Abstract: A hanger bar for an electrowinning cell, wherein hanger bar includes a bar portion and one or more contact portions adapted, in use, to be brought into contact with an electrical conductor. The contact portions are fabricated from an electrically conductive material, and a welded seal is formed between the bar portion and the contact portions in order to minimize corrosion.

Abstract: A composite material for medical devices includes a superelastic shape memory alloy configured or constituting a matrix and a metal oxide which is dispersed in the matrix.

Abstract: A sputtering target for forming protective film according to the invention is used to form protective film on one surface or both surfaces of a Cu wiring film, and includes 8.0 to 11.0% by mass of Al, 3.0 to 5.0% by mass of Fe, 0.5 to 2.0% by mass of Ni and 0.5 to 2.0% by mass of Mn with a remainder of Cu and inevitable impurities. In addition, a laminated wiring film includes a Cu wiring film and protective film formed on one surface or both surfaces of the Cu wiring film, and the protective film is formed by using the above sputtering target.

Abstract: A copper alloy wire is a filamentary material of a copper alloy containing, in percent by mass, Ni: 3.0 to 15.0%, Al: 0.5 to 5.0%, and Si: 0.1 to 3.0%, with the remainder being composed of Cu and incidental impurities, which is provided with the tensile strength (?B) of 900 to 1300 MPa and electrical conductivity of 10 to 22% IACS and, in addition to that property, satisfies an intensity ratio of A:B:C of 1.0:1.2 to 6.0:2.2 to 8.0 when A, B and C represent diffraction intensities of Cu (111), Cu (200) and Cu (220), respectively, according to an X-ray diffraction method in a predetermined cross section, and which is used for an operation or contact spring by incorporating in mobile phones and various small electronic instruments by formulating into a copper alloy spring used, particularly, for an electrical conductive spring.

Abstract: An apparatus and method for treating ballast water to achieve IMO standards for ballast water includes a reactor fabricated of copper nickel for receiving and discharging ballast water, a UV source for irradiating the water in the presence of copper nickel thereby to generate free radicals for biocidal and bactericidal effects on organisms and microbes entering the reactor with ballast water.

Abstract: The invention relates to an alloy permitting to replace the current CuBe alloy, soon to be prohibited by the various environmental directives because of the presence of Be and for which there is currently no substitution alloy with similar desired thermal and mechanical properties for measuring physical parameters, notably in aeronautics. This alloy is a Cu—Al—Ni—Fe alloy and the balance is copper. It contains from 3.8 to 4.4 wt % aluminum, from 4.2 to 5 wt % nickel, from 1.7 to 5 wt % iron, additives including silicon, manganese, chromium and titanium, silicon being present at less than 0.8 wt %, manganese being present at less than 0.15 wt %, chromium being present at less than 0.3 wt %, titanium being present at less than 0.1 wt %, the other chemical elements having contents by weight of less than 1%, each being present at less than 0.05 wt % and the balance is copper.

Abstract: This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I{420}/I0{420}>1.0??(1), where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I0{420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.

Abstract: A Cu—Ni—Si based copper alloy, comprising 1.2 to 4.5% by mass of Ni, 0.25 to 1.0% by mass of Si and the the balance Cu with inevitable impurities, wherein when an X-ray diffraction intensity of a {111} plane of a rolled surface and that of a {111} plane of a pure copper powder standard specimen is represented by I{111}, I0{111} respectively, I{111}/I0{111} is 0.15 or more, wherein when an X-ray diffraction intensity of a {200} plane of the rolled surface and that of a plane {200} of the pure copper powder standard specimen is represented by I{200}, I0{200} respectively, I{200}/I0{200} is 0.5 or less, when an X-ray diffraction intensity of a {220} plane and a plane {311} of the rolled surface is represented by I{220}, I{311} respectively, I{111}/(I{111}+I{200}+I{220}+I{311}) is 0.2 or more, a bending coefficient is 130 GPa or more, a yield strength YS satisfies: YS=>?22×(Ni mass %)2+215×(Ni mass %)+422, and the electrical conductivity is 30% IACS or more both in a direction transverse to rolling direction.

Abstract: The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. The copper alloy comprising: small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 ?m and smaller than 0.3 ?m; and large particles of Ni—Si compound having a particle size of equal to of greater than 0.3 ?m and smaller than 1.5 ?m. The number density of the small particles is 1 to 2000 pieces/?m2 and the number density of the large particles is 0.05 to 2 pieces/?m2.

Abstract: A mechanical structure is provided with a crystalline superelastic alloy that is characterized by an average grain size and that exhibits a martensitic phase transformation resulting from a mechanical stress input greater than a characteristic first critical stress. A configuration of the superelastic alloy is provided with a geometric structural feature of the alloy that has an extent that is no greater than about 200 micrometers and that is no larger than the average grain size of the alloy. This geometric feature undergoes the martensitic transformation without intergranular fracture of the geometric feature.

Abstract: Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X % by atom, an electrical conductivity ? (% IACS) satisfies the following Expression (1), ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100 (1); and (b) an average number of intermetallic compounds, which have grain sizes of 0.1 ?m or more and contain Cu and Mg as main components, is in a range of 1 piece/?m2 or less. A copper alloy according to a fourth aspect further contains one or more selected from a group consisting of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, and Zr at a total content of 0.01% by atom to 3.0% by atom, and satisfies the condition (b).

Abstract: A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1}<3 4 6> is within 30° is 60 % or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.

Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation ? of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.

Abstract: A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} <1 0 0> is 5 to 50%, according to a crystal orientation analysis in EBSD measurement.

Abstract: To provide a copper alloy wire being a filamentary material of a copper alloy containing, in percent by mass, Ni: 3.0 to 15.0%, Al: 0.5 to 5.0%, and Si: 0.1 to 3.0%, with the remainder being composed of Cu and incidental impurities, which is provided with the tensile strength (?B) of 900 to 1300 MPa and electrical conductivity of 10 to 22% IACS and, in addition to that property, satisfies an intensity ratio of A:B:C of 1.0:1.2 to 6.0:2.2 to 8.

Abstract: A secondary alloyed 1N copper wire for bonding in microelectronics contains one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.09 wt % and about 9.9 wt %.

Abstract: An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.

Abstract: A copper zinc alloy that is used as a material for a sliding bearing wherein the alloy comprises 59-73% copper, 2.7-8.5% manganese, 1.5-6.3% aluminum, 0.2-4% silicon, 0.2-3% iron, 0-2% lead, 0-2% nickel, 0-0.4% tin, residual zinc and unavoidable impurities.

Abstract: A mechanical structure is provided with a crystalline superelastic alloy that is characterized by an average grain size and that is characterized by a martensitic phase transformation resulting from a mechanical stress input greater than a characteristic first critical stress. A configuration of the superelastic alloy is provided with a geometric structural feature of the alloy that has an extent that is no greater than about 200 micrometers and that is no larger than the average grain size of the alloy. This geometric feature is configured to accept a mechanical stress input.

Abstract: The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5?Ni/Co?about 2, and wherein Pc is equal to or less than about 15/1000 ?m2, or Pc/P is equal to or less than about 0.

Abstract: An alloy including at least 6 weight percent aluminum, greater than 6 weight percent nickel, and at least 50 weight percent copper. In some embodiments, the alloy includes 6 to 9 weight percent aluminum, 6 to 11 weight percent nickel, 1.5 to 3 weight percent iron, 1.5 to 3 weight percent manganese, 1 to 3 weight percent silicon, 1 to 5 weight percent tin, and 75 to 80 weight percent copper. The alloy is particularly suitable for jewelry, e.g., wrist watches, and materials exposed to aquatic environments for extended periods of time, e.g., boat hulls and boat propellers.

Abstract: An antimicrobial, tarnish resistant copper alloy with a golden visual appearance comprising between about 1% and about 4% Ni, up to 3% Al, and optionally Zn and/or Mn up to a total of about 15%.

Abstract: A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 ?m to 2 ?m, the intermetallic compound B has a compound diameter of 0.05 ?m to less than 0.3 ?m, and the intermetallic compound C has a compound diameter of more than 0.001 ?m to less than 0.05 ?m.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: A mechanical structure is provided with a crystalline superelastic alloy that is characterized by an average grain size and that is characterized by a martensitic phase transformation resulting from a mechanical stress input greater than a characteristic first critical stress. A configuration of the superelastic alloy is provided with a geometric structural feature of the alloy that has an extent that is no greater than about 200 micrometers and that is no larger than the average grain size of the alloy. This geometric feature is configured to accept a mechanical stress input.

Abstract: A metal alloy is primarily formed of copper, nickel, magnesium and iron. The main constituents are copper and nickel. The contents of magnesium and iron are increased considerably in comparison with the prior art conventional alloys.

Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.

Abstract: A beryllium copper alloy is provided, having a thickness “t” in a range from 0.05 mm to 0.5 mm and having an alloy composition consisting by weight (or mass %), of Cu100?(a+b)NiaBeb, wherein 1.0?a?2.0, 0.15?b?0.35, and 5.5 ?a/b?6.5. The beryllium copper alloy also exhibits a 0.2% proof stress equal to or above 650 MPa, an electric conductivity equal to or above 70% IACS, and a bending formability defined by a ratio of R/t=0, wherein “R” is a maximum bend radius before cracking at a bent portion when the beryllium copper alloy is bent into a V shape at a right angle.

Abstract: The invention relates to a metal matrix material based on shape-memory alloy powders, to the production method thereof and to the use of same. More specifically, the invention relates to a metal matrix material which is characterised in that it is based on particles of shape-memory alloy powder, having a base of copper at a concentration of between 45 vol.-% and 70 vol.-% in relation to the total volume of the material, said powder particles being supported by a metal matrix. The invention also relates to a method of producing the aforementioned material and to the use of same for absorbing vibrations, particularly acoustic and mechanical vibrations.

Abstract: A copper alloy extruded material is provided by extruding a copper alloy powder solidified billet and old grain boundaries remain in it.

Abstract: A brazing material for brazing tungsten/carbide/cobalt substrates (e.g., wear pads) to substrates comprising titanium or alloys thereof (e.g., fan or compressor blades). The brazing material includes silver, aluminum, nickel, copper, and titanium present in respective amounts to provide a post-braze hardness of between 450 and 550 KHN to thereby increase the impact resistance of the braze joint. The substrates may be brazed by induction heating at temperatures up to about 1750° F. (about 954° C.).

Abstract: The invention relates to a copper alloy which is used for mechanically stressed components which, during operation, are subjected to vibrations and/or impacts to produce the same, and have particularly good mechanical damping properties. The composition of said copper alloy depends upon the utilisation temperature or working temperature of the component. Said copper alloy consists of 2-12 wt.-% manganese, 5-14 wt.-% aluminum and individually or in total 0-18 wt.-% of one or several elements, nickel, iron, cobalt, zinc, silicon, vanadium, niobium, molybdenum, chromium, tungsten, beryllium, lithium, yttrium, cerium, scandium, calcium, titanium, phosphorous, zirconium, boron, nitrogen, carbon, whereby each element does not contain more that 6% and 100 wt.-% copper.

Abstract: A metal alloy is primarily formed of copper, nickel, magnesium and iron. The main constituents are copper and nickel. The contents of magnesium and iron are increased considerably in comparison with the prior art conventional alloys. The novel alloy has the following constituents in the following proportions (in % by mass and/or % by weight): copper (40% to 61%), nickel (35% to 45%), manganese (3.9% to 10%), iron (0.1% to 5%); and other materials, such as carbon, silicon, aluminum, magnesium, titanium, chromium, rare earths, molybdenum, and/or yttrium (at most 2% in total), with the sum of the components amounting to 100% by mass or, respectively, to 100% by weight.

Abstract: Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C.

Abstract: The invention relates to an alloy permitting to replace the current CuBe alloy, soon to be prohibited by the various environmental directives because of the presence of Be and for which there is currently no substitution alloy with similar desired thermal and mechanical properties for measuring physical parameters, notably in aeronautics. This alloy is a Cu—Al—Ni—Fe alloy and the balance is copper. It contains from 3.8 to 4.4 wt % aluminum, from 4.2 to 5 wt % nickel, from 1.7 to 5 wt % iron, additives including silicon, manganese, chromium and titanium, silicon being present at less than 0.8 wt %, manganese being present at less than 0.15 wt %, chromium being present at less than 0.3 wt %, titanium being present at less than 0.1 wt %, the other chemical elements having contents by weight of less than 1%, each being present at less than 0.05 wt % and the balance is copper.

Abstract: The disclosure relates to a platinum alloy comprising (a) 55 to 63 wt. % of platinum, (b) 2 to 10 wt. % of cobalt, and (c) 27 to 43 wt. % of copper. The disclosure further relates to a platinum alloy comprising (a) 70 to 79.5 wt. % of platinum, 2 to 10. wt. % of cobalt, and (c) 10.5 to 28 wt. % of copper. The platinum alloys have excellent mechanical and optical properties for use in the production of ornamental articles such as rings, necklaces, earrings, watch bands, watch bodies and other jewelry. The disclosure further relates to a method of preparing the platinum alloys and their use in the production of ornamental articles. Still further the disclosure relates to ornamental articles comprising the platinum alloy and a method of production thereof.

Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.

Abstract: A product resistant or immune to carburization, metal dusting, coking, oxidation, and having sufficient mechanical strength for use at temperatures greater than 400° C. The product consists of a load-bearing member and a corrosion resistant member, wherein the corrosion resistant member is a Cu—Al-alloy comprising Si. The product can be used in CO-containing atmospheres, and/or hydrocarbon containing atmospheres or solid carbon containing processes. A method of resisting carburization, metal dusting, coking and oxidation is also disclosed.

Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.

Abstract: A valve seat (2) is formed by build-up cladding by irradiating a laser beam on a copper alloy powder (4) provided in the rim of a port (3) formed in an engine cylinder head (1). The copper alloy powder (4) consists of copper (Cu), 6-9 wt % nickel (Ni), 1-5 wt % silicon (Si), and 1-5 wt % of one of molybdenum (Mo), tungsten (W), tantalum (Ta), niobium (Nb) and vanadium (V). Due to this composition, the valve seat (2) has few microcracks and excellent abrasion resistance.

Abstract: The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper from the conductive member. The hardness of the target may be enhanced by alloying the copper conductive member with another material and/or mechanically working the material of the conductive member during its manufacturing process in order to improve conductive member and film qualities. The copper may be alloyed with magnesium, zinc, aluminum, iron, nickel, silicon and any combination thereof.

Abstract: A copper alloy sheet comprises 0.4 to 2.5 wt % of Ni, 0.05 to 0.6 wt % of Si, 0.001 to 0.05 wt % of Mg, and the balance being Cu and inevitable impurities wherein an average grain size in the sheet is in the range of 3 to 20 &mgr;m and a size of an intermetallic compound precipitate of Ni and Si is in the range of 0.3 &mgr;m or below. If necessary, the sheet may further comprise one or more of 0.01 to 5 wt % of Zn, 0.01 to 0.3 wt % of Sn, 0.01 to 0.1 wt % of Mn, and 0.001 to 0.1 wt % of Cr. It is preferred that when an X-ray diffraction intensity from {200} plane in the surface of said sheet is taken as I{200}, an X-ray diffraction intensity from {311} plane is taken as I{311}, and an X-ray diffraction intensity from {220} plane is taken as I{220}, the following equation is satisfied [I{200}+I{311}]/I{220}≧0.

Abstract: Improved biocompatible liquid delivery compositions, which are useful for the formation of sustained release delivery systems for active agents, are provided. The compositions include liquid formulations of a biocompatible polymer or prepolymer in combination with a controlled release component. The controlled release component includes an active agent. These compositions may be introduced into the body of a subject in liquid form which then solidify or cure in situ to form a controlled release implant or a film dressing. The liquid delivery compositions may also be employed ex situ to produce a controlled release implant. Methods of forming a controlled release implant and employing the liquid formulations in the treatment of a subject are also provided.

Abstract: The present invention is directed to a macrocapsule for encapsulating microcapsules containing biologically active material, such as living cells or free living cells, to make the system more biocompatible by decreasing the surface area and surface roughness of microencapsulated biological materials; increasing mechanical stability of microencapsulated biological materials; enhancing cytoprotectivity by increasing diffusion distance of encapsulated biological material from cytotoxins secreted in vivo; providing retrievability of microencapsulated material; and providing a system of sustained release of the cellular products. The method for producing such a macrocapsule containing the microcapsules is also disclosed.

Abstract: A copper-zinc alloy for semi-finished products and articles which are highly loaded and subjected to extreme wear especially synchronizing rings. The alloy possesses a composition of 40 to 65% Cu, 8 to 25% Ni, 2.5 to 5% Si, 0 to 3% Al, 0 to 3% Fe, 0 to 2% Mn and 0 to 2% Pb, with the balance being zinc and unavoidable impurities. The Ni:Si ratio is about 3 to 5:1, and the structure consists of at least 75% .beta.-phase, with the balance .alpha.-phase, in the absence of a .gamma.-phase. Nickel silicides occur predominantly as a round intermetallic phase. The alloy provides quite substantially higher levels of resistance to wear.

Abstract: The present invention aims to provide a metal mold for glass, which needs not apply any swab in molding of glass, enabling no-swabbing glass forming. The alloy for the mold comprises by weight Cu: 10 to 80%, Al: 4 to 11%, Cr: 3 to 16%, Ni: 2 to 36%, and at least one rare earth element: 0.02 to 2.08 with the balance consisting of Fe and further comprises at least one member selected from the group consisting of Ti: Al %.times.0.5 to 2, V: Al %.times.0.2 to 1, Zr: Al %.times.0.1 to 0.3, and Nb: Al %.times.0.1 to 0.3. The alloy is gradually cooled from the solidification initiation temperature to 500.degree. C. at a cooling rate of 10.degree. C./min. The surface of the mold is coated with an Al-containing coating or roughened to an average roughness of 0.3 to 5 .mu.m. A solid lubricating film is provided in a fitting portion of the mold, or alternatively a self-lubricating solid is embedded in the fitting portion of the mold.

Abstract: A copper based casting alloy in which lead is replaced by 0.1 to 7 wt % bismuth and 0.1 to 2 wt % mischmetal or its rare earth equivalent is used to improve the distribution of bismuth in the alloy. The alloy is further defined by additions of tin, zinc, nickel, manganese, silicon, aluminum, iron and/or antimony.

Abstract: A high temperature abrasion resistant copper alloy suitable for the material of engine parts such as valve seats and valve guides. The copper alloy comprising aluminum in an amount ranging from 1.0 to 15.0% by weight; at least one element selected from the group consisting of vanadium, niobium and tantalum in the group Va of the periodic table of elements, in an amount ranging from 0.1 to 5.0% by weight; and balance containing copper and impurities. The copper alloy has a structure in which at least one of intermetallic compounds is dispersed. each intermetallic compound contains at least one metal selected from the group consisting of aluminum and copper and at least one element selected from the group consisting of elements of the group Va of the periodic table. This copper alloy exhibits also high oxidation resistance and corrosion resistance at high temperatures.

Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.