Abstract: Various methods and apparatus for handling a plurality of disks and repositioning them into pairs is provided. In one embodiment, a nest is configured to hold a cassette and includes a nest. The nest includes a curved surface with ribs or teeth extending therefrom which define a row of grooves. The grooves are dimensioned to hold a pair of disks in concentric contact merge orientation and the teeth facilitate movement of pairs of disks into the grooves.

Abstract: Apparatus and method for inexpensively storing a quantity of packages awaiting transfer to a manufacturing process station includes a dispenser for quickly removing the packages from the container and directly into a secondary receptacle which is particularly adapted for feeding the packages to the process station. The provision of an inexpensive container to hold the packages is advantageous in that the more expensive secondary receptacles are not tied up for the sole purpose of holding packages which are awaiting the next process station.

Abstract: A semiconductor processing system for wafers or other semiconductor articles. The system uses an interface section at an end of the machine accessible from the clean room. A plurality of processing stations are arranged away from the clean room interface. A transfer subsystem removes wafers from supporting carriers, and positions both the wafers and carriers onto a carrousel which is used as an inventory storage. Wafers are shuttled between the inventory and processing stations by a robotic conveyor which is oriented to move toward and away from the interface end. The system processes the wafers without wafer carriers.

Abstract: An apparatus for transferring wafers between wafer holders such as wafer cassettes, etching drums and the like includes a tank for containing a liquid transfer medium in which the wafers can be transferred. The apparatus includes a wafer transfer unit that can transfer a plurality of wafers such as semiconductor wafers between wafer holders, and maintain the wafers in a desired relative orientation during transfer. For example, the wafers can be maintained in a parallel relationship. The apparatus can be used to automatically transfer wafers to etching drums without cross-indexing of the wafers and without manual handling of the wafers.