Abstract: A method of manufacturing a semiconductor optical device includes a step of bonding a semiconductor element to a substrate that includes silicon, the semiconductor element being made of a III-V compound semiconductor and having optical gain; after the step of bonding the semiconductor element, a step of molding the semiconductor element by wet-etching; and after the step of molding the semiconductor element, a step of forming a mesa at the semiconductor element. The substrate includes a waveguide, a groove that extends along the waveguide, a terrace that is positioned on a side of the groove opposite to the waveguide, and a wall that covers the groove. The step of bonding the semiconductor element is a step of bonding the semiconductor element to the waveguide, the groove, the terrace, and the wall of the substrate.

Abstract: A semiconductor device has an interposer. A first semiconductor die with a photonic portion is disposed over the interposer. The photonic portion extends outside a footprint of the interposer. The interposer and first semiconductor die are disposed over a substrate. An encapsulant is deposited between the interposer and substrate. The photonic portion remains exposed from the encapsulant.

Abstract: A system installed in a cross-border area between a provider network of a provider and a customer network of a customer includes: a smart optical network termination device (NT) at a site of the customer, wherein the smart optical NT is configured to implement a demarcation point between the customer network and the provider network, and wherein the smart optical NT is independent of a data rate passing through it and an optical interface connected to it; and a monitoring device located at a point of presence (POP) of the provider network. The smart optical NT is further configured to monitor a coupling of optical power by the customer into the provider network and to interact with the monitoring device via at least one traffic analysis point (TAP) for connectivity validation from the POP to the demarcation point.

Abstract: The photonic integrated chip includes a laser light source configured to generate an optical carrier, a first optical splitter configured to split the optical carrier into a first optical carrier and a second optical carrier, an optical local oscillation generation unit, and a photonic frequency conversion unit. The first optical splitter sends the first optical carrier and the second optical carrier to the photonic frequency conversion unit and the optical local oscillation generation unit. The optical local oscillation generation unit generates an optical local oscillation signal and send the optical local oscillation signal to the photonic frequency conversion unit. The photonic frequency conversion unit converts a first intermediate frequency signal into a first radio frequency signal through photonic up-conversion. The photonic frequency conversion unit converts a second radio frequency signal into a second intermediate frequency signal through photonic down-conversion.

Abstract: An optical module includes an optical source, a first polarization splitter-rotator, a second polarization splitter-rotator, a first port, a second port, a third port, and a fourth port. The optical source produces an optical signal. The first polarization splitter-rotator generates a first source optical signal based at least in part on the optical signal. The second polarization splitter-rotator generates a second source optical signal based at least in part on the optical signal. The first port transmits, to a first device, the first source optical signal and receives, from the first device, a first modulated optical signal. The first polarization splitter-rotator produces a second modulated optical signal. The second port transmits, to a second device, the second source optical signal and receives, from the second device, a third modulated optical signal. The second polarization splitter-rotator produces a fourth modulated optical signal.

Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes a first doped region having a first doping type disposed in a semiconductor substrate. A second doped region having a second doping type different than the first doping type is disposed in the semiconductor substrate and laterally spaced from the first doped region. A waveguide structure is disposed in the semiconductor substrate and laterally between the first doped region and the second doped region. A photodetector is disposed at least partially in the semiconductor substrate and laterally between the first doped region and the second doped region. The waveguide structure is configured to guide one or more photons into the photodetector. The photodetector has an upper surface that continuously arcs between opposite sidewalls of the photodetector. The photodetector has a lower surface that continuously arcs between the opposite sidewalls of the photodetector.

Abstract: A radio frequency module includes a power amplification element, a transmission filter, and a transmission matching element, which are transmission-only components for processing only a transmission signal, a low noise amplification element, a reception filter, and a reception matching element, which are reception-only components for processing only a reception signal, an antenna switch, which is a transmission-reception dual-use component for processing both a transmission signal and a reception signal, and a first module board and a second module board, which are arranged to face each other. The transmission-only components are mounted on a main surface of the first module board, and the reception-only components and the transmission-reception dual-use component are mounted on respective main surfaces of the second module board.

Abstract: A photonic chip. In some embodiments, the photonic chip includes a waveguide; and an optically active device comprising a portion of the waveguide. The waveguide may have a first end at a first edge of the photonic chip; and a second end, and the waveguide may have, everywhere between the first end and the second end, a rate of change of curvature having a magnitude not exceeding 2,000/mm2.

Abstract: The invention relates to a method and apparatus of operating a bidirectional optical transmission link. The optical transmission link includes a first and a second optical transceiver at a dedicated end of the optical transmission link and an optical path connecting the first and second optical transceiver. The optical transceivers apply the methods of converting an electrical digital transmit signal into an electrical PAM-n transmit signal, pre-emphasizing the electrical PAM-n transmit signal) by digital filtering and using the pre-emphasized electrical PAM-n signal2) as modulating signal for optically modulating an optical carrier signal. The optical modulation method deployed is configured to create an optical PAM-n transmit signal with a positive or negative chirp.

Abstract: An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

Abstract: An optical transceiver supports bidirectional communication with another optical transceiver that is a communications partner via a single-mode optical fiber. A surface emitting laser has a T-band oscillation wavelength that is shorter than the cutoff wavelength of the optical fiber. A photodetector has detection sensitivity with respect to the T band. A planar lightwave circuit couples the optical fiber, the surface emitting laser, and the photodetector.

Abstract: In an embodiment an optoelectronic sensor arrangement includes a carrier substrate, an illuminating device, a frequency-selective optical element and a photodetector, wherein the illuminating device and the photodetector form a stacked arrangement on or with the carrier substrate, wherein the frequency-selective optical element is arranged between the illuminating device and the photodetector, wherein the photodetector is arranged in a cavity of the carrier substrate which is covered by the illuminating device and/or the frequency-selective optical element, and wherein the frequency-selective optical element includes a divider mirror and an optical filter.

Abstract: A system, comprising an optical transmitter configured to modulate a pulsed laser signal based on a plurality of data signals to form a plurality of modulated optical data signals, optical time division multiplex the plurality of modulated optical data signals to obtain a multiplexed optical data signal, and transmit the multiplexed optical data signal together with an optical clock signal derived from the pulsed laser signal; and an optical receiver that includes a clock recovery branch configured to recover the optical clock signal into a plurality of phase-shifted recovered optical clock signals and a data branch with a plurality of saturable absorbers (SA), each SA being in optical communication with one of the phase-shifted recovered optical clock signals and configured to receive the multiplexed optical data signal and to transmit of one of the plurality of modulated optical data signals according to the recovered optical clock signal.

Abstract: An LED may be optimized for high speed operation for optical communication systems in a variety of ways. The LED, which may be a microLED, may include dopants and dopant levels allowing for increased speed of operation, the LED may include interlayers, and the LED may include other features.

Abstract: An optical module for bi-directional monochromatic transmission is provided. The optical module includes a substrate, a common terminal, a circulator module, a multiplex-demultiplex (MDM) module, and an input-output terminal. The common terminal is adjacent to the substrate and connected to an optical fiber. The circulator module is on the substrate and in free space optical communication with the common terminal The MDM module is on the substrate and in free space optical communication with the circulator. The input-output terminal is on the substrate and in free space optical communication with the MDM module, the input-output terminal being configured to connect to an emitter and a receiver. The circulator is configured to spatially separate a first directional transmission to the MDM module from a second directional transmission from the MDM module.

Abstract: A communication device includes: a switching unit connected to a transmission unit, a reception unit, a transmission port, and a reception port, the switching unit being set in a first state in which the transmission unit and the transmission port are connected and the reception unit and the reception port are connected or a second state in which the transmission unit and the reception port are connected and the reception unit and the transmission port are connected; a monitoring unit configured to monitor a light level of light input from the reception port or the transmission port; and a control unit configured to set the switching unit in the first state or the second state based on the light level monitored by the monitoring unit.

Abstract: An integrated circuit package integrates a photonic die (oDie) and an electronic die (eDie). More specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the oDie and/or the eDie, where molded material at least partially surrounds the at least one of the oDie and/or the eDie.

Abstract: An interface connector, comprising a housing, a first heat dissipating member, and a second heat dissipating member. A first accommodating space and a second accommodating space are disposed in the housing. The first accommodating space is adjacent to the second accommodating space. The first accommodating space accommodates a first mating connector. The second accommodating space accommodates a second mating connector. The first heat dissipating member is disposed at the outside of the housing and passes through the housing. The first heat dissipating member extends into the first accommodating space to be connected to the first mating connector. The second heat dissipating member is disposed in the housing. The second heat dissipating member extends into the second accommodating space to be connected to the second mating connector.

Abstract: Disclosed herein is a cable device including a cable configured to transmit power and a connector connected to the cable, the cable device including a connector with improved electromagnetic interference (EMI) shielding performance. The cable device includes a cable, and a connector connected to the cable. The connector includes a printed circuit board including a ground electrode, and a shield case provided to accommodate the printed circuit board therein, the shield case including a contact portion provided in direct contact with the ground electrode.

Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.

Abstract: Presented herein are techniques for assigning Ultra-Wideband (UWB) anchors for client ranging. A control device can monitor UWB ranging between a mobile device and a primary anchor. In response to determining that a signal strength between the mobile device and the primary anchor is below a threshold, the control device can identify anchors for which the mobile device has had a signal strength above the threshold during a period of time, and select one of the anchors as a new primary anchor for the mobile device. For example, the control device can select the new primary anchor based on a relative collision tolerance mapping for the new primary anchor and at least one other anchor within a UWB range of the new primary anchor. The control device can send a command causing UWB ranging to be performed between the mobile device and the new primary anchor.

Abstract: A GaN based LED, with an active region of the LED containing one or more quantum wells (QWs), with the QWs separated by higher energy barriers, with the barriers doped, may be part of an optical communications system.

Abstract: At least some aspects of the present disclosure provide for a method. In some examples, the method includes receiving 2-line data in an embedded Universal Serial Bus (eUSB) format. The method further includes encoding the 2-line data into a single signal. The single signal comprises a first symbol corresponding to a first state change of the 2-line data and a second symbol corresponding to a second state change of the 2-line data.

Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.

Abstract: An optical module of the present disclosure includes an optical element, a first optical component that is optically coupled to the optical element, a second optical component that is optically coupled to the first optical component, a receptacle to which an optical fiber that transmits the incident light to the second optical component is connected, a terminal unit that electrically outputs an output signal of the optical element to the outside, and a package that accommodates the optical element, the first optical component, and the second optical component and is provided with the receptacle on a first surface and the terminal unit on a second surface facing the first surface, wherein the wiring extends from the first surface side to the second surface side and electrically connects the second optical component and the terminal unit.

Abstract: An optical receiver capable of substantially measuring the phase and amplitude of a received intensity- or amplitude-modulated optical signal by performing digital-signal processing. In an example embodiment, a DSP of the receiver operates to reduce the detrimental effects of relative phase noise between the optical reference oscillator and optical carrier based on an optical pilot present in the received optical signal. The DSP may employ a sequence of digital filters configured to select a signal component that represents a non-vestigial modulation sideband and then perform signal equalization thereon. The signal equalization may include but is not limited to dispersion compensation. In some embodiments, the optical receiver can be a direct-detection optical receiver. In an example embodiment, the optical reference oscillator and optical carrier are generated using two respective independently running lasers that may or may not be co-located.

Abstract: A transceiver comprises a transmitter including a light source, a modulator coupled to the light source, a driver that drives the modulator according to a set of driving conditions to cause the modulator to output optical signals based on light from the light source, and an output that passes first portions of the optical signals output by the modulator. The transceiver further comprises a first detector that detects second portions of the optical signals output from the modulator, and a receiver including a second detector that detects optical signals from an external transmitter.

Abstract: A photonic chip. In some embodiments, the photonic chip includes a waveguide; and an optically active device comprising a portion of the waveguide. The waveguide may have a first end at a first edge of the photonic chip; and a second end, and the waveguide may have, everywhere between the first end and the second end, a rate of change of curvature having a magnitude not exceeding 2,000/mm2.

Abstract: A box-type packaged optical transceiver with multiplexing capabilities includes a box-shaped housing, a cover plate, an optical receiving module, an optical emitting module, a prism module, and an optical fiber connector. The housing has a through hole and is hermetically sealed by the cover plate. The optical receiving module, the optical emitting module and the prism module are disposed in the internal space. A first incoming optical signal is transmitted to the optical receiving module through the optical fiber connector, the through hole, and the prism module, and the optical emitting module emits an outgoing second optical signal through the prism module, the through hole, and the optical fiber connector.

Abstract: A device includes a photonic integrated circuit having an optical phased array. The optical phased array includes multiple array elements, where each array element includes (i) an antenna element configured to transmit or receive optical signals and (ii) a phase modulator configured to phase-shift the optical signals transmitted or received by the antenna element. The device also includes multiple digital register in integrated circuit (DRIIC) cells, where each DRIIC cell is associated with one of the array elements. The DRIIC cells are configured to receive digital inputs and to provide outputs to the phase modulators of the associated array elements in order to control the phase-shifts of the optical signals transmitted or received by the antenna elements based on the digital inputs.

Abstract: An optical module includes: a casing; a printed circuit board (PCB) connected to a first side wall of the casing and configured to provide first electrical signals to an optical transmitter assembly; the optical transmitter assembly arranged in the casing and configured to convert the first electrical signals into first optical signals; an optical receiver adapter and an optical transmitter adapter arranged outside the casing and connected to a second side wall of the casing, wherein the optical transmitter adapter is configured to receive second optical signals; a first displacement prism arranged in the casing and configured to direct the second optical signals toward an optical receiver assembly; and the optical receiver assembly configured to convert the second optical signals into second electrical signals. At least one component of the optical receiver assembly is arranged in the casing.

Abstract: Space division multiplexers can include adapters between multicore fibers with different core patterns and/or add-drop multiplexers for multicore fibers.

Abstract: An optical network element includes a connection to an optical fiber in an optical line system including a coherent receiver; a microphone configured to detect sound; and circuitry connected to the microphone and configured to cause transmission of information related to sounds detected by the microphone to a receiver at an end of the optical line system, wherein the transmission is over the optical fiber in the optical line system to the coherent receiver. The optical network element can include a polarization controlling device connected to the circuitry and configured to modulate a state-of-polarization (SOP) envelope for the transmission.

Abstract: Methods and apparatus for nonuniformity correction (NUC) for a sensor having an avalanche photodiode (APD) array and an integrated circuit. The sensor can include anode bias control module, a passive mode module, and an active mode module. DC photocurrent from the APD array can be measured and used for controlling an anode reverse bias voltage to each element in the APD to achieve a nonuniformity correction level less than a selected threshold.

Abstract: A vertical cavity surface emitting laser (VCSEL) may include a substrate layer, epitaxial layers on the substrate layer, and angled reflectors configured to receive an optical beam emitted toward a bottom surface of the VCSEL and redirect the optical beam through an exit window in a top surface of the VCSEL. In some implementations, the angled reflectors may be formed in the substrate layer. Additionally, or alternatively, the VCSEL may include molded optics, where the molded optics include the angled reflectors. In some implementations, the exit window may include an integrated lens.

Abstract: An optical transceiver module includes an optical transceiver and a controller. The optical transceiver has a ring filter configured to transmit optical signals from or receive optical signals for the optical transceiver module. The controller is configured to: detect a carrier frequency at the optical transceiver; detect a data signal frequency of data at the optical transceiver; determine a bit error rate of the data; and in response to determining that the bit error rate of the data is greater than a threshold, periodically vary a central wavelength of the ring filter at a frequency at least three orders slower than the data signal frequency.

Abstract: An example device may include an optical configuration configured to transmit a transmitted optical beam and receive a received optical beam, an optical modem, and an optical amplifier. An example optical amplifier may include an optical gain medium and an optical bandpass filter. The transmitted optical beam may have a transmit wavelength selectable from a plurality of transmit wavelength, and may have a different wavelength from the received optical beam. In some examples, the optical configuration may include at least one dichroic element. Various other devices, systems, and methods are described.

Abstract: An optical transceiver is pluggable to any one of a first apparatus and a second apparatus and includes a clock recovery circuit capable of regenerating a clock signal from an electrical signal, a memory storing a first program including a first transmission rate and a second program including a second transmission rate, and a processor executing a program with a higher priority level in a boot process. The processor sets a transmission rate of a program being executed to a transmission rate set value, and operates the clock recovery circuit. In accordance with an interrupt request, the processor sets, based on regeneration or non-regeneration of the clock signal, the priority level of the first or second program that is being executed to be lower than the priority level of the first or second program that is not being executed, and boots up.

Abstract: A wireless power transmission system for a robotic surgical system includes features for optical data transmission. A first component of the surgical system includes a control element, a power transmission element and an optical data transmission element; and a second component of the surgical system including a wireless power receiving element and an optical data receiving element, the second component is removably mountable to the first component. In some embodiments, a barrier such as a surgical drape and/or hermetic enclosure is positioned between the first and second components. In one example, of the components is a robotic manipulator arm and another is a powered instrument removably mountable to the manipulator arm.

Abstract: An optical fiber includes: a first core portion capable of transmitting first light; a second core portion formed on an outer periphery of the first core portion in a structure different from that of the first core portion and capable of transmitting second light different from the first light. The second core portion is formed around the outer periphery of the first core portion, and a center of the second core portion is positioned in a region of the first core portion.

Abstract: This disclosure describes devices and methods related to multiplexing optical datasignals. A method may be disclosed. The method may comprise receiving, by a dense wave division multiplexer (DWDM), one or more optical data signals. The method may comprise combining, by the DWDM, the one or more optical data signals. The method may comprise outputting, by the DWDM, the combined one or more optical data signals to a first circulator. The method may also comprise combining, by the WDM, the second optical data signal and one or more third signals, and outputting an egress optical data signal to an optical switch. The method may also comprise outputting, by the optical switch, the egress optical data signal on a primary fiber.

Abstract: A system and method for performing an in-service optical time domain reflectometry test, an in-service insertion loss test, and an in-service optical frequency domain reflectometry test using a same wavelength as the network communications for point-to-point or point-to-multipoint optical fiber networks while maintaining continuity of network communications are disclosed.

Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.

Abstract: An optical connector includes a housing in which a counterpart optical connector connected to a pair of optical fibers having a first optical fiber and a second optical fiber is fitted, a light emitting side lens portion accommodated in the housing, and in which a first end surface of the first optical fiber in the counterpart optical connector is disposed on one end side, a light receiving side lens portion accommodated in the housing, and in which a second end surface of the second optical fiber in the counterpart optical connector is disposed on one end side, a light emitting element disposed on the other end side of the light emitting side lens portion, and a light receiving element disposed on the other end side of the light receiving side lens portion.

Abstract: An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.

Abstract: Methods and systems for generating an estimate of a bit error rate of a signal are provided. Methods and systems include obtaining an eye mask for a receiver, receiving a signal with the receiver, generating an eye mask probability density function of the eye mask, generating an eye diagram probability density function based on the signal, calculating a product of the eye mask probability density function and the eye diagram probability density function, summing the product of the eye mask probability density function and the eye diagram probability density function, and estimating the bit error rate of the signal based on the summing of the product of the eye mask probability density function and the eye diagram probability density function.

Abstract: An optical module includes a housing including an optical interface, a circuit board module disposed in the housing, a fiber optic receptacle module disposed in the housing and including a plurality of fiber optic receptacles, and an optoelectronic chip disposed in the housing and electrically connected to the circuit board module. The plurality of fiber optic receptacles are connected together and are installed at the optical interface.

Abstract: An integrated circuit package integrates a photonic die (oDie) and an electronic die (eDie). More specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the oDie and/or the eDie, where molded material at least partially surrounds the at least one of the oDie and/or the eDie.

Abstract: Provided herein are various improvements to laser communication ranging. In one example, a method includes converting a ranging signal in a radio frequency (RF) format into an optical format and combining the ranging signal in the optical format with data communications into an optical transmission for receipt by a communication node. The method also includes receiving from the communication node an additional optical transmission comprising additional data communications combined with a retransmitted version of the ranging signal, and determining an indication of a range to the communication node based at least on properties of the retransmitted version of the ranging signal.