Abstract: This invention discloses a transferring apparatus for transferring a glass substrate from a cartridge in case the glass substrate disposed therein is damaged or defective. The transferring apparatus includes a chassis, and a conveying device. The conveying device includes a frame and a plurality of transferring rods arranged in a common plane and along a longitudinal direction. A first driving device disposed on the chassis and is interlinked with the conveying device. The first driving device moves the frame along the first horizontal direction such that the frame can be moved in and out from the cartridge to carry the damaged glass substrate. The driving device further drives the transferring rods to rotate centered with its own axis. By the provision of the transferring apparatus, a damaged or defective glass substrate can be properly transferred out of the cartridge without damaging adjacent glass substrate. This can be performed automatically so as to increase the efficiency, while reducing labors.

Abstract: An apparatus is disclosed for engaging and releasing a plurality of items. The apparatus comprises a frame having a longitudinally extending support member and at least one group of engagement unit. Each engagement unit has at least one engagement member, and each engagement unit is adapted for engaging, and disengaging from at least one item. Each of the engagement units in the one group is mounted in series for longitudinal movement on the longitudinal support member, and each one of the plurality of engagement units is interconnected to at least one other of the plurality of engagement units. A movement apparatus is provided for engaging at least one but not all of the plurality of engagement units in the one group to displace the group longitudinally on the longitudinal support member.

Abstract: A vehicle hood opening and closing device including a slideable assembly with a linear separator bar that has a first end affixed to a first end support and a second end affixed to a second end support, a first intermediate carriage between the end supports, a second intermediate carriage between the second end support and first intermediate carriage, a first pneumatic cylinder with piston affixed to the first end support and cylinder affixed to the first intermediate carriage, a second pneumatic cylinder with cylinder affixed to the first and second intermediate carriages and piston affixed to a flexible element, wherein the flexible element slideably passes through a pulley assembly affixed to the second end support and attaches to a lift assembly that has a lift plate and at least two vacuum cups, and pneumatic control system pneumatically connected to the two pneumatic cylinders.

Abstract: A suction cup for a tool driven by vacuum is presented, the suction cup in a first or upper end arranged to be brought into fluid flow communication with a vacuum source and in its opposite end arranged to be brought tightly into contact with the surface of an object to be handled. The suction cup is in its lower end arranged to be coupled to a sealing ring having a sealing surface arranged between an outer periphery and a through-opening defined by an inner periphery, and the sealing ring in the region of its inner periphery having a lip arranged to engage with the suction cup, to which purpose the suction cup in its lower end has a circumferentially running groove) in which the peripheral region and the lip of the sealing ring is insertable under form fitting engagement and in a radially overlapping relation between the groove and the lip in the region (r) of engagement.

Abstract: A transferring apparatus includes a main body, at least one suction cup, and a vacuum generating device. The main body is used for supporting a liquid crystal panel. The at least one suction cup is disposed in the main body and is adhered to the liquid crystal panel. The vacuum generating device is disposed in the main body and communicates with the at least one suction cup for generating negative-pressure gas when the at least one suction cup contacts the liquid crystal panel to allow the at least one suction cup to be adhered to the liquid crystal panel. With the vacuum generating device, the suction cup is capable of being adhered to the liquid crystal panel tightly, thus, the transferring apparatus can carry and transfer the liquid crystal panel stably after the liquid crystal panel contacts the suction cups, and further avoid damage to the liquid crystal panel.

Abstract: The device for transferring items to a transport system or to a storage unit has a feed unit for conveying a plurality of items in three parallel feeding lines. Further, is has a transfer station for receiving the items from the feed unit and for transferring the items to the transport system or to the storage device. The transfer station includes three temporary storage lines arranged in parallel. The items are provided by the feed unit in a manner that the items in each of the temporary storage lines are arranged offset from the items in the other temporary storage lines with respect to a first direction. A pusher in the transfer station pushes the items in a second direction perpendicular to the first direction to a single temporary storage line.

Abstract: An apparatus for transferring and securing a substrate is shown. A pressure source is provided that is adapted to provide positive and negative pressure. A vacuum chuck is provided having a top side with a plurality of vacuum chuck portals formed therein. Each vacuum chuck portal is in fluid communication with the pressure source. The substrate is secured to the top side of the vacuum chuck when the pressure source provides negative pressure to the vacuum chuck portals. An intermediate member that selectively cooperates with the vacuum chuck to support and transfer the substrate between the vacuum chuck and the intermediate member is provided. The intermediate member has a plurality of receiving spaces and a plurality of transfer members. The receiving spaces and transfer members are adjacent to one another in an alternating pattern, and each transfer member has a top side with a plurality of transfer member portals formed therein.

Abstract: Various embodiments of methods and devices are provided for a self-aligning pick and place collet having proximal and distal ends configured for use with a tape and reel machine. A suction area is located at a distal end of the collet. A pick and place collet contact area is located adjacent to and outwardly from the suction area, and comprises tapered sidewalls that depend downwardly and outwardly away from the outer periphery of the suction area. The tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to cause an electronic device to substantially self-align and center itself with respect to the collet when engaged thereby.

Abstract: Provided is a die pickup device for picking up a die from a wafer and putting the die on a substrate. The die pick device includes a pickup head for picking up the die, a handle portion and a connecting portion connected between the pickup head and the handle portion. The handle portion is substantially ring-shaped and defines a central opening. An end of the connecting portion connected to the pickup head faces toward a center of the central opening.

Abstract: The invention relates to a plunger that is used to feed and withdraw an electronic component, in particular integrated circuits, to and/or from a contact device that is connected to a test device. The plunger head can be secured to a base body by a quick locking system. The quick locking system can be placed in a rear-engagement position when the plunger head is rotated in relation to the base body, a position in which the plunger head is axially coupled to the base body.

Abstract: Embodiments include a carton feeding device for feeding cartons to a conveyor track, comprising a pick-up head with a plurality of vacuum cups, an erecting finger pivotally suspended at the pick-up head, where the pick-up head has a pick-up position (P1) and an insertion position (P2), where the carton is held with an angle ? between the holding plane of the pick-up head and the bearing surface of the erecting finger, wherein the angle ? differs from 90 degrees with at least 10 degrees in the insertion position (P2), where the carton is inserted between two parallel teeth of the conveyor track, and where the distance between the teeth is substantially equal to the width of the upper wall of the carton.

Abstract: According to an aspect of an embodiment, there is provided a part-delivery apparatus which transports a part to a designated part-delivery position by drawing the part onto a head by suction pressure at a designated part-suction position, and which releases the part at the part-delivery position by stopping application of the suction pressure. The apparatus includes: a compliance mechanism for allowing movement of the head in a horizontal plane; an upper-side positioning unit for positioning the head in the part-suction position by responding to an upward movement of the head; and a lower-side positioning unit for positioning the head in the part-delivery position by responding to the downward movement of the head.

Abstract: A system for providing vacuum to a moving element of a transport system, the system includes: a vacuum chamber on the moving element for storing vacuum; a vacuum source; a vacuum inlet provided on the vacuum chamber and for connection to the vacuum source; and a vacuum outlet in communication with the vacuum chamber and positioned on the moving element. The vacuum source may be provided on and travel with the moving element or on the transport system and periodically engage with the vacuum chamber. Where the vacuum source is provided on the moving element, a vacuum chamber may not be required. Further, the vacuum source may be driven by electrical energy and/or mechanical energy in various configurations.

Abstract: A device for detecting metal elements in slab form such as metal plates or sheets, includes an emission coil powered by suitable control elements and generating a magnetic field, a reception coil placed so as to enable generation via induction of a voltage across the terminals of the coil under the action of the magnetic field, and elements for processing and evaluating the voltage signal delivered by the at least one reception coil, enabling delivery of an information signal indicating the absence or presence of one or more metal elements near the coils. The emission coil (3) and the reception coil (5) are both mounted in a housing or a sensor head having an active detection face having an associated detection region, and are positioned at a defined inclination one relative to the other and relative to the face.

Abstract: Pick and place tape release techniques and tools that allow thin, fragile semiconductor dies to be removed from wafer tape with reduced tape release forces applied to the semiconductor dies. For example, a method for removing semiconductor die from wafer tape includes mounting a wafer ring having wafer tape and one or more dies attached to the wafer tape, and aligning an ejector pin assembly under a target die to be removed from the wafer tape. The ejector pin assembly includes a vacuum housing, an ejector pin, a suction plate, and an aperture formed in the suction plate in alignment with the ejector pin. A vacuum is generated in the vacuum housing to draw the tape against a surface of the suction plate.

Abstract: A gripper grasps irregular and deformable work pieces so as to lift and hold packaged, processed, or raw, and manipulate the work pieces for the purpose of material handling, assembly, packaging, and other robotic and automated manipulative functions. A vacuum is induced at multiple points through a flexible gripping hood to provide lifting force to, and facilitate rapid movement of, work pieces. An array of lighting devices and a double ring array of segmented mirrors provide uniform illumination to ensure accurate positioning of the gripping hood with respect to the work piece to be manipulated.

Abstract: An operating valve of the present invention is a differential pressure operating valve 100 for performing a vacuum suction of a substrate, the operating valve comprises a body 4 having an opening which is provided at an exhaust side for exhausting an air from an inside to an outside and is opposed to a suction side for sucking the air from the outside to the inside, a valve 8, and a spring 9 whose one end is connected with one of the suction side and the exhaust side of the body 4 and the other end is connected with the valve 8. The spring 9 is configured to stretch or compress in accordance with a differential pressure between the suction side and the exhaust side, and the valve 8 is provided with at least one hole.

Abstract: A component pane handling apparatus configured to handle component panes of multiple different sizes is disclosed. The apparatus includes at least one component pane capture element that can be displaced between a number of different positions, each position corresponding to a particular component pane size. Therefore, the at least one component pane capture element can be positioned to different positions for allowing handling of component panes of corresponding sizes. The apparatus also includes a position alignment mechanism configured to control displacement of the at least one component pane capture element to the different positions. The apparatus can also include one displacement arm coupled to the component pane capture element. The displacement of the component pane capture element can be effectuated by a displacement of at least a portion of the displacement arm. A method for handling component panes of multiple sizes is also included in this disclosure.

Abstract: A component mounting system including mounting machines along a direction of conveying a circuit board; a feeder mount base in each of the mounting machines; a feeder removably mounted on the feeder mount base of each of the mounting machines; a mounting head in each of the mounting machines, the mounting head sucking a component supplied from the feeder for mounting on the circuit board; a moving mechanism in each of the mounting machines, the moving mechanism configured to removably mount and move the mounting head; an inspection camera unit configured to image an inspection target part of the circuit board; and an inspection image processing unit mounted, replaceably with the feeder, on the feeder mount base where the inspection camera unit is mounted, the inspection image processing unit processing an image signal output from the inspection camera unit to inspect the inspection target part.

Abstract: The invention relates to a tissue sample handling apparatus, in particular for grasping histological samples after infiltration of an embedding medium such as, for example, paraffin, which is characterized in that a sample is immobilizable on the handling apparatus, in particular in a sample holding position, by means of negative pressure.

Abstract: The invention relates to a tissue sample handling apparatus, in particular for grasping histological samples after infiltration of an embedding medium such as, for example, paraffin, which is characterized in that a sample is immobilizable on the handling apparatus, in particular in a sample holding position, by means of negative pressure.

Abstract: A loadport for handling film frames is disclosed. The loadport is modular and substantially compatible with applicable standards regarding modular equipment. In particular, the load port is substantially interchangeable with loadports not adapted for handling film frames. The loadport has a compact shuttle for moving film frames and flexible alignment mechanisms for aligning film frames and cassettes of different configurations.

Abstract: The invention relates to a coverslip handling device (100) comprising a pick-up component (200) for picking up a coverslip (800) and a sensor device (203, 204) for checking the state of the coverslip (800) picked up, the coverslip handling device (100) being arranged to pick up a coverslip (800) automatically by means of the pick-up component (200), to check the state of the coverslip (800) picked up by means of the sensor device (203, 204) so that unusable coverslips are detected, and to set down a coverslip (800) that has been detected as being usable, automatically by means of the pick-up component (200) on a slide (500) provided for this purpose, wherein the coverslip handling device (100) is configured to automatically discard a coverslip found to be unusable by means of the pick-up component (200).

Abstract: A robotic placement machine including a base operably connected to the Y axis actuator and the X axis actuator, a first Z axis actuator coupled to the first end of the base, the first Z axis actuator capable of moving up and down a first Z axis, a second Z axis actuator coupled to the second end of the base, the second Z axis actuator capable of moving up and down a second Z axis, and a pick and place plate operably connected to the first Z axis actuator and the second Z axis actuator, wherein the first Z axis actuator and the second Z axis actuator are each capable of moving independently of each other to tilt the pick and place plate is provided. Furthermore, a system comprising a first machine, second machine, and third machine to eliminate air bubbles when bonding two substrates is also provided. A method of optical bonding is further provided.

Abstract: Methods and systems, in one embodiment, for receiving a warped flexible wafer to be transferred between a first mechanism and a second mechanism are described. The method and system senses a first vacuum suction between the warped flexible wafer and the first mechanism. The warped flexible wafer is positioned to define a gap between the warped flexible wafer and the second mechanism. Methods and systems for closing the gap incrementally between the warped flexible wafer and the second mechanism are described. At each increment, the methods and systems detect whether a second vacuum suction is created between the warped flexible wafer and the second mechanism. When a second vacuum suction is detected between the warped flexible wafer and the second mechanism, the first vacuum suction between the warped flexible wafer and the first mechanism is released.

Abstract: A component suction method including feeding components accommodated in component storage spaces of a tape base to a predetermined position, lowering a nozzle capable of sucking the components supplied to the predetermined position, stopping the nozzle at a predetermined distance from an upper surface of the tape base, pushing an undersurface of the component up when the nozzle is at a bottom dead center position or a position adjacent to the center, vacuum-sucking the component by the nozzle at the bottom dead center position or at the position adjacent to the center, and moving the component sucked by the nozzle to a predetermined position of a board after the vacuum-sucking.

Abstract: An adsorbent in a board conveying hand includes: a pad for adsorbing a board in contact with the board; and an elastic member interposed between the fork and the pad and provided with an adsorption passage for allowing an adsorbing fluid to pass between the fork and the pad, wherein a part of the elastic member is deformed, thus arbitrarily varying a projection amount of the pad from the fork.

Abstract: Methods and systems, in one embodiment, for receiving a warped flexible wafer to be transferred between a first mechanism and a second mechanism are described. The method and system senses a first vacuum suction between the warped flexible wafer and the first mechanism. The warped flexible wafer is positioned to define a gap between the warped flexible wafer and the second mechanism. Methods and systems for closing the gap incrementally between the warped flexible wafer and the second mechanism are described. At each increment, the methods and systems detect whether a second vacuum suction is created between the warped flexible wafer and the second mechanism. When a second vacuum suction is detected between the warped flexible wafer and the second mechanism, the first vacuum suction between the warped flexible wafer and the first mechanism is released.

Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.

Abstract: The present disclosure relates to a pick-up and delivery system including a pick-up assembly and a delivery assembly. The pick-up assembly includes a robotic arm, a pick-up device rotatably mounted on the robotic arm, and a first vacuum pressure supply port operably connected to the pick-up device. The delivery assembly includes an insertion device and a second vacuum pressure supply port. The insertion device may include an insertion member and a release assistance rod arranged inside the insertion member. The release assistance rod is moveable between an extended position and a retracted position. When the release assistance rod is in the extended position, a proximal end extends beyond an end of the insertion member. Further aspects are directed towards methods for grasping and releasing an object with a pick-up and delivery system.

Abstract: This invention relates to a work edge detection mechanism that enables an edge of a work to be viewed clearly through an aligning camera without adding an illumination device, and to a work transfer mechanism that uses the work edge detection mechanism. The work edge detection mechanism formed from a tubular body provided with an opening at one end thereof, the tubular body having a blocking member provided at the other end thereof, includes light-reflecting means on a lower surface side of the blocking member in order to reflect any light entering from the opening, is constructed so that the tubular body has an inside diameter (?1) at the opening of the tubular body and an inside diameter (?2) at a side of the blocking member, the inside diameter (?2) being greater than the inside diameter (?1), and enables vacuum suction transfer of the work.

Abstract: In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.

Abstract: An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.

Abstract: An apparatus for transferring a plurality of electronic components includes a row of pick heads operative to pick up the electronic components simultaneously from a first location and to place them at a second location. Additionally, there is a driving mechanism operative to drive the pick heads to move relative to one another in directions which are parallel to a length of the row of pick heads whereby to adjust a pitch width of the pick heads.

Abstract: Pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.

Abstract: Two or more pads having through holes formed therein concentrically at given pitches are provided on a U-shaped holding arm. Compressed air is sprayed from the pad to a protection sheet to generate negative pressure between a holding surface of the holding arm and the protection sheet for suspendingly holding a wafer with the protection sheet floating, or the pad suction-holds and transports a rear face of the wafer having an exposed circuit surface.

Abstract: A tool mount assembly includes drop down connections to aid in mounting of a tool to a moving base and a fail-safe tool mounting system for preventing installation of a tool in an undesired or incorrect manner. A plurality of tool mount rails are received within mounts and are uniquely tailored to assure proper placement of tools such as grippers or vacuum cups at desired locations specific to the application requirements.

Abstract: A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

Abstract: A moving device comprises at least a first element provided with main magnets and a second element provided with coils. The main magnets are arranged in a grid of rows and columns, wherein main magnets in adjacent rows are oppositely polarised and staggered relative to each other. The coils can be energized for moving the first element relative to the second element in a direction parallel to the rows as well as in a direction parallel to the columns. Auxiliary magnets of the same polarity are disposed between the main magnets at least in a number of rows, wherein the strength of the magnetic field of said auxiliary magnets is different from that of the main magnets.

Abstract: A suction head including a first transmission part, a second transmission part and a suction nozzle is provided. The second transmission part is magnetically attracted by the first transmission part to permit a displacement of the second transmission part relative to the first transmission part. The suction nozzle is disposed on the second transmission part and transmitted by the first transmission part via the second transmission part. Additionally, a transporting machine including a shuttle, a transporting mechanism and the aforementioned suction nozzle is provided. The shuttle is capable of carrying an object being transported, and the suction head is driven by the transporting mechanism to take the object being transported. The suction head and the transporting machine applying the same provide high transporting efficiency and ensuring a normal operation in transporting process.

Abstract: An apparatus for transferring and securing a substrate is shown. A pressure source is provided that is adapted to provide positive and negative pressure. A vacuum chuck is provided having a top side with a plurality of vacuum chuck portals formed therein. Each vacuum chuck portal is in fluid communication with the pressure source. The substrate is secured to the top side of the vacuum chuck when the pressure source provides negative pressure to the vacuum chuck portals. An intermediate member that selectively cooperates with the vacuum chuck to support and transfer the substrate between the vacuum chuck and the intermediate member is provided. The intermediate member has a plurality of receiving spaces and a plurality of transfer members. The receiving spaces and transfer members are adjacent to one another in an alternating pattern, and each transfer member has a top side with a plurality of transfer member portals formed therein.

Abstract: An item handling system includes a vacuum source, a transport element defining a plurality of vacuum openings in fluid communication with the vacuum source to create a securing force on an item proximate to the transport element for holding the item in contact with the transport element, and a drive element for driving the transport element to transport the item. The transport element further defines a plurality of sensor openings arranged in two substantially parallel arrays along a longitudinal direction of the transport element. The system further includes a sensor associated with each array of sensor openings for sensing energy passing through the sensor openings to thereby sense the item on the transport element. Each sensor is disposed at a common longitudinal position relative to the transport element. Sensing the item corresponds to a condition where the sensor associated with each array is blocked.

Abstract: A stage apparatus, which holds a plate member, comprises: a stage; a first positioning member and a second positioning member which are placed on the stage, and are configured to contact a lower surface and an upper surface of the plate member respectively to position the plate member in a direction perpendicular to a plane of the plate member; an elastic, first enclosing member configured to form a first enclosed space around the first positioning member; an elastic, second enclosing member configured to form a second enclosed space around the second positioning member; and a first suction mechanism and a second suction mechanism configured to respectively suck air from the first enclosed space and air from the second enclosed space so as to chuck the plate member to the first enclosed space and the second enclosed space by vacuum absorption.

Abstract: A pick-and-place module for test handlers is disclosed that includes a main body and a kit. The main body forms vacuum paths therein and the kit also forms vacuum passages therein. The kit is detachably mounted to the main body in a hook coupling manner. The pick-and-place module can be applied to all customer trays having different loading capabilities when only the kit of the pick-and-place module needs to be replaced, so there is no need to manufacture the entire pick-and-place module and this reduces manufacturing costs. The pick-and-place module can reduce the amount of resources to be replaced and reduce the replacement time since the kit can be easily removed from the main body of the pick-and-place module in a hook manner.

Abstract: An equidistance pick-and-place device for ICs is disclosed. It comprises a housing, a driving device, a guideway structure, a moving structure, a lazy tongs, a plurality of pick-and-place structures, and a transmission structure. The housing supports the equidistance pick-and-place device. The guideway structure is set on the housing. The moving structure slides on the guideway structure. The pick-and-place structures are set on the moving structure. The free end and the shafts of the lazy tongs are fixed in the moving structure. The transmission structure is connected with the driving device and the moving structure for driving the moving structure. The equidistance pick-and-place device utilizes the lazy tongs to drive the pick-and-place structures moving with equidistance to pick and place a plurality of ICs at a time. Therefore, the present invention can improve the efficiency and reduce cost.

Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.

Abstract: A workpiece pickup apparatus is provided. The workpiece pickup apparatus includes: a gripping unit which sucks a workpiece so as to lift up the workpiece; a lowering unit which lowers the gripping unit from a waiting position towards the workpiece; a detecting unit which detects a physical amount which corresponds to a force with which the gripping unit presses the workpiece; a comparison unit which compares the detected physical amount with a reference physical amount; and a controller which controls a movement of the gripping unit based on a comparison result of the detected physical amount and the reference physical amount.

Abstract: A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.

Abstract: An attachment for a telescopic material handler supplies five degrees of freedom (DOF) for the task of picking, manipulating and aiding in the installation of vertical and horizontal wall cladding and other construction materials. The cladding can be of a size up to 1.3×8.0 m and a mass of 350 kg. The control and positioning of the load is accomplished through standard operation of the telehandler in conjunction with wireless control of the five DOF of the device. Hydraulic power for the device functions may be supplied through the telehandler auxiliary circuit. The auxiliary flow also powers a hydraulic generator, which supplies the device with electrical power for both system logic and control and vacuum generation. The cladding panels are handled by the vacuum system.

Abstract: An apparatus for transferring a plurality of electronic components includes a row of pick heads operative to pick up the electronic components simultaneously from a first location and to place them at a second location. Additionally, there is a driving mechanism operative to drive the pick heads to move relative to one another in directions which are parallel to a length of the row of pick heads whereby to adjust a pitch width of the pick heads.