Optical Fiber To A Nonfiber Optical Device Connector Patents (Class 385/88)
  • Patent number: 10386576
    Abstract: An optical waveguide circuit includes a polarization beam splitter connecting to a first input optical waveguide; an optical interference element receiving one of orthogonally polarization-split lights of a first light from the polarization beam splitter, and one of orthogonally-polarized lights from a second light input to a second input optical waveguide, the optical interference element causing interference therebetween; a first connection optical waveguide connecting the polarization beam splitter and the optical interference element; and a second connection optical waveguide connecting the second input optical waveguide and the optical interference element. The first and the second input optical waveguides have a straight-line shape or an S-shape including a first bending portion and a second bending portion to cancel the polarization-rotation of light taking place in the first bending portion.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: August 20, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD
    Inventors: Kazutaka Nara, Takashi Inoue, Noritaka Matsubara, Hiroshi Kawashima
  • Patent number: 10386586
    Abstract: A Si photonics device includes: a first semiconductor chip; a second semiconductor chip having a laser diode and mounted on the first semiconductor chip; a third semiconductor chip taking in a laser beam emitted from the laser diode and mounted on the first semiconductor chip; and a resin layer disposed on the first semiconductor chip so as to face the second semiconductor chip. Further, the Si photonics device has: a bump electrode connecting the second semiconductor chip and an upper layer electrode pad provided on the resin layer of the first semiconductor chip; and a bump electrode connecting the first semiconductor chip and the third semiconductor chip, and the second semiconductor chip is mounted on the first semiconductor chip via the resin layer.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: August 20, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Tetsuya Iida, Yasutaka Nakashiba
  • Patent number: 10382142
    Abstract: An optical module includes a board including a first surface and a second surface, a light-receiving element mounted on the first surface of the board, a capacitor mounted on the first surface of the board and connected to the light-receiving element, an optical waveguide attached to the second surface of the board and configured to transmit light, and a housing that covers the board. A recess is formed in an area of the inner surface of the housing to face the capacitor.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: August 13, 2019
    Assignee: FUJITSU COMPONENT LIMITED
    Inventor: Takatoshi Yagisawa
  • Patent number: 10382137
    Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: August 13, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Luca Maggi, Antonio Fincato, Salvatore Mario Rotolo, Matteo Alessio Traldi, Luigi Verga, Mark Andrew Shaw
  • Patent number: 10361784
    Abstract: An example remote radio apparatus is provided, including a body, a mainboard, a mainboard heat sink, a maintenance cavity, an optical module, and an optical module heat sink. The maintenance cavity and the optical module heat sink are integrally connected, while the optical module is mounted on a bottom surface of the optical module heat sink. The maintenance cavity and the optical module heat sink are mounted on a side surface of the body, and the mainboard heat sink is mounted on and covers the mainboard. The mainboard heat sink and the mainboard are installed on a front surface of the body, and the mainboard heat sink and the optical module heat sink are spaced by a preset distance. The temperature of the optical module is controlled within a range required by a specification.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: July 23, 2019
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xiaoming Shi, Xiaohui Shen, Dan Liang, Haigang Xiong, Haizheng Tang
  • Patent number: 10355410
    Abstract: Provided is a connector connection structure which is configured to directly connect connectors provided to casings of two devices, respectively, to each other, and which can keep sealing property of the connector connection portion. A second terminal is arranged movable with respect to a second casing, thus displacement of a first casing and the second casing with respect to each other can be absorbed by allowing the second terminal to move, thereby allowing the connectors provided respectively to the casings of the two devices to be directly connected to each other. At this time, a connector-side opening of a second housing is closed using a first housing of a first connector as a mating connector, thereby keeping sealing property of the connector connection portion while allowing the connectors provided respectively to the casings of the two devices to be directly connected to each other.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: July 16, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Daisuke Yamanashi, Kenichi Okamoto, Yukihiro Takagi
  • Patent number: 10348406
    Abstract: This disclosure provides an electrical interface module including a signal processor, a switch, and a connection component, wherein the signal processor includes a first interface, a second interface, and a third interface; the first interface and the second interface of the signal processor are connected with the connection component through the switch, and configured to output differential signals; the third interface of the signal processor is connected with the switch, and configured to output an enable signal; and the switch is configured to be controlled by the enable signal to be closed so that the differential signals are output through the connection component.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: July 9, 2019
    Assignee: Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Chungang Zhang, Shu Liu, Liang Shi, Hua Zhang
  • Patent number: 10342141
    Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: July 2, 2019
    Assignee: FINISAR CORPORATION
    Inventors: Maziar Amirkiai, Yunpeng Song, Peter Henry Mahowald, Hongyu Deng
  • Patent number: 10333272
    Abstract: An optical device includes: an optical module provided with an electrical pin; a printed wiring board that is connected to the electrical pin of the optical module, on which a control circuit for controlling the optical module is mounted, and on which an opening is formed; a first plate-shaped member to which the printed wiring board is fixed; a first fixing member that is inserted into the opening of the printed wiring board, and that fixes the printed wiring board with the first plate-shaped member; a second plate-shaped member that is disposed such that the printed wiring board is interposed between the second plate-shaped member and the first plate-shaped member; and a second fixing member that fixes the first fixing member with the second plate-shaped member such that the optical module is retained between the first plate-shaped member and the second plate-shaped member.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: June 25, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masayoshi Nishita, Atsushi Yamamoto, Atsushi Shinozaki
  • Patent number: 10317633
    Abstract: An SFP transceiver with a die-casting metal housing and a metallic upper cover formed via sheet metal and assembled to the housing to commonly form therebetween a receiving cavity in which a printed circuit board assembly is received. The printed circuit board assembly includes an optical module with a lens structure, around a mating port, including a front face with a pair of tubular structures extending forwardly. A metallic EMI shielding device includes a plate with a pair of sleeves unitarily extending therefrom via a deep drawing method to cover the front face and the tubular structures, respectively. Each sleeve further includes a flange to cover a ring type front end face of the corresponding tubular structure in the front-to-back direction.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: June 11, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Paul Yu, David Meadowcroft
  • Patent number: 10295740
    Abstract: An optoelectronic device includes an optoelectronic die, a laser die, and electrical interconnects. The optoelectronic device has a surface. A trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface. The laser die includes first and second electrodes and a laser output aperture. The laser die is mounted in the trench and is configured to emit a laser beam. The first electrode is coupled to the electrically conductive layer and the laser output aperture is mechanically aligned with a waveguide that extends from the second wall. The interconnects are formed on the second electrode of the laser die and on selected locations on the surface of the optoelectronic die. The interconnects are coupled to a substrate, and are configured to conduct electrical signals between the optoelectronic die and the substrate.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: May 21, 2019
    Assignee: Mellanox Technologies, Ltd.
    Inventors: Ido Bourstein, Sylvie Rockman
  • Patent number: 10295765
    Abstract: A photodiode package is disclosed that includes a TO-Can style body with an exposed sensor cavity that eliminates the necessity of an encapsulant dispensing process. The TO-Can body of the photodiode package includes an integrated coupling member to allow for coupling to a ROSA housing without an intermediate member. The photodiode package includes a base portion with a cylindrical wall portion that extends therefrom to form an optical coupling cavity. A surface of the base portion provides at least one mounting surface within the optical coupling cavity for coupling to a photodiode chip. The cylindrical wall may function as an integrated coupling member and may be used to directly couple the photodiode package, e.g., without an intermediate cap/ring, into a socket of a ROSA housing. The base portion and cylindrical wall may be formed from a single piece of material, or from multiple pieces depending on a desired configuration.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: May 21, 2019
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kai-Sheng Lin, YongXuan Liang, Justin Lii
  • Patent number: 10250334
    Abstract: An optical receiver module includes light-receiving elements each having a first electrode and a second electrode to which a bias is applied, and converting input optical signals into electric signals and outputting the electric signals from the first electrodes, and a carrier having wiring patterns respectively electrically connecting to the light-receiving elements and supporting the light-receiving elements. The wiring pattern includes a first wiring line electrically connecting to the first electrode and a second wiring line electrically connecting to the second electrode. The second wiring line has a high resistance portion having a higher resistance value than the other portions at least in a position overlapping with the light-receiving element to be connected and a low resistance portion having a lower resistance value than the high resistance portion at least in a position not overlapping with any of the light-receiving elements.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: April 2, 2019
    Assignee: Oclaro Japan, Inc.
    Inventors: Takuma Ban, Kazuhiro Komatsu
  • Patent number: 10241264
    Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: March 26, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi-Min Chin, Yung-Shun Chang, Mei-Ju Lu, Jia-Hao Zhang, Wen-Chi Hung
  • Patent number: 10241286
    Abstract: An optical transmitter and an optical module including the optical transmitter are provided. The optical transmitter may include a support substrate, a temperature control module disposed on the support substrate, a sub-mount disposed on the temperature control module, a prism disposed on the temperature control module and having a sloped surface, a light receiving element disposed on the temperature control module, a light emitting element disposed on the sub-mount, and a thermistor disposed on the sub-mount. The light receiving element may be disposed separately from the sub-mount in a first direction, and the prism may be disposed between the light receiving element and the sub-mount. Some first light emitted from the light emitting element may be reflected by the sloped surface of the prism, and some of the first light may pass through the prism and be received by the light receiving element.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: March 26, 2019
    Assignee: OE SOLUTIONS CO., LTD.
    Inventors: Eun Kyo Jung, Hyun Chang Shin, Dai Hyoung Koo
  • Patent number: 10228525
    Abstract: A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipater, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: March 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Tymon Barwicz, Edward Lindsey Kimbrell, Theodore William Lichoulas
  • Patent number: 10230226
    Abstract: A network interface device includes a housing. The housing includes a base and a cover, the cover connected to the base and movable relative to the base between an open position and a closed position. The network interface device further includes an insert removably connectable to the base. The insert includes a base plate, and an adapter plate extending from the base plate and defining a subscriber section of the insert and a provider section of the insert. The subscriber section and provider section are opposite each other relative to the adapter plate. The adapter plate defines one or more adapter apertures extending therethrough. The insert further includes an organizer arm which includes a support member, an upper portion extending from the support member, and a lower portion extending from the support member opposite the upper portion.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 12, 2019
    Assignee: AFL Telecommunications LLC
    Inventors: Cecilia L. Stout, David J. Lane, Shirley Ball, William Miller, Joseph Cignarale
  • Patent number: 10222294
    Abstract: A wafer includes multiple optical devices. One of the devices includes a waveguide that terminates at a facet that is included in a testing port. Light is injected from a light source into the waveguide through the facet without being reflected between exiting from the light source and entering the facet. The devices are separated from the wafer after the light is injected into the waveguide.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: March 5, 2019
    Assignee: Mellanox Technologies Silicon Photonics Inc.
    Inventors: Dazeng Feng, Hong Liang
  • Patent number: 10215938
    Abstract: A photoelectric conversion assembly is proposed. The photoelectric conversion assembly comprises a photoelectric conversion module having an interposer, at least one optical element and an optical bench. The at least one optical element is configured on the interposer, and the optical bench is used to support for the interposer. A circuit board is used to support for the photoelectric conversion module, having metal pads for coupling the at least one optical element. An optical transmission component is used for transmitting light. An optical ferrule is used for engaging with the photoelectric conversion module and an optical transmission component. A plug is used for electrically connecting the circuit board.
    Type: Grant
    Filed: June 11, 2016
    Date of Patent: February 26, 2019
    Assignee: AQUAOPTICS CORP.
    Inventors: Chia-Chi Chang, Shih-Jye Yo
  • Patent number: 10209464
    Abstract: An optical transmitter may include a chip stack that includes an electrical IC that is mounted using solder balls to a photonic chip. These solder connections permit the electrical IC and the photonic chip to communicate. In addition, the transmitter may include a PCB coupled to the stack so that electrical signals in the PCB are transmitted to the IC and photonic chip (and vice versa). Instead of coupling the PCB to the stack using wire bonds attached to pads on a surface of the photonic chip, at least a portion of the PCB is disposed between the photonic chip and electrical IC. The PCB may also include bond pads used to form a direct solder connection to the electrical IC. As such, the electrical IC may include direct solder connections to both the PCB and the photonic chip.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: February 19, 2019
    Assignee: Cisco Technology, Inc.
    Inventors: Stefan Martin Pfnuer, Matthew Joseph Traverso, Bipin Dama
  • Patent number: 10209454
    Abstract: Disclosed are optical connectors having lenses along with methods for making the same. In one embodiment, the optical connector includes a fiber body having a front portion with a plurality of fiber guides, and a connector body having a plurality of connector body fiber guides that lead to a plurality of lenses at a front portion of the connector body. The fiber body attaches to the connector body and may align a plurality of optical fibers to the lenses at the front portion of the connector body. One embodiment has the fiber body configured as a crimp body with a barrel at a rear portion for attaching a fiber optic cable.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: February 19, 2019
    Assignee: Corning Optical Communications LLC
    Inventors: Micah Colen Isenhour, Dennis Michael Knecht, James Phillip Luther
  • Patent number: 10191216
    Abstract: An optical interface device for a photonic integrated system includes a plug and a receptacle. The receptacle is operably arranged on a PIC that supports waveguides. The plug operably supports optical fibers. The receptacle and plug are configured to operably engage to establish optical communication between the optical fibers and the waveguides. A tab on the receptacle is configured to constrain longitudinal motion while allowing for lateral motion of the receptacle to adjust its position relative to the PIC to optimize alignment. The plug can include a spacer sized to fit within a recess defined by the tab to further facilitate alignment. The receptacle and plug can be engaged and disengaged in a manner similar to conventional electrical connectors.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: January 29, 2019
    Assignee: Corning Optical Communications LLC
    Inventor: Alan Frank Evans
  • Patent number: 10187709
    Abstract: Modular switchboard terminal block (10,20) for transmission of data signals (2) is provided, comprising a container (10a,20a) having, arranged inside it, a printed circuit (30) for processing the data signals, which has two opposite sides (30a,30b) in a transverse direction (Y-Y); connectors (11;21) for electrical connection to controlled/detection devices; and a rear end face provided with hook and spring means for mounting on a DIN switchboard rail (6).
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: January 22, 2019
    Assignee: MORSETTITALIA S.P.A.
    Inventor: Silvano Cerini
  • Patent number: 10162116
    Abstract: An apparatus can comprise an optical slab comprising a rigid substrate of substantially transmissive material. The apparatus can also comprise a WDM multiplexer to receive and combine a plurality of optical signals at different wavelengths to form a combined optical signal in the optical slab having an aggregate power. The apparatus can further comprise a broadcaster to distribute the combined optical signal from the optical slab to each of a plurality of different optical receivers with a fraction of the aggregate power of the combined optical signal.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: December 25, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Georgios Panotopoulos, Michael Renne Ty Tan, Wayne Victor Sorin, David A. Fattal
  • Patent number: 10162140
    Abstract: An optical communication subassembly includes one or more optoelectronic devices, one or more optical elements, and a transceiver light coupling unit. Each optical element is configured to change a divergence of the outgoing light relative to a divergence of the incoming light and is spaced apart from and optically aligned with a corresponding optoelectronic device. The transceiver light coupling unit has a mating surface configured for mating with a connector light coupling unit attached to an optical waveguide. A mating direction of the optical light coupling unit forms an angle with the mating surface of the transceiver light coupling unit such that when the connector light coupling unit mates with the transceiver light coupling unit, the angle between the mating direction of the connector light coupling unit and the mating surface of the transceiver light coupling unit causes the optical waveguide to bend.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: December 25, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Terry L. Smith, Barry J. Koch, Michael A. Haase, Alexander R. Mathews
  • Patent number: 10154559
    Abstract: A control circuit includes a first control unit, a power unit, a driver unit, a second control unit, a power source, a first switch, a pull-up element and a second switch. The first control unit is used to detect whether a configuration channel line has a predetermined divided voltage and generate a control signal accordingly. The power unit is coupled to the configuration channel line and a power line for supplying power to the driver unit. The driver unit is used to enable or disable a light emitting unit according to the control signal. The second control unit is used to detect whether the configuration channel line has the predetermined divided voltage and control the first switch and the second switch accordingly. The first switch is coupled between a power source and the configuration channel line. The second switch is coupled between the pull-up element and the configuration channel line.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: December 11, 2018
    Assignee: WELTREND SEMICONDUCTOR INC.
    Inventors: Chih-Sheng Yang, Jeng-Cheng Liu
  • Patent number: 10129983
    Abstract: A base material includes a pair of end regions located on both sides in a first direction, and an intermediate region located between the pair of end regions. The intermediate region includes a pair of side edges on both sides in a second direction orthogonal to the first direction. Both the pair of side edges do not project outward in the second direction from the pair of end regions. At least one of the pair of side edges has a shape recessed inward in the second direction from the pair of end regions. Terminals include end pads and a side pad. The end pads are located in each of the pair of end regions of the base material and arranged in the second direction. The side pad is located at at least one of the pair of side edges of the base material.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 13, 2018
    Assignee: Oclaro Japan, Inc.
    Inventors: Yoshikuni Uchida, Naohiko Baba, Hideaki Asakura, Michihide Sasada, Kazuhiro Komatsu
  • Patent number: 10107968
    Abstract: A fiber optic connector assembly comprising: a fiber optic connector (110) and a fiber optic adapter (120). The fiber optic connector comprises a ferrule assembly (110) and is simplified to not comprise a case and/or an insertion body of a standard fiber optic connector disposed outside the ferrule assembly. The fiber optic adapter comprises a simplified port (121) adapted to receive the ferrule assembly (110) therein and an elastic piece (130) for holding the ferrule assembly (110) in the simplified port. The elastic piece is disposed in a peripheral wall of the simplified port and clamped on the ferrule assembly to exert an axial elastic force on the ferrule assembly. The fiber optic connector and the fiber optic adapter of the present invention both can be shortened in length, and the fiber optic connector assembly has a simpler structure than that of a standard fiber optic connector assembly.
    Type: Grant
    Filed: September 2, 2013
    Date of Patent: October 23, 2018
    Assignee: CommScope Telecommunications (China) Co. Ltd.
    Inventors: Zhaoyang Tong, Liu Lei, Lin Lin
  • Patent number: 10091881
    Abstract: An optical device includes a connection pad, which is connected to a conductor pattern on the circuit substrate, at one edge. The connection pad includes one ground pad, and two or more signal pads between which the ground pad is interposed from its both sides. The ground pad includes a concave portion including an opening at the edge. The circuit substrate is provided with a metal columnar member in the conductor pattern to which the ground pad is connected. The conductor pattern and the connection pad are fixed to each other with solder in a state in which the columnar member is fitted into the concave portion. Solder, which gradually rises from the ground pattern to a lateral surface of the columnar member, is formed between the columnar member and the ground pattern that is formed in the flexible printed circuit.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: October 2, 2018
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Toshio Kataoka, Kei Katou
  • Patent number: 10073206
    Abstract: A system and an apparatus for connecting a fiber optic or rigid light guide to a light source are provided. The fiber optic or rigid light guide has one end connected to a ferrule with a contact surface. The system includes a connecting element connectable to the light source, into which the ferrule can be inserted. The connecting element has a number of radially movable fastening portions, wherein the fixing portions are radially biased and cooperate with the contact surface, when the ferrule is inserted into the connecting element, whereby a first retention force is applied to the contact surface, and a fixing element is positioned in such a way that it cooperates with the fastening portions so that a second retention force, which is greater than the first retention force, is applied to the contact surface.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: September 11, 2018
    Assignee: SCHOTT AG
    Inventor: Andreas Dietrich
  • Patent number: 10048456
    Abstract: The present invention provides a packaging device of single optical multiplexed parallel optical receiver coupling system component, comprising a housing having a transmission function, an adapter component and collimating lens. The upper surface of the housing is provided with a first groove and a second groove, the lower surface of the housing is provided with a third groove. One end of the housing is provided with a through hole which communicates with the first groove. One end of the collimating lens is connected with the adapter component, and the other end of the collimating lens passes through the through hole to the first groove. A first slope and a second slope are respectively provided on the adjacent side wall between the first groove and the second groove. The second slope is provided with a reflective film. The third groove is provided with a lens array having multiple channels.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: August 14, 2018
    Assignee: Linktel Technologies Co., Ltd.
    Inventors: Dingkun Hu, Jian Zhang, Xianwen Yang, Tianshu Wu, Linke Li
  • Patent number: 10050390
    Abstract: A light emitting power line plug structure is disclosed, comprising a plug accommodation body, an electric power line communicatively connected to the plug accommodation body, a plug front end assembly, a connection assembly fixedly locked to the plug front end assembly and a light emitting circuit assembly, wherein the light emitting circuit assembly is located between the plug front end assembly and the connection assembly, and is configured with at least a light emitting diode (LED) which faces towards the light guiding line extending from the inside of the electric power line; therefore, when the electric power cords in the electric power line conduct electric power, the LEDs in the light emitting circuit assembly can become conductive and emit light such that the light guiding line integrally illuminates by means of light transfers and glow outwards on the entire electric power line through the translucent cladding.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: August 14, 2018
    Inventor: Chia-Hua Lin
  • Patent number: 10042125
    Abstract: Optical connectors may include various portions, or structures, to provide a plurality of degrees of movement to optical ferrules. The optical ferrules may be linearly movable along one or more axes and rotationally moveable about one or more axes for alignment and coupling to corresponding optical ferrules. The optical connectors may be integrated with, or in conjunction with, other non-optical connectors such as electrical connectors, e.g., located on a drive carrier.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: August 7, 2018
    Assignee: Xyratex Technology Limited
    Inventors: Richard C. A. Pitwon, Alexander C. Worrall, Myles E. R. Spence, Alistair Allen Miller
  • Patent number: 10012809
    Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: July 3, 2018
    Assignee: Mellanox Technologies, LTD.
    Inventors: Elad Mentovich, Itshak Kalifa, Sylvie Rockman, Pierre Avner Badehi, Anna Sandomirsky, Evelyn Landman
  • Patent number: 10010396
    Abstract: Novel multilayer composite material vias for biological implants are disclosed. The vias comprise two metals, so that the metal more compatible with biological environments is on one end of the via, and the metal more compatible with fabrication of a hermetic package is on the other end of the via.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: July 3, 2018
    Assignee: Second Sight Medical Products, Inc.
    Inventors: Jerry Ok, Alfred E Mann
  • Patent number: 10003175
    Abstract: An external resonator type light-emitting device includes a light source oscillating a semiconductor laser light and a grating element configuring an external resonator together with the light source. The light source includes an active layer oscillating the semiconductor laser light. The grating element includes an optical waveguide and a plurality of Bragg gratings formed in the optical waveguide. The optical waveguide includes an incident face on which the semiconductor laser light is incident and an emitting face from which an emitting light having a desired wavelength is emitted.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: June 19, 2018
    Assignee: NGK Insulators, Ltd.
    Inventors: Jungo Kondo, Shoichiro Yamaguchi, Tetsuya Ejiri
  • Patent number: 9995893
    Abstract: There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: June 12, 2018
    Assignee: Sony Corporation
    Inventors: Hirohito Miyazaki, Tsuyoshi Ogawa, Kazuyoshi Yamada
  • Patent number: 9989713
    Abstract: An optical structure includes a substrate including a cavity on a first surface of the substrate, an optical component on the substrate and an adhesive applied to a side of the optical component to fix the optical component to the substrate. The optical component includes a recess on a second surface of the optical component, the second surface is opposed to the first surface of the substrate, and the recess is provided along an edge of the second surface.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: June 5, 2018
    Assignee: International Business Machines Corporation
    Inventors: Elaine Cyr, Paul F. Fortier, Takashi Hisada, Patrick Jacques, Koji Masuda, Masao Tokunari
  • Patent number: 9977062
    Abstract: An electric field intensity calculation apparatus specifies, by analyzing a measurement result for a near magnetic field intensity distribution on a component side of a printed circuit, a maximum intensity of an evaluation target frequency component of a near magnetic field of the printed circuit and an area of a range, on the printed circuit, delimited by using, as its boundary, positions where intensity of the evaluation target frequency component of the near magnetic field attenuates by a predetermined factor relative to the maximum intensity, and calculate a far electric field intensity for the evaluation target frequency at a place at a distance from the printed circuit, based on the area, an electronic current value of an electronic current that generates a near magnetic field having the maximum intensity when flowing through the component side of the printed circuit, the evaluation target frequency, the distance, and a proportional coefficient.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: May 22, 2018
    Assignees: FUJITSU TEN LIMITED, FDK CORPORATION
    Inventors: Jun Inami, Katsuji Hirabayashi, Manabu Teranishi
  • Patent number: 9979157
    Abstract: An external resonator type light-emitting device includes a light source oscillating a semiconductor laser light and a grating element configuring an external resonator together with the light source. The light source includes an active layer oscillating said semiconductor laser light. The grating element includes an optical waveguide and a plurality of Bragg gratings formed in the optical waveguide. The optical waveguide includes an incident face to which the semiconductor laser light is incident and an emitting face from which an emitting light having a desired wavelength is emitted. A half value reflectance R50 is larger than a reflectance R2 at an emitting end of the light source. A half value reflectance R50 is 3% or larger. A combined reflectance is not less than the half value reflectance R50 in a wavelength region ??50.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: May 22, 2018
    Assignee: NGK Insulators, Ltd.
    Inventors: Jungo Kondo, Shoichiro Yamaguchi, Tetsuya Ejiri
  • Patent number: 9971088
    Abstract: An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: May 15, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Michael Renne Ty Tan, Sagi Varghese Mathai, Joseph Straznicky
  • Patent number: 9965433
    Abstract: A converter module is provided that is configured to provide data connectivity between at least two external devices, where the converter module comprises a pair of first connectors and up to eight second connectors. The pair of first connectors is configured to be plugged into and interfaced with ports on a first external device. The second connectors are configured to receive and interface with cables. The converter module also comprises a demultiplexing and multiplexing unit that is configured to split signals received via the pair of first connectors or combine signals received by plurality of second connectors. The pair of first connectors receive and couple signals at a first data rate, while the second connectors receive and couple signals at a second data rate. The first data rate may be four times the second data rate.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: May 8, 2018
    Assignee: Cisco Technology, Inc.
    Inventor: Franco Tomada
  • Patent number: 9964716
    Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: May 8, 2018
    Assignee: WAVEFRONT RESEARCH, INC.
    Inventors: Randall C. Veitch, Thomas W. Stone
  • Patent number: 9935403
    Abstract: A pluggable module includes a pluggable body having a top and channel walls extending above the top defining a cooling channel along the top. The cooling channel allows airflow between a front end and a mating end of the pluggable body. The pluggable module includes a communication circuit board held in the pluggable body. The pluggable module includes an EMI shield coupled to the pluggable body above the top. The EMI shield has a shield plate spanning the cooling channel. The shield plate is metal and provides electrical shielding across the cooling channel. The shield plate has openings allowing airflow therethrough to flow through the cooling channel.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: April 3, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Eric David Briant, Nikhil Shankar
  • Patent number: 9927681
    Abstract: Provided is a lens driving device which includes: a lens holder including a coil; a frame for receiving the lens holder; a driving circuit board disposed below the frame; a plurality of first conductive elastic bodies disposed in a manner to keep the lens holder moving in a Z-axis direction; and a plurality of second conductive elastic bodies disposed in a manner to keep the frame moving in a direction perpendicular to the Z-axis direction. The lens driving device further comprises a plurality of electrical contact-oriented Z-axis position sensor. The Z-axis position sensor senses the motion of the lens holder in the Z-axis direction. An electronic circuit between a portion of the plurality of electrical contacts and the coil of the lens holder comprises a Molded Interconnect Device and a portion of the first conductive elastic bodies. The Molded Interconnect Device is disposed on the frame.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: March 27, 2018
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Shu-Shan Chen, Cheng-Kai Yu, Bing-Ru Song
  • Patent number: 9897770
    Abstract: A novel, hybrid optical fiber stub device comprises a first ferrule transparent to UV light and a second ferrule including a conventional material. An optical fiber is disposed through the first ferrule and second ferrule. The input and output faces of the optical fiber are prepared suitable for optical coupling. A photonic device is coupled to the first optical fiber surface. A UV curable epoxy is disposed between the photonic device and the first optical fiber surface. The UV curable epoxy includes an index of refraction between an index of refraction of the first optical fiber and an index of refraction of the photonic device. A second optical fiber is coupled to the first optical fiber.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: February 20, 2018
    Assignee: Semtech Corporation
    Inventors: Christopher A. Park, Nayla El Dahdah
  • Patent number: 9887782
    Abstract: An example embodiment includes an optoelectronic module. The optoelectronic module may be configured to transmit out-of-band (OOB) data as an average optical power difference between optical signals. The optoelectronic module may include a first optical source, a second optical source, and an optical power control device. The first optical source may be configured to generate a first optical signal including first channel payload data on a first optical channel. The second optical source may be configured to generate a second optical signal including second channel payload data on a second optical channel. The optical power control device may be configured to vary average optical powers of one or more of the first optical signal and the second optical signal to create an average optical power difference between the first optical signal and the second optical signal that is representative of a logical bit of the OOB data.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: February 6, 2018
    Assignee: FINISAR CORPORATION
    Inventor: Lucy G. Hosking
  • Patent number: 9880069
    Abstract: An optical fiber test apparatus includes an optical power meter operable to detect light at a predetermined wavelength, and a laser source operable to generate a visible laser beam. The optical fiber test apparatus further includes an optical fiber extending between a first end and a second end, and a diplexer which includes a first optical connector and is coupled to the optical power meter, the laser source, and the first end of the optical fiber. The optical fiber test apparatus further includes a second optical connector coupled to the second end of the optical fiber and including a test port. The diplexer is operable to transmit light at the predetermined wavelength from the second optical connector to the optical power meter and transmit the visible laser beam from the laser source to the second optical connector.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: January 30, 2018
    Assignee: AFL Telecommunications LLC
    Inventors: Sean Patrick Adam, Dale Channing Eddy, Scott Prescott
  • Patent number: 9880367
    Abstract: A single hybrid electrical/optical connector simultaneously forms both electrical and optical input/output connections by a single step engagement between elements on a connector and corresponding elements of the opposite gender on a mating connector. The connector can be surface-mounted on a circuit board, and a mating connector can be vertically pluggable onto the connector. The optical elements on the connector and/or the mating connector can be detachable, which can simplify assembly of a system that includes the circuit board. The hybrid electrical/optical connector has applications for optical transceivers. The hybrid electrical/optical connector includes a housing that extends laterally along a housing plane. The housing includes electrical and optical sockets thereon. In some examples, the electrical sockets and the optical sockets are laterally arranged on opposite sides of a division plane perpendicular to the housing plane.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: January 30, 2018
    Assignee: Intel Corporation
    Inventors: Donald Faw, Zining Huang, Ansheng Liu
  • Patent number: 9874711
    Abstract: A fiber optic cassette includes a body defining a front and an opposite rear. A cable entry location, such as a multi-fiber connector, is defined on the body for a cable to enter the cassette, wherein a plurality of optical fibers from the cable extend into the cassette and form terminations at one or more single or multi-fiber connectors adjacent the front of the body. A flexible substrate is positioned between the cable entry location and the connectors adjacent the front of the body, the flexible substrate rigidly supporting the plurality of optical fibers. Each of the connectors adjacent the front of the body includes a ferrule. Dark fibers can be provided if not all fiber locations are used in the multi-fiber connectors. Multiple flexible substrates can be used with one or more multi-fiber connectors.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: January 23, 2018
    Assignees: CommScope Asia Holdings B.V., CommScope Technologies LLC
    Inventors: Paul Schneider, Alexander Dorrestein, James Joseph Eberle, Jr.