Abstract: Described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing. The wafer is subjected to a pressure differential between the top surface and bottom surface so that sufficient force prevents the wafer from moving during processing, the pressure differential generated by applying a decreased pressure to the back side of the wafer.

Abstract: Described are apparatus and methods for processing a semiconductor wafer so that the wafer remains in place during processing. The wafer is subjected to a pressure differential between the top surface and bottom surface so that sufficient force prevents the wafer from moving during processing, the pressure differential generated by applying a decreased pressure to the back side of the wafer.

Abstract: A floor-bound continuous conveyor for intralogistics includes at least one frame and at least one load-carrying means which has a conveying plane for piece goods and which is configured to transport the piece goods in a conveying direction. A stop means is configured to stop an item of piece goods transported on the conveying plane in the conveying direction at a predetermined position on the load-carrying means. A movement apparatus is designed to move the item of piece goods resting against the stop means on the conveying plane from the starting position and orientation thereof standing on the conveying plane of the load handling device into an end position and orientation deviating from the starting position and orientation on the load-carrying means out of the conveying plane of the load-carrying means into the end position and orientation.

Abstract: Certain aspects relate to systems and techniques for detection of undesirable forces on one or more surgical robotic arms. In one aspect, there is provided a system including a robotic arm, including: two linkages, a joint, a torque sensor, and an instrument device manipulator (IDM). The system may further include a processor configured to measure a first torque value at the joint based on an output of the torque sensor and determine a second torque value at the joint based on a position of the robotic arm. The second torque value may be indicative of a gravitational component of the torque between the two linkages. The processor may be further configured to determine a force at the IDM based a difference between the first and second torque values and determine whether the robotic arm has collided with an object or misaligned based on the force at the IDM.

Abstract: A refuse bin includes a liner sealed to a container. An inflatable space is between the liner and the container, and an inlet to the inflatable space conducts a flow to inflate the inflatable space from a deflated state to an inflated state. In the deflated state, the liner lines a cavity for refuse in the container. In the inflated state, the liner extends above the open end of the container. The flow into the inlet pushes the inflatable space toward the inflated state causing the liner to lift the refuse. The refuse bin may further include a lid-lifting mechanism activation by inflation of the inflatable space or an insert that helps shape the liner in the inflated state.

Abstract: An apparatus for rotating an inner stamped part with respect to an outer stamped part is provided. The inner stamped part is nested within an aperture formed within the outer stamped part. The apparatus includes a plurality of grippers that include at least a first gripper positioned at a first edge of the inner stamped part and a second gripper positioned at a second edge of the inner stamped part opposite to the first edge. The plurality of grippers is configured to grip the inner stamped part at the first edge and the second edge, respectively. The plurality of grippers is further configured to rotate the gripped inner stamped part about an axis of rotation. The axis of rotation intersects the first gripper and the second gripper. The plurality of grippers is also configured to open to release the inner stamped part.

Abstract: The device for emptying and then disposing of trays filled with brochures comprises a feed device for transporting the filled trays in a transport direction and a turning device for rotating the trays. The turning device may comprise a slide, which is rotatable and thus movable back and forth along a U-shaped path between a receiving position to receive the trays, an emptying position in which the brochures are pushed out of the trays, and a disposal position, in which the empty trays are disposed of. The device may also comprise at least one pusher element to push the brochures out of the trays when the slide is in the emptying position, and conveying means for conveying the brochures which have been pushed out of the tray.

Abstract: An automated flat mail items handling device includes a rotating apparatus, which rotates the stack during operation from a starting orientation, in which the mail items lie flat, one on top of the other, to a processing orientation, in which the mail items are arranged substantially standing next to each other. The device also includes a holder, which retains the stack while the stack is being rotated, and a transport support, which supports the stack in the processing orientation and by way of which the stack can be moved in a conveying direction. In order to be able to process more mail items per unit of time in the device and by way of the method, the transport support is separate from the rotating apparatus.

Abstract: Postal sorting equipment comprises a sorting machine with an unstacking member (5) and a feed magazine (7). The equipment further comprises storage trays (4) for storing mailpieces (3) and for bringing them into the feed magazine. The magazine has a deck with a first deck portion (22) that is superposed above a second deck portion (23). Each tray (4) has a bottom (26) provided with a groove that is open to the front and to the top of the tray. The first deck portion and the groove of each tray are designed to fit together so that when a tray filled with mailpieces in a stack and on edge is standing on the second deck portion, the first deck portion comes to fit into the groove in the tray under the stack of mailpieces, thereby enabling the mailpieces to be unloaded automatically from the tray.

Abstract: Described are apparatus and methods for processing a semiconductor wafer in which the gap between the wafer surface and the gas distribution assembly remains uniform and of known thickness. The wafer is positioned within a susceptor assembly and the assembly is lifted toward the gas distribution assembly using actuators. The wafer can be lifted toward the gas distribution assembly by creating a fluid bearing below and/or above the wafer.

Abstract: A workpiece separating device for separating workpieces from support sheets includes a lifting unit and a positioning assembly supporting the support sheets with the workpieces adhered. The lifting unit includes a lifting cylinder and two pins raised and lowered by the lifting cylinder. The two pins are raised by the lifting cylinder to push the workpieces, thereby separating the workpieces from the support sheets in turn. A method for separating workpieces from support sheets using the present device is also provided.

Abstract: A separating device for separating workpieces includes a driving unit, a supporting board, and a moving assembly. The supporting board defines a number of sliding grooves spaced from each other. The moving assembly includes a sliding board slidably assembled to the supporting board, and a plurality of first moving blocks for holding workpieces. The sliding board slides along a first direction and defines two latching holes, each extending along a second direction perpendicular to the first direction. Each of the first moving blocks extends through the latching holes to be inserted in one of the sliding grooves. The driving unit drives the sliding board to slide along the first direction. The sliding board forces the number of first moving blocks to slide along the number of sliding grooves.

Abstract: Provided is an apparatus for removing material from a reciprocating floor container. The apparatus may comprise a first member, a flexible sealing portion coupled to the first member and configured to provide a seal between the first member and the container, and a biasing arrangement configured to enable the first member to be moveably attached to a frame member. The biasing arrangement may comprise an actuation mechanism for biasing the flexible sealing portion towards the container. The actuation mechanism may comprise adjustable tension means. In some embodiments of the invention there may also be provided a system comprising a frame member and an apparatus, wherein the frame member is moveable through the container in use.

Abstract: A method for transferring an electronic component supported by a carrier to a desired position on a substrate include moving the carrier supporting the component relative to the substrate while the component is present on a side of the carrier facing towards the substrate, with the component is positioned opposite the desired position on the substrate. Then, a light beam is directed at the carrier, at the location of the component, from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Abstract: A variable tape feeder is provided. The variable tape feeder includes a frame having an accommodating section and a component feeding section on a transfer path that transfers a carrier tape having components packaged with a cover tape. Width adjusters for the transfer path, the accommodating section, and the component feeding section are installed respectively on the transfer path, accommodating section, and component feeding section to adjust widths thereof according to widths of the carrier tape, the accommodating section, and the component feeding section, respectively. Width sensors for the transfer path, the accommodating section, and the component feeding section detect widths adjustment of the transfer path, the accommodating section, and the component feeding section width adjusters, respectively. A controller outputs a response signal in response to signals detected by the respective sensors installed in the component feeding section and the accommodating section.

Abstract: A transfer device for transferring product stacks has a connecting element for connecting the transfer device to a transport device, and the transfer device has a number of receiver regions therein, that each receive a product stack. Each receiver region has guide elements with spring-loaded closure elements, and a plate that is movable in a spring-loaded manner toward the closing elements along the direction of the guide elements. When the transfer device with the product stacks therein reaches its transfer destination, the product stacks are pushed from the transfer device by the plates by spring force.

Abstract: A wafer transfer device and method capable of preventing a wafer from falling off of a carrier. A first carrier receiver holding a first carrier has a box-like shape having an opening through which the first carrier is attached/removed to/from the first carrier receiving member. A second carrier receiver holding a second carrier has a box-like shape having an opening through which the second carrier is attached/removed to/from the first carrier receiving member. The first carrier and the second carrier can be attached/removed to/from the first carrier receiver and the second carrier receiver, respectively. Owing to such a configuration, it is possible to prevent a wafer received in the first carrier and the second carrier from falling off from the first carrier and the second carrier, respectively.

Abstract: A component loader orients a component along its long-axis for transfer from a rotatable load plate. The load plate has an outer peripheral edge and an upper surface inclined from a horizontal plane. Slots on the upper surface terminate at the outer edge of the load plate and are sized to receive at least one elongate chip lying with its long axis perpendicular to the axis of the load plate and in parallel with radius of the load plate. An outer wall conforms to the curvature of the outer edge and is mounted adjacent thereto. A transfer slot extends axially from and into the upper surface of the load plate on outer ends of the slots and terminates at the outer edge of the load plate. Each transfer slot is shaped so that a chip descending therein from a slot has a ninety degree rotation about the long axis.

Abstract: An insert for a carrier board of a test handler is disclosed. The insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch apparatus is installed to the insert pocket, so that the damaged latch apparatus can be easily replaced. The insert has a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes in the lower direction. Thus, the insert can load semiconductor devices regardless of the sizes of the semiconductor devices.

Abstract: A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

Abstract: Tubes (T), coming from a production line, are supplied by means of a grouping unit (1). The grouping unit comprises a conveyor belt (10), with product holders (11) and the tubes are supplied in groups by means of a stepping motor (12). A slider (13) pushes the tubes (T) into the correct position on a mandrel support (20) of a packaging unit (2). The mandrel support (20) comprises a plate (21), which may be moved back and forth by means of a piston/cylinder unit (22) and which may be pivoted from the horizontal holding position into the vertical dispensing position. The tubes are pushed onto mandrels (25) which are mounted on the plate (21), by means of the slider (13), The tubes are thus held in exact alignment and can be filled into the carton (B) without a relative displacement or tilting of the tubes.

Abstract: A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

Abstract: Various methods and apparatus for handling a plurality of disks and repositioning them into pairs is provided. In one embodiment, a nest is configured to hold a cassette and includes a nest. The nest includes a curved surface with ribs or teeth extending therefrom which define a row of grooves. The grooves are dimensioned to hold a pair of disks in concentric contact merge orientation and the teeth facilitate movement of pairs of disks into the grooves.

Abstract: A method and system are disclosed for delivering and feeding a stack of paper to a high-speed sheet feeder. A sheet handling cart is removably connectable to a docking station attached to the high-speed sheet feeder. The sheet handling cart comprises a paper trough which is liftable from the rest of the cart. The paper trough has a trough bottom which longitudinally forms an elongated opening narrower than the bottom of the paper trough, the elongated opening being dimensioned to accommodate a conveyor belt that will protrude upward through the rectangular opening, after the paper trough is lifted from the rest of the cart, in order to advance the stack of paper toward the high-speed sheet feeder.

Abstract: A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: A power tool has a mechanism for ejecting a battery pack which includes a receiving frame which defines a cavity to receive a battery pack. A receiving member is adjacent the cavity. The receiving member meshes with a member on the battery pack to hold the battery pack in the cavity. A biasing member is in the cavity adjacent the receiving member. The biasing member ejects the battery pack from the ejecting mechanism. A member retains the biasing member in the cavity. The member guides a portion of the battery pack meshing with the receiving member into contact with the biasing member such that when the battery pack is locked onto the frame, the biasing member is in a compressed condition and when the battery pack is an unlocked position, the biasing member ejects the battery pack from the frame.

Abstract: According to one aspect of the invention, a system for handling microelectronic dies is provided. Two vertical supports are secured to the frame of the die handler. A wafer support, to support a semiconductor wafer, is mounted between the vertical supports such that the wafer can rotate about its central axis. An ejector arm track is mounted between the vertical supports below the wafer. An ejector arm is mounted to the track for rotation about the central axis of the wafer, and an ejector head is mounted to the ejector arm for translational movement along the ejector arm. A pick arm track is mounted between the vertical supports above the wafer. A pick arm is mounted to the track for rotation about the central axis of the wafer, and a pick head is mounted to the pick arm for translational movement along the pick arm.

Abstract: A plant for unloading stacks (5) of thermoformed products from a cage (4) containing stacks (5), which comprises a support structure (2), at least one support plate (3) for a respective cage (4) containing stacks (5), which is mounted for rotation on the support structure (2), reversible motor (8) to cause the support platen (3) to effect angular movements of a preset amplitude around a horizontal axis, so as to angularly move its respective containing cage (4) between an erect position, in which the stacks (5) of thermoformed products contained therein extend in a substantially vertical direction, and an inclined unloading position, expeller bar (12) designed to expel stacks (5) of thermoformed objects from the cage (4) when the support plate (3) is in inclined unloading position, and a conveyer (20) for receiving stacks (4) of thermoformed objects unloaded from the containing cage (4) located downstream of the unloading position of the support plate (3).

Abstract: Various methods and apparatus for handling a plurality of disks and repositioning them into pairs is provided. In one embodiment, a nest is configured to hold a cassette and includes a nest. The nest includes a curved surface with ribs or teeth extending therefrom which define a row of grooves. The grooves are dimensioned to hold a pair of disks in concentric contact merge orientation and the teeth facilitate movement of pairs of disks into the grooves.

Abstract: A system, method, and apparatus, for resistor tube feeding is disclosed. A tube magazine comprising a length of tubing and adapted for receiving precision resistor cores and compressed air is disclosed. The tube magazine may be connected to a laser spiraller and a terminal welder. The process of filling the tube magazine may be electronically controlled.

Abstract: Apparatus and methods for a wafer handling system that manipulates semiconductor wafers. The invention includes an end effector having a vacuum chuck, an internal vacuum plenum, and flow diverters positioned within the vacuum plenum that define vacuum distribution channels coupled in fluid communication with vacuum ports of the vacuum chuck. The invention also includes a vacuum chuck having flow diverters positioned in one or more internal vacuum plenums that are in fluid communication with the vacuum ports of the vacuum chuck. The flow diverters adjust the vacuum pressure supplied to the vacuum ports such that, as vacuum ports are occluded by the wafer, the vacuum pressure is preferentially applied to unblocked vacuum ports for increasing the attractive force applied to unengaged portions of the wafer. The apparatus of the present invention has particularly utility for securing thin semiconductor wafers with a significant warpage.

Abstract: A wafer transfer machine transfers wafers from either of a first wafer cassette (55) and a second wafer cassette (56) having incompatible registration features into the other, and includes a support plate (30) having a top surface (38) for supporting the first and second wafer cassette. A first and second registration bosses attached to the top surface extend upward into registration features of the first and second wafer cassette, respectively. A carriage (1) is supported by and movable in opposite directions along a track mechanism (41A,B) that is attached in fixed relationship to the support plate (30). First and second wafer pushing members (10A,B) are supported by the carriage. Each wafer pushing member can be moved to push wafers in one of the wafer cassettes into the other by moving the carriage in one direction or the other.

Abstract: An adjustable wafer transfer machine that includes an adjusting mechanism for changing the spacing between adjacent wafers to accommodate placement of the wafers in either a smaller wafer carrier or a larger wafer carrier and a transfer mechanism for transferring the wafers between the smaller wafer carrier and the adjusting mechanism and for transferring the wafers between the larger wafer carrier and the adjusting mechanism. The adjusting mechanism comprises a pair of flat plates disposed parallel to and opposite one another and a plurality of elongated opposing dividers slidably mounted on the plates. The dividers are disposed vertically adjacent to one another at spaced apart intervals and they extend horizontally to support the wafers along a portion of their perimeter. A positioning mechanism is operatively coupled to the dividers for changing the spacing between the dividers and, correspondingly, between the wafers supported on the dividers.

Abstract: An intraocular lens cartridge having a distal injector portion and a proximal shipping portion. The injector portion and the shipping portion are join be a hinge that allows the shipping portion to be rotated so that the lens, when held in the shipping portion, aligns with the bore of the injector portion. The shipping portion may also be flexible so as to provide a prefold to the lens.

Abstract: A commissioning device (1) has essentially vertical product storage units (2) in which products (3) of the same type are stacked, respectively, and at least one conveying means (4), especially a conveyor belt, which is located underneath the product storage units, for transporting outgoing selected or commissioned products. The product (3′) at the very bottom of the stack of a selected product storage unit can be pushed out of the product storage unit in the direction of travel (F) of the moving conveying device and placed in a positioned product field (6) of the conveyor device by an upwardly oriented product stopping device (5) of the conveying device. The product storage units (2) are preferably located at equal intervals above the level of the conveying device (7). If the bottom product (3′) in a stack is not commissioned, the product stops (5) of the moving conveying device (4) pass freely under the product storage unit (2).

Abstract: A processor for processing articles, such as semiconductor wafers, includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. An article extraction mechanism adapted to seal with the pod removes articles from the pod without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism adapted to seal with a pod in the interface section. The article insertion mechanism allows insertion of the articles into the pod after processing by at least one processing station.

Abstract: In a system and method for automatically transporting and precisely positioning a work piece at a station for processing, a relatively low precision transport mechanism is utilized to transfer a chuck that holds the work piece to and from the processing station. Notwithstanding the use of the low precision transport mechanism, the chuck can be precisely positioned at the processing station by using a quasi-kinematic coupling. More specifically, the chuck is precisely located at the coupling by engaging pre-defined indexing notches at the coupling. The chuck is securely held against the coupling at the processing station by suction. The coupling may be supported on a precision stage, which is configured to further position the chuck with the work piece thereon with high precision for processing at the processing station. In another aspect of the invention, the chuck is configured to securely hold a smooth surface of the work piece by suction.

Abstract: An apparatus that is made integral with, attached to or attachable to machines for compacting and baling materials, particularly waste materials. The apparatus generally has a hopper compartment and a conveying assembly attached to a frame. The hopper compartment receives waste materials therein. The conveying assembly has a motor driven conveyor belt for conveying the waste materials from the hopper to the compactor/baler machine through an opening in the housing of the machine. Preferably, the first end of the frame attaches to the door that is used for removing compacted bales from the machine, thereby becoming integral with the machine, so as to allow the apparatus to pivot or swing to and from the machine with the opening and closing of the door. Wheels on the second end of the frame facilitate movement of the apparatus along the ground.

Abstract: A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section.

Abstract: A plant for unloading stacks (5) of thermoformed products from a cage (4) containing stacks (5), which comprises a support structure (2), at least one support plate (3) for a respective cage (4) containing stacks (5), which is mounted for rotation on said support structure (2), drive means (8) to cause said support platen (3) to effect angular movements of a preset amplitude around a horizontal axis, so as to angularly move its respective containing cage (4) between an erect position, in which the stacks (5) of thermoformed products contained therein extend in a substantially vertical direction, and an inclined unloading position, expeller means (12) designed to expel stacks (5) of thermoformed objects from said cage (4) when said support plate (3) is in inclined unloading position, and a conveyer (20) for receiving stacks (4) of thermoformed objects unloaded from said containing cage (4) located downstream of the unloading position of said support plate (3).

Abstract: A wafer lift for lifting a series of vertically oriented wafers arranged parallel to one another in a cassette. The wafer lift includes a vertically movable ramp and a cassette guide positioned over the ramp. The ramp is raised to engage wafers in a cassette supported on the guide so that each wafer is lifted incrementally higher than the preceding wafer.

Abstract: Apparatus and methods for a wafer handling system that manipulates semiconductor wafers. The present invention includes an end effector having a vacuum chuck, an internal vacuum plenum, and a plurality of flow diverters positioned within the vacuum plenum to define vacuum distribution channels in fluid communication with respective vacuum ports of the vacuum chuck. The present invention also includes a vacuum chuck having flow diverters positioned in one or more internal vacuum plenums which are in fluid communication with the vacuum ports of the vacuum chuck. The flow diverters of the vacuum chucks adjust the vacuum pressure supplied to the vacuum ports such that, as vacuum ports are occluded by the wafer, the vacuum pressure is preferentially applied to unblocked vacuum ports for increasing the attractive force applied to unengaged portions of the wafer.

Abstract: A device for mechanically gripping, transporting, loading and unloading cylindrical containers of various sizes for attachment to a robotic arm. The containers may be bottles including drinking water bottles. The device includes a plurality of gripping mechanisms for gripping the containers. Support pins are also provided for supporting the rotational motion of full bottles. A system for efficiently removing empty containers from racks and simultaneously loading full containers is also disclosed.

Abstract: A wafer transfer apparatus for taking out a wafer from a wafer cassette having grooves on both ends for holding circumferential edges of a plurality of wafers by moving a wafer transfer arm in height directions and back and forth directions relative to the wafer cassette. The apparatus comprises a wafer pushing out mechanism for pushing out a wafer on the back of a wafer inlet/outlet side of the wafer cassette into which the transfer arm is inserted. The wafer pushing out mechanism comprises a pushing pin rotatable when it is in contact with the wafer and a driving mechanism for driving the pushing pin so as to push the wafer from the back of the wafer cassette to the wafer inlet/outlet side.