Abstract: An electrode core material that may be used in electrodes of spark plugs and other ignition devices to provide increased thermal conductivity to the electrodes. The electrode core material is a precipitate-strengthened copper alloy and includes precipitates dispersed within a copper (Cu) matrix such that the electrode core material has a multi-phase microstructure. In several exemplary embodiments, the precipitates include: particles of iron (Fe) and phosphorous, particles of beryllium, or particles of nickel and silicon.

Abstract: A pivotable tundish (1) for continuous casting a metal alloy. The tundish comprises a body (3) comprising a first chamber (5), a second chamber (7), a first passage (12) between the first chamber and the second chamber, and a second passage (16) between the second chamber and a mold (9). The first chamber is adapted to receive and hold a base metal constituting the base for forming the metal alloy by addition of alloying elements. The metal alloy is fed from the second chamber to the mold through the second passage. The second chamber further comprises a first portion (30) and a second portion (32), and a third passage (36) between the first portion and the second portion. In the casting state the metal alloy is formed while casting by adding the alloying elements to the second portion of the second chamber.

Abstract: The present invention addresses the problem of providing a novel, sold metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal in a finely mixed state at the nanolevel in a specific region where the two types of metal are unevenly distributed. This metal alloy has a substitutional solid solution of the two or more types of metal as the principal constituent thereof. This metal alloy is preferably one obtained by precipitation after mixing ions of two or more types of metal and a reducing agent in a thin-film fluid formed between processing surfaces, at least one of which rotates relative to the other, which are arranged so as to face one another and are capable of approaching and separating from one another.

Abstract: The present invention addresses the problem of providing a novel, solid silver-copper alloy. Provided is a solid silver-copper alloy in which the concentration of copper contained in the silver-copper alloy is 0.1-99.94 wt %, and which has, as the principal constituent thereof, a non-eutectic structure which does not contain a eutectic when the solid silver-copper alloy is at room temperature. This silver-copper alloy can be produced by mixing a fluid containing silver ions and copper ions with a fluid containing a reducing agent, and separating silver-copper alloy particles therefrom. It is preferable to mix the fluid containing the silver ions and copper ions with the fluid containing the reducing agent in a thin-film fluid formed between processing surfaces arranged so as to face one another, capable of approaching toward and separating from one another, and capable of having at least one surface rotate relative to the other.

Abstract: A copper base alloy achieves a breakthrough electrical conductor product of strength, flexure and conductivity of minimal inverse in relationship of at least 85% IACS electrical conductivity while providing an 80 to 85 ksi tensile strength, an increase of at least 33% in strength compared to prior art and is made from an alloy containing 0.2-0.5 w/o chromium, 0.02-0.20 w/o silver and 0.04-0.16 w/o of a third metallic component selected from tin, magnesium and tin/magnesium together.

Abstract: Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10?9 m to 10?6 m) and micrometers (10?6 m to 10?3 m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy.

Abstract: Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)?0.5.

Abstract: An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %.

Abstract: A 3N copper wire with trace additions for bonding in microelectronics contains 3N copper and one or more corrosion resistance addition materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance addition materials is between about 90 wt. ppm and about 980 wt. ppm.

Abstract: A secondary alloyed 1N copper wire for bonding in microelectronics contains one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.09 wt % and about 9.9 wt %.

Abstract: A doped 4N copper wire for bonding in microelectronics contains one or more corrosion resistance dopant materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance dopant materials is between about 10 wt. ppm and about 80 wt. ppm.

Abstract: A rolled copper foil consisted of at least either of silicon (Si) and iron (Fe), boron (B), silver (Ag), oxygen (O) of 0.002 mass % or less, and a balance consisted of copper (Cu) and inevitable impurities.

Abstract: The present invention is directed to a process for manufacture of base metal nano-particles using precious metal seed particles. The process comprises the steps of mixing at least one base metal precursor and at least one precious metal precursor in one or more polyol solvents, reacting the mixture at a temperature in the range of 110 to 150° C. to form precious metal seed particles (STEP A) and reacting the mixture at a temperature in the range of 180 to 220° C. to form the final metal particles (STEP B). Base metal particles of Co, Ni and Cu containing 100 to 10000 ppm of precious metals Ru, Pd, Pt or Ir are obtained. The resulting metal nano-particles with medium diameters of 20 to 200 nm are useful for electronic and catalytic applications and can be used as core materials for the manufacture core/shell type catalysts.

Abstract: Ultrahigh purity copper having a residual resistance ratio of 38,000 or greater and a purity of 8N or higher (excluding gas components), and in particular ultrahigh purity copper wherein the respective elements of O, C, N, H, S and P as gas components are 1 ppm or less. Further provided is a method of subjecting copper to high purification. An anode and a cathode are partitioned with an anion exchange membrane, an anolyte is intermittently or continuously extracted and introduced into an active carbon treatment vessel, a chlorine-containing material is added to the active carbon treatment vessel so as to precipitate impurities as chloride, active carbon is subsequently poured in and agitated so as to adsorb the precipitated impurities, the adsorbed impurities are removed by filtration, and the obtained high purity copper electrolytic solution is intermittently or continuously introduced into the cathode side and electrolyzed.

Abstract: Sliding parts are made of Pb-free Cu-Bi based sintered material. The side in contact with a shaft is machined to a predetermined roughness. A number of Bi phases are present on the finished surface. Stable performance of Bi is to be exhibited. Machined sintered material covers a portion of the Bi phases. The ratio of the exposed surface area of the Bi phases is 0.5% or more relative to the area of the finished surface.

Abstract: To provide a production process of an electrode catalyst for fuel cell whose initial voltage is high and whose endurance characteristics, especially, whose voltage drop being caused by high-potential application is less. A production process according to the present invention of an electrode catalyst for fuel cell is characterized in that: it includes: a dispersing step of dispersing a conductive support in a solution; a loading step of dropping a platinum-salt solution, a base-metal-salt solution and an iridium-salt solution to the resulting dispersion liquid, thereby loading respective metallic salts on the conductive support as hydroxides under an alkaline condition; and an alloying step of heating the conductive support with metallic hydroxides loaded in a reducing atmosphere to reduce them, thereby alloying them.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: A method of making a treating wash includes mixing brass granules with acetone, mixing carbon nanotube material, silver granules, iron pyrite granules and copper granules in the acetone brass mixture, and straining the liquid from the remaining solid material. Methods of treating materials such as brass granules, silver granules, iron pyrite granules, carbon nanotube material, and brass granules comprises washing the materials in the treating wash, followed by straining and drying the materials.

Abstract: A fuel cell catalyst comprising platinum, chromium, and copper, nickel or a combination thereof. In one or more embodiments, the concentration of platinum is less than 50 atomic percent, and/or the concentration of chromium is less than 30 atomic percent, and/or the concentration of copper, nickel, or a combination thereof is at least 35 atomic percent.

Abstract: A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper and tungsten, or an oxide, carbide and/or salt of one or more of platinum, copper and tungsten, wherein the sum of the concentrations of platinum, copper and tungsten, or an oxide, carbide and/or salt thereof, is greater than 90 atomic percent.

Abstract: A method for producing a copper/palladium colloid catalyst useful for Suzuki couplings.

Abstract: The present invention relates to new compositions of matter, particularly metals and alloys, and methods of making such compositions. The new compositions of matter exhibit long-range ordering and unique electronic character.

Abstract: The invention includes a sputtering target containing copper of a purity of at least about 99.999 wt. %, and at least one component selected from the group consisting of Ag, Sn, Te, In, B, Bi, Sb, and P dispersed within the copper. The total of Ag, Sn, Te, In, B, Bi, Sb, and P within the copper is from at least 0.3 ppm to about 10 ppm. The sputtering target has a substantially uniform grain size of less than or equal to about 50 micrometers throughout the copper and the at least one component.

Abstract: The optical recording medium has a substrate (1) with a recording layer (2), a reflecting layer (3) and a protecting layer (4) laminated successively on the substrate (1). The reflecting layer (3) is a thin film of an alloy containing 99.7 to 73.0% by weight of Cu as a major component, as well as, 0.2 to 18.0% by weight of Ag and 0.1 to 9.0% by weight of Ti. The reflecting layer has a film thickness of 50 nm to 150 nm. The optical recording medium provided with the reflecting layer (3) shows improved corrosion resistance and also retains high reflectance. The present invention also provides a target for forming the reflecting layer (3).

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: Described is a sputtering target assembly of high purity copper diffusion bonded to a precipitation hardened aluminum alloy backing plate via an intermediate layer of a CuCr alloy and in which the copper contains a micro alloy addition of at least one of Ag, Su, Te, In, Mg, B, Bi, Sb and/or P. Also disclosed is a method that includes preparation of a master alloy for addition to high purity copper and fabricating, heat treating and diffusion bonding processes to produce a sputtering target assembly with a stable fine-grained target microstructure.

Abstract: A sputtering target made of AgxMayMbz or CuxMayMbz, where x>50 at % and Ag or Cu are a first metal, Ma is a second metal and Mb is a third metal is used in a method for manufacturing data storage disks. The method of manufacture includes providing a substrate, providing a spacer layer of a material transmitting light of a selected wavelength onto a surface of the substrate, applying a first layer of a first metal alloy between the substrate and spacer layer, providing a second layer of a second metal alloy on the spacer layer, and depositing the first and second metal alloys so that one of the first and second layers is semi-transparent with respect to the light. The first and second alloys have at least one common metal provided in particular fractions of the alloys.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: 1 nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02-0.

Abstract: The present invention pertains to systems and methods for reducing the agglomeration of copper deposited by physical vapor deposition. More specifically, the invention pertains to systems and methods for depositing copper seed layers on a semiconductor wafer. The invention involves the use of an anti-agglomeration agent, so that the copper deposition is completed in an even, continuous and conformal manner.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: A physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from 50 at % to 70 at %. A physical vapor deposition target includes an alloy of copper and tin, with tin being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a conductive integrated circuit metal alloy interconnection includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. A conductive integrated circuit metal alloy interconnection includes an alloy of copper and silver, with the silver being present in the alloy at from 50 at % to 70 at %. A conductive integrated circuit metal alloy interconnection includes an alloy of copper and tin, with tin being present in the alloy at from less than 1.0 at % to 0.

Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).

Abstract: A bond for a single layer metal bond abrasive tool can be easily chemically and electrochemically stripped from the metal core of a recovered used tool to facilitate reuse of the core. Relative to conventionally bonded tools, the speed of stripping the novel bond is quick, and the stripped core has a smooth, clean surface which needs only minimal mechanical repair prior to reuse. In one aspect, the novel bond is a quaternary bond composition consisting essentially of copper, tin, titanium and silver. The powder components can be used dry or mixed with a fugitive liquid binder as a paste. The novel bond can be brazed at lower temperature than copper/tin/titanium bonds prepared otherwise. The bond composition forms a good melt at braze temperature that flows smoothly, evenly over a tool preform and provides consistent quality bonding of abrasive from tool to tool.

Abstract: The copper-based sliding material has improved seizure resistance, even if it is free of Pb, and enables thinning of the overlay. The copper alloy provided consists of from 0.1 to 2% of Ag, from 1 to 10% of Sn, and the balance consisting of Cu and unavoidable impurities and, further said Ag and Sn do not essentially form the secondary phases but are in complete or essentially solid-solution state in the Cu matrix.

Abstract: The contacts material of the present invention is contacts material including silver-tungsten carbide alloy containing 55-70 weight % of tungsten carbide (WC) of mean particle size 0.1-6 .mu.m wherein is included 0.005-0.2 weight % of carbon in an undissolved state or non-compound state whose equivalent diameter is 0.01-5 .mu.m.The present invention enables the current interruption characteristics of contacts material to be improved.

Abstract: The brazing filler of the present invention is excellent in wetting properties towards the open end of a ceramic cylinder and a metal sealing cap can be sealed well on the open end. The present brazing filler comprises Ag, Cu and active metal, in which the Cu-active metal compound is contained in an amount of not more than 40% by volume.

Abstract: A composite for preparation of an oxide superconductor includes a primary alloy phase of constituent elements of a desired oxide superconductor; and a secondary phase comprising copper, the secondary phase supported by the primary alloy phase. The composite may additionally include a matrix material for supporting the primary alloy phase and second phase disposed therein. The composite is oxidized to form an oxide superconductor composite.

Abstract: Alloy powder which is low in price and is unlikely to be oxidized on the surface, and a dispersion-type conductor using the alloy powder in which electromigration is not likely to occur. Melt of copper and silver is cooled at a high cooling speed of 10.sup.5 .degree. C./s or higher. Alloy powder having a composition expressed by a chemical formula Cu.sub.x Ag.sub.1-x (where 0.80.ltoreq.X.ltoreq.0.99) is obtained. Also, a dispersion-type conductor is produced by dispersing 100 parts by weight of the alloy powder in between 5-100 parts by weight of a binder. Thus, the low-priced alloy powder and the dispersion-type conductor of high quality and high reliability can be obtained.

Abstract: A high-strength and high-conductivity copper alloy sheet is provided, which consists of a composition of from 6 to 24 wt. % Ag, and Cu and impurities as the balance, and has a sheet structure in which Cu solid solution and Ag solid solution are streched into a fiber shape.

Abstract: A gold based jewelry alloy is disclosed of preferably the 10 to 18 karat range containing primarily gold, copper, zinc and silver. This alloy is formulated to create a unique color, a mid-range hue with a fresh, soft appearance that is very complimenting to a variety of skin tones and gem stones. Aside from characteristics of appearance, the alloy disclosed has an increased hardness over standard yellow alloys for longer wear and improved polish holding characteristics. The alloy disclosed has excellent castability and formability and responds well to typical jewelry manufacturing processes (i.e., tooling, stone setting, soldering, remelting, forging and plating). The alloy contains about 40% to about 76% gold, about 20% to about 52% copper, about 0% to about 12% zinc and about 0% to about 12% silver.

Abstract: A noble metal dental casting alloy for use in making dental restorations comprises 35-70 percent by weight palladium, 25-50 percent by weight silver, 0.5-10 percent by weight manganese, and 1-30 percent of at least one modifier element selected from (i) the group of gold, platinum, copper, tin, gallium, zinc, indium and cobalt in amounts of up to 15 percent by weight each, and (ii) the group of ruthenium, rhenium, aluminum, germanium, lithium, silicon, iridium, boron, tantalum and niobium in amounts of up to 5 percent by weight each. The alloy has a solidus temperature of at least 1100.degree. C., a liquidus temperature of not more than 1400.degree. C., tensile elongation of at least 2 percent, thermal expansion coefficient of at least 14.0.times.10.sup.-6 per .degree.C., Vickers hardness of at least 150, and offset yield strength at 0.2 percent of at least 250 MPa.

Abstract: The present invention relates to a contact for a vacuum interrupter obtained by processing a contact-forming material comprising from 20% to 60% by weight of Cr, Bi in an amount of from 0.05% to 1.0% by weight of the total amount of Cu and Bi, and the balance substantially Cu into the shape of a contact, and thereafter subjecting the processed material to vacuum heat treatment. The contact for the vacuum interrupter has both excellent anti-welding characteristics and excellent voltage withstanding characteristics.

Abstract: A copper alloy composition comprising 100 parts by weight of powder of copper alloy represented by the general formula Ag.sub.x Cu.sub.y (wherein x and y are atomic ratio values; 0.001.ltoreq..times..ltoreq.0.999, 0.001.ltoreq.y.ltoreq.0.999, x+y=1), 5 to 200 parts by weight of one or more organic binders and 0.01 to 100 parts by weight of an additive capable of removing copper oxide; and a paste for screen printing, electromagnetic shielding, an electrically conductive additive, a paste for electrode and a paste for through hole, which are obtained by using said composition.

Abstract: An Ag-Cu-WC contact forming material for a vacuum interrupter comprising a highly conductive component comprising Ag and Cu and an arc-proof component comprising WC wherein the content of the highly conductive component is such that the total amount of Ag and Cu(Ag+Cu) is from 25% to 65% by weight and the percentage of Ag based on the total amount of Ag and Cu[Ag/(Ag+Cu)] is from 40% to 80% by weight; wherein the content of the arc-proof component is from 35% to 75% by weight; wherein the structure of the highly conductive component comprises a matrix and a discontinuous phase, the discontinuous phase having a thickness or width of no more than 5 micrometers and wherein said arc-proof component comprises a discontinuous grain having a grain size of no more than 1 micrometer.

Abstract: There is provided a high-conductivity copper alloy with excellent workability and heat resistance, characterized by the alloy consists essentially of, by weight, at least one element selected from the group consisting of______________________________________ 10-100 ppm In (indium), 10-1000 ppm Ag (silver), 10-300 ppm Cd (cadmium), 10-50 ppm Sn (tin), 10-50 ppm Sb (antimony), 3-30 ppm Pb (lead), 3-30 ppm Bi (bismuth), 3-30 ppm Zr (zirconium), 3-50 ppm Ti (titanium) and 3-30 ppm Hf (hafnium), ______________________________________and the balance copper. S (sulfur) and O (oxygen) as unavoidable impurities are controlled to amounts of less than 3 ppm S, and less than 5 ppm O, respectively. Other unavoidable impurities are controlled to less than 3 ppm in total amount. The alloy is very suitable for applications such as forming magnet wires and other very thin wires, lead wires for electronic components, lead members for tape automated bonding (TAB) and the like, and members for printed-circuit boards.

Abstract: A phosphorous copper based alloy having combined tin and antimony contents up to approximately six percent each for brazing filler metal joining copper and copper alloys producing strong clean joints at lower brazing temperatures. Silver added in amounts of 1-18% offers the ability to lower brazing temperatures further.

Abstract: A contact forming material for a vacuum interrupter comprising: from 25% to 65% by weight of a highly conductive component comprising Ag and Cu, and from 35% to 75% by weight of an arc-proof component selected from the group consisting of Ti, V, Cr, Zr, Mo, W and their carbides and borides, and mixtures thereof wherein the highly conductive component of the contact forming material comprises (i) a first highly conductive component region composed of a first discontinuous phase having a thickness or width of no more than 5 micrometers and a first matrix surrounding the first discontinuous phase, and (ii) a second highly conductive component region composed of a second discontinuous phase having a thickness or width of at least 5 micrometers and a second matrix surrounding the second discontinuous phase, wherein the first discontinuous phase in the first highly conductive component region is finely and uniformly dispersed in the first matrix at intervals of no more than 5 micrometers, and wherein the amount of