Copper Base Patents (Class 420/469)
  • Patent number: 9911910
    Abstract: In one embodiment a superconductor tape includes a substrate comprising a plurality of layers, an oriented superconductor layer disposed on the substrate, and an alloy coating disposed upon the superconductor layer, the alloy coating comprising one or more metallic layers in which at least one metallic layer comprises a metal alloy.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: March 6, 2018
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Connie P. Wang, Paul Sullivan, Paul Murphy, Kasegn D. Tekletsadik, Bharatwaj Ramakrishnan
  • Patent number: 9809872
    Abstract: A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance of pure copper and inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO2, TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO2, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: November 7, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Shuji Sakai, Takahiro Sato, Hidenori Abe
  • Patent number: 9734937
    Abstract: Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 ?m or less in a surface layer having a depth of 50 ?m from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: August 15, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Hiromitsu Kuroda, Hideyuki Sagawa
  • Patent number: 9157004
    Abstract: A composition for copper patterning and a method of copper patterning using the composition are provided, which composition is excellently safe in copper patterning, sintering at lower temperatures, and capable of forming a highly conducive copper pattern of a desired shape even on a plastic substrate. The composition contains Component A: a copper ?-ketocarboxylate compound of formula (1): (R1, R2: H or C1-C6 straight- or C3-C6 branched-hydrocarbon group, etc.); and based on 1 mol of this compound, Component B: an amine compound having a boiling point of not higher than 250° C. at 0.1 to 500 mol; and Component C-1: an organic acid having pKa of not more than 4 at 0.01 to 20 mol, and/or Component C-2: an organic copper compound composed of copper and an organic acid having pKa of not more than 4 at 0.01 to 100 mol. The composition is useful in the field of electronics.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: October 13, 2015
    Assignees: NOF CORPORATION, OSAKA UNIVERSITY
    Inventors: Eui-chul Kang, Tomoyuki Ohtake, Katsuaki Suganuma, Masaya Nogi, Natsuki Komoda
  • Publication number: 20150147584
    Abstract: Fibrous copper microparticles having a minor axis of 1 ?m or less and an aspect ratio of 10 or more, wherein the content of the copper particles having a minor axis of 0.3 ?m or more and an aspect ratio of 1.5 or less is 0.1 or less copper particle per one fibrous copper microparticle.
    Type: Application
    Filed: June 11, 2013
    Publication date: May 28, 2015
    Applicant: UNITIKA LTD.
    Inventors: Munenori Yamada, Kou Takeuchi, Mutsumi Matsushita, Akira Shigeta, Masahiro Hosoda, Yoshiaki Echigo
  • Publication number: 20150136219
    Abstract: This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2.
    Type: Application
    Filed: May 8, 2013
    Publication date: May 21, 2015
    Inventors: Junichi Koike, Hoang Tri Hai
  • Publication number: 20150122335
    Abstract: Disclosed are an ink composition for manufacturing a light absorption layer including metal nano particles and a method of manufacturing a thin film using the same, more particularly, an ink composition for manufacturing a light absorption layer including copper (Cu)-enriched Cu—In bimetallic metal nano particles and Group IIIA metal particles including S or Se dispersed in a solvent and a method of manufacturing a thin film using the same.
    Type: Application
    Filed: January 6, 2015
    Publication date: May 7, 2015
    Inventors: Seokhee YOON, Seokhyun YOON, Taehun YOON
  • Patent number: 9023271
    Abstract: A Cu—Ni—Mo alloy thin film, including Ni as a solution element and Mo as a diffusion barrier element. Ni and Mo are co-doped with Cu. The enthalpy of mixing between Mo and Cu is +19 kJ/mol, and the enthalpy of mixing between Mo and Ni is ?7 kJ/mol. The atomic fraction of Mo/Ni is within the range of 0.06-0.20 or the weight faction of Mo/Ni within the range of 0.10-0.33. The total amount of Ni and Mo additions is within the range of 0.14-1.02 at. % or wt. %. A method for manufacturing the alloy thin film is also provided.
    Type: Grant
    Filed: January 27, 2013
    Date of Patent: May 5, 2015
    Assignee: Dalian University of Technology
    Inventors: Xiaona Li, Xinyi Zhang, Jin Zhu, Qing Wang, Chuang Dong
  • Patent number: 9023272
    Abstract: A copper-zinc alloy product of the invention contains zinc in an amount of higher than 35% by weight and 43% by weight or less and has a two-phase structure of an ?-phase and a ?-phase. Further, the ratio of the ?-phase in the copper-zinc alloy is controlled to be higher than 10% and less than 40% and the crystal grains of the ?-phase and the ?-phase are crushed into a flat shape and arranged in a layer shape through cold working. According to the copper-zinc alloy product, it is possible to decrease the copper content and to appropriately secure the strength and cold workability by appropriately controlling the ratio of the ?-phase.
    Type: Grant
    Filed: July 5, 2010
    Date of Patent: May 5, 2015
    Assignee: YKK Corporation
    Inventors: Yasuharu Yoshimura, Takuya Koizumi, Koichi Mikado, Takahiro Fukuyama, Atsushi Ogihara
  • Patent number: 8991787
    Abstract: A piping component for controlling the flow of high-temperature fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and 650° F. The piping body may also be sized for high-temperature fluids (e.g., steam) operating at pressures of up to approximately 400 psi, and 600 psi. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than 0.25% lead, less than 0.25% bismuth, 2 to 6% silicon and a balance of copper (by weight).
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: March 31, 2015
    Assignee: NIBCO Inc.
    Inventors: David A. Bobo, Mark A. Clark, Aaron W. Edds, Benjamin L. Lawrence, Charles M. Stutsman
  • Patent number: 8993493
    Abstract: Sliding parts are made of Pb-free Cu—Bi based sintered material. The side in contact with a shaft is machined to a predetermined roughness. A number of Bi phases are present on the finished surface. Stable performance of Bi is to be exhibited. Machined sintered material covers a portion of the Bi phases. The ratio of the exposed surface area of the Bi phases is 0.5% or more relative to the area of the finished surface.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: March 31, 2015
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Ryo Mukai, Hiromi Yokota, Kao Mouri
  • Publication number: 20150086416
    Abstract: A method of producing nanoparticles can comprise milling a plurality of milling bodies sufficient to produce the nanoparticles from exterior surfaces of the plurality of milling bodies. In this manner, the milling bodies are simultaneously the milling media and the feedstock for production of nanoparticles such that additional solids are not present during milling. Nanoparticles can be readily formed and optional milling agent and capping agents can be provided to stabilize and/or customize the nanoparticles for a particular application.
    Type: Application
    Filed: August 6, 2012
    Publication date: March 26, 2015
    Inventors: Scott L. Anderson, Brandon McMahon, Jesus Paulo L. Perez
  • Publication number: 20150064496
    Abstract: The present invention relates to a single crystal copper having [100] orientation and a volume of 0.1˜4.0×106 ?m3. The present invention further provides a manufacturing method for the single crystal copper and a substrate comprising the same.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Inventors: Chih CHEN, King-Ning TU, Chia-Ling LU
  • Publication number: 20150040723
    Abstract: A method of making dispersion-strengthened alloy particles involves melting an alloy having a corrosion and/or oxidation resistance-imparting alloying element, a dispersoid-forming element, and a matrix metal wherein the dispersoid-forming element exhibits a greater tendency to react with a reactive species acquired from an atomizing gas than does the alloying element. The melted alloy is atomized with the atomizing gas including the reactive species to form atomized particles so that the reactive species is (a) dissolved in solid solution to a depth below the surface of atomized particles and/or (b) reacted with the dispersoid-forming element to form dispersoids in the atomized particles to a depth below the surface of said atomized particles. The atomized alloy particles are solidified as solidified alloy particles or as a solidified deposit of alloy particles.
    Type: Application
    Filed: September 3, 2014
    Publication date: February 12, 2015
    Inventors: Iver E. Anderson, Robert L. Terpstra
  • Patent number: 8951371
    Abstract: A method of producing a copper alloy containing a precipitate X composed of Ni and Si and a precipitate Y that includes (a) Ni and 0% Si, (b) Si and 0% Ni, or (c) neither Ni nor Si, wherein the precipitate X has a grain size of 0.001 to 0.1 ?m, and the precipitate Y has a grain size of 0.01 to 1 ?m.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: February 10, 2015
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kuniteru Mihara, Tatsuhiko Eguchi, Nobuyuki Tanaka, Kiyoshige Hirose
  • Publication number: 20150030495
    Abstract: A pivotable tundish (1) for continuous casting a metal alloy. The tundish comprises a body (3) comprising a first chamber (5), a second chamber (7), a first passage (12) between the first chamber and the second chamber, and a second passage (16) between the second chamber and a mold (9). The first chamber is adapted to receive and hold a base metal constituting the base for forming the metal alloy by addition of alloying elements. The metal alloy is fed from the second chamber to the mold through the second passage. The second chamber further comprises a first portion (30) and a second portion (32), and a third passage (36) between the first portion and the second portion. In the casting state the metal alloy is formed while casting by adding the alloying elements to the second portion of the second chamber.
    Type: Application
    Filed: February 10, 2012
    Publication date: January 29, 2015
    Applicant: Luvata Espoo Oy
    Inventor: Sarita Hernesniemi
  • Publication number: 20150024204
    Abstract: The present invention relates a process of preparing a nanopowder by using a natural source starting material wherein the nano powder is a nano metal or nano alloy or nano metal oxide or nano metal carbide or nano compound or nano composite or nanofluid. The nano product produced by the process has novel properties such as enhanced hardness, antibacterial properties, thermal properties, electrical properties, abrasive resistant, wear resistant, superior frictional properties, sliding wear resistance, enhanced tensile strength, compression strengths, enhanced load bearing capacity and corrosion properties.
    Type: Application
    Filed: January 9, 2013
    Publication date: January 22, 2015
    Inventor: Sudhakara Sastry AMANCHI BALA
  • Publication number: 20150017058
    Abstract: To provide a metal wire and an electric wire of high mechanical strength and high ductibility that have sufficiently increased ductibility as well as sufficiently increased mechanical strength. A metal wire manufactured at least by being subjected to an extension in which a metal wire is extended in an axial direction, and having a hardness distribution in which hardness decreases toward a specific peripheral portion from a central portion in a cross-section orthogonal to axis, whereby a softened peripheral portion becomes to show a good malleability as well as a high resistance to cracking, so as to attain an improvement of mechanical strength and ductibility.
    Type: Application
    Filed: September 24, 2014
    Publication date: January 15, 2015
    Inventors: Junichiro Tokutomi, Kenichi Hanazaki, Jun Yanagimoto
  • Publication number: 20150011749
    Abstract: Metal-accumulating plants for preparing compositions including a metal catalyst derived from the plants. The composition is substantially devoid of organic matter. Also, carrying out chemical reactions with the compositions prepared from metal-accumulating plants.
    Type: Application
    Filed: March 5, 2013
    Publication date: January 8, 2015
    Applicants: UNIVERSITE MONTPELLIER 2 SCIENCES ET TECHNIQUES, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Claude Grison, Vincent Escande
  • Publication number: 20140376347
    Abstract: Disclosed herein are near field transducers (NFTs) that include either silver, copper, or aluminum and one or more secondary elements.
    Type: Application
    Filed: June 24, 2014
    Publication date: December 25, 2014
    Inventors: Justin Glen Brons, Tong Zhao, Sethuraman Jayashankar, Steve C. Riemer, Michael C. Kautzky
  • Publication number: 20140363871
    Abstract: The present invention refers to a process for obtaining copper nanoparticles from a fungus selected between Hypocrea lixii and Trichoderma koningiopsis. The present invention refers to the use of dead biomass of Hypocrea lixii or Trichoderma koningiopsis to perform bioremediation of wastewater and for industrial scale production of copper nanoparticles. In the present invention, it is developed a synthetic strategy for the biosynthesis and removal of copper nanoparticles which is fast, low cost, environment friendly and easily scalable, using as a reduction agent the fungus Hypocrea lixii or Trichoderma koningiopsis.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 11, 2014
    Inventors: Benedito CORRÊA, Cláudio Augusto Oller NASCIMENTO, Márcia Regina SALVADORI
  • Publication number: 20140363870
    Abstract: The present invention refers to a process for obtaining copper nanoparticles from Rhodotorula mucilaginosa. The present invention refers to the use of dead biomass of Rhodotorula mucilaginosa to perform bioremediation of wastewater and for industrial scale production of copper nanoparticles. In the present invention, it is developed a synthetic strategy for the biosynthesis and removal of copper nanoparticles which is fast, low cost, environment friendly and easily scalable, using as a reduction agent the yeast Rhodotorula mucilaginosa.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 11, 2014
    Inventors: Benedito CORRÈA, Cláudio Augusto Oller NASCIMENTO, Márcia Regina SALVADORI
  • Publication number: 20140350147
    Abstract: A method of producing metal flakes (72?) is provided. The method includes: applying a layer of ionic liquid (70) to a substrate (24); forming a layer of metal (70) on the substrate (24) over the ionic liquid (70); and removing the layer of metal (70) from the substrate (24).
    Type: Application
    Filed: August 24, 2012
    Publication date: November 27, 2014
    Applicant: ECKART AMERICA CORPORATION
    Inventor: John Moffatt
  • Publication number: 20140348203
    Abstract: Provided in one embodiment is a method of identifying a stable phase of an ordering binary alloy system comprising a solute element and a solvent element, the method comprising: determining at least three thermodynamic parameters associated with grain boundary segregation, phase separation, and intermetallic compound formation of the ordering binary alloy system; and identifying the stable phase of the ordering binary alloy system based on the first thermodynamic parameter, the second thermodynamic parameter and the third thermodynamic parameter by comparing the first thermodynamic parameter, the second thermodynamic parameter and the third thermodynamic parameter with a predetermined set of respective thermodynamic parameters to identify the stable phase; wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase.
    Type: Application
    Filed: May 20, 2014
    Publication date: November 27, 2014
    Applicant: Massachusetts Institute of Technology
    Inventors: Heather A. Murdoch, Christopher A. Schuh
  • Publication number: 20140332733
    Abstract: Provided herein are nanofibers and processes of preparing nanofibers. In some instances, the nanofibers are metal and/or ceramic nanofibers. In some embodiments, the nanofibers are high quality, high performance nanofibers, highly coherent nanofibers, highly continuous nanofibers, or the like. In some embodiments, the nanofibers have increased coherence, increased length, few voids and/or defects, and/or other advantageous characteristics. In some instances, the nanofibers are produced by electrospinning a fluid stock having a high loading of nanofiber precursor in the fluid stock. In some instances, the fluid stock comprises well mixed and/or uniformly distributed precursor in the fluid stock. In some instances, the fluid stock is converted into a nanofiber comprising few voids, few defects, long or tunable length, and the like.
    Type: Application
    Filed: August 30, 2012
    Publication date: November 13, 2014
    Applicant: CORNELL UNIVERSITY
    Inventors: Yong Lak Joo, Nathaniel S. Hansen, Daehwan Cho
  • Publication number: 20140335328
    Abstract: Provided is a nanowire manufacturing substrate, comprising a grid base layer on a substrate and a grid pattern formed by patterning the grid base layer, the grid pattern being disposed to produce a nanowire on a surface thereof. According to the present invention, the width and height of the nanowire can be adjusted by controlling the wet-etching process time period, and the nanowire can be manufactured at a room temperature at low cost, the nanowire can be mass-manufactured and the nanowire with regularity can be manufactured even in case of mass production.
    Type: Application
    Filed: July 28, 2014
    Publication date: November 13, 2014
    Inventors: Young Jae Lee, Kyoung Jong Yoo, Jun Lee, Jin Su Kim, Jae Wan Park
  • Publication number: 20140322069
    Abstract: Methods of producing metal nanowires, compositions, and articles are disclosed. Such methods allow production of metal nanowires with reproducibly uniform diameter and length, even in the presence of catalyst concentration variation. Such metal nanowires are useful for electronics applications.
    Type: Application
    Filed: July 9, 2014
    Publication date: October 30, 2014
    Inventors: David R. Whitcomb, William D. Ramsden, Doreen C. Lynch
  • Publication number: 20140241937
    Abstract: The invention relates to the use of a particle-containing powdered coating material in a coating method selected from the group consisting of cold gas spraying, flame spraying, high-speed flame spraying, thermal plasma spraying and non-thermal plasma spraying, wherein the particles have a relative deformability factor Vm of at most 0.1 and the relative deformability factor is defined according to Formula (I): V m = d D 50 , ( I ) wherein d is the average smallest thickness of the particles, measured vertical to and in the middle half of the longitudinal axis of the particles, and D50 is the average diameter of the volume-averaged particle-size distribution. The invention furthermore relates to a method for coating.
    Type: Application
    Filed: July 25, 2012
    Publication date: August 28, 2014
    Applicant: ECKART GMBH
    Inventors: Sebastian Höfener, Markus Rupprecht, Christian Wolfrum, Andreas Reis
  • Publication number: 20140225042
    Abstract: A flexible conductive material and a cable using the same, being resistant to one million times or more of dynamic driving and particularly suitable for wiring robots or automobiles. An average crystal grain size of crystal grains 20 forming a metal texture of a base material is 2 ?m or less, in which the crystal grains 20 being 1 ?tm or less are included at least 20% or more in a cross sectional ratio. Also, it is preferable to include 0.1 mass % to 20 mass % of nanoparticles 22.
    Type: Application
    Filed: June 27, 2012
    Publication date: August 14, 2014
    Applicants: DYDEN CORPORATION, NAT'L UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY, FUKUOKA PREFECTURAL GOVERNMENT
    Inventors: Hiroyuki In, Fumiyo Annou, Daisuke Matsunaga, Hiromoto Kitahara, Shinji Ando, Masayuki Tsushida, Toshifumi Ogawa
  • Patent number: 8802151
    Abstract: The instant invention relates to shaped transition metal particles, in particular in the form of a dispersion in an aqueous and/or organic medium, the manufacture thereof and their use as an infrared (IR) absorbing agent, an IR curing agent for coatings, an additive in conductive formulations, an antimicrobial agent or for sensoring organic and/or inorganic compounds. Further, the invention relates to dispersions comprising said shaped particles and an aqueous and/or organic medium, such as a thermoplastic or crosslinkable polymer, as well as to antimicrobial compositions and products.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: August 12, 2014
    Assignee: BASF SE
    Inventors: Nikolay A. Grigorenko, Michael Muehlebach, Florian Muehlebach
  • Patent number: 8801971
    Abstract: Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: August 12, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Youichi Machii, Shunya Yokozawa, Yoshinori Ejiri, Katsuyuki Masuda
  • Patent number: 8795585
    Abstract: There is provided cryogenic milled nanophase copper alloys and methods of making the alloys. The alloys are fine grained having grains in the size range from about 2 to about 100 nanometers, and greater. The nanophase alloys possess desirable physical properties stemming from the fine grain size, such as potentially high strength. Some embodiments of the cryogenic milled copper alloys may also be tailored for ductility, toughness, fracture resistance, corrosion resistance, fatigue resistance and other physical properties by balancing the alloy composition. In addition, embodiments of the alloys generally do not require extensive or expensive post-cryogenic milling processing.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: August 5, 2014
    Assignee: The Boeing Company
    Inventors: Barun Majumdar, James D. Cotton, Clifford C. Bampton
  • Publication number: 20140212324
    Abstract: Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10?9 m to 10?6 m) and micrometers (10?6 m to 10?3 m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy.
    Type: Application
    Filed: April 10, 2012
    Publication date: July 31, 2014
    Applicant: THREE-O CO., LTD.
    Inventor: Kazuo Ogasa
  • Publication number: 20140203222
    Abstract: There are provided copper particles and a copper paste for a copper powder-containing coating film which can be subjected to electroless metal plating without using an expensive catalyst such as palladium, and a process for producing a conductive coating film by subjecting a copper powder-containing coating film formed by using the copper paste to electroless metal plating or heat treatment with superheated steam. The present invention relates to a process for producing a conductive coating film comprising the step of forming a coating film on an insulating substrate using copper particles having an average particle diameter of 0.
    Type: Application
    Filed: May 17, 2012
    Publication date: July 24, 2014
    Applicant: TODA KOGYO CORPORATION
    Inventors: Chiho Ito, Takeshi Yatsuka, Yasuo Kakihara
  • Patent number: 8784728
    Abstract: There is provided cryogenic milled copper alloys and methods of making the alloys. The alloys are fine grained and possess desirable physical properties stemming from the fine grain size. Embodiments include desirable physical properties, such as potentially high strength. Some embodiments of the cryogenic milled copper alloys may also be tailored for ductility, toughness, fracture resistance, corrosion resistance, fatigue resistance and other physical properties by balancing the alloy composition. In addition, embodiments of the alloys generally do not require extensive or expensive post-cryogenic milling processing.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: July 22, 2014
    Assignee: The Boeing Company
    Inventors: Clifford C. Bampton, James D. Cotton, Barun Majumdar
  • Publication number: 20140193656
    Abstract: There are disclosed a method of manufacturing fine metal powder and fine metal powder manufactured by using the same. The method of manufacturing fine metal powder includes forming a pattern having a predetermined size and shape on a base substrate, forming a metal film on the pattern, and separating the metal film from the pattern to obtain individual metal particles having a predetermined size and shape. The fine metal powder manufactured by the method has a uniform shape and a uniform particle size distribution. The fine metal powder is in the form of flakes, having a large ratio of particle diameter to thickness.
    Type: Application
    Filed: April 10, 2013
    Publication date: July 10, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: SAMSUNG ELECTRO-MECHANICS CO., LTD.
  • Publication number: 20140140917
    Abstract: A process for producing graphene by providing a plurality of metallic particles as templates for graphene formation and providing a carbon source; reacting the metallic particles and carbon source under conditions suitable for graphene formation; and forming graphene particles on the metallic particles. The graphene particles formed on the metallic particles are of a size and shape substantially corresponding to the size and shape of the metallic particles.
    Type: Application
    Filed: June 13, 2012
    Publication date: May 22, 2014
    Inventor: Karl Coleman
  • Publication number: 20140134041
    Abstract: A dispersion liquid contains metal nanowires of excellent dispersion stability, and a conductive film that is formed using the dispersion liquid. This dispersion liquid is a dispersion liquid that contains metal nanowires. The metal nanowires are 10-200 nm in diameter, the coefficient of variation in diameter being less than 30%, and the ratio of the length to the diameter (length/diameter) being 10 or greater. The metal nanowires are metal members having as the principal constituent at least one metal selected from the group consisting of gold, nickel, and copper.
    Type: Application
    Filed: October 25, 2013
    Publication date: May 15, 2014
    Applicant: FUJIFILM Corporation
    Inventor: Yoshinori HOTTA
  • Publication number: 20140134038
    Abstract: Provided are resin-based and metal-based anti-thermally-expansive members each having small thermal expansion. More specifically, provided are an anti-thermally-expansive resin and an anti-thermally-expansive metal, each including a resin or a metal having a positive linear expansion coefficient at 20° C. and a solid particle dispersed in the resin or metal, in which the solid particle includes at least an oxide represented by the following general formula (1): (Bi1-xMx)NiO3 (1), where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02?x?0.15.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 15, 2014
    Applicants: KYOTO UNIVERSITY, CANON KABUSHIKI KAISHA
    Inventors: Makoto Kubota, Kaoru Miura, Hisato Yabuta, Yoshihiko Matsumura, Yuichi Shimakawa, Masaki Azuma
  • Publication number: 20140106959
    Abstract: Disclosed is a method for preparing a metal catalyst having improved yield of alcohols. The method for preparing a metal catalyst for the production of alcohol from synthesis gas includes forming a metal catalyst; and irradiating the metal catalyst with gamma rays. The metal catalyst has improved yield of alcohols by stabilizing the metal catalyst through gamma ray irradiation to inhibit generation of hydrocarbons in catalytic reaction with synthesis gas.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 17, 2014
    Applicant: Korea Institute of Energy Research
    Inventors: Sun-Hwa YEON, Dae-Hyun SHIN, Nam-Sun NHO, Kyoung-Hee SHIN, Chang-Soo JIN, Sung-Chan NAM, Je-Kyoung WOO, Kwang-Ho KIM
  • Patent number: 8658009
    Abstract: This Cu alloy sputtering target includes, in terms of atomic percent: Al: 1% to 10%; and Ca: 0.1% to 2%, with the balance being Cu and 1% or less of inevitable impurities. This thin film transistor includes: a gate electrode layer joined to the surface of a glass substrate through an adhesion layer; a gate insulating layer; a Si semiconductor layer; an n-type Si semiconductor layer; a barrier layer; a wire layer composed of a drain electrode layer and a source electrode layer, both of which are mutually divided; a passivation layer; and a transparent electrode layer, wherein the barrier layer is formed by sputtering under an oxidizing atmosphere using the Cu alloy sputtering target.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: February 25, 2014
    Assignees: Mitsubishi Materials Corporation, Ulvac, Inc.
    Inventors: Kazunari Maki, Kenichi Yaguchi, Yosuke Nakasato, Satoru Mori
  • Patent number: 8647534
    Abstract: A copper-carbon composition including copper and carbon, wherein the copper and the carbon form a single phase material, and wherein the carbon does not phase separate from the copper when the material is heated to a melting temperature.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: February 11, 2014
    Assignee: Third Millennium Materials, LLC
    Inventors: Jason V. Shugart, Roger C. Scherer
  • Publication number: 20140003991
    Abstract: A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N?-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; heating a reducing agent solution that includes a reducing agent, an N,N?-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N?-dialkylethylenediamine ligand. Such copper nanoparticles in this composition have a fusion temperature between about 100° C. to about 200° C. A surfactant system for the stabilizing copper nanoparticles includes an N,N?-dialkylethylenediamine and a C6-C18 alkylamine.
    Type: Application
    Filed: June 17, 2013
    Publication date: January 2, 2014
    Applicant: Lockheed Martin Corporation
    Inventors: Alfred A. ZINN, Paul P. Lu
  • Publication number: 20130309127
    Abstract: The present invention relates to tailored materials, particularly metals and alloys, and methods of making such materials. The new compositions of matter exhibit long-range ordering and unique electronic character.
    Type: Application
    Filed: April 24, 2013
    Publication date: November 21, 2013
    Applicant: ELECTROMAGNETICS CORPORATION
    Inventor: Christopher J. Nagel
  • Publication number: 20130302205
    Abstract: High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 ?m or more and 20 ?m or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, O-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility.
    Type: Application
    Filed: July 18, 2013
    Publication date: November 14, 2013
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Yuichiro Shindo, Susumu Shimamoto, Atsushi Fukushima
  • Publication number: 20130301151
    Abstract: Substrates suitable for mirrors used at wavelengths in the EUV wavelength range have substrates (1) including a base body (2) made of a precipitation-hardened alloy, of an intermetallic phase of an alloy system, of a particulate composite or of an alloy having a composition which, in the phase diagram of the corresponding alloy system, lies in a region which is bounded by phase stability lines. Preferably, the base body (2) is made of a precipitation-hardened copper or aluminum alloy. A highly reflective layer (6) is preferably provided on a polishing layer (3) of the substrate (1) of the EUV mirror (5).
    Type: Application
    Filed: July 19, 2013
    Publication date: November 14, 2013
    Inventors: Claudia EKSTEIN, Holger MALTOR
  • Publication number: 20130230737
    Abstract: Methods are disclosed for preparing copper nanowires that do not rely on highly reactive reagents, highly corrosive solutions, high temperatures, or long reaction times. Nanowires produced from such methods are free of large attached nanoparticles that have accompanied previously disclosed copper nanowires. Such nanowires are useful for electronics applications.
    Type: Application
    Filed: February 12, 2013
    Publication date: September 5, 2013
    Inventor: David R. Whitcomb
  • Publication number: 20130221287
    Abstract: A metal particle which is a non-nucleated, spherical porous material having continuous open pores, and which is formed from dendritic crystals which have grown uniformly outward from the center without requiring a nucleating agent. A method for producing a metal particle which includes the steps of: mixing a metal salt and a polycarboxylic acid in a liquid phase; adding a reducing agent to the resultant mixture to deposit metal particles; and drying the deposited metal particles. The metal particle produced by the method, which is a non-nucleated, spherical porous material having continuous open pores, is unlikely to suffer bonding or aggregation of the metal particles and exhibits excellent dispersibility, and, when the metal particle is used in a conductive composition, such as a conductive paste, a cured product having satisfactory conduction properties can be obtained at a relatively low temperature, making it possible to easily control the specific gravity or resistance.
    Type: Application
    Filed: November 4, 2011
    Publication date: August 29, 2013
    Inventors: Tomoyuki Takahash, Akito Yoshii
  • Publication number: 20130177471
    Abstract: There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.
    Type: Application
    Filed: September 12, 2011
    Publication date: July 11, 2013
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yuki Kaneshiro, Shinichi Suenaga, Hidefumi Fujita, Minoru Kishida
  • Publication number: 20130156631
    Abstract: A pickling solution, including: 50 g/L to 400 g/L of sulfuric acid; 1 g/L to 100 g/L of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (III) ions; 0.01 g/L to 10 g/L of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/L to 10 g/L of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/L to 300 g/L of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 20, 2013
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Mitsubishi Materials Corporation