Abstract: In a copper-based slide member in which needle-shaped Mn—Si based compounds are dispersed in a brass structure, 50% or more of a total number of the needle-shaped Mn—Si based compounds having lengths of 50 ?m or more in a major axis direction are constituted of a plurality of small particles. Thereby, even if the needle-shaped Mn—Si based compounds fall off during sliding, the small particles which constitute the needle-shaped Mn—Si based compounds may fall off. Thus, the frequency of falling off of the coarse needle-shaped Mn—Si based compound which damages a shaft and a bearing is decreased. Therefore, seizure hardly occurs.

Abstract: Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X % by atom, an electrical conductivity ? (% IACS) satisfies the following Expression (1), ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100 (1); and (b) an average number of intermetallic compounds, which have grain sizes of 0.1 ?m or more and contain Cu and Mg as main components, is in a range of 1 piece/?m2 or less. A copper alloy according to a fourth aspect further contains one or more selected from a group consisting of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, and Zr at a total content of 0.01% by atom to 3.0% by atom, and satisfies the condition (b).

Abstract: Alloys are demonstrated based on copper, which have additions of manganese and sulfur and/or calcium as well as additional elements. The copper alloys are free from tellurium and lead, and are distinguished by high electrical conductivity and good machinability.

Abstract: Copper-manganese alloys, optionally with potentially other alloying elements, whose compositions are at or sufficiently near the congruent (minimum) melting point of the Cu—Mn system to substantially avoid dendritic growth during solidification. Processes for producing such alloys are also provided, as well as products produced from such alloys.

Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Abstract: To provide a production process of an electrode catalyst for fuel cell whose initial voltage is high and whose endurance characteristics, especially, whose voltage drop being caused by high-potential application is less. A production process according to the present invention of an electrode catalyst for fuel cell is characterized in that: it includes: a dispersing step of dispersing a conductive support in a solution; a loading step of dropping a platinum-salt solution, a base-metal-salt solution and an iridium-salt solution to the resulting dispersion liquid, thereby loading respective metallic salts on the conductive support as hydroxides under an alkaline condition; and an alloying step of heating the conductive support with metallic hydroxides loaded in a reducing atmosphere to reduce them, thereby alloying them.

Abstract: A marine anti-bio-fouling coating 10, for application onto the surface of a marine article 12. The coating 10 comprises a self-levelling, self-curing epoxy resin primer adhesive 14, an adhesive modified epoxy resin binder adhesive 16 and granulated Copper Nickel alloy 18. When a coated marine article 12 is immersed in water a chemical reaction occurs between the water and the Copper Nickel alloy 18 which causes a film of a complex metal oxide 20 to form on the exterior surface of the layer of Copper Nickel alloy granules 18. The oxide film 20 forms an inhospitable environment to aquatic organisms and aquatic borers, thereby preventing bio-fouling occurring on the coated marine article. A method of applying the coating 10 to a marine article 12 is also provided.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: Disclosed is a white-colored copper alloy comprising by weight up to 30% zinc, up to 20% manganese, up to 5% nickel with the balance copper. This alloy may have from 6% to 25% zinc, from 4% to 17% manganese, from 0.1% to 3.5% nickel and the balance copper. The balance copper in the alloy may further contain at least one of: up to 0.5% of at least one of the group which consists of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr, and Ag; and up to 0.1% of at least one of the group which consists of P, B, Ca, Ge, Se, Te. It may also contain up to 0.3% Zr by weight. The alloy may have an electrical conductivity greater than 2.5% IACS at eddy current gauge exciting frequencies between 60 kHz and 480 kHz.

Abstract: A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

Abstract: A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.

Abstract: A copper alloy having superior thermal conductivity comparable to that of conventional materials, can be produced at low cost. An oxygen free copper, a base material of a Cu—B alloy were melted in vacuo by a casting method, B and at least one element selected from Mg, Ni, Co, Al, Si, Fe, Zr, and Mn are added into the molten metal wherein the content of each element or the alloy of Ni—B, Fe—B, Cu—Mg, and so forth becoming the predetermined content. This alloy is cast into an ingot of 12 mm square, heated at 600 to 900° C. for 1 hour, and the cast was rolled to be 3 mm by hot rolling. After these steps, heat treatment at 600 to 900° C. was provided and processed into predetermined shape.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: A brazing alloy according to the present invention has a melting point equivalent to that of a copper brazing filler and is excellent in corrosion- and oxidation-resistance. The brazing alloy consists essentially of Mn, Ni and Cu, and has a composition in terms of weight percentage which, when plotted on a diagram as shown in FIG. 1, falls within a range defined by: the point A (37% Mn, 63% Ni, 0% Cu), the point B (18% Mn, 27% Ni, 55% Cu); the point C (42% Mn, 3% Ni, 55% Cu); the point D (50% Mn, 3% Ni, 47% Cu); and the point E (50% Mn, 50% Ni, 0% Cu), wherein Mn=50% is exclusive.

Abstract: The present invention provides a copper-based alloy having high shape memory properties and superelasticity while maintaining an excellent workability, members such as a wire, plate, pipe, etc. made of the copper-based alloy, and methods for producing them. The copper-based alloy has a recrystallization structure substantially composed of &bgr;-single phase, and can be produced by a method comprising the steps of: forming an alloy by cold-working with a particular maximum cold-working ratio; and subjecting the cold-worked alloy to at least one solution treatment for improving a crystal orientation of the &bgr;-single phase, a quenching and an aging treatment. The maximum cold-working ratio is set so that the crystal orientation density of the &bgr;-single phase measured by an electron back scattering pattern method is 2.0 or more in a cold-working direction.

Abstract: The copper alloy tube disclosed here contains 0.05 to 1.5 wt. % of Mn and deoxidized copper containing oxygen concentration at 100 ppm or less. At least one element selected from a group of elements comprising P, B, Li, Pb and Sb can be added at the amount of 0.20 wt. % or less in total. At least one element selected from another group of elements comprising Cr, Ti, Zr, Al and Si also can be added at the amount of 0.50 wt. % or less in total. Further, at least one element selected from other group of elements comprising Mg, Fe, Co, Ag, In and As can be added at the amount of 1.0 wt. % or less in total. Furthermore, at least one element selected from a group of elements comprising Zn and Ni can be added at the amount 5.0 wt. % or less in total. Thereby, an corrosion resistant copper alloy tube having better corrosion resistant property against the ant-nest type corrosion which is specific problem for refrigerant tubes and tubes for the heat exchanger and also better brazing property can be provided.

Abstract: Bismuth bearing copper-nickel-manganese-zinc corrosion and gall resistant castable alloy, particularly for use in food processing machinery, with the following weight percentage range:Nickel=12-28Manganese=12-28Zinc=12-28Aluminum=0.5-2.00Bismuth=2-6Phosphorus=0-0.3Tin =0-1.5Iron=0-1.

Abstract: A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.

Abstract: Spray cast copper-manganese-zirconium alloys are disclosed. In one embodiment, the alloy is spray cast in nitrogen and contains from about 1 ppm to about 20 ppm of dissolved nitrogen. In a second embodiment, the alloy contains an addition selected from the group consisting of chromium, titanium, erbium and mixtures thereof. The alloys are useful for sound damping as the combination of zirconium and the addition inhibits degradation of the specific damping capacity of the alloy.

Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.

Abstract: A non-magnetic alloy of a volume Vcu of copper and a volume Vmn of manganese. Vmn/Vcu is made equal to -Xcu/Xmn where Xcu is the susceptibility of the copper and Xmn is the susceptibility of the manganese. Vmn/Vcu is experimentally predicted to be 1.04 percent by volume.

Abstract: A method for making a non-magnetic alloy structure. Alloy samples are for by taking three volumes V1 of host matrix material having a first susceptibility X1 and adding to each of them one of three volumes V2, V3 and V4 of a magnetically compensating material having a second opposite susceptibility X2. The volume V3 is chosen so that (V1)(X1) =(V3)(X2). The volumes V2 and V4 are chosen so that V3/V1-V2/V1 is equal to 0.299 percent and V4/V1-V3/V1 is equal to 0.531 percent. The magnetizations of the alloy samples are determined and ploted as a function of their volume percentages. A volume percentage V5/V1 is determined from the plot, such that the volume percentage, V5/V1, has zero magnetization. This volume percentage V5/V1 is used to make nonmagnetic alloy structures having this volume percentage V5/V1.

Abstract: The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphor, tin and possibly small amounts of manganese. The alloys are produced by means of rapid solidification. Their advantages are low liquidus temperature and narrow mushy zone. The alloys are mainly used for brazing copper and its alloys.

Abstract: A copper alloy comprising:(A) 0.15-1.0 wt % Fe,(B) 0.05-0.3 wt % P, and(C)(1) 0.01-0.1 wt % Ni and 0.01-0.05 wt % Si or(2) 0.01-0.1 wt % Ni and 0.005-0.05 wt % b or(3) 0.05-0.3 wt % Mg and 0.05-0.3 wt % Pb or(4) 0.01-0.1 wt % Mn and 0.005-0.05 wt % Si,with the balance being essentially composed of Cu.

Abstract: A new copper-based alloy is described, the principle characteristic of which lies in having two different age-hardening temperature intervals corresponding to which significantly different electrical and mechanical characteristics are obtained from an alloy of the same composition; the alloy is composed, in parts by weight, of from 0.05 to 1% Mg, from 0.03 to 0.9% P and from 0.002 to 0.04% Ca, the remainder being Cu with possible very small additions of other alloying elements such as Sn, Zr, Mn and Li.

Abstract: Molded bodies of SiC ceramic can be firmly bonded to each other or to mol bodies of other ceramic material or to metal workpieces by the establishment of diffusion-welding conditions when a metal alloy layer is interposed between cleaned and polished surfaces that are to be joined. The alloy metal of the layer is MnCu or MnCo or multi-component alloys containing the foregoing as a base and additions of other metals to a total percentage not exceeding 70% with each single other metal being present in the range from 2 to 45% by weight. Such other metals constitute 1 or more of Cr, Ti, Zr, Fe, Ni, V and Ta. The Mn, Cu alloy or alloy base has a Cu content from 10 to 90%, preferably 25 to 82% and the MnCo alloy or alloy base has a cobalt content of 5 to 50% by weight. MnCuFe eutectic compositions containing 5 to 30% by weight Fe and 10 to 90% by weight Cu and MnCoCr eutectic compositions with chromium content from 2 to 45% by weight are preferred, especially 50:40:10 MnCuFe and 60:30:10 MnCoCr.

Abstract: A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4. This copper-base alloy has high mechanical strength of about 50 kgf/mm.sup.2 or more and electric conductivity of 30% IACS or more as well as good solderability and solder durability. Thus, it may be used as a highly reliable material for leadframes of semiconductor devices.

Abstract: A metal alloy consisting essentially of about 4-16 atom percent manganese, 4-16 atom percent silicon, 0-16 atom percent tin, 0-20 atom percent zinc, 0-10 atom percent silver and about 0-10 atom percent indium, the balance being copper and incidental impurities. The alloy is adapted for brazing steels, cemented carbides to steels, copper and copper alloys to steels, copper to copper and copper alloys, and composite materials to steels and copper.

Abstract: Reactive metal-copper alloys containing specified amounts of a third metal selected from the group consisting of silicon, tin, germanium, manganese, nickel, cobalt and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: An alloy containing Mn in an amount of from 5 to 30 weight percent, at least one member selected from the group consisting of Sn of an amount of not more than 5 weight percent, Al of an amount of not more than 8.5 weight percent, Zn of an amount of not more than 7 weight percent, Fe of an amount of not more than 2.5 weight percent, and Ni of an amount of not more than 2.5 weight percent, and the balance to make up 100 weight percent of Cu plus normally entrained impurities produces a metallic material proof against the attachment thereto of marine organisms when the alloy fulfils a requirement that it should possess an .alpha.(face-centered cubic lattice) single-phase structure.

Abstract: A copper base brazing alloy consisting of, in percent by weight, 25 to 40 manganese, 0 to 10 nickel, 0 to 10 iron, 0 to 6 indium and 0 to 10 tin with the combination of tin and indium being not less than 2, and the balance essentially copper, is suitable for brazing cemented carbide to steel in a temperature range 815.degree.-900.degree. C. (1500.degree.-1650.degree. F.). The brazing temperature of these filler alloys are at least 100.degree. F. lower than those of non-precious brazing filler alloys of the prior art used for this application and are considerably less expensive than prior art precious metal brazing alloys currently being used. The resulting cemented carbide to steel joints have high shear strength and good ductility.

Abstract: This invention describes a process for producing copper alloys by rapid sdification in order to improve their strength and thermal stability after being exposed to elevated temperatures. The method used to rapidly solidify the molten alloy is either by use of a high pressure non-oxidizing gas spray to atomize the molten alloy into a powder or to pour the molten alloy onto a rotating wheel to form a ribbon which is then attrited into powder. The powder is canned, compacted to full density and cold worked to the desired shape.