Abstract: A substrate processing apparatus includes: a substrate rotator configured to hold and rotate a substrate; an outer cup configured to annularly cover a periphery of the substrate held by the substrate rotator; an inner cup disposed inside the outer cup and under the substrate held by the substrate rotator; an annular drain formed between the outer cup and the inner cup to discharge a processing liquid supplied to the substrate outward; and an exhaust passage formed inside the inner cup, wherein the inner cup has an exhaust hole through which a liquid reception space, which is formed by the inner cup and the outer cup, and the exhaust passage are in communication with each other, and the exhaust hole is formed obliquely downward from an outer surface to an inner surface of the inner cup.

Abstract: A liquid ejection apparatus capable of suppressing the amount of liquid to discharge by recovery processing is provided. The liquid ejection apparatus includes: a first path fluidly connected to an ejection port unit and provided with a deformable region; and a second path fluidly connected to the first path via the ejection port unit and provided with a deformable region. Here, a flow of liquid is generated between the first path and the second path by a displacement unit.

Abstract: A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.

Abstract: A device includes a wafer chuck, a first nozzle, an actuator, and a first elongated cup. The first nozzle is disposed over the wafer chuck. The first elongated cup is coupled to the actuator. The actuator is capable of moving the first elongated cup from a first position to a second position. The first elongated cup shields the first nozzle from the wafer chuck at the first position. The first elongated cup is free of shielding the first nozzle from the wafer chuck at the second positon.

Abstract: A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit. A pair of the solution treating units are both arranged and carry out the solution treatment in a same chamber.

Abstract: A method includes a first step of vertically moving the arm or the pins from a reference position in one direction by a predetermined distance, a second step of moving the arm in a horizontal direction, a third step of vertically moving the arm or the pins moved in the one direction in the other direction by a distance equal to or greater than the predetermined distance, a fourth step of detecting a horizontal position of the substrate held by the arm with respect to the arm. The steps are repeated. Whenever the processes are performed, the reference position in the first step is shifted in the one direction by the predetermined distance, and a vertical position of the arm or the pins which is obtained when the horizontal position of the substrate detected in the fourth step is deviated from a preset position is taught as the delivery position.

Abstract: A dispensing head for dispensing a developer onto a substrate is provided. The dispensing head includes a housing configured to receive the developer. The dispensing head further includes at least one liquid outlet provided on the housing. The liquid outlet is configured to spray the developer onto an elongated area on the substrate. Also, the liquid outlet is configured to spray the developer along a dispensing direction that is tilted with respect to the normal direction of the substrate and perpendicular to the long-axis direction of the elongated area.

Abstract: A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.

Abstract: A development roller includes a substantially cylindrical development sleeve that has an axis and rotates about the axis; and a magnet portion that is provided in the development sleeve and has plural magnetic poles. The development sleeve has a surface and a groove in the surface along a direction of the axis. The development sleeve has an outer peripheral surface and the groove has a bottom portion, the development sleeve having a deflection of the outer peripheral surface in a radial direction of the development sleeve being larger than about 20 ?m and smaller than about 30 ?m, and a deflection of the bottom portion in the radial direction being equal to or smaller than about 35 ?m.

Abstract: There is provided a periphery coating method of coating a coating liquid on a periphery region of a substrate. The method includes performing a scan-in process of moving the coating liquid nozzle from an outside of an edge of the substrate to a position above the periphery region of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle; and performing a scan-out process of moving the coating liquid nozzle from the position above the periphery region of the substrate to the outside of the edge of the substrate while rotating the substrate and discharging the coating liquid from the coating liquid nozzle. Further, in the scan-out process, the coating liquid nozzle is moved at a speed lower than a speed at which the coating liquid is moved to a side of an edge of the substrate.

Abstract: In an apparatus for performing a substrate developing process, a first washing tank and a second washing tank are disposed on both sides of a substrate support section for supporting the substrate opposite to each other to wash a developing nozzle. The developing nozzle moves in a horizontal direction from the first washing tank toward the second washing tank and supplies a developing solution onto the substrate in the meantime. After supplying the developing solution, the developing nozzle is received in the second washing tank, and the developing solution adhered to the developing nozzle is removed by a washing solution in the second washing tank.

Abstract: A coating apparatus includes a liquid film forming mechanism configured to form a liquid film of a process liquid for preventing a contaminant derived from a coating liquid from being deposited or left on a back side peripheral portion of a substrate. The liquid film forming mechanism includes a counter face portion facing the back side peripheral portion of the substrate and a process liquid supply portion for supplying the process liquid onto the counter face portion. The coating apparatus further includes a posture regulating mechanism disposed around the substrate holding member and configured to damp a vertical wobble of the peripheral portion of the substrate being rotated. The posture regulating mechanism includes delivery holes arrayed in a rotational direction of the substrate and configured to deliver a gas onto a back side region of the substrate on an inner side of the peripheral portion.

Abstract: The present invention provides a rinsing method capable of satisfactorily rinsing the surface of a resist film regardless of the condition of the surface of the resist film so that development defects caused by residuals produced by development may be reduced. A rinsing method of rinsing a substrate processed by a developing process for developing an exposed pattern comprises the steps of discharging a rinsing liquid onto a central part of the substrate processed by the developing process and coated with a developer puddle while the substrate is stopped or rotated (step 5), stopping discharging the rinsing liquid in a state where the developer puddle remains at least in a peripheral part of the substrate (step 6), and rotating the substrate at a high rotating speed to shake the developer remaining on the substrate off the substrate together with the rinsing liquid (step 7).

Abstract: A substrate processing apparatus is configured to provide in series a plurality of processing blocks, each block including a processing unit and a transport robot transporting a substrate. A substrate rest is provided in a connecting portion of adjacent processing blocks. A sensor plate with sensor coils is provided spanning over support pins of the substrate rest. Once a temperature-measurement substrate with temperature-measuring elements, each element formed by connecting a coil to a quartz resonator, is placed on the support pins, a transmitter-receiver transmits transmission waves corresponding to the characteristic frequencies of the quartz resonators to the temperature-measuring elements through the sensor coils. After the stop of the transmission, the transmitter-receiver receives electromagnetic waves from the temperature-measuring elements through the sensor coils, and the temperature computer computes the substrate temperature based on the frequencies of the electromagnetic waves.

Abstract: The present invention provides a rinsing method capable of satisfactorily rinsing the surface of a resist film regardless of the condition of the surface of the resist film so that development defects caused by residuals produced by development may be reduced. A rinsing method of rinsing a substrate processed by a developing process for developing an exposed pattern comprises the steps of discharging a rinsing liquid onto a central part of the substrate processed by the developing process and coated with a developer puddle while the substrate is stopped or rotated (step 5), stopping discharging the rinsing liquid in a state where the developer puddle remains at least in a peripheral part of the substrate (step 6), and rotating the substrate at a high rotating speed to shake the developer remaining on the substrate off the substrate together with the rinsing liquid (step 7).

Abstract: A system and method for coding an intermediate film element, e.g., an interpositive or an internegative, in an effective manner while maintaining the integrity of the film element. A first coat of a stabilizer is applied to frames of a selected scene. A second coat of stabilizer is applied, and a third coat of stabilizer is thereafter applied. A security code according to the present invention may be applied to specifically selected locations on a reel or footage so as to create a unique code which is traceable to, e.g., a specific laboratory.

Abstract: The present invention provides a rinsing method capable of satisfactorily rinsing the surface of a resist film regardless of the condition of the surface of the resist film so that development defects caused by residuals produced by development may be reduced. A rinsing method of rinsing a substrate processed by a developing process for developing an exposed pattern comprises the steps of discharging a rinsing liquid onto a central part of the substrate processed by the developing process and coated with a developer puddle while the substrate is stopped or rotated (step 5), stopping discharging the rinsing liquid in a state where the developer puddle remains at least in a peripheral part of the substrate (step 6), and rotating the substrate at a high rotating speed to shake the developer remaining on the substrate off the substrate together with the rinsing liquid (step 7).

Abstract: A developing apparatus includes two rotating members respectively having parallel horizontal axes of rotation and disposed longitudinally opposite to each other, a carrying passage forming mechanism extended between the rotating members to form a carrying passage, and capable of moving along an orbital path to carry a wafer supported thereon along the carrying passage, a sending-in transfer unit disposed at the upstream end of the carrying passage, a sending-out transfer unit disposed at the downstream end of the carrying passage, a developer pouring nozzle for pouring a developer onto the wafer, a cleaning nozzle for pouring a cleaning liquid onto the wafer, and a gas nozzle for blowing a gas against the wafer. The developer pouring nozzle, the cleaning nozzle and the gas nozzle are arranged in that order in a direction in which the wafer is carried along the carrying passage.

Abstract: A coating and developing system that includes two rotating members having parallel horizontal axes of rotation and disposed longitudinally opposite to each other, a carrying passage forming mechanism extended between the rotating members to form a carrying passage, and capable of moving along an orbital path to carry a wafer supported thereon, a sending-in transfer unit disposed at the upstream end of the carrying passage, a sending-out transfer unit disposed at the downstream end of the carrying passage, a developer pouring nozzle for pouring a developer onto the wafer, a cleaning nozzle for pouring a cleaning liquid onto the wafer, and a gas nozzle for blowing a gas against the wafer. The developer pouring nozzle, the cleaning nozzle, and the gas nozzle are arranged in a direction in which the wafer is carried along the carrying passage between the upstream and the downstream end of the carrying passage.

Abstract: In the present invention, a substrate transfer unit into/from which a substrate is transferred from/to the outside of a treatment container and a developing treatment unit in which development of the substrate is performed are arranged side by side in the treatment container, and a carrier mechanism is provided which carries the substrate while grasping an outside surface of the substrate from both sides, between the substrate transfer unit and the developing treatment unit. A developing solution supply nozzle for supplying a developing solution onto the substrate and a gas blow nozzle for blowing a gas to the substrate, are provided between the substrate transfer unit and the developing treatment unit and above a carriage path along which the substrate is carried, and a cleaning solution supply nozzle is provided in the developing treatment unit for supplying a cleaning solution onto the substrate.

Abstract: A photo development apparatus for use in fabricating a color filter substrate for a display panel is disclosed. The disclosed photo apparatus includes a development solution supplier to supply a negative development solution. The photo apparatus also includes a first photo apparatus to form a positive photo-resist pattern to be used in forming a black matrix, wherein the positive photo-resist pattern is formed by patterning a light shielding layer formed on a substrate using the negative development solution and a positive photo-resist.

Abstract: A processing chamber actually performs a heating process for a substrate. The processing chamber has an upper plate, a lower plate, and an exhaust opening. The upper plate heats a resist from a front surface of the substrate. The lower plate heats the resist from a rear surface of the substrate. The exhaust opening exhausts gas from the processing chamber. The upper plate is disposed in such a manner that it can be raised and lowered in the processing chamber by an upper air cylinder that composes an upper driving mechanism. The lower plate is disposed on a floor of the processing chamber. The exhaust opening is connected to a pump through a pipe. Heating temperature and heating time of the upper plate and the lower plate are controlled by a heating control portion. A pressure in the processing chamber is controlled by a pump. The pump is controlled by a pressure controlling portion.

Abstract: An optical sensor for detecting the housing state such as the thickness of a substrate in the present invention is provided at supporting arms. The supporting arms are attached to a supporting shaft. The supporting arms are in a vertical state in a state before detection of the substrate, but when detecting, the supporting shaft rotates to bring the supporting arms into a horizontal state so that the optical sensor enters a substrate housing body and is set at a predetermined detection position. Accordingly, a space for moving the optical sensor in the horizontal direction becomes unnecessary to reduce the space required for the detecting operation and the like, making it possible to reduce the size of a substrate processing apparatus in which the detecting apparatus is incorporated.

Abstract: Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coated on the wafer W or rinsing solution 326 on the wafer W. Thus, the impact against the wafer W can be suppressed. As a result, pattern collapse can be prevented. In addition, a front portion of the developing solution 350 can push away the developing solution 350.

Abstract: Disclosed are a method of reducing biological contamination in an immersion lithography system and an immersion lithography system configured to reduce biological contamination. A reflecting element and/or an irradiating element is used to direct radiation to kill biological contaminates present with respect to at least one of i) a volume adjacent a final element of the projection system or ii) an immersion medium supply device disposed adjacent the final element.

Abstract: The invention discloses a developing apparatus and a developing process. Wherein the developing process comprises following steps. First, a developing apparatus and a substrate are provided, wherein the developing apparatus comprises a conveyer and a nozzle. Then, the substrate is conveyed along a first direction by the conveyer, and the nozzle is driven to move along a second direction opposite to the first direction, wherein the nozzle sprays a developer over the substrate as moving. As mentioned above, the non-uniformity of development can be reduced.

Abstract: Disclosed is a processing device of a photo-sensitive material which comprises a conveying device for conveying a photo-sensitive material, a slot die for applying a processing liquid to the photo-sensitive material conveyed by the conveying device, a reservoir tank of the processing liquid, a supply device of the processing liquid for supplying a processing liquid in the reservoir tank of the processing liquid to the slot die, a support roll of the photo-sensitive material arranged at a position opposite to and spaced from a tip of the slot die, a device for detecting a photo-sensitive material, and a driving device for rotating the support roll of the photo-sensitive material which can rotate the support roll at least in the direction reverse to a conveying direction of the photo-sensitive material.

Abstract: A developing apparatus and method is provided in which the use amount of a developing solution can be reduced without deteriorating the accuracy of development. The developing apparatus comprises a new solution tank for storing an unused developing solution and a used solution tank for storing a used developing solution which is withdrawn from a material to be treated. A new solution feeding nozzle extends from the new solution tank, and the tip end of the nozzle faces toward the upper portion of the cup of each developing unit. A used solution feeding nozzle extends from the used solution tank, and the tip end of the nozzle faces toward the upper portion of the cup of each developing unit.

Abstract: A method for making a photosensitive resin printing plate which comprises at least (1) the exposure step of forming a latent image in an aqueous-developable photosensitive resin layer of a printing plate material by irradiating the printing plate material with a ray of active light, (2) the development step of forming a relief image from the latent image by dissolving or dispersing the photosensitive resin layer that forms the latent image into a developer that contains water as a main component, and (3) the drying step of removing the developer from the printing plate having the relief image, the method being characterized in that a photosensitive resin layer component-dissolved or dispersed developer produced in the development step is subjected to a reduced pressure distillation, and is therefore reused as a developer, and a residue produced by the reduced pressure distillation is solidified.

Abstract: The present invention provides a resist development processor consisting of a development processing chamber for storing a resist substrate having an exposed resist on the substrate and for developing the exposed resist by means of a development solvent consisting of a supercritical fluid; and a supercritical fluid container for storing a supercritical fluid, where the supercritical fluid container is connected to the development processing chamber through a valve.

Abstract: A development apparatus for discharging a developer onto a surface of a semiconductor substrate (15) comprises a nozzle pipe (13) for supplying the developer, and a nozzle (14) having a shape of a spoon with a taper and discharging the developer supplied by the nozzle pipe onto the surface of the substrate. The nozzle sprays the developer onto the surface of the substrate at any spray angle under a low and constant pressure.

Abstract: An apparatus for washing contaminants from a coated surface of a material comprises an inclined substantially planar surface up which the material is passed, an inlet for the introduction of wash solution at the upper part of the planar surface and pressure applying means for holding the material in full contact with the surface.

Abstract: There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.

Abstract: The invention relates to a photographic processor and a method of processing photographic material. The photographic processor is adapted to achieve a high speed processing of photographic material by utilizing the combination of a vacuum platen and a stacker arrangement that is adapted to hold the media for a time necessary to process and/or dry the media. The system permits media to be fed to a first vacuum platen where a first solution is applied. The platen transports the media to a first vertical stacker arrangement, which holds the media for a desired processing time for the first solution. The media can then be pushed through a stop solution, if needed, and onto a second vacuum platen where a second solution can be applied. The media is then delivered to second vertical stacker arrangement that is designed to assure the proper amount of processing time for the second solution.

Abstract: Embodiments of the present invention provide a developing method, which can efficiently prevent the developing solution from remaining on the backside surface of the wafer, so as to avoid the influence of the contamination on the subsequent processes. In one embodiment, a developing method comprises providing a wafer in a reaction space, wherein the wafer has an exposed photoresist thereon; coating a developing solution on a surface of the wafer; rotating the wafer; rinsing a normal surface and a backside surface of the wafer; and stopping rinsing the normal surface of the wafer while keeping rinsing the backside surface of the wafer for a specific time period.

Abstract: A method of preparing a roll of film for development. The method involves inspecting the film for defects and imperfections as the film is unwound from a magazine. A method of preparing a roll of film for development and developing the film is also disclosed. The development of the film involves conveying the film to a development station and controlling a temperature of the development station.

Abstract: A digital film processing system and film processing solution cartridge are disclosed. The cartridge comprises a housing and a chamber for storing a film processing fluid. The processing solution may be contained within a flexible bladder within the chamber. The cartridge may also include an integral applicator for coating the processing solution onto undeveloped film. The cartridge is generally removeably attached to the film processing system, but may also be refillable.

Abstract: The present invention provides a photosensitive material processing apparatus in which a photosensitive material is processed with a processing solution. Reliable liquid displacement in the vicinity of the surface of a photosensitive material, and uniform temperature adjustment can be performed. Also, damage or a transport deficiency, caused by a corner of the material coming into a through hole when a conveyance path of the photosensitive material is formed can be prevented. When pre-washing processing is carried out prior to development processing using a developer, processing unevenness in which an overcoat layer partially remains can be prevented. An operation of mounting and removing conveyance rollers disposed in a pair is facilitated and a proper nipping force can be imparted between a conveyance roller pair. Mounting of a replenisher case filled with a replenisher is facilitated and a replenisher is kept from remaining in piping or in a replenisher case.

Abstract: A method of developing a latent image on a photographic element (such as imagewise exposed photographic film) by absorbing a dye precursor into the film, applying a developer solution to the film to develop the latent image and form a dye in the film, scanning the film with light, and detecting at least one of light reflected away from and light transmitted through the film.

Abstract: Disclosed herein are a method and apparatus for efficiently processing workpieces which are developed using a liquid developer. According to the invention a first set of workpieces is obtained from an imaging station, a second set of workpieces is obtained from a workpiece collection device, and the workpieces from the first and second sets are aligned in a contiguous arrangement, with the workpieces from the first set preferably being interspersed with those from the second set. Developer is then applied to the group of contiguous workpleces, thereby reducing the amount of overrun or overspray of developer that would otherwise result from individual processing of workpieces. The invention is particularly well-suited for use in preparing lithographic printing plates.

Abstract: The invention relates to the application of a uniform film of a fluid to the surface of a flat workpiece as it is being conveyed through a workstation. The invention is specifically directed to the development of lithographic printing plates and comprises the application of the thin film of developer solution to each plate in a controlled manner using a wire-wound coating device and a unique manner of metering and feeding fresh fluid to the wire-wound device. Specifically, the fluid is gently fed onto the wire-wound device by simple volumetric displacement and overflow from the inside of a hollow tube onto the wire and the flow is controlled by sensing the beginning and end of each workpiece or plate. The hollow tube may be the wire-wound component or it may be a tube mounted above the wire-wound component. The spent developer is rinsed and sent to waste. According to the invention, only fresh developer solution is applied at a uniform film thickness, thereby achieving uniform image development.

Abstract: A printing plate processing apparatus provides a step in which a printing plate which has undergone image exposure is processed by being immersed in a developing solution, and the printing plate is delivered while the developing solution is being squeezed out from the printing plate by a conveying roller pair which is partially immersed in the developing solution. A stoppage time of the apparatus is measured, and the conveying roller pair is driven to rotate for an amount of time set in accordance with a measured result of the stoppage time when operation of the apparatus is started, thereby allowing the conveying rollers to be cleaned. A concentration of carbon dioxide in an environment in which the apparatus is installed is detected, and based on the detected result and the measured result of the apparatus stoppage time, the driving time of the conveying roller pair is set.

Abstract: The present invention relates to a method for developing a photoresist pattern. The method consists of mixing a concentrated chemical solution with a solvent to obtain a diluted chemical solution of a predetermined concentration. In this method, the mixing is done in a fabrication facility where the substrates are processed. The diluted chemical solution is then applied onto the photoresist pattern. Analysis of the pattern is then carried out to detect any defects or pattern collapse on the substrate. In the event that defects and/or pattern collapse occur, the predetermined concentration is adjusted to reduce the phenomenon.

Abstract: A substrate (SW) is rotatably held in an approximately horizontal position by a wafer holding and rotation mechanism (810). One end of a rinsing liquid supply nozzle (840) is rotatably supported by a rinsing liquid supply nozzle rotation supporting mechanism (850) to pass over the substrate (SW). In response to rotation of the rinsing liquid supply nozzle (840), the rotation axis of the rinsing liquid supply nozzle (840) moves in a direction closer to or away from the rotation axis of the substrate (SW), whereby the amount of projection of a tip portion of the rinsing liquid supply nozzle (840) is reduced.

Abstract: The present invention relates to a photographic processing system and a method of processing photographic media, wherein a conveying member having slots therein is provided on top of a vacuum chamber and is used to convey photographic media to be processed. A processing solution supply member applies processing solution onto the photographic media on the conveying member, and a vacuum air source is adapted to apply a vacuum suction force to the vacuum chamber to hold the sheet of photographic media flat either during the application of processing solution to the media or after the processing solution is applied to the media.

Abstract: On the occasion of developing processing, a mixed solution produced by stirring a developing solution and a solution with a specific gravity smaller than the developing solution is supplied to the front surface of a substrate and left as it is for a fixed period of time. After the mixed solution is separated into two layers of which the lower layer is the developing solution and the upper layer is the solution, developing progresses all at once in the entire surface of the substrate. Hence, time difference in start time of developing does not occur in the surface of the substrate, thereby enabling uniform developing and an improvement in line width uniformity of a resist pattern film in the surface of the substrate.

Abstract: A developer unit for a wet-type color image forming apparatus. The developer unit includes a developer bath filled with a liquid developing agent to a predetermined depth, and a developing roller that develops an electrostatic latent image formed on a photoreceptor to correspond to an original image by supplying the liquid developing agent while being partially immersed in the liquid developing agent. The developer unit further includes a cleaning roller that cleans the surface of the developing roller, a depositing roller that deposits the liquid developing agent onto the cleaned surface of the developing roller, and a metering roller that adjusts the thickness and concentration of the liquid developing agent deposited onto the surface of the developing roller by the depositing roller to suitable levels to develop the electrostatic latent image. The developer unit also includes a developer cartridge that supplies the liquid developing agent into the developer bath.

Abstract: Provided is a method for increasing an etching selectivity of photoresist material. The method initiates with providing a substrate with a developed photoresist layer. The developed photoresist layer on the substrate is formulated to contain a hardening agent. Next, the substrate is exposed to a gas, where the gas is formulated to interact with the hardening agent. A portion of the developed photoresist layer is then converted to a hardened layer where the hardened layer is created by an interaction of the hardening agent with the gas. Some notable advantages of the discussed methods of increasing the selectivity of a photoresist include improved etch profile control. Additionally, by combining fabrication steps such as the hardening of the photoresist in an etch chamber, downstream etching processes may be performed without having to transfer the wafer to an additional chamber, thereby improving wafer throughput while minimizing handling.

Abstract: The invention relates to the application of a uniform film of a fluid to the surface of a flat workpiece as it is being conveyed through a workstation. The invention is specifically directed to the development of lithographic printing plates and comprises the application of the thin film of developer solution to each plate in a controlled manner using a wire-wound coating device and a unique manner of metering and feeding fresh fluid to the wire-wound device. Specifically, the fluid is gently fed onto the wire-wound device by simple volumetric displacement and overflow from the inside of a hollow tube onto the wire and the flow is controlled by sensing the beginning and end of each workpiece or plate. The hollow tube may be the wire-wound component or it may be a tube mounted above the wire-wound component.

Abstract: One embodiment is a system for the development of a film includes an infrared light source and a visible light source. The system also includes at least one sensor operable to collect a first set of optical data from light associated the infrared light source and a second set of optical data from light associated with the visible light source. The system further includes a processor in communication with the at least one sensor, the processor operable to determine an image on the film in response to the first and second sets of optical data.