligned with the adapter module. The single biasing member can bias the adapter module in a direction toward an end of the housing and be compressible in the opposite direction toward the other end of the housing.

Abstract: Provided is an optical fiber adapter. The optical fiber adapter includes an adapter body, a shielding gate, a sleeve, and an elastic shield. One side wall of the adapter body is provided with a long groove. The shielding gate is disposed at a lower port of the adapter body. The shielding gate includes one end connected to the lower port of the adapter body and one end facing away from the lower port of the adapter body. The sleeve is sleeved on a periphery of a lower end portion of the adapter body. The elastic shield is disposed in the long groove. The elastic shield is fitted with one end portion of the shielding gate facing toward the elastic shield. The shielding gate, the sleeve, and the elastic shield form an anti-light-leakage cavity on an optical fiber access side of the optical fiber adapter.

Abstract: An optical connection structure includes a first focus lens arranged between a first light incidence/emission end and an optical element, and a second focus lens arranged between a second light incidence/emission end and the optical element. The first focus lens and the second focus lens are arranged on an optical axis connecting the first light incidence/emission end and the second light incidence/emission end.

Abstract: An optoelectronic module and optoelectronic connector assemblies can be used for releasable connection of a laser source to the module from a location exterior to the module. The construction of the optoelectronic connector assemblies is such that both in connection and disconnection, the electrical contacts are broken before the optical contacts so that the laser may power down before the optical connection is broken. The optoelectronic connection assemblies have blind mating features. Some versions are free of any latching or mechanical interconnection of the optoelectronic connector assemblies to each other. A spring has a construction which permits it to be received onto a cable by lateral movement of the spring.

Abstract: An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.

Abstract: Provided is a single-fiber bi-directional optical transceiver sub-assembly capable of improving the wavelength separation characteristics of a multiplexing/demultiplexing filter while also attaining a compact size. A single-fiber bi-directional optical transceiver sub-assembly is provided with a housing, an optical receptacle, a multiplexing/demultiplexing filter, a receiving-side photoelectric converter, a transmitting-side photoelectric converter, an isolator, and a collimating lens. The multiplexing/demultiplexing filter is disposed on the optical path between the optical receptacle and the transmitting-side photoelectric converter and on the optical path between the optical receptacle and the receiving-side photoelectric converter. The isolator passes optical signals outputted from the transmitting-side photoelectric converter and blocks optical signals proceeding to the transmitting-side photoelectric converter.

Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.

Abstract: A light emitting device includes multiple light source parts each including at least one first light source part and at least one second light source part, each including a light emitting element and a light-guiding member to guide light of the light emitting element. Each light-guiding member has a taper shape narrowing toward the light emitting element. Light from each light source part satisfies condition of ????tan?1×2 tan ?. (? is an angle of a straight line connecting a position on the light-irradiation surface having an illuminance of at least one-half of that at center position and the center of the light emitting surface of the first light source part, and ? is an angle of a straight line connecting a center of a light-irradiation region on a light-irradiation surface and a center of the light emitting surface of the second light source part.

Abstract: A package structure includes a circuit board, a package substrate, a fine metal L/S RDL-substrate, an electronic assembly, a photonic assembly, a heat dissipation assembly, and an optical fiber assembly. The package substrate is disposed on and electrically connected to the circuit board. The fine metal L/S RDL-substrate is disposed on and electrically connected to the package substrate. The electronic assembly includes an application specific integrated circuit (ASIC) assembly, an electronic integrated circuit (EIC) assembly, and a photonic integrated circuit (PIC) assembly which are respectively disposed on the fine metal L/S RDL-substrate and electrically connected to the package substrate by the fine metal L/S RDL-substrate. The heat dissipation assembly is disposed on the electronic assembly. The optical fiber assembly is disposed on the package substrate and electrically connected to the package substrate and the PIC assembly. A packaging method of the VCSEL array chip is presented.

Abstract: An optical fiber connector ferrule assembly has a ferrule holder and a ferrule partially within the ferrule holder. The ferrule holder has a keying feature for setting the angular orientation of the ferrule assembly within a connector housing. The ferrule includes at least one stand-off feature on the end face of the ferrule for maintaining a controlled air gap spacing when mated to a second compatible ferrule assembly.

Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.

Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.

Abstract: A pluggable optical module includes: a casing with an internal space; a latching pocket disposed on a side wall of the casing; and a latch plane on a surface of the latching pocket. The surface is a beveled surface, and the beveled surface delimiting the latch plane has an angle of between 3 to 15 degrees.

Abstract: A coupling alignment device and method for a laser chip and a silicon-based optoelectronic chip are disclosed. The device comprises a transfer mold which includes a substrate, first protrusions, and second protrusions. The first protrusions are provided with through holes and are used for being clamped into first recesses in the laser chip; and the second protrusions are used for being clamped into second recesses in the silicon-based optoelectronic chip. The coupling alignment is achieved by etching the first recesses in the laser chip, etching the second recesses in the silicon-based optoelectronic chip, etching the first protrusions, the second protrusions, and the through holes in the transfer mold. A flip-chip suction nozzle is connected with the transfer mold, which is in alignment with the laser chip, and picks up the laser chip by means of the through holes.

Abstract: A package includes a photonic integrated circuit die, an electric integrated circuit die, and an encapsulant. The photonic integrated circuit die includes a semiconductor substrate and a waveguide. The semiconductor substrate has a notch. The waveguide is disposed over the semiconductor substrate. A portion of the waveguide is located within a span of the notch of the semiconductor substrate. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The encapsulant laterally encapsulates the electric integrated circuit die.

Abstract: A hybrid integrated optoelectronic chip including an optoelectronic chip and a silicon photonic chip, a material of the optoelectronic chip being different from a material of the silicon photonic chip. The optoelectronic chip includes at least one first waveguide. The silicon photonic chip includes at least one second waveguide and an installation recess. The optoelectronic chip is installed in the installation recess, and the first waveguide is optically connected to the second waveguide.

Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The connection port passageway defines a keying portion. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.

Abstract: Systems and methods of using a multiport assembly and associated components are disclosed. The multiport assembly can include a multiport device that communicatively couples multiple sets or pairs of connectors, such as optical connectors or electrical connectors, together. The multiport assembly can also include an auxiliary port device that couples to the multiport device to expand the capacity of the multiport assembly. Both the multiport and auxiliary port devices can be selectively configured to receive specific types of connectors by selectively coupling to different types of adapters, where the types of adapters correspond to the types of connectors. When coupled to the multiport or auxiliary port devices, the adapters facilitate the formation of the communication between its corresponding set of connectors.

Abstract: A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.

Abstract: A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

Abstract: A connection element for adhering to a component surface of a first component, such that a second component can be secured to the first component by the connection element, including a base element having an adhesive side with an adhesive surface, and a mounting structure. The base element consists of a thermoplastic with a temperature of continued use of at least 130° C., which can be poorly irradiated or cannot be irradiated with light, and has at least one irradiation region. The base element can be irradiated with light in this region in such a way that light energy penetrates the base element. The irradiation region, in cross-section, has a smaller thickness and a transmittance at least 20% with a light wavelength between 320 and 500 nm. Alternatively, the irradiation region is formed by a through-opening.

Abstract: Systems and methods of using a multiport assembly and associated components are disclosed. The multiport assembly can include a multiport device that communicatively couples multiple sets or pairs of connectors, such as optical connectors or electrical connectors, together. The multiport assembly can also include an auxiliary port device that couples to the multiport device to expand the capacity of the multiport assembly. Both the multiport and auxiliary port devices can be selectively configured to receive specific types of connectors by selectively coupling to different types of adapters, where the types of adapters correspond to the types of connectors. When coupled to the multiport or auxiliary port devices, the adapters facilitate the formation of the communication between its corresponding set of connectors.

Abstract: An optical pick and place machine that includes a self-calibrating optical controller for error feedback based optical placement of optical components using active alignment is described. The optical controller can include a loopback mode to generate a baseline value of light generated by a light source and measured by a photodetector within the optical controller. The optical controller can further include an active alignment mode in which the light is coupled from the pick and place machine to the optical device on which the component is placed. The optical coupling of the placed component can be evaluated against the baseline value to ensure that the optical coupling is within specification (e.g., within a prespecified range).

Abstract: A module for a digital display panel includes a circuit board, a first face of which presents a network of light emitting diodes. The module also includes a chassis fixed on a second face of the circuit board, and a water permeable connector mounted on the circuit board. The chassis includes a base around the water permeable connector, a top part of the base having at least one groove, wherein a seal is inserted. Further, the module includes a power supply unit fitted with a continuous voltage connector surrounded by a ferrite and fitted in the water permeable connector. The power supply unit is attached to the chassis so that a lower plate of the power supply unit co-operates with the seal of the base to ensure a seal around the water permeable connector and the DC voltage connector of the power supply unit.

Abstract: A ferrule holder assembly can support groupings of a transceiver ferrules in an optical connector interface of an optical transceiver. A first holder body holds a first grouping of transceiver ferrules and has a holder-to-holder interface. A second, typically identical, holder body holds a second grouping of transceiver ferrules. The holder-to-holder interface of the first holder body engages the holder-to-holder interface of the second holder body to operatively align the first holder body with the second holder body to position the first grouping of transceiver ferrules and the second grouping of transceiver ferrules in the optical connector interface for making optical connections to one or more optical connectors plugged into the optical connector interface. The ferrule holder assembly can be used in combination with pre-terminated fiber arrays to couple an optical interface to a circuit board in a transceiver.

Abstract: An optical communications system includes a laser transmitter to generate an optical signal and a first optical fiber network coupled to transmit the optical signal from the laser transmitter system. A first latchable, asymmetric coupler is disposed along the first optical fiber network to receive the optical signal, and has a first tap output that receives a selected and alterable first fraction of the optical signal. A second latchable, asymmetric coupler is disposed along the first optical fiber network to receive the optical signal from the first latchable asymmetric coupler and has a second tap output that receives a selected and alterable second fraction of the optical signal incident at the second latchable. In certain embodiments the first and second couplers are capable of operating at any of at least three tapping fractions.

Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.

Abstract: One of two connector receiving parts of a processor for endoscope has a shutter mechanism configured to open a shutter by an external force, the shutter having a gap through which a connector-side connection end section passes, and being configured to partition a recessed space of the connector receiving part with respect to an outside. In addition, the processor for endoscope includes a lock mechanism configured to make the shutter into the locked state during a period when another connection end section on the connector side and a processor-side connection end section are connected, and release the locked state of the shutter when the connection between the other connection end section on the connector side and the processor-side connection end section is released.

Abstract: The present utility model discloses a MFi-certified digital data cable comprising a wire rod which is equipped with an input connector at one end and an output connector at the other end; the output connector comprises a MFi-certified connector, a circuit board, a Nixie tube and a rubber base; a connecting piece is fixed at the position adjoining the tail-end of the MFi-certified connector; a plurality of conductive terminals are fixed inside the connecting piece, two ends of each conductive terminal pass through two ends of the connecting piece and then are connected with the MFi-certified connector and the circuit board respectively so the circuit board is assembled and fixed via the connecting piece.

Abstract: A fiber optic connector arrangement includes a printed circuit board coupled to a connector housing. The printed circuit board includes a memory storage device that is configured to store physical layer information pertaining to the fiber optic connector arrangement. The printed circuit board also defines contacts that are electrically coupled to the memory storage device to enable the physical layer information to be read from the memory storage device by a media reading interface. A connector assembly includes at least one adapter assembly; a printed circuit board; and a media reading interface. The connector assembly also may include a tactile pressure sensor. The adapter assembly defines at least a first port and a second port that are configured to connect optical fibers of two connector arrangements. One or more connector assemblies can be mounted to a fiber panel system.

Abstract: A battery includes: a core cell including a first surface and a second surface which are opposite each other and on which first and second electrodes are respectively located, and a lateral surface connecting the first and second surfaces; an insulating sheet arranged on the first surface of the core cell and in which a conduction hole facing the first electrode is defined; and an electrode plate arranged on the insulating sheet and electrically connected to the first electrode through the conduction hole.

Abstract: An opto-electric hybrid board connector includes an opto-electric hybrid board extending along a transmission direction of light in an optical waveguide, and a connector to which an attached region of the opto-electric hybrid board is attached. The attached region has a board front end surface for inputting and outputting light to and from the optical waveguide. The connector has a connector front end surface disposed to be flush with the board front end surface. The surface roughness SRa1 of the board front end surface is 0.2 ?m or more and 3 ?m or less. A difference D between the surface roughness SRa1 of the board front end surface and the surface roughness SRa2 of the connector front end surface is 1 ?m or less.

Abstract: Aspects of the embodiments are directed to an opto-electronic device and methods of using the same. The opto-electronic device can include a processing device and a photonic device. The photonic device can include an optical demultiplexer; a collimating lens optically coupled to the optical demultiplexer and positioned to receive light from the optical demultiplexer, the collimating lens to collimate light received from the optical demultiplexer; a photodetector comprising a photosensitive element, the photosensitive element to convert received light into an electrical signal; and a focusing lens optically coupled to the photodetector, the focusing lens to receive light and focus the light towards the photosensitive element.

Abstract: A flip chip package includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board. The solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit is on the inner bonding area. The T-shaped circuit unit has a main part, a connection part, and a branch part. The connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to inhibit solder shorts caused by solder overflow on the branch part.

Abstract: An optical module with optical fibers is intended to be able to be easily sucked and conveyed, and mounted on another substrate. An optical module of the present disclosure includes an optical device to which optical fibers are optically connected; and a carrier including a substrate and an adhesive layer formed at a surface of the substrate, and a part of the optical device and a part of the optical fibers are adhesively fixed on a surface of the adhesive layer. The optical device may include ball grid array shaped electrodes. The carrier may be provided with a plurality of holes.