Optical Fiber To A Nonfiber Optical Device Connector Patents (Class 385/88)
  • Patent number: 11909448
    Abstract: Provided is a single-fiber bi-directional optical transceiver sub-assembly capable of improving the wavelength separation characteristics of a multiplexing/demultiplexing filter while also attaining a compact size. A single-fiber bi-directional optical transceiver sub-assembly is provided with a housing, an optical receptacle, a multiplexing/demultiplexing filter, a receiving-side photoelectric converter, a transmitting-side photoelectric converter, an isolator, and a collimating lens. The multiplexing/demultiplexing filter is disposed on the optical path between the optical receptacle and the transmitting-side photoelectric converter and on the optical path between the optical receptacle and the receiving-side photoelectric converter. The isolator passes optical signals outputted from the transmitting-side photoelectric converter and blocks optical signals proceeding to the transmitting-side photoelectric converter.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: February 20, 2024
    Assignee: NEC CORPORATION
    Inventor: Isao Tomita
  • Patent number: 11886017
    Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: January 30, 2024
    Assignee: Corning Research & Development Corporation
    Inventors: Thierry Luc Alain Dannoux, Robert Bruce Elkins, II, Joel Christopher Rosson, Dayne Wilcox, Michael Wimmer, Shane C. Woody, Zhiye Zhang
  • Patent number: 11880016
    Abstract: A light emitting device includes multiple light source parts each including at least one first light source part and at least one second light source part, each including a light emitting element and a light-guiding member to guide light of the light emitting element. Each light-guiding member has a taper shape narrowing toward the light emitting element. Light from each light source part satisfies condition of ????tan?1×2 tan ?. (? is an angle of a straight line connecting a position on the light-irradiation surface having an illuminance of at least one-half of that at center position and the center of the light emitting surface of the first light source part, and ? is an angle of a straight line connecting a center of a light-irradiation region on a light-irradiation surface and a center of the light emitting surface of the second light source part.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: January 23, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Yoshinori Shinohara, Kosuke Gomi
  • Patent number: 11860428
    Abstract: A package structure includes a circuit board, a package substrate, a fine metal L/S RDL-substrate, an electronic assembly, a photonic assembly, a heat dissipation assembly, and an optical fiber assembly. The package substrate is disposed on and electrically connected to the circuit board. The fine metal L/S RDL-substrate is disposed on and electrically connected to the package substrate. The electronic assembly includes an application specific integrated circuit (ASIC) assembly, an electronic integrated circuit (EIC) assembly, and a photonic integrated circuit (PIC) assembly which are respectively disposed on the fine metal L/S RDL-substrate and electrically connected to the package substrate by the fine metal L/S RDL-substrate. The heat dissipation assembly is disposed on the electronic assembly. The optical fiber assembly is disposed on the package substrate and electrically connected to the package substrate and the PIC assembly. A packaging method of the VCSEL array chip is presented.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: January 2, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: John Hon-Shing Lau, Tzyy-Jang Tseng
  • Patent number: 11852879
    Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: December 26, 2023
    Assignee: Prime World International Holdings Ltd.
    Inventors: Ling-An Kung, Ming-You Lai, Che-Shou Yeh
  • Patent number: 11852871
    Abstract: An optical fiber connector ferrule assembly has a ferrule holder and a ferrule partially within the ferrule holder. The ferrule holder has a keying feature for setting the angular orientation of the ferrule assembly within a connector housing. The ferrule includes at least one stand-off feature on the end face of the ferrule for maintaining a controlled air gap spacing when mated to a second compatible ferrule assembly.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: December 26, 2023
    Assignee: Panduit Corp.
    Inventors: Richard J. Pimpinella, Jose M. Castro
  • Patent number: 11822138
    Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: November 21, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Robert Kalman, Bardia Pezeshki, Cameron Danesh, Alexander Tselikov
  • Patent number: 11809002
    Abstract: A pluggable optical module includes: a casing with an internal space; a latching pocket disposed on a side wall of the casing; and a latch plane on a surface of the latching pocket. The surface is a beveled surface, and the beveled surface delimiting the latch plane has an angle of between 3 to 15 degrees.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: November 7, 2023
    Assignee: Arista Networks, Inc.
    Inventor: Youngbae Park
  • Patent number: 11803019
    Abstract: A coupling alignment device and method for a laser chip and a silicon-based optoelectronic chip are disclosed. The device comprises a transfer mold which includes a substrate, first protrusions, and second protrusions. The first protrusions are provided with through holes and are used for being clamped into first recesses in the laser chip; and the second protrusions are used for being clamped into second recesses in the silicon-based optoelectronic chip. The coupling alignment is achieved by etching the first recesses in the laser chip, etching the second recesses in the silicon-based optoelectronic chip, etching the first protrusions, the second protrusions, and the through holes in the transfer mold. A flip-chip suction nozzle is connected with the transfer mold, which is in alignment with the laser chip, and picks up the laser chip by means of the through holes.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: October 31, 2023
    Assignee: UNITED MICROELECTRONICS CENTER CO., LTD
    Inventors: Chao Peng, Junbo Feng, Heng Zhao
  • Patent number: 11789214
    Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The connection port passageway defines a keying portion. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: October 17, 2023
    Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATION
    Inventors: Thierry Luc Alain Dannoux, Robert Bruce Elkins, II, Joel Christopher Rosson, Dayne Wilcox, Michael Wimmer, Shane C. Woody, Zhiye Zhang
  • Patent number: 11789202
    Abstract: A hybrid integrated optoelectronic chip including an optoelectronic chip and a silicon photonic chip, a material of the optoelectronic chip being different from a material of the silicon photonic chip. The optoelectronic chip includes at least one first waveguide. The silicon photonic chip includes at least one second waveguide and an installation recess. The optoelectronic chip is installed in the installation recess, and the first waveguide is optically connected to the second waveguide.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: October 17, 2023
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Mengxi Ji, Xianyao Li
  • Patent number: 11789201
    Abstract: A package includes a photonic integrated circuit die, an electric integrated circuit die, and an encapsulant. The photonic integrated circuit die includes a semiconductor substrate and a waveguide. The semiconductor substrate has a notch. The waveguide is disposed over the semiconductor substrate. A portion of the waveguide is located within a span of the notch of the semiconductor substrate. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The encapsulant laterally encapsulates the electric integrated circuit die.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: October 17, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Ming-Fa Chen
  • Patent number: 11774682
    Abstract: Systems and methods of using a multiport assembly and associated components are disclosed. The multiport assembly can include a multiport device that communicatively couples multiple sets or pairs of connectors, such as optical connectors or electrical connectors, together. The multiport assembly can also include an auxiliary port device that couples to the multiport device to expand the capacity of the multiport assembly. Both the multiport and auxiliary port devices can be selectively configured to receive specific types of connectors by selectively coupling to different types of adapters, where the types of adapters correspond to the types of connectors. When coupled to the multiport or auxiliary port devices, the adapters facilitate the formation of the communication between its corresponding set of connectors.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: October 3, 2023
    Assignee: Senko Advanced Components, Inc
    Inventors: Jeffrey Gniadek, Paul Newbury
  • Patent number: 11762154
    Abstract: A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: September 19, 2023
    Assignee: Ayar Labs, Inc.
    Inventors: Manan Raval, Matthew Sysak, Chen Li, Chong Zhang
  • Patent number: 11754781
    Abstract: A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: September 12, 2023
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO..LTD, GARUDA TECHNOLOGY CO., LTD.
    Inventor: Wei-Liang Wu
  • Patent number: 11745433
    Abstract: A connection element for adhering to a component surface of a first component, such that a second component can be secured to the first component by the connection element, including a base element having an adhesive side with an adhesive surface, and a mounting structure. The base element consists of a thermoplastic with a temperature of continued use of at least 130° C., which can be poorly irradiated or cannot be irradiated with light, and has at least one irradiation region. The base element can be irradiated with light in this region in such a way that light energy penetrates the base element. The irradiation region, in cross-section, has a smaller thickness and a transmittance at least 20% with a light wavelength between 320 and 500 nm. Alternatively, the irradiation region is formed by a through-opening.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: September 5, 2023
    Assignee: Böllhoff Verbindungstechnik GmbH
    Inventor: Franz Drüke
  • Patent number: 11733465
    Abstract: Systems and methods of using a multiport assembly and associated components are disclosed. The multiport assembly can include a multiport device that communicatively couples multiple sets or pairs of connectors, such as optical connectors or electrical connectors, together. The multiport assembly can also include an auxiliary port device that couples to the multiport device to expand the capacity of the multiport assembly. Both the multiport and auxiliary port devices can be selectively configured to receive specific types of connectors by selectively coupling to different types of adapters, where the types of adapters correspond to the types of connectors. When coupled to the multiport or auxiliary port devices, the adapters facilitate the formation of the communication between its corresponding set of connectors.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: August 22, 2023
    Assignee: Senko Advanced Components. Inc.
    Inventor: Paul Newbury
  • Patent number: 11693195
    Abstract: An optical pick and place machine that includes a self-calibrating optical controller for error feedback based optical placement of optical components using active alignment is described. The optical controller can include a loopback mode to generate a baseline value of light generated by a light source and measured by a photodetector within the optical controller. The optical controller can further include an active alignment mode in which the light is coupled from the pick and place machine to the optical device on which the component is placed. The optical coupling of the placed component can be evaluated against the baseline value to ensure that the optical coupling is within specification (e.g., within a prespecified range).
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: July 4, 2023
    Assignee: OpenLight Photonics, Inc.
    Inventors: Steven William Keck, Roberto Marcoccia, Steve McGowan
  • Patent number: 11678455
    Abstract: A module for a digital display panel includes a circuit board, a first face of which presents a network of light emitting diodes. The module also includes a chassis fixed on a second face of the circuit board, and a water permeable connector mounted on the circuit board. The chassis includes a base around the water permeable connector, a top part of the base having at least one groove, wherein a seal is inserted. Further, the module includes a power supply unit fitted with a continuous voltage connector surrounded by a ferrite and fitted in the water permeable connector. The power supply unit is attached to the chassis so that a lower plate of the power supply unit co-operates with the seal of the base to ensure a seal around the water permeable connector and the DC voltage connector of the power supply unit.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: June 13, 2023
    Assignee: PRISMAFLEX INTERNATIONAL
    Inventors: William Dulieu, Jeffrey-Changbing Jiang
  • Patent number: 11664900
    Abstract: An optical communications system includes a laser transmitter to generate an optical signal and a first optical fiber network coupled to transmit the optical signal from the laser transmitter system. A first latchable, asymmetric coupler is disposed along the first optical fiber network to receive the optical signal, and has a first tap output that receives a selected and alterable first fraction of the optical signal. A second latchable, asymmetric coupler is disposed along the first optical fiber network to receive the optical signal from the first latchable asymmetric coupler and has a second tap output that receives a selected and alterable second fraction of the optical signal incident at the second latchable. In certain embodiments the first and second couplers are capable of operating at any of at least three tapping fractions.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: May 30, 2023
    Assignee: COMMSCOPE TECHNOLOGIES LLC
    Inventors: Jan Watté, Salvatore Tuccio, Vivek Panapakkam Venkatesan, Saurav Kumar
  • Patent number: 11662531
    Abstract: A ferrule holder assembly can support groupings of a transceiver ferrules in an optical connector interface of an optical transceiver. A first holder body holds a first grouping of transceiver ferrules and has a holder-to-holder interface. A second, typically identical, holder body holds a second grouping of transceiver ferrules. The holder-to-holder interface of the first holder body engages the holder-to-holder interface of the second holder body to operatively align the first holder body with the second holder body to position the first grouping of transceiver ferrules and the second grouping of transceiver ferrules in the optical connector interface for making optical connections to one or more optical connectors plugged into the optical connector interface. The ferrule holder assembly can be used in combination with pre-terminated fiber arrays to couple an optical interface to a circuit board in a transceiver.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: May 30, 2023
    Assignee: Senko Advanced Components, Inc.
    Inventors: Gang Xu, Takuya Nimomiya
  • Patent number: 11656414
    Abstract: Devices such as multiports comprising connection ports with associated securing features and methods for making the same are disclosed. In one embodiment, the device comprises a shell, at least one connection port, at least one securing feature passageway, and at least one securing feature. The at least one connection port is disposed on the multiport with the at least one connection port comprising an optical connector opening extending from an outer surface of the multiport to a cavity of the multiport and defining a connection port passageway. The at least one securing feature is associated with the connection port passageway, and the at least one securing feature is disposed within a portion of the at least one securing feature passageway.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: May 23, 2023
    Assignee: Corning Research & Development Corporation
    Inventors: Thierry Luc Alain Dannoux, Robert Bruce Elkins, II, Joel Christopher Rosson, Dayne Wilcox, Michael Wimmer, Shane C. Woody, Zhiye Zhang
  • Patent number: 11647894
    Abstract: One of two connector receiving parts of a processor for endoscope has a shutter mechanism configured to open a shutter by an external force, the shutter having a gap through which a connector-side connection end section passes, and being configured to partition a recessed space of the connector receiving part with respect to an outside. In addition, the processor for endoscope includes a lock mechanism configured to make the shutter into the locked state during a period when another connection end section on the connector side and a processor-side connection end section are connected, and release the locked state of the shutter when the connection between the other connection end section on the connector side and the processor-side connection end section is released.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: May 16, 2023
    Assignee: HOYA CORPORATION
    Inventors: Takao Hijikata, Yuya Masukawa, Toru Mukumoto, Motoharu Endo
  • Patent number: 11631953
    Abstract: The present utility model discloses a MFi-certified digital data cable comprising a wire rod which is equipped with an input connector at one end and an output connector at the other end; the output connector comprises a MFi-certified connector, a circuit board, a Nixie tube and a rubber base; a connecting piece is fixed at the position adjoining the tail-end of the MFi-certified connector; a plurality of conductive terminals are fixed inside the connecting piece, two ends of each conductive terminal pass through two ends of the connecting piece and then are connected with the MFi-certified connector and the circuit board respectively so the circuit board is assembled and fixed via the connecting piece.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 18, 2023
    Inventor: Yi Chen
  • Patent number: 11630269
    Abstract: A fiber optic connector arrangement includes a printed circuit board coupled to a connector housing. The printed circuit board includes a memory storage device that is configured to store physical layer information pertaining to the fiber optic connector arrangement. The printed circuit board also defines contacts that are electrically coupled to the memory storage device to enable the physical layer information to be read from the memory storage device by a media reading interface. A connector assembly includes at least one adapter assembly; a printed circuit board; and a media reading interface. The connector assembly also may include a tactile pressure sensor. The adapter assembly defines at least a first port and a second port that are configured to connect optical fibers of two connector arrangements. One or more connector assemblies can be mounted to a fiber panel system.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: April 18, 2023
    Assignee: CommScope Technologies LLC
    Inventors: Mark Smrha, Michael D. Schroeder, Michael Gunderson, Vern Loch
  • Patent number: 11594794
    Abstract: A battery includes: a core cell including a first surface and a second surface which are opposite each other and on which first and second electrodes are respectively located, and a lateral surface connecting the first and second surfaces; an insulating sheet arranged on the first surface of the core cell and in which a conduction hole facing the first electrode is defined; and an electrode plate arranged on the insulating sheet and electrically connected to the first electrode through the conduction hole.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: February 28, 2023
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Sanghun Park
  • Patent number: 11592619
    Abstract: An opto-electric hybrid board connector includes an opto-electric hybrid board extending along a transmission direction of light in an optical waveguide, and a connector to which an attached region of the opto-electric hybrid board is attached. The attached region has a board front end surface for inputting and outputting light to and from the optical waveguide. The connector has a connector front end surface disposed to be flush with the board front end surface. The surface roughness SRa1 of the board front end surface is 0.2 ?m or more and 3 ?m or less. A difference D between the surface roughness SRa1 of the board front end surface and the surface roughness SRa2 of the connector front end surface is 1 ?m or less.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: February 28, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventor: Naoto Konegawa
  • Patent number: 11579426
    Abstract: Aspects of the embodiments are directed to an opto-electronic device and methods of using the same. The opto-electronic device can include a processing device and a photonic device. The photonic device can include an optical demultiplexer; a collimating lens optically coupled to the optical demultiplexer and positioned to receive light from the optical demultiplexer, the collimating lens to collimate light received from the optical demultiplexer; a photodetector comprising a photosensitive element, the photosensitive element to convert received light into an electrical signal; and a focusing lens optically coupled to the photodetector, the focusing lens to receive light and focus the light towards the photosensitive element.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 14, 2023
    Assignee: Intel Corporation
    Inventors: Chia-Pin Chiu, Anna M. Prakash
  • Patent number: 11581283
    Abstract: A flip chip package includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board. The solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit is on the inner bonding area. The T-shaped circuit unit has a main part, a connection part, and a branch part. The connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to inhibit solder shorts caused by solder overflow on the branch part.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: February 14, 2023
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Patent number: 11567275
    Abstract: An optical module with optical fibers is intended to be able to be easily sucked and conveyed, and mounted on another substrate. An optical module of the present disclosure includes an optical device to which optical fibers are optically connected; and a carrier including a substrate and an adhesive layer formed at a surface of the substrate, and a part of the optical device and a part of the optical fibers are adhesively fixed on a surface of the adhesive layer. The optical device may include ball grid array shaped electrodes. The carrier may be provided with a plurality of holes.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: January 31, 2023
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Yuriko Kawamura, Yusuke Nasu, Kiyofumi Kikuchi, Shunichi Soma
  • Patent number: 11521954
    Abstract: Disclosed is a light emitting diode (LED) assembly having vertical type micro LEDs which are vertically aligned and is capable of significantly improving light efficiency, a light quantity, and an integration degree through optimized alignment of the vertical type micro LEDs each having a nano size or micro size. The LED assembly includes a substrate provided with a plurality of through holes formed in a thickness direction, micro LEDs each formed in a vertical type in which a vertical width is greater than a lateral width, and aligned in an upright state by being at least partially inserted into the through holes, and a first electrode deposited on a lower surface of the substrate to be connected to a first conductive layer and a second electrode deposited on an upper surface of the substrate to be connected to a second conductive layer.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: December 6, 2022
    Inventors: Chi-Young Yoon, Bae-Gun Jung
  • Patent number: 11523092
    Abstract: An optical system has a hollow mechanical body having first and second ends. An optical assembly has a plurality of optical components arranged in a stack configuration. Each of the optical components has a set of engagement configurations. For each pair of adjacent optical components in the stack configuration, at least some of the engagement configurations of a first optical component in the pair engage with at least some of the engagement configurations of a second optical component in the pair. Some of the engagement configurations of the optical component at a first end of the stack configuration engage with corresponding engagement configurations of the hollow mechanical body at the first end of the hollow mechanical body to position the other optical components of the stack configuration within the hollow mechanical body. An emissive display device is deployed at the second end of the hollow mechanical body.
    Type: Grant
    Filed: December 6, 2020
    Date of Patent: December 6, 2022
    Assignee: LUMUS LTD.
    Inventors: Kobi Greenstein, Tsion Eisenfeld, Netanel Goldstein
  • Patent number: 11513301
    Abstract: A chip-scale transceiver includes an interposer having microspring electrical contacts disposed on the interposer substrate. At least one electronic chip and at least one optoelectronic chip are electrically coupled to the interposer through the microsprings. The electronic chip includes at least one of an amplifier array and a laser driver array. First electrical contact pads arranged to make electrical contact with the first microsprings of the interposer. The optoelectronic chip includes at least one of a laser array and a photodetector array. Second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer are disposed on the optoelectronic chip substrate. The transceiver has an area less than or equal to 0.17 mm2 per Gbps.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: November 29, 2022
    Assignee: Palo Alto Research Center Incorporated
    Inventor: Christopher L. Chua
  • Patent number: 11506843
    Abstract: A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: November 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Che-Hsiang Hsu, Chewn-Pu Jou, Feng-Wei Kuo, Min-Hsiang Hsu
  • Patent number: 11509401
    Abstract: An optical connector of a power over fiber system includes a shutter. The shutter opens in conjunction with a connection operation to enable the connection and closes in conjunction with a disconnection operation to block feed light from exiting. A light receiving surface of the shutter is made of a wavelength conversion material. The light receiving surface receives the feed light when the shutter is closed. The optical connector is disposed at a feed-light output end in the power over fiber system.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: November 22, 2022
    Assignee: KYOCERA CORPORATION
    Inventor: Takehiko Suyama
  • Patent number: 11493696
    Abstract: The present disclosure relates to a ferrule-less fiber optic connector including a connector body having a front end. The ferrule-less fiber optic connector can include a plurality of optical fibers that extend through the connector body. The optical fibers can have having free end portions at the front end of the connector body that are not supported by a ferrule or by ferrules. In one example, the ferrule-less fiber optic connector can be a duplex fiber optic connector. Transceiver modules and components are also disclosed.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: November 8, 2022
    Assignee: CommScope Technologies LLC
    Inventors: Michael James Ott, John D. Schmidt
  • Patent number: 11480741
    Abstract: Connector assemblies are described herein. For example, a connector assembly including: a housing configured to accept a first ferrule and a second ferrule. The connector assembly may also have a push/pull clip that is configured to depress a protrusion that rotates down a connector device to remove the connector assembly from an adapter. The push/pull clip is integrated with a cable boot assembly that allows a user to apply a distal force to remove or insert the connector assembly into the adapter housing. The push/pull clip is configured for use to release a MPO and LC connector type from an adapter.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: October 25, 2022
    Assignee: Senko Advanced Components, Inc.
    Inventors: Man Ming Ho, Kazuyoshi Takano
  • Patent number: 11480746
    Abstract: A fiber optical transceiver includes a package, a plurality of lead frames provided with the package and protruding outward from the package, a first circuit board installed in the package and electrically connected to the plurality of lead frames, and an optical element provided on the first circuit board. The package includes a ceramic portion formed of ceramic and covered with a metallized film.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: October 25, 2022
    Assignee: YAZAKI CORPORATION
    Inventors: Chiemi Yamagata, Motonori Miyanari
  • Patent number: 11439465
    Abstract: A laser fiber for use in performing a medical laser treatment includes an optical fiber and a fiber tip. The optical fiber includes a terminating end surface at a distal end. The fiber tip is positioned at the distal end of the optical fiber and includes a transmissive portion and a spacer portion. Laser energy discharged from the terminating end surface of the optical fiber is transmitted through the transmissive portion. The spacer portion defines a distal terminating end of the fiber tip that is spaced a predetermined distance from the terminating end surface of the optical fiber. The predetermined distance is set for shock wave generation for calculus destruction at the distal terminating end of the fiber tip.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: September 13, 2022
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Jian James Zhang, Rongwei Jason Xuan, Danop Rajabhandharaks
  • Patent number: 11435542
    Abstract: A fiber optic cassette system is disclosed comprising a case defining a tray receiving space and an opening to a space, a tray received within the case for movement between a stored position wherein the tray is inside the case and an accessible position wherein a front end of the tray is in front of the opening and outside of the case, fiber optic cassettes arrangeable side by side along the tray front end, a first of the cassettes comprising a width of one of one, two, three, four or six standard width units and a second of the cassettes comprising a width different from the first cassette width and one of one, two, three, four or six standard width units, and a fastener for removeably the cassettes to the tray. When arranged on the tray each of said selected cassettes is directly adjacent at least one other selected cassette.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: September 6, 2022
    Inventor: Vincent Pilon
  • Patent number: 11428880
    Abstract: An optical pick and place machine that includes a self-calibrating optical controller for error feedback based optical placement of optical components using active alignment is described. The optical controller can include a loopback mode to generate a baseline value of light generated by a light source and measured by a photodetector within the optical controller. The optical controller can further include an active alignment mode in which the light is coupled from the pick and place machine to the optical device on which the component is placed. The optical coupling of the placed component can be evaluated against the baseline value to ensure that the optical coupling is within specification (e.g., within a prespecified range).
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: August 30, 2022
    Assignee: OpenLight Photonics, Inc.
    Inventors: Steven William Keck, Roberto Marcoccia, Steve McGowan
  • Patent number: 11409031
    Abstract: An optical device is mounted to an electronic circuit having a main face with at least one light source. The optical device is made from a block which includes, for each light source, a corresponding opening that passes through the block. The opening includes a cylindrical part with a threading on an inside surface.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: August 9, 2022
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) Limited
    Inventors: Frederic Fantoni, Arthur Finlay, Julien Venel, Guilhem Dubois, Marco Antonelli, Hugo Vargas Llanas, Antoine Puthon
  • Patent number: 11402583
    Abstract: An assembly may include at least one camera and a controllable mechanical handling device. The system may further include a first component, including a first optical waveguide and a second component, including a second optical waveguide. The first component and the second component are fixedly connected to a substrate and arranged directly next to one another on the substrate and relative to one another in such a way that a coupling side of the first component and a coupling side of the second component are situated opposite each other on a first and second side of a coupling plane. The optical waveguides of the first and second component each end at a first coupling surface or a second coupling surface. The first and second coupling sides are aligned, and optically coupled with one another at a first and second end face.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: August 2, 2022
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Hans-Hermann Oppermann, Tolga Tekin, Jörg Stockmeyer, Juliane Fröhlich
  • Patent number: 11401965
    Abstract: A first and second electric members respectively having electrical connection portions are electrically connected in a state that mutual positions are regulated by guide pins, and fastening screws which are inserted through fastening screw insertion holes of the second electric member are screwed into screw holes for fastening of the first electric member, and thereby the first and second electric members are fastened. At least one of the screw holes for fastening has large-diameter portions into which the guide pin is detachably inserted, and small-diameter portions equipped with female screw portions. The female screw portions are not arranged in the large-diameter portions, and inner diameters of the large-diameter portions are larger than root diameters of the female screw portions, and outer circumferential surfaces of the fastening screws which are screwed with the female screw portions and inner circumferential surfaces of the large-diameter portions are not in contact with each other.
    Type: Grant
    Filed: December 25, 2019
    Date of Patent: August 2, 2022
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takeshi Otani, Yusuke Yamamura, Hiroshi Kunii, Masashi Bando
  • Patent number: 11397364
    Abstract: In an optical modulator, high frequency characteristics are improved and the stability thereof is improved. An optical modulator includes: an optical element substrate that includes an optical waveguide and a plurality of electrodes that control light waves propagating through the optical waveguide; and a package case that houses the optical element substrate, in which a plurality of signal input terminals, respectively electrically connected to the plurality of electrodes, are provided on the bottom surface of the package case, and the plurality of signal input terminals respectively electrically connected to the plurality of electrodes provided on the optical element substrate are divided and disposed on the sides facing each other with the optical element substrate interposed therebetween.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 26, 2022
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Norikazu Miyazaki, Toru Sugamata
  • Patent number: 11385405
    Abstract: The present application provides a fiber array for vertical coupling, including an optical fiber, an L-shaped plate, a U-shaped cover plate and a V-shaped slot; wherein the optical fiber includes a straight section, a curved transition section and a curved fixed section that are sequentially connected; the curved transition section of the optical fiber is arranged on an outer side surface of the L-shaped plate, the straight section of the optical fiber is fixedly arranged at a horizontal end of the L-shaped plate through the U-shaped cover plate, and the curved fixed section of the optical fiber is fixedly arranged on a curved end of the L-shaped plate through the V-shaped slot. The fiber array for vertical coupling provided by the present application can greatly reduce the optical loss in the light path.
    Type: Grant
    Filed: April 28, 2018
    Date of Patent: July 12, 2022
    Assignee: WUHAN YILUT TECHNOLOGY CO., LTD.
    Inventors: Chuang Yu, Wanglong Huang, Jingnong Cai
  • Patent number: 11387131
    Abstract: An alignment apparatus according to one embodiment, includes: a first and a second stage; a first and a second detector; a first and a second moving mechanism; and a controller. The first and second stages are configured to respectively hold a first and a second semiconductor substrate on which a first and a second alignment mark are respectively disposed. The first and second moving mechanisms are configured to respectively move the first and second stages relatively to each other. The controller is configured to perform the following (a), (b). (a) The controller control the detectors and the moving mechanisms to cause the first detector to detect the second alignment mark and to cause the second detector to detect the first alignment mark. (b) The controller calculate a position deviation between the substrates in accordance with results of the detections.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: July 12, 2022
    Assignee: Kioxia Corporation
    Inventors: Miki Toshima, Osamu Yamane
  • Patent number: 11338333
    Abstract: A laser cleaning system including a laser source, an energy-transferring optical fiber, a laser cleaning head, a coreless motor, a connection lens barrel, and a mirror.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: May 24, 2022
    Assignee: INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCES
    Inventors: Xuechun Lin, Zhiyan Zhang, Hao Liang, Yibo Wang, Yannan Liu, Wenhao Ma
  • Patent number: 11333953
    Abstract: A light source package includes: a substrate; a first light source device disposed on the substrate, and configured to emit a light of a first wavelength; a second light source device disposed to be spaced apart from the first light source on the substrate, and configured to emit a light of a second wavelength, different from the first wavelength; and a light transmissive structure disposed above first and second light source devices, and including at least one first lens configured to increase a beam angle of the light of the first wavelength and at least one second lens configured to reduce a beam angle of the light of the second wavelength.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: May 17, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jongsup Song, Seolyoung Choi
  • Patent number: 11327241
    Abstract: An optical fiber adapter structure, comprises a metal flange, a tubular housing, an insulating ring, an optical fiber stub, and a shielding annulus. The optical fiber stub is embedded into the metal flange; the shielding annulus is fixed at a bottom of the metal flange by means of a conductive adhesive; the shielding annulus covers an end of the optical fiber stub and is provided with a reserved hole only for laser signals to pass through; the tubular housing is sleeved to the bottom of the metal flange; and the tubular housing is insulated from the metal flange by means of the insulating ring. The conductive adhesive adheres the shielding annulus made of conductive material to a tail end of the metal flange and maintains complete electrical contact therebetween, such that the electromagnetic wave radiation between the interior of optical device and the exterior of metal flange is reduced.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: May 10, 2022
    Inventors: Xuguang Chen, Qiangpeng Hu, Jun Zhang, Zhiqiang Chen, Hong Zhu, Po Liang