Abstract: A method is for positioning a center of a V-type notch of a wafer. The method includes: determining, based on collected edge data of a V-type notch of a wafer, a center of a concentric circle corresponding to edges of the V-type notch; and judging, based on a position relation between the center and a set reference scale line, whether the V-type notch is at a preset target center position. The method also includes determining, based on the position relation between the center and the set reference scale line, a rotation direction and rotation angle of the wafer when the V-type notch is out of the preset target center position; and driving, according to the rotation direction and rotation angle of the wafer, the wafer to rotate until the V-type notch is rotated to the preset target center position.

Abstract: A wafer positioning device includes at least one fixed stop that is positioned at a periphery of a clamped position on a surface of a chuck and an extendible finger. A finger extension mechanism extends the finger outward toward a center of the chuck surface, and retracts the finger away from the center of the chuck surface. The finger is configured, when a wafer is placed on the chuck surface and the finger extension mechanism is operated to extend the finger outward, to push the wafer laterally toward the fixed stop until an edge of the wafer contacts the fixed stop when a distal end of the finger is at the periphery of the clamped position.

Abstract: A notch detecting method for detecting a notch defined in an outer circumferential portion of a wafer includes a placing step of placing the wafer on a rotary table, an image capturing step of acquiring an image of the outer circumferential portion of the wafer, a contour data acquiring step of acquiring contour data including coordinates of a contour of the wafer, a hypothetical circle calculating step of calculating a hypothetical circle that approximates the contour of the wafer, an irregularly shaped area determining step of determining whether an irregularly shaped area exists in the outer circumferential portion of the wafer or not, and a first notch determining step of determining whether the irregularly shaped area is the notch or not.

Abstract: A film formation apparatus of the present invention is a film formation apparatus which performs deposition on a substrate to be processed, and includes a supply device that is disposed in an evacuable vacuum chamber and supplies a deposition material, and a holding device that holds the substrate to be processed during deposition. The holding device includes a deposition preventing plate that covers a region to which the deposition material is adhered in the holding device, a holder that holds the substrate to be processed, and a position setter that sets a position of the substrate to be processed when the deposition preventing plate and the holder sandwich and hold the substrate to be processed. The position setter includes a roller that comes into contact with a peripheral edge end surface portion of the substrate to be processed.

Abstract: Substrate holding hand including a base plate spreading from base toward tip end sides, part of base plate located at base end side, fixed to hand tip portion, holding position at base plate, engaging claw at part of base plate located at tip end side, engaging claw configured to engage part of edge of substrate in vertical or inclined postures, part of edge located lower than center of substrate, moving portion at base end side of holding position and configured to move toward tip end side, and plurality of rotating bodies at the moving portion, being pressed by movement against edge of substrate located lower than holding position and engaged with claw, and plurality of rotating bodies pushing substrate upward holding position while rotating along edge of substrate.

Abstract: A test apparatus for devices having fine pitches, includes a loading picker provided on one side of a loading part so as to sequentially adsorb devices to be tested, thereby putting the adsorbed devices on the upper surface of a vacuum chuck, a device alignment part, which is provided at an upper portion of a loading zone for aligning the devices, tester for testing a performance of the devices for a set time as the vacuum chuck positioned in the test position moves and comes into electrical contact with bumps of respective devices, and an unloading picker, which is provided at one side of an unloading zone so as to adsorb tested devices from the vacuum chuck, sorts the tested devices into good products and bad products, and unloads the tested devices as sorted on a tray of an unloading part.

Abstract: A first edge ring for a substrate support is provided. The first edge ring includes an annular-shaped body and one or more lift pin receiving elements. The annular-shaped body is sized and shaped to surround an upper portion of the substrate support. The annular-shaped body defines an upper surface, a lower surface, a radially inner surface, and a radially outer surface. The one or more lift pin receiving elements are disposed along the lower surface of the annular-shaped body and sized and shaped to receive and provide kinematic coupling with top ends respectively of three or more lift pins.

Abstract: A wafer inspection system is provided. The wafer inspection system includes: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

Abstract: Systems and methods for engineering integrated circuit design and development are described. A requester posts a request for an integrated circuit chip design using the systems and methods. Moreover, using design tools of the systems and methods, one or more designers generate one or more designs. The designers use computer software that is provided by the systems and methods to test the one or more designs. Moreover, the designs are independently verified by a design engineering entity or by other designers. The one or more designs are provided to a fab via the systems and methods to fabricate a prototype of an integrated circuit chip. The prototype is tested on a printed circuit board by using a test software, which is provided by the systems and methods.

Abstract: The present invention provides a wafer notch leveling device, which comprises a body, a first rotating portion, a positioning portion, a power portion, and a control unit. The body has a support portion and a pivot portion is provided at each terminal of the body, the pivot portion pivotally connects a plurality of supporting arms. The first rotating portion and the positioning portion are electrically connected with the power portion. The power portion is electrically connected with the control unit. Especially, when a plurality of wafers are placed on the support portion and fixed, the first rotating portion is electrically connected with the power portion through the control unit to drive the plurality of wafers to rotate the wafers, a notch on the wafer is leveled through the positioning portion.

Abstract: Disclosed are a plane coding target and an image splicing system and method applying the same. The plane coding target comprises a plurality of coding units distributed in an array, the coding unit comprises one central coding point, a plurality of normal coding points and at least one positioning point, and a positioning point distribution style of the positioning point is used for determining coordinates of the central coding point and the normal coding points in a coding unit coordinate system; and coding numerical value sequences of the coding units are different from each other and unique. The plane coding target can realize large-area coding and positioning functions, and the image splicing system applying the plane coding target can solve the problems of splicing error and error accumulation caused by an identification error of a splicing location, thus realizing large-range, high-precision and short-time two-dimensional image splicing.

Abstract: One illustrative device disclosed herein includes a FOUP (Front Opening Unified Pod) storage bin, a plurality of pins positioned on a first surface of the FOUP storage bin, wherein the plurality of pins are adapted to engage and register with the FOUP, and a conversion plate. In one illustrative embodiment, the conversion plate includes a plate with a front surface and a back surface, a reticle pod receiving structure on the front surface that at least partially bounds a reticle pod receiving area on the front surface, and a pin engagement structure on the back side that is adapted to engage the plurality of pins on the first surface of the FOUP storage bin.

Abstract: Systems and methods are provided for an apparatus for moving objects along a predetermined path. A system includes plurality of conveying units, each conveying unit being connected to two other conveying units. A particular conveying unit includes a first link unit configured for connection to a first neighbor conveying unit. A second link unit is configured for connection to the first link unit, the second link unit further being configured for connection to a first link unit of a second neighbor conveying unit. A cup is detachably connected to the second link unit.

Abstract: Produce sorting systems and methods that utilize a conveyor system to move produce through stages such as singulation, camera inspection, weight, and sorting. The sorting systems and methods may utilize conveyor systems having carrier segments that provide for increased speed, efficiency, accuracy, reliability, durability, and lower maintenance.

Abstract: A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads.

Abstract: An assembly used in a process chamber for depositing a film on a wafer and including a pedestal extending from a central axis. An actuator is configured for controlling movement of the pedestal. A central shaft extends between the actuator and pedestal, the central shaft configured to move the pedestal along the central axis. A lift pad is configured to rest upon the pedestal and having a pad top surface configured to support a wafer placed thereon. A pad shaft extends between the actuator and the lift pad and controls movement of the lift pad. The pad shaft is positioned within the central shaft and is configured to separate the lift pad from the pedestal top surface by a process rotation displacement when the pedestal is in an upwards position. The pad shaft is configured to rotate relative to the pedestal top surface between first and second angular orientations.

Abstract: Apparatus for improving substrate temperature uniformity in a substrate processing chamber are provided herein. In some embodiments, a cover plate for a substrate processing chamber includes: an outer portion; and a raised inner portion having a thermally emissive layer, wherein a thermal emissivity of the thermally emissive layer varies across the thermally emissive layer.

Abstract: Provided apparatus and methods for back side passivation of a substrate. The systems comprise an elongate support with an open top surface forming a support ring so that when a substrate is on the support ring, a cavity is formed within the elongate support. A plasma generator is coupled to the cavity to generate a plasma within the cavity to deposit a passivation film on the back side of the substrate.

Abstract: Provided apparatus and methods for back side passivation of a substrate. The systems comprise an elongate support with an open top surface forming a support ring so that when a substrate is on the support ring, a cavity is formed within the elongate support. A plasma generator is coupled to the cavity to generate a plasma within the cavity to deposit a passivation film on the back side of the substrate.

Abstract: A method and apparatus for processing a substrate are provided. The apparatus includes a pedestal and rotation member, both of which are moveably disposed within a processing chamber. The rotation member is adapted to rotate a substrate disposed in the chamber. The substrate may be supported by an edge ring during processing. The edge ring may selectively engage either the pedestal or the rotation member. In one embodiment, the edge ring engages the pedestal during a deposition process and the edge ring engages the rotation member during rotation of the substrate. The rotation of the substrate during processing may be discrete or continuous.

Abstract: An enhanced mechanical design of multiple zone plates precision alignment apparatus for hard x-ray focusing in a twenty-nanometer scale is provided. The precision alignment apparatus includes a zone plate alignment base frame; a plurality of zone plates; and a plurality of zone plate holders, each said zone plate holder for mounting and aligning a respective zone plate for hard x-ray focusing. At least one respective positioning stage drives and positions each respective zone plate holder. Each respective positioning stage is mounted on the zone plate alignment base frame. A respective linkage component connects each respective positioning stage and the respective zone plate holder. The zone plate alignment base frame, each zone plate holder and each linkage component is formed of a selected material for providing thermal expansion stability and positioning stability for the precision alignment apparatus.

Abstract: A method and apparatus for processing a substrate are provided. The apparatus includes a pedestal and rotation member, both of which are moveably disposed within a processing chamber. The rotation member is adapted to rotate a substrate disposed in the chamber. The substrate may be supported by an edge ring during processing. The edge ring may selectively engage either the pedestal or the rotation member. In one embodiment, the edge ring engages the pedestal during a deposition process and the edge ring engages the rotation member during rotation of the substrate. The rotation of the substrate during processing may be discrete or continuous.

Abstract: A single-chamber type cleaning-drying apparatus for flat objects, such as semiconductor wafers, wherein cleaning is carried out by impinging both sides of the wafer, which rotates at a relatively low speed, with jets of a washing liquid and wherein subsequent drying is carried out in the same chamber by increasing the rotation speed of the wafer and supplying isopropyl-alcohol (IPA) mist onto the wafer from the top of the chamber. After the IPA forms a solution with the residue of water on the wafer, the drying process is accelerated by supplying gaseous nitrogen through nozzles arranged on both sides of the wafer he coaxially with the wafer center. As a result, the IPA-water solution quickly evaporates without leaving traces of water drops on the dried surface.

Abstract: A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.

Abstract: A substrate holding and rotary driving mechanism, e.g., for a cleaning chamber with vertical orientation of the wafer, that is comprised of a three-armed spider which is rotatingly installed on the outer side of the cleaning chamber and rotatingly supports on the outer ends of its arms outer shafts with eccentrically arranged inner shafts. The inner shafts pass through the outer shafts into the cleaning chamber where they support contact rollers, while the opposite ends of the inner shafts support gears driven into rotation by a synchronous belt. The contact rollers can be moved apart for insertion or removal of wafers from and into the chamber. This is achieved by turning the spider with eccentric inner shafts in one or another direction.

Abstract: According to various aspects, exemplary embodiments are disclosed of automatic container orientation systems. Also disclosed are methods for automatically orienting containers. In an exemplary embodiment, a system for automatically orienting containers generally includes one or more cameras, a controller, and an orientation unit. The one or more cameras are configured to obtain data relating to an orientation of at least one container to be included in a package. The controller is in communication with the one or more cameras for receiving the data and is configured to use the data to determine an amount of rotation needed for the at least one container to orient the at least one container in a desired final orientation. The orientation unit is configured to rotate the at least one container by the determined amount of rotation to thereby orient the at least one container in the desired final orientation.

Abstract: A motif-arraying apparatus for arraying motifs such as a hot fix or the like in mounting grooves formed in a mold plate. The motif-arraying apparatus includes a shaking member for loading motifs in the mounting grooves formed in the mold plate, wherein the shaking member includes a vertical board and a horizontal board coupled to an edge thereof, and a plurality of shaking knives coupled to the bottom surface of the vertical board at a predetermined interval. The apparatus not only enables motifs to be correctly arrayed in the mounting grooves formed in the mold plate in a quick and easy manner, but also enables a motif inserted in a wrong direction to be removed from the mounting groove and correctly arrayed, thereby improving productivity, minimizing defects, and reducing costs.

Abstract: A substrate position aligner includes a substrate holding assembly, a plurality of rollers, a rotation mechanism, and a sensor. The substrate holding assembly is configured to hold a substrate in a vertical orientation. The plurality of rollers include at least two idler rollers and a drive roller. Each roller has a point on its perimeter spaced on a common radius from a center of substrate rotation defined within the substrate holding assembly. The sensor is positioned approximately on the common radius and configured to detect the presence of an orientation cut in the substrate when the orientation cut is not orientated within a range between about ?44 degrees and about +44 degrees from horizontal. A method of aligning a substrate having an orientation cut includes sensing a presence of the orientation cut when the orientation cut is not orientated within the above recited range.

Abstract: A device for rotating flat products, in particular sheets or stacks of sheets, moved in a first direction from a first orientation into a second orientation, by a predetermined total rotation angle, by means of a first rotating device, in which the product is rotated first by a first rotation angle, and by means of at least one second rotating device, in which the product is later rotated by a second rotation angle. The first and second rotating devices are arranged one after the other in transport direction, and each rotating device includes rotating elements, which engage with the product for the rotating process. In order to be able to process products having different formats at the highest possible throughput and as failure-free as possible, and in order to ensure as mild a treatment of the products as possible, at least the first rotating device includes switchable engagement elements by means of which the rotating elements can be engaged with or disengaged from the product at selected times.

Abstract: The invention relates to a device for fitting and equipping motor vehicle battery housings as a compact system, which comprises individual production stations and associated transport devices, wherein the battery plate packs to be processed are arranged in clamping cassettes and are provided to the device in the necessary pack width for the intended battery cells by a feeding station arranged upstream.

Abstract: A robot control unit that turns off a holding unit for a plate member, while the plate member is placed on an end effector, and lower the end effector, by a predetermined distance, from an initial position higher than a preset temporary placing position toward the temporary placing position. Then the robot control unit switches the holding member, from an OFF state to an ON state, while the end effector is stopped, and determines whether the plate member is held by the holding unit, with a holding-state detection unit. When the plate member is held by the holding unit, the robot control unit turns off the holding unit while further lowering the end effector by the predetermined distance. When the plate member is not held by the holding unit, the robot control unit detects a position of the end effector at this point of time, as a normal placing position.

Abstract: A supporting member, carrier and method of supporting are provided with a supporting member main body mounted to freely rotate. The supporting member main body is provided with a plurality of projections extending radially from a central rotation axis. Since the substrate is supported by abutment of the projections with an end of the substrate, the occurrence of cracking in the substrate can be prevented or the durability of the supporting member main body can be increased.

Abstract: An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.

Abstract: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

Abstract: Provided is a buffer unit, which includes a frame including a base plate, a first vertical plate, and a second vertical plate, wherein the first and second vertical plates are spaced apart from each other on the base plate, a first buffer on which a photomask is placed, the first buffer being allowed to be reversed between the first and second vertical plates; and a plurality of driving parts disposed at outsides of the first and second vertical plates, and driving the first buffer to grip and reverse the photomask placed on the first buffer.

Abstract: In the wafer position teaching method for a wafer carrying system, a teaching tool is mounted at a position of the container or the processing equipment where the semiconductor wafer is to be set. The teaching tool is sensed by a sensor provided at a wafer gripping portion of the robot. Prior to sensing the teaching tool by the sensor, external teaching tools mounted on a front external wall of the processing equipment are sensed by the sensor to roughly estimate the position of the teaching tool. Based on the estimated position, the sensor approaches and senses the teaching tool to obtain the position of the semiconductor wafer. Thus, the wafer position can be taught precisely and automatically without causing interference, even when the frontage of processing equipment is narrow.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: A lifting apparatus includes a vertical guide device, a turntable device which is movable along the vertical guide device upwards or downwards, and a first driving device which drives the turntable device moving in an upward and downward direction guided by the vertical guide device. The turntable device includes a bracket which is slidably engaged with the vertical guide device and projects perpendicularly toward a side of the vertical guide device, a turntable which is rotatably provided on the bracket, and a second driving device which rotates the turntable on the bracket.

Abstract: A device for supporting and rotating a disc-like article includes: a first rotor including a support for supporting the disc-like article, wherein the first rotor is located within a process chamber, a second rotor connected to a drive mechanism for rotating the second rotor, wherein the second rotor is coupled to the first rotor by magnetic forces without touching the first rotor, and the second rotor is located outside the process chamber and a wall is arranged between the first rotor and the second rotor, and at least one magnetic couple, wherein the couple includes a first coupling part and a second coupling part, wherein the first coupling part includes a coupling magnet mounted to the first rotor and the second coupling part includes a high temperature superconducting material, wherein the magnetic couple(s) are arranged and/or formed so that no degree of freedom remains between the first and second rotor so that the first rotor moves together with the second rotor.

Abstract: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

Abstract: A technology to resolve positional deviations without using a transport robot. An object to be transported placed on a holding stand is rotated, so as to make an error angle ? to be zero; and thereafter, a temporarily placing portion is made to move obliquely to move for an error distance in a horizontal component, thereby locating the center of the object to be transported on the central axis line of the holding stand; and the object to be transported is placed on holding stand. In a case where an orientation of a notch is definite, the holding stand is further rotated by a desired amount. Without using the transport robot, it is possible to resolve an error angle and an error distance.

Abstract: A process for producing a silicon wafer by conveying a (100) face silicon wafer into and from a treating furnace of a single wafer heat-treating apparatus or a vapor phase growth apparatus with a conveying blade having a mounting face capable of mounting only a specified region of the wafer inclusive of a center position of its rear face for subjecting the wafer to a heat treatment or a vapor phase growth, in which <010> or <001> orientation is shifted by a predetermined angle with respect to a transverse direction of the mounting face of the conveying blade.

Abstract: A hinge feeder for feeding open hinges at a predetermined orientation to a receiver ready for use by an automatic door hinger. A dispenser is provided to hold a stack of closed hinges. The orientation of the top end and hinge joint of each hinge is sensed and the hinges sequentially dispensed at a uniform orientation, except for the pinhead location, to a rotator that rotates those hinges to bring their top ends to a desired side. The hinges are then opened by a leaf turner, fed to a stacker and the opened and oriented hinges then deposited in a stack by a stacker.

Abstract: A handling system able to efficiently process information relating to a plurality of conveyed articles, the handling system provided with a conveyer for conveying workpieces, a visual sensor for detecting positions of workpieces by acquiring images of a plurality of tracking ranges obtained by dividing a belt into sections, an encoder for detecting an amount of movement of the belt, a tracking manager for monitoring amounts of movement of the plurality of tracking ranges based on the amount of movement detected by the encoder and specifying the tracking range passing through a workpiece detection area, a workpiece manager for selecting the article in the tracking range specified by the tracking manager, and a controller for controlling operations of robots so as to hold the workpiece selected by the workpiece manager.

Abstract: A supply of plastic wrapping material for wrapping cylindrical modules includes a plurality of end-to-end segments, with each segment being of a length sufficient for enveloping a cylindrical cotton module of a given size with a predetermined number of layers of wrapping. All except an inner tail of an inner layer of wrapping adheres to the following layer. The location within each segment which becomes a loose inner tail when wrapped about a module is provided with a first RFID tag while other RFID tags are provided at equally spaced locations along the inner layer. Each RFID tag is provided with a unique identifier for which may be read by a RFID tag reader carried by a module handling implement having forks rotatable by reversible motors operable for rotating the module for placing the loose inner tail at a desired location relative to a cutting device for slitting the wrapping during wrapping removal.

Abstract: A robot calibration system and method for robots in semiconductor wafer processing systems is disclosed. The calibration system comprises a calibration array, a dummy wafer and a control system programmed with a calibration routine. The calibration array has an plurality of inductive proximity sensors to determine parallelism of the robot relative to a station and a center locating sensor to determine the center of the station.

Abstract: A substrate W rotates about the center of rotations A0 of a spin base 3, while supported by plural support pins 5 in such a manner that the substrate W can freely slide and while held owing to the force of friction which develops between the bottom surface of the substrate W and the support pins 5. After a detection sensor 74 detects, while the substrate W rotates, an edge surface position (eccentric position) of the edge surface of the substrate which is the farthest from the center of rotations A0, a press block 71 pushes this edge surface position to a preset position P1 which is away along the horizontal direction from the center of rotations A0 by a distance which is determined in accordance with the radius of the substrate W. This aligns the eccentric position to the preset position P1 and positions the center W0 of the substrate within a predetermined range from the center of rotations A0.

Abstract: An automated parking garage includes a three-dimensional warehousing facility for receiving a vehicle at a delivery bay, storing the vehicle in a parking area, and retrieving the vehicle from the parking area. The parking garage includes mechanical elements for transporting the vehicle between the delivery bay and the parking space, namely, at least one shuttle vehicle and at least one elevator. A central computer is in electrical communication with each of the mechanical elements to control the movement of the corresponding elements in the facility. A main catwalk extends the length of the facility to define parking spaces in the parking area to receive at least two vehicles, each vehicle having a front end and a rear end, with the desired end of each vehicle adjacent the main catwalk.

Abstract: A wafer bonding apparatus and method are provided. The wafer bonding apparatus can include an aligning unit, and the aligning unit can include a rotating roller for rotating at least two wafers, an aligning bar for aligning the at least two wafers, and a notch alignment sensor for sensing at least two notches of each of the at least two wafers.

Abstract: An apparatus for centering a substrate in a track lithography tool includes a processing chamber having an opening large enough to admit the substrate. The processing chamber includes a substrate support member. The substrate is characterized by a diameter and comprises a mounting surface, a process surface, and an edge. The apparatus also includes a clamped robot blade including a substrate support surface adapted to support the mounting surface of the substrate, two edge contact regions, and a base contact region. The clamped robot blade also includes a clamping system adapted to move at least one of the two edge contact regions or the base contact region from an unclamped position to a clamped position, thereby making contact between the edge of the substrate and the two edge contact regions and the base contact region in the clamped position. The apparatus further includes a robot arm coupled to the clamped robot blade.