Abstract: A substrate processing system which is capable of preventing dust from becoming attached to substrates without increasing the degree of cleanliness of a clean room to a predetermined level, and also capable of increasing the substrate processing throughput without increasing the burden on workers. a plasma processing apparatus 2 that subjects semiconductor wafers W to plasma processing in a cleaned atmosphere. A SMIF 4 has a enclosure 23 that is connected to the plasma processing apparatus 2 and has a cleaned atmosphere therein, a pod stage 26 on which a pod 3 housing semiconductor wafers W is mounted, a pod mounting portion 24 that carries out removal of semiconductor wafers W from the pod 3 and housing of semiconductor wafers W into the pod 3, and a wafer cassette transfer arm 27 that transfers semiconductor wafers W between the pod stage 26 and the plasma processing apparatus 2 via the enclosure 23.

Abstract: A method for calibrating a controller of a robotic arm in a microelectronics manufacturing apparatus that includes storing a default position for an edge detector, moving a blade on the robotic arm based on the default position of the edge detector such that at least three edge points on the blade pass through and are detected by the edge detector, generating a plurality of arm position measurements from an arm position sensor by measuring a position with the arm position sensor of the robotic arm at each position of the robotic arm at which an edge point of the blade is detected by the edge detector, and determining at least one of an actual position of the edge detector and an offset for measurements of the arm position sensor based on the plurality of arm position measurements.

Abstract: An ion implantation apparatus, system, and method are provided for transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module.

Abstract: A substrate-handling robot which serves a processing tool such as a plating tool may be automatically controlled by a controller to perform a self-calibration procedure. As part of the procedure, an end effector of the robot is moved to interact with sensors provided on a calibration fixture that is positioned in a substrate placement location for which the calibration procedure is performed. The calibration fixture may have an opening formed therein to allow movement of the robot end effector within the calibration fixture. Sensor light beams generated by the sensors may interact with the end effector during the automatic calibration process so as to determine calibration data for the substrate placement location.

Abstract: Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component mounter includes: a base frame; a rotary housing rotatably mounted on the base frame and having spindle receiving holes vertically formed at regular intervals at the same radius from a center thereof; a plurality of nozzle spindles having lower ends to which nozzles for picking up electronic components are coupled, and received in the spindle receiving holes such that the plurality of nozzle spindles rotate on the same axis when the rotary housing rotates; a housing rotating mechanism rotating the rotary housing; and a nozzle lifting mechanism including a nozzle lift driving unit, and a clutch part that moves according to the operation of the nozzle lift driving unit and can simultaneously press down and lower the plurality of nozzle spindles.

Abstract: A device for aligning a plurality of vertically arranged (upright) disks (20), especially wafer disks during the fabrication of semiconductor chips. Two mounting or bearing elements (30, 32) respectively have individually mounted guide rollers (34) positioned next to each other for each disk position. A drive device (40, 42; 50, 60; 240, 242) is for rotating the disks in relation to their azimuthal positions. A device (80) is provided for detecting the azimuthal positions of notches or indentations (22) arranged in the outer circumference in the disks (20). A device is provided for controlling the drive with the signals of the detection device (80) for detecting the azimuthal positions of the notches (22). The drive for rotating the disks in relation to their azimuthal positions has an individually driven drive roller element (42) for each disk (20) mounted on the stationary axis.

Abstract: A device (12) picks up at least one semi-conductor wafer (11) from a container (14) of wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant. The device is on the opposite side (17) of the aperture and the pick-up is effected through it. The device incorporates a shutter (1) movable between open and closed positions. A wafer picking up means (2) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means (3) moves the picking up means (2) back and forth through the aperture (13).

Abstract: An industrial robot that has uses a simulated force vector to allow a work piece held by the robot end effector to be mated with a work piece whose location and orientation is not precisely known to the robot. When the end effector makes contact with the location and orientation in which the other work piece is held the robot provides a velocity command to minimize the force of the contact and also provides a search pattern in all directions and orientations to cause the end effector to bring the work piece it is holding in contact with the other work piece. The search pattern and the velocity command are continued until the two work pieces mate.

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: The invention relates to a simple and cost-effective method for aligning substrates. In order to achieve this, the invention provides a device for aligning disc-shaped substrates, in particular semiconductor wafers, comprising an alignment detection unit, at least one first support for receiving the substrate, which forms an oblique plane in relation to the horizontal, a stop against which the substrate can be displaced as a result of the oblique angle and a rotational device for rotating the substrate.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: A lifting mechanism includes a plurality of lift pins which may be driven separately and independently upward to engage an alignment surface of the chamber using ambient atmospheric pressure as the chamber is evacuated by a pump. In the illustrated embodiment, each lift pin includes a piston which is exposed to the internal chamber pressure on one side of the piston, and is exposed to the external ambient pressure on the other side of the piston. As the pump evacuates the chamber, the internal chamber pressure decreases, causing each lift pin piston to drive the associated lift pin upward. Once all the lift pins have securely engaged the alignment surface, the lift pins may be clamped to a linking mechanism to permit a motor to actuate the lift pins during processing operations.

Abstract: A prealigner for aligning a disk-like work piece such as a silicon wafer, by centering and rotationally orienting the work piece. The prealigner centers and orients the work piece while only touching the periphery of the work piece using a plurality of wafer rollers and an air bearing table to support the weight of the wafer. The prealigner can accept a range of different diameters of work piece without modification because the wafer rollers are radially moveable until they contact and center the work piece. The prealigner includes a plurality of simple optical sensors for detecting a notch in the work piece and the work piece is rotationally oriented based on a notch detection signal from the optical sensors.

Abstract: This invention pertains to processing continuous webs such as paper, film, composites, and the like, in dynamic continuous processing operations. More particularly, it relates to transferring discrete parts to a continuous web, whether paper, film, composite, or the like. Specifically, the invention relates to methods and apparatus for taking discrete parts from a source in a taking zone, optionally taking the discrete parts as components of a continuous web, onto a transport head on a transfer assembly, severing the discrete parts from the continuous web if received as part of a continuous web, rotating the transfer assembly about a first axis and correspondingly rotating the transport head about a second axis radial to the first axis, to thereby present the discrete parts to a receiver in a transfer zone, and transferring the discrete parts to the receiver in the transfer zone.

Abstract: The device (1) picks up and aligns a sawframe (30) for handling and aligning silicon wafers (31). The device (1) includes at least one resiliently moveable locating arm (11) which is adapted to engage co-operably with a notch (35, 36) on the periphery of the sawframe (30) when the device (1) is moved into contact therewith. The sawframe (30) is thus urged into alignment with the device (1), and may be held in position relative to the device (1).

Abstract: Tracking the movement of individual wafers in a semiconductor processing system is improved by using an apparatus to axially rotate a wafer and using both the rotation angle and the wafer's location in the processing system as tracking coordinates. In an example embodiment, the apparatus imparts angles of rotation on the wafers in different stages of wafer processing. The rotation angles of each wafer are collected as data along with the wafer's location in the process. The combined wafer location and angle of rotation data are used to map the path the wafer has traveled from the onset of processing. An important advantage to this apparatus is the increased control and improved yields that the apparatus brings to wafer processing.

Abstract: A system and method for preparing and testing of targeted nucleic acids is presented. The system integrates a pipetter, extractor, assay reader, and other components, including a selectively compliant articulated robot arm (SCARA). This synergistic integration of previously separate diagnostic tools creates a system and method whereby a minimum of human intervention is required. The resulting system provides a substantially more accurate and precise method of isolating, amplifying and detecting targeted nucleic acids for diagnosing diseases.

Abstract: A device for aligning a flatted object to a desired orientation. The flatted object has a substantially circular perimeter and a flatted chord portion and may be a silicon wafer or a cover for an electrostatic chuck. The device includes multiple conically shaped rollers that center and rotationally align the object, each roller having a bottom lip for supporting the object. Centering rollers are mounted so that they contact the circular perimeter of the object when it is in the desired orientation. Rotational alignment rollers are mounted so that they contact the flatted chord portion of the object when it is in the desired orientation. When placed on the alignment device, the flatted object passively moves to the desired orientation under the force of gravity.

Abstract: A prealigner for aligning a disk-like work piece such as a silicon wafer, by centering and rotationally orienting the work piece. The prealigner centers and orients the work piece while only touching the periphery of the work piece using a plurality of wafer rollers and an air bearing table to support the weight of the wafer. The prealigner can accept a range of different diameters of work piece without modification because the wafer rollers are radially moveable until they contact and center the work piece. The prealigner includes a plurality of simple optical sensors for detecting a notch in the work piece and the work piece is rotationally oriented based on a notch detection signal from the optical sensors.

Abstract: The apparatus for orienting tablets on a measuring station of a tablet tester comprises:

Abstract: A device for positioning disk-shaped objects (1) to inspect the front and rear sides of disk-shaped objects and to reduce the negative effect of large-area contact between the holder and the disk-shaped object. The device comprises a rotatable table (24) which can be adjusted in the x-y direction in an adjustment plane and is intended to accomodate a platform (3). A fork-shaped frame (8) is mounted on the platform so as to be rotatable about an axis of rotation which is aligned perpendicular to the surface of the platform (3) and the angle of tilt of which can be set relative to the adjustment plane. At its fork ends, the fork-shaped frame (8) has another axis of rotation which is aligned perpendicular to the axis of rotation of the fork-shaped frame (8) and about which a frame-shaped object holder (9) is mounted so as to be rotatable in the fork-shaped frame (8) for the purpose of turning the object.

Abstract: A retreat permission position of a carrier arm when the carrier arm is moved back to retreat outside a mounting table after the carrier arm carries a substrate to a position above the mounting table while holding a peripheral portion of the substrate, to thereby place the substrate on a plurality of supporting pins vertically movable through the mounting table. A disk substantially equal in size to the substrate, having insertion holes formed to allow the supporting pins to be inserted therethrough and being supportable by the carrier arm, and a sensor to detect whether or not the supporting pin inserted through the insertion hole of this disk exists.

Abstract: A method for moving a substrate to a predetermined location with a specified orientation with a robotic manipulator, the robotic manipulator having a plurality of joint actuators and an end-effector for holding the substrate, wherein the end-effector is independently rotatable with respect to the remaining robotic manipulator. The method can select a reference point on the end-effector for determining a position of the end-effector, wherein the reference point is offset from a wrist of the robotic manipulator, determining a motion path for movement of the end-effector of robotic arm toward predetermined location with specified orientation, and generating motion profiles for translational and rotational components of movement of the end-effector of robotic manipulator along the motion path.

Abstract: Robot arm (16) end effectors (10, 110, 210) of this invention rapidly and cleanly transfer semiconductor wafers (12) between a wafer cassette (14) and a processing station. The end effectors include fiber optic light transmission sensors (90, 102, 202, 214) for determining various wafer surface, edge, thickness, tilt, and location parameters. The sensors provide robot arm extension and elevation positioning data supporting methods of rapidly and accurately placing and retrieving a wafer from among a stack of closely spaced wafers stored in the wafer cassette. The methods effectively prevent accidental contact between the end effector and the wafers while effecting clean, secure gripping of the wafer.

Abstract: A cylindrical article is positioned relative to a support surface by supporting the cylindrical article from a first pair of ball bearings contacting the cylindrical article adjacent to its first end, and a second pair of ball bearings contacting the cylindrical surface adjacent to its second end. At least one of the ball bearings is moved relative to the cylindrical article to reposition the cylindrical article. The repositioning may be performed under feedback control of actuators that move the ball bearings. The article may be fixed relative to the support surface after it is properly positioned.

Abstract: An object of the present invention is to enable the orientations of chip components accommodated in groove portions of an index table to be assuredly uniformized. When a polarity judgment device finds that the orientation of the chip component accommodated in the groove portion of the index table is opposite, the polarity inversion apparatus according to the present invention moves the chip component to the component accommodating inversion portion by using compressed air and the intake air from air inlet/outlet ports. Since the bottom surface of the inlet of the inversion portion is set so as to be lower than the base surface under the index table and the width of the inlet of the inversion portion is set so as to be wider than the width of the groove portion, the chip component can move to the inversion portion without getting stuck in the vicinity of the boundary.

Abstract: A wafer orienting apparatus for aligning a plurality of semiconductor wafers each of which has a v-notch formed on its outer periphery. The apparatus includes a cassette process carrier for supporting the plurality of wafers in parallel wafer supporting slots and wafer supporting means engaging the periphery of each wafer in an individual slot with the central axis of all wafers in coaxial alignment. A supporting platform is placed over the cassette for supporting the wafers in an inverted position in which the wafers are substantially vertical and biased by their own weight against a multiplicity of orienting mechanisms. The orienting mechanisms are arranged to correspond to each wafer position within the cassette. The plurality of orienting mechanisms are integrated with the supporting platform so that all wafers within the cassette can be aligned during this aligning process.

Abstract: Apparatus for repositioning eggs from a generally vertical position to a generally horizontal position such that injection/removal of material into/from the side of the egg can occur. Each apparatus may include a cradle, an alignment member, and an orientation member. The cradle has an inclined, arcuate surface with an upper portion, a lower portion, and opposite side portions. The alignment member is operably positioned adjacent the cradle and is configured to engage an egg positioned on the arcuate surface lower portion in an inclined orientation and to releasably secure the egg in a predetermined alignment relative to the cradle. The orientation member is operably positioned relative to the cradle, and is configured to urge an egg positioned on the lower portion in an inclined orientation to a generally vertical orientation after injection/removal of material into/from the egg has occurred.

Abstract: The present invention provides a wafer positioning device having wafer storage capability. The wafer positioning device has a wafer platform with wafer lift pins, a wafer position sensor, and a storage location in close proximity to the wafer platform and the wafer position sensor. The storage location may be above the wafer position sensor, in which case the wafer position sensor retracts or rotates so that the wafer lift pins may elevate a positioned wafer past the position sensor to the storage location. Alternatively, the storage location may be between the wafer platform and the wafer positioning device. The storage location is preferably formed by a plurality of rotatable towers or a plurality of retractable lift pins that are operatively coupled to the wafer platform and that have wafer support portions capable of assuming both a wafer storage position and a wafer passage position.

Abstract: A wafer or some other article is aligned while being held by an end-effector.

Abstract: An optical disk is provided by bonding two substrates to each using a radiation-hardening resin, and leveling and hardening the resin. In an optical recording medium manufacturing apparatus including lamps for emitting radiation to two disks attached to each other with a radiation-hardening resin layer sandwiched therebetween, and a rotation arm for supporting and rotating the two disks to allow the disks to traverse the emission area of the lamps, light source centers of the lamps are positioned radially outside a rotation locus of the center of the disks attached to each other, said locus being drawn while the disks are supported by the rotation arm.

Abstract: A device for aligning a flatted object to a desired orientation. The flatted object has a substantially circular perimeter and a flatted chord portion and may be a silicon wafer or a cover for an electrostatic chuck. The device includes multiple conically shaped rollers that center and rotationally align the object, each roller having a bottom lip for supporting the object. Centering rollers are mounted so that they contact the circular perimeter of the object when it is in the desired orientation. Rotational alignment rollers are mounted so that they contact the flatted chord portion of the object when it is in the desired orientation. When placed on the alignment device, the flatted object passively moves to the desired orientation under the force of gravity.

Abstract: An air track included a first body having a concave top surface with a plurality of air outlets or a flat surface with a notch and a plurality of air outlets. The body includes at least one air filter that runs along the length of at least a portion of the body. The air filter dividing the body into a first plenum and a second plenum. The air track also includes a hood covering at least a portion of the top surface. The air track further includes a stopper assembly that arrests the motion of a disk. The stopper assembly includes a disk detector that senses the presence of the disk on the air track.

Abstract: The invention relates to a simple and cost-effective method for aligning substrates. In order to achieve this, the invention provides a device for aligning disc-shaped substrates, in particular semiconductor wafers, comprising an alignment detection unit, at least one first support for receiving the substrate, which forms an oblique plane in relation to the horizontal, a stop against which the substrate can be displaced as a result of the oblique angle and a rotational device for rotating the substrate.

Abstract: An apparatus for holding and orienting a wafer having an alignment feature, and including a movable robot arm; and an end effector attached to an end of the robot arm, the end effector including a gripping mechanism which during operation both holds the wafer and rotates it about an axis that is perpendicular to the plane of the wafer and a sensing element for detecting the alignment feature on the wafer as the gripping mechanism rotates the wafer past the sensing element.

Abstract: Robot arm (16) end effectors (10, 110, 210) of this invention rapidly and cleanly transfer semiconductor wafers (12) between a wafer cassette (14) and a processing station. The end effectors include proximal and distal rest pads (24, 26, 124, 126) having pad and backstop portions (32, 34, 132, 134) that support and grip the wafer either by wafer peripheral edge contact or within an annular exclusion zone (30) that extends inward from a peripheral edge of the wafer. An active contact point (50, 150, 222) is movable by a vacuum actuated piston (52, 152) between a retracted wafer-loading position and an extended position that urges the wafer against the distal rest pads to grip the wafer at its edge or within the exclusion zone. The end effector further includes fiber optic light transmission sensors (90, 102, 202, 214) for determining various wafer surface, edge, thickness, tilt, and location parameters.

Abstract: A semiconductor processing robot is provided with a robot arm on which is mounted an integrated edge gripper having an orienting assembly and a detecting assembly. The orienting assembly operates to rotate a substrate such that a substrate reference marking, or indicium, is positioned at the detecting assembly. The detecting assembly detects the location of the reference indicium and thereby derives information about the relative orientation of the substrate in the integrated edge gripper.

Abstract: A multiple substrate orienter is provided that includes a rotatable substrate handler having a plurality of substrate support portions, each adapted to support a substrate. The multiple substrate orienter also includes a plurality of stacked substrate supports, each adapted to support a substrate. A plurality of substrate orientation marking (SOM) detectors are provided, and each SOM detector is coupled to a different one of the substrate supports and is adapted to identify a presence of an SOM of a substrate positioned close enough to the SOM detector to allow SOM detection by the SOM detector. The multiple substrate orienter further includes a plurality of lift and lower mechanisms, each lift and lower mechanism coupled to a different one of the substrate supports and adapted to individually lift and lower the substrate support to which the lift and lower mechanism is coupled. Numerous other aspects are provided.

Abstract: In order to achieve a higher compaction ratio with a wafer transfer apparatus for transferring wafers stacked in an interspaced manner in a first holding device, e.g.

Abstract: A multiple substrate orienter is provided that includes a rotatable substrate handler having a plurality of substrate support portions, each adapted to support a substrate. The multiple substrate orienter also includes a plurality of stacked substrate supports, each adapted to support a substrate. A plurality of substrate orientation marking (SOM) detectors are provided, and each SOM detector is coupled to a different one of the substrate supports and is adapted to identify a presence of an SOM of a substrate positioned close enough to the SOM detector to allow SOM detection by the SOM detector. The multiple substrate orienter further includes a plurality of lift and lower mechanisms, each lift and lower mechanism coupled to a different one of the substrate supports and adapted to individually lift and lower the substrate support to which the lift and lower mechanism is coupled.

Abstract: A wafer flat zone aligner prevents wafers from binding to the walls of a wafer cassette, that define the slots in which the wafers are seated, by restricting axial movement of the wafers while the wafers are being rotated by a wafer rotating roller of the aligner. To this end, the wafer rotating roller includes a shaft portion, and a plurality of spaced apart annular members protruding radially from the shaft portion. Each wafer seated in the cassette is inserted between adjacent ones of the annular members into contact with the shaft portion of the roller. When the roller is rotated, the shaft portion rotates the wafers while the wafers are constrained from moving in the axial direction of the roller by the annular members. The wafer aligner also includes a guide roller that is moved into contact with the wafers and causes the wafers to stop rotating when flat zones of the wafer arrive at the guide roller.

Abstract: The present invention is an edge grip aligner with buffering capabilities and a method for increasing the throughput of wafers through the device. According to one embodiment, the present invention has first and second buffer arms, and a chuck arm. A workpiece can be aligned while supported on the chuck arm. Once the workpiece is aligned, the chuck arm transfers the workpiece to the buffer arms so that a second workpiece can be aligned on the chuck arm. While the second workpiece is being aligned, an end effector can transfer the first workpiece away from the buffer arms and retrieve another workpiece to place upon the chuck arm.

Abstract: A wafer flat zone aligner prevents wafers from binding to the walls of a wafer cassette, that define the slots in which the wafers are seated, by restricting axial movement of the wafers while the wafers are being rotated by a wafer rotating roller of the aligner. To this end, the wafer rotating roller includes a shaft portion, and a plurality of spaced apart annular members protruding radially from the shaft portion. Each wafer seated in the cassette is inserted between adjacent ones of the annular members into contact with the shaft portion of the roller. When the roller is rotated, the shaft portion rotates the wafers while the wafers are constrained from moving in the axial direction of the roller by the annular members. The wafer aligner also includes a guide roller that is moved into contact with the wafers and causes the wafers to stop rotating when flat zones of the wafer arrive at the guide roller.

Abstract: Specimen edge-gripping prealigners (8, 80) grasp a wafer (10) by at least three edge-gripping capstans (12) that are equally spaced around a periphery (13) of the wafer. Each edge-gripping capstan is coupled by a continuous synchronous belt (14) to a drive hub (15, 84) that is rotated by a drive motor (18, 88). The belts are tensioned by idler pulleys (22, 92) that are rotated by a motive force (25, 96, 102). The edge-gripping capstans and the drive drums are mounted to hinged bearing housings (28, 112) that are spring biased to urge the capstans away from the drive hub. Deactivating the motive force rotates the idler plates into a belt tensioning position that draws the capstans inward to grip the periphery of the wafer. Once gripped, rotation of the drive hub is coupled through the tensioned belts to the capstans. Driving all the capstans provides positive grasping and rotation of the wafer without surface contact with the wafer and thereby reduces wafer damage and particle contamination.

Abstract: Specimen edge-gripping prealigners (8, 80) grasp a wafer (10) by at least three edge-gripping capstans (12) that are equally spaced around a periphery (13) of the wafer. Each edge-gripping capstan is coupled by a continuous synchronous belt (14) to a drive hub (15, 84) that is rotated by a drive motor (18, 88). The belts are tensioned by idler pulleys (22, 92) that are rotated by a motive force (25, 96, 102). The edge-gripping capstans and the drive drums are mounted to hinged bearing housings (28, 112) that are spring biased to urge the capstans away from the drive hub. Deactivating the motive force rotates the idler plates into a belt tensioning position that draws the capstans inward to grip the periphery of the wafer. Once gripped, rotation of the drive hub is coupled through the tensioned belts to the capstans. Driving all the capstans provides positive grasping and rotation of the wafer without surface contact with the wafer and thereby reduces wafer damage and particle contamination.

Abstract: An assembly for turning bundles includes a planar surface that receives bundles from an upstream station. A sensor detects movement of the bundle toward the surface and initiates a timing sequence. The sequence includes slowing the bundle over the surface so that it does not contact the stop at high speed. The stop is then retracted after the bundle movement is terminated and a portion of the surface is lifted and rotated through approximately ninety degress to re-orient the bundle. After the bundle is lowered to the planar surface, it is then advanced by a drive assembly from the surface toward a downstream station.

Abstract: A wafer orienting apparatus for aligning a plurality of semiconductor wafers each of which bas a v-notch formed on its outer periphery. The apparatus includes a cassette process carrier for supporting the plurality of wafers in parallel wafer supporting slots and wafer support means engaging the periphery of each wafer in an individual slot with the central axis of all wafers in coaxial alignment. A supporting platform is placed over the cassette for supporting the wafers in an inverted position in which the wafers are substantially vertical and biased by their own weight against a multiplicity of orienting mechanisms. The orienting mechanisms are arranged to correspond to each wafer position within the cassette. The plurality of orienting mechanisms are intergrated with the supporting platform so that all wafers within the cassette can be aligned during this aligning process.

Abstract: An apparatus is provided with a plurality of stages of mounting bases on each of which is disposed upwardly orientated, narrow tapered pins around the periphery of a semiconductor wafer, and a plurality of stages of turntables, one for each of the mounting bases, with the mounting bases being capable of moving independently of the turntables. When a wafer is transferred from a transporter arm to the tapered pins, the peripheral edge of the wafer comes into contact with the inner peripheral surfaces of the tapered pins and the wafer is centered thereby. The turntable then picks up the wafer and aligns the orientation thereof. This makes it possible to position the centers of a plurality of wafers and position the orientations thereof in a simple manner.

Abstract: An apparatus for fabricating a device includes a stage for holding a substrate to be treated, a hand for carrying the substrate to the stage, and a mark detecting system for detecting a mark formed on the substrate, before the substrate is transferred to the stage, in order to roughly position the substrate. The hand is provided with a reference mark which can be detected by the mark detecting system, and the mark detecting system detects a mark of the substrate and the reference mark of the hand. Also, the hand can carry the substrate to the stage after rotating the stage in a rotational direction in response to a value detected by the mark detecting system.

Abstract: A semiconductor wafer testing and inspecting apparatus and method are provided in which a plurality of tests are performed on each of a plurality of wafers from a wafer cassette and before the wafers are returned to a packaging cassette or further processing. A carousel conveyor receives each wafer from a cassette and indexes it through each of a plurality of testing stations, including preferably at least two electrical testing stations at which a probe contacts each device or die on the wafer to perform an electrical test, with the two stations performing different electrical tests. The wafers are each moved through at least one visual or optical testing station at which each of the dies on the wafer is inspected. Preferably, a testing head or probe is moved in a plane parallel to the wafer sequentially to positions over each of the devices on the wafer to perform a test on or otherwise inspect the devices on the wafer.