Solder Applying Patents (Class 413/21)
  • Patent number: 6626352
    Abstract: A soldering method is designed to seal an on-line transfer device of cable such that a housing of the device is sealed off to prevent the electromagnetic interference. The method includes a first step in which a fusing portion between a receiving seat and a cover of the housing is furnished with a soft solder. The cover is heated to cause the soft solder to melt to flow into the fusion portion, so as to fuse the receiving seat and the cover together. The housing of the device is free of the soldering marks or lumps.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: September 30, 2003
    Inventor: Ching-Chieh Li
  • Publication number: 20020121072
    Abstract: A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.
    Type: Application
    Filed: December 13, 2001
    Publication date: September 5, 2002
    Inventors: Hideyuki Yoshino, Sanae Taniguchi, Mitsuo Zen, Takenori Azuma
  • Patent number: 5277357
    Abstract: A process for making a metal wall enclosure of a package for housing an electronic element. An elongated strip, to be formed as the metal sidewall of the enclosure, and a bottom plate, for closing an open end of the metal sidewall, are formed from a sheet of metal stock. At least one aperture is selectively provided in at least one of the bottom plate and the planar metal strip. The strip is prepared for folding, such as by transverse grooves formed in the strip along predetermined fold lines corresponding to corners of the metal sidewall, to facilitate folding of the strip into the desired configuration of the metal sidewall and with the opposite ends of the strip, as folded to form the metal sidewall, in abutting relationship.
    Type: Grant
    Filed: May 14, 1992
    Date of Patent: January 11, 1994
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Takaharu Miyamoto, Fumio Miyagawa, Tsutomu Higuchi
  • Patent number: 5242254
    Abstract: An end wall 9, for attachment to a container, has a central panel 10 and surrounded by a channel portion 11 which includes a deposit of solder 19 in the form of a paste of solder and flux. The can end 9 is joined by a double seam 23 to a sidewall 12 of a container body. Heating of the double seam melts the solder to create a soldered joint between the end wall and sidewall. The invention is to be used in the manufacture of containers requiring strong double seams and may be used to make containers for carriage of dangerous goods. Apparatus for applying solder pastes to can ends is described in which paste is urged from a pot against convex surface 37 before passing through oulet nozzles 38 onto a can end.
    Type: Grant
    Filed: October 29, 1992
    Date of Patent: September 7, 1993
    Assignee: CarnaudMetalbox plc
    Inventor: George Harold
  • Patent number: 4739918
    Abstract: When the free marginal portions 42 are telescoped within the confines of the peripheral flange 36 preparatory to the soldering operation, inward pressure on the end tank 38 usually is maintained during the soldering operation. Of course, the soldering operation involves the application of heat to both the peripheral flange 36 and the peripheral side wall 40. This sometimes will cause the free marginal portion 42 of the peripheral side wall 40 to deform inwardly away from the peripheral flange 36, thus leaving excessive spacing between the free marginal portion 42 and the peripheral flange 36. In order to avoid this condition, raised dimples 44 are formed in the header plate 34 along the peripheral flange 36 and spaced slightly inward from the latter a distance equal to the thickness of the peripheral side wall 40.
    Type: Grant
    Filed: February 6, 1987
    Date of Patent: April 26, 1988
    Inventors: Bennie J. Stokes, Dyrell K. Stokes
  • Patent number: 4419168
    Abstract: Apparatus is provided for handling gasket-forming material. This material is usually supplied in tubular cartridge form and is dispensed to a screen with a porous pattern which shapes the material to the desired gasket-configuration. The material is spread on the screen and forced through to the other side where the gasket pattern is applied to an adjacent transfer surface of a transfer pad. This pad with the pattern on the transfer surface is moved to a mateable surface of a workpiece located on a support spaced from the screen. The gasket-forming material is then transferred to the mateable surface. The gasket-forming material is dispensed from the cartridge with the aid of a cartridge holder having an opening at one end to receive a spout of the cartridge and having a plunger at the other end with a plunger rod extending outwardly therefrom. A fluid-operated cylinder is aligned with the plunger rod and has a piston connected with the rod.
    Type: Grant
    Filed: October 13, 1981
    Date of Patent: December 6, 1983
    Inventor: William A. Paul
  • Patent number: 4353775
    Abstract: Apparatus is provided for applying a bead of gasket-forming material to a mateable surface of a workpiece. The apparatus includes a source of gasket-forming material and a screen having a predetermined pattern conforming to the desired bead of the gasket-forming material. A spreader applies the gasket-forming material to one side of the screen and the gasket pattern is then formed on an adjacent transfer surface of a transfer pad on the opposite side of the screen. Means are provided for moving the pad with the pattern on the transfer surface and engaging it with the mateable surface of a workpiece mounted on a support spaced from the screen, thereby forming a bead of gasket-forming material on the mateable surface. The transfer surface is moved through an arc of 180.degree. when moving between the screen and the workpiece surface.
    Type: Grant
    Filed: June 10, 1981
    Date of Patent: October 12, 1982
    Inventor: William A. Paul
  • Patent number: 4352712
    Abstract: Apparatus is provided for applying a bead of gasket-forming material to a mateable surface of a workpiece. The apparatus includes a source of gasket-forming material and a screen having a predetermined pattern conforming to the desired bead of the gasket-forming material. A spreader applies the gasket-forming material to one side of the screen and the gasket pattern is then formed on an adjacent transfer surface of a transfer pad on the opposite side of the screen. Means are provided for moving the pad with the pattern on the transfer surface and engaging it with the mateable surface of a workpiece mounted on a support spaced from the screen, thereby forming a bead of gasket-forming material on the mateable surface. The transfer surface is moved through an arc of 180.degree. when moving between the screen and the workpiece surface.
    Type: Grant
    Filed: June 10, 1981
    Date of Patent: October 5, 1982
    Inventor: William A. Paul