Abstract: A high-strength, high-conductivity copper alloy comprises, all by weight, from 0.8 to 4.0% of Sn, from more than 0.01 to 0.4% of P, from 0.05 to 1.0% of Ni, from 0.05 to 1.0% of one, two or more elements selected from Al, Hf, Be, Mo, Zn, Te, Pb, Co, Zr, and Nb, and the remainder of Cu and inevitable impurities. The impurities include not more than 0.0020% of oxygen.

Abstract: In construction of a clad material for ornamental use such as eyeglass frames and watch bands, use of age-hardenable alloy sheath followed by age-hardening enables production of product with light weight, high mechanical strength, excellent workability and good fit to brazing and plating.

Abstract: The present invention relates to copper-silicon-tin alloys having improved cleanability. These alloys consist essentially of from about 1.0% to about 5.0% tin, from about 1.0% to about 4.5% silicon, an element selected from the group consisting of from about 0.05% to about 0.5% magnesium and from about 0.01% to about 0.5% lithium, and the balance essentially copper. The alloys may also contain from about 0.01% to about 0.45% chromium.

Abstract: Disclosed is a moderate electrical conductivity copper alloy containing titanium and beryllium wherein the ratio of titanium to beryllium is about 10:1. The alloy has an outstanding combination of useful engineering properties: mechanical strength, physical characteristics and good fabricability. A typical alloy contains, in weight percent, about 2.3 titanium, 0.2 beryllium and the balance copper plus normal impurities found in alloys of this class.

Abstract: This invention is directed to the treatment of copper beryllium alloys, and to articles and parts made therefrom, containing special small amounts of beryllium and nickel, e.g., about 0.05% to about 0.5% beryllium and about 0.05% to about 1% nickel where cobalt may be substituted for up to about one-half of said nickel content at a substitution ratio of about 1 part by weight cobalt for about 2 parts by weight nickel, which imparts to these alloys a superior combination of stress relaxation resistance, formability, ductility, conductivity and strength by the process of solution annealing, cold working at least about 50% or at least about 70% or 90% or more and age hardening.

Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bead formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.

Abstract: A lead material for semiconductor devices comprising from 0.4 to 4.0 wt % of Ni, from 0.1 to 1.0 wt % of Si, from 0.05 to 1.0 wt % of Zn, from 0.01 to 1.0 wt % of Mn, from 0.001 to less than 0.01 wt % of Mg, from 0.001 to less than 0.01 wt % of Cr, up to 0.003 wt % of S, and the balance of Cu and inevitable impurities. The material may further comprise up to 5 ppm of hydrogen and up to 5 ppm of oxygen.

Abstract: A contact material for a vacuum circuit breaker consists essentially of copper as the basic component, and, as the other components, 35% by weight or below of chromium and 50% by weight or below of niobium, the total quantity of chromium and niobium in said contact material being 10% by weight and above.

Abstract: A copper alloy excellent in general properties such as heat resistance, electric and heat conductivity and mechanical strength and suitable for use as materials for lead frames of electronic parts, heat exchanger fins, or the like can be obtained by optimizing the Fe and Ti contents and proportions of a Cu-Fe-Ti ternary alloy and adding thereto a suitable amount of one or more members selected from the group consisting of Mg, Sb, V Misch metal, Zr, In, Zn, Sn, Ni, Al, and P.

Abstract: An improved copper base alloy having excellent thermal resistance and electric conductivity. The alloy consists essentially of from 0.0005 to 0.01 percent boron, a material selected from the group consisting of phosphorus from 0.001 to 0.01 percent, indium from 0.002 to 0.03 percent, tellurium from 0.001 to 0.06 percent and mixtures thereof, and the balance copper and inevitable impurities. The copper base alloy may further contain from 0.002 to 0.05 percent magnesium whereby the magnesium imparts further enhanced thermal resistance to the alloy.

Abstract: Tubes for water and/or hot-water supply use, which are made of Cu-base-alloys essentially containing Mg from 0.05 to 2.8 wt % and the balance Cu and inevitable impurities, have been found to have conspicuously low dissolution rates of undesirable ions, especially Cu ions and other ions, even in stagnant water and/or at elevated temperature. The alloys are desirably further contain up to 1.0% Ca to further restrain dissolution of Cu ions.

Abstract: Tubes for water and/or hot-water supply use, which are made of Cu-base-alloys essentially containing Mg from 0.05 to 2.8 wt % and the balance Cu and inevitable impurities, have been found to have conspicuously low dissolution rates of undesirable ions, especially Cu ions and other ions, even in stagnant water and/or at elevated temperature. The alloys are desirably further contain up to 1.0% Ca to further restrain dissolution of Cu ions.