Abstract: A pick and place device includes a lift head and a build platform. Both the lift head and the build platform include flexible aprons. An item layer is constructed on the build platform and the lift head is moved into position over the build platform. By slipping the lift head apron under the layer while concurrently pulling from under the layer the build platform apron, support for the layer passes from the build platform to the lift head. The lift head then moves to a place site and the lift head apron is pulled from under the layer and the layer falls from the lift head onto the place site. Under one form of the device, the layer may be constructed directly upon the lift head apron and then moved to a place site and deposited thereat by pulling the lift head apron from thereunder. Tower configurations illustrated define a vertical column of space including a layer pre-build table, layer transport and layer stacking occurring therewithin.