Phosphorus, Arsenic, Antimony, Or Bismuth Containing Patents (Class 420/499)
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Patent number: 10297429Abstract: Provided is a high-purity copper-chromium alloy sputtering target comprising 0.1 to 10 wt % of Cr and the remainder being Cu and inevitable impurities, wherein when the number of precipitated Cr grains in a 100 ?m square area is counted at different five areas randomly selected on the surface of the target, the difference between the largest and the smallest numbers of counted precipitated Cr grains is less than 40. The term “precipitated Cr grains” refers to the grains each having a Cr content of 70% or more and having a grain size of 1 to 20 ?m. Thus, a thin film having excellent uniformity can be formed by adding an appropriate amount of a Cr element to copper and reducing the in-plane Cr variation of the sputtering target. In particular, the invention provides a high-purity copper-chromium alloy sputtering target that is useful for improving the yield and the reliability of semiconductor products, which have been progressing in miniaturization and integration.Type: GrantFiled: January 21, 2013Date of Patent: May 21, 2019Assignee: JX Nippon Mining & Metals CorporationInventors: Tomio Otsuki, Atsushi Fukushima
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Patent number: 8991787Abstract: A piping component for controlling the flow of high-temperature fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and 650° F. The piping body may also be sized for high-temperature fluids (e.g., steam) operating at pressures of up to approximately 400 psi, and 600 psi. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than 0.25% lead, less than 0.25% bismuth, 2 to 6% silicon and a balance of copper (by weight).Type: GrantFiled: March 12, 2013Date of Patent: March 31, 2015Assignee: NIBCO Inc.Inventors: David A. Bobo, Mark A. Clark, Aaron W. Edds, Benjamin L. Lawrence, Charles M. Stutsman
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Publication number: 20140376347Abstract: Disclosed herein are near field transducers (NFTs) that include either silver, copper, or aluminum and one or more secondary elements.Type: ApplicationFiled: June 24, 2014Publication date: December 25, 2014Inventors: Justin Glen Brons, Tong Zhao, Sethuraman Jayashankar, Steve C. Riemer, Michael C. Kautzky
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Patent number: 8888932Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.Type: GrantFiled: July 17, 2008Date of Patent: November 18, 2014Assignee: Senju Metal Industry Co., Ltd.Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
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Patent number: 8871354Abstract: Provided is a copper-based sliding material including a steel back-metal layer and a Cu alloy layer. The Cu alloy layer contains, by mass %, 10 to 30% of Bi, 0.5 to 5% of an inorganic compound, and the balance being Cu and inevitable impurities. The Cu alloy layer may further contain 0.5 to 5% of Sn and/or at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%. The inorganic compound has an average particle size of 1 to 5 ?m and a specific gravity of 70 to 130% relative to the specific gravity of Bi. Bi phase is formed in the Cu alloy layer in an average particle size of 2 to 15 ?m, and the Bi phase is dispersed in the Cu alloy layer and isotropic.Type: GrantFiled: February 23, 2011Date of Patent: October 28, 2014Assignee: Daido Metal Company Ltd.Inventors: Takuo Imai, Kouji Zusi, Kentaro Tujimoto
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Patent number: 8715431Abstract: A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis, wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.Type: GrantFiled: August 11, 2005Date of Patent: May 6, 2014Assignee: Kobe Steel, Ltd.Inventors: Yasuhiro Aruga, Katsura Kajihara
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Patent number: 8603390Abstract: A brazing alloy including copper (Cu), phosphorus (P), and strontium (Sr) and any one element of indium (In), boron (B), silver (Ag), tin (Sn), cesium (Cs), germanium (Ge), and nickel (Ni). The brazing alloy includes 5.0 to 7.5 wt % of phosphorus (P) and 0.1 to 5.0 wt % of strontium (Sr) and the remainder is composed of copper (Cu). The brazing alloy includes copper (Cu), phosphorus (P), and strontium (Sr) unlike the existing alloy element. The brazing alloy further includes, as alloy components, one or more elements of indium (In), boron (B), silver (Ag), and tin (Sn). The brazing alloy includes no silver (Ag) or the silver (Ag) content is reduced compared to an existing brazing alloy containing silver (Ag).Type: GrantFiled: May 8, 2012Date of Patent: December 10, 2013Assignee: Alcoma, Ltd.Inventor: Chu Hyon Cho
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Publication number: 20130302205Abstract: High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 ?m or more and 20 ?m or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, O-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility.Type: ApplicationFiled: July 18, 2013Publication date: November 14, 2013Applicant: JX Nippon Mining & Metals CorporationInventors: Yuichiro Shindo, Susumu Shimamoto, Atsushi Fukushima
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Patent number: 8518192Abstract: A lead-free copper alloy includes, in combination by weight, about 10.0% to about 20.0% bismuth, about 0.05% to about 0.3% phosphorous, about 2.2% to about 10.0% tin, up to about 5.0% antimony, and up to about 0.02% boron, the balance essentially copper and incidental elements and impurities. The alloy contains no more than about 0.05 wt. % or 0.10 wt. % lead.Type: GrantFiled: March 2, 2010Date of Patent: August 27, 2013Assignee: QuesTek Innovations, LLCInventors: Abhijeet Misra, Jason Sebastian, James A. Wright
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Patent number: 8465003Abstract: A plumbing fixture includes a plumbing fixture body having a composition of, by weight percentage, 58-63 of copper, 0.8-1.5 of bismuth, 0.05-0.15 of phosphorous, and a remainder of zinc and any impurities. The plumbing fixture body includes a first opening and a second opening that are arranged to communicate a fluid there through. The first opening defines a first inner diameter D1 and the second opening defines a second inner diameter D2 such that a ratio of D1/D2 is 1.05-2.3.Type: GrantFiled: August 26, 2011Date of Patent: June 18, 2013Assignee: Brasscraft Manufacturing CompanyInventors: Mahesh K. Cheerla, Robert O. Learmont
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Publication number: 20120321506Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.Type: ApplicationFiled: June 14, 2011Publication date: December 20, 2012Applicant: INGOT METAL COMPANY LIMITEDInventor: David SHORE
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Patent number: 8252157Abstract: An electrolytic copper plating method characterized in employing a phosphorous copper anode having a crystal grain size of 1,500 ?m (or more) to 20,000 ?m in an electrolytic copper plating method employing a phosphorous copper anode. Upon performing electrolytic copper plating, an object is to provide an electrolytic copper plating method of a semiconductor wafer for preventing the adhesion of particles, which arise at the anode side in the plating bath, to the plating object such as a semiconductor wafer, a phosphorous copper anode for electrolytic copper plating, and a semiconductor wafer having low particle adhesion plated with such method and anode.Type: GrantFiled: March 3, 2008Date of Patent: August 28, 2012Assignee: JX Nippon Mining & Metals CorporationInventors: Akihiro Aiba, Takeo Okabe
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Publication number: 20110224112Abstract: Sliding parts are made of Pb-free Cu-Bi based sintered material. The side in contact with a shaft is machined to a predetermined roughness. A number of Bi phases are present on the finished surface. Stable performance of Bi is to be exhibited. Machined sintered material covers a portion of the Bi phases. The ratio of the exposed surface area of the Bi phases is 0.5% or more relative to the area of the finished surface.Type: ApplicationFiled: September 9, 2009Publication date: September 15, 2011Applicant: TAIHO KOGYO CO., LTD.Inventors: Ryo Mukai, Hiromi Yokota, Kao Mouri
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Publication number: 20110123389Abstract: High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 ?m or more and 20 ?m or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, 0-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility.Type: ApplicationFiled: September 24, 2009Publication date: May 26, 2011Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Yuichiro Shindo, Susumu Shimamoto, Atsushi Fukushima
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Patent number: 7883588Abstract: In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the Bi phase is suppressed to as low level as possible. The novel structure is that the contact between the Bi phase and hard particles is kept to a low ratio. A lead-free bearing used for a fuel injection pump according to the present invention contains from 1 to 30 mass % of Bi and from 0.1 to 10 mass % of hard particles having from 10 to 50 ?m of the average particle diameter, the balance being Cu and unavoidable impurities. The properties of the main component phases are utilized at a high level such that the sliding properties are equivalent to those of a Pb containing Cu-based sintered alloy.Type: GrantFiled: June 9, 2005Date of Patent: February 8, 2011Assignees: Taiho Kogyo Co., Ltd., Denso CorporationInventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Hayakawa, Naruhiko Inayoshi, Youichi Murakami, Masashi Suzuki, Takahiro Nozu
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Publication number: 20110020171Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.Type: ApplicationFiled: January 22, 2009Publication date: January 27, 2011Inventors: Hitoshi Wada, Takashi Tomikawa, Daisuke Yoshitome, Hiromi Yokota
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Patent number: 7776163Abstract: The present invention provides a lead-free free-cutting aluminum brass alloy and its manufacturing method. The alloy comprises: 57.0˜63.0 wt % Cu, 0.3˜0.7 wt % Al, 0.1˜0.5 wt % Bi, 0.2˜0.4 wt % Sn, 0.1˜0.5 wt % Si, 0.01˜0.15 wt % P, at least two elements selected from the group of 0.01-0.15 wt % Mg, 0.0016-0.0020 wt % B, and 0.001-0.05 wt % rare earth elements and the balance being Zn and unavoidable impurities. The inventive alloy has excellent castability, weldability, cuttability and corrosion resistance. It is suitable for low pressure die casting, gravity casting, horizontal continuous casting, forging and extrusion. Its metal material cost is lower than bismuth brass. It is particularly applicable for components used in drinking water supply systems and other structural components. It is a new environmentally-friendly free-cutting aluminum brass alloy.Type: GrantFiled: December 21, 2009Date of Patent: August 17, 2010Assignee: Xiamen Lota International Co., Ltd.Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
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Patent number: 7736448Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.Type: GrantFiled: October 16, 2003Date of Patent: June 15, 2010Assignee: Institute of Metal Research Chinese Academy of SciencesInventors: Lei Lu, Xiao Si, Yongfeng Shen, Ke Lu
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Publication number: 20100111753Abstract: [Task] The adhesion resistance of Cu—Bi based or Cu—Sn—Bi based alloy is lower than that of Cu—Sn—Pb based alloy, and also since conformability of the former alloy is low. Therefore, when Bi of the former alloy adheres onto an opposite shaft, seizure of the former alloy is likely to occur as compared with the case of the latter Cu—Sn—Pb based alloy. In is alloyed in the Bi phase of the Cu—Sn—Bi—In based copper alloy. The In-alloyed Bi phase has a considerably low melting point and therefore the sliding properties deteriorate. [Means for Solving] A Pb-free copper-based sintered sliding material has a composition that 0.5 to 15.0 mass % Bi and 0.3 to 15.0 mass % In, with the balance being Cu and inevitable impurities. With regard to the existence of Cu, Bi, and In, the material consists of a Cu matrix containing In, a Bi phase, and an In concentrated region in said Cu matrix at a boundary of said Bi phase.Type: ApplicationFiled: February 13, 2008Publication date: May 6, 2010Applicant: TAIHO KOGYO CO., LTD.Inventors: Daisuke Yoshitome, Takashi Tomikawa, Hitoshi Wada
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Patent number: 7678173Abstract: In a Pb-free copper-based sintered alloy containing from 1 to 30% of Bi and from 0.1 to 10% of hard matter particles having from 10 to 50 ?m of average particle diameter, the Bi phase has a smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix, or the hard matter particles having 50% or less of a contact length ratio with the Bi phase based on the total circumferential length of the hard particle, which are in contact with said Bi phase, are present in a ratio of 70% or more based on the entire number of the hard matter particles.Type: GrantFiled: January 13, 2005Date of Patent: March 16, 2010Assignee: Taiho Kogyo Co., Ltd.Inventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Kobayashi, Hiroyuki Kawaguti
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Patent number: 7461770Abstract: The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to 5.0 atom % of zinc, 6 to 16 atom % of phosphorus, remainder copper and incidental impurities. The total amount of copper, nickel, tin and zinc is between 80 and 95 atom %. The addition of more than 0.5 atom % of zinc produces excellent resistance to surface oxidation in air and/or atmospheric humidity. These brazing alloys can be used to produce excellent brazed joints.Type: GrantFiled: April 1, 2005Date of Patent: December 9, 2008Assignee: Vacuumschmelze GmbH & Co. KGInventors: Thomas Hartmann, Dieter Nuetzel
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Publication number: 20080193324Abstract: A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a Cu—Sn based alloy. A Bi—Sn based alloy or a Bi—In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.Type: ApplicationFiled: November 12, 2004Publication date: August 14, 2008Inventors: Issaku Sato, Sinzo Nakamura, Naoki Sato, Toshio Hakuto
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Patent number: 7374651Abstract: The present invention pertains to an electrolytic copper plating method characterized in employing a phosphorous copper anode having a crystal grain size of 1500 ?m (or more) to 20000 ?m in an electrolytic copper plating method employing a phosphorous copper anode. Upon performing electrolytic copper plating, an object is to provide an electrolytic copper plating method of a semiconductor wafer for preventing the adhesion of particles, which arise at the anode side in the plating bath, to the plating object such as a semiconductor wafer, a phosphorous copper anode for electrolytic copper plating, and a semiconductor wafer having low particle adhesion plated with such method and anode.Type: GrantFiled: November 28, 2002Date of Patent: May 20, 2008Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Akihiro Aiba, Takeo Okabe
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Publication number: 20080095658Abstract: [PROBLEMS] To provide a Cu—Bi—hard substance base sintered alloy in which the respective properties of Bi and hard substance can be satisfactorily exerted. [MEANS FOR SOLVING PROBLEMS] There is provided a Ph free copper base sintered alloy, comprising 1 to 30% of Bi and 0.1 to 10% of hard substance particles of 10 to 50 ?m average diameter, (1) wherein a Bi phase having an average particle diameter smaller than that of the hard substance particles is dispersed in a matrix of Cu, or wherein with respect to a Bi phase in contact with the hard substance particles, the ratio of presence of hard substance particles exhibiting a ratio of hard substance particle contact length to entire circumference of Bi phase of 50% or less is 70% or greater based on the total number of hard substance particles.Type: ApplicationFiled: January 13, 2005Publication date: April 24, 2008Inventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Kobayashi, Hiroyuki Kawaguti
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Patent number: 7261760Abstract: A member having a separated structure made by an alloy consisting of two regions having different compositions with each other is formed by casting a molten alloy into a prescribed shape, or by spray-quenching the same from a temperature of Tc+10° C. or more, wherein the molten alloy exhibits two phase separation in a liquid state having a temperature difference ?T between the maximum temperature Tc (° C.) and minimum temperature Td (° C.) in the region of two phase separation in the liquid state being 10° C. or more, and the molten alloy has a mean composition with a difference of the volume fraction between the two liquid phases of 5% by volume or more. The suitable alloy is a Cu—Fe—X alloy, a Cu—Cr—X alloy, a Cu—Co—X alloy, a Cu—Bi—X alloy, an Al—Sn—X alloy or an Al—In—X alloy.Type: GrantFiled: March 5, 2002Date of Patent: August 28, 2007Inventors: Kiyohito Ishida, Ryosuke Kainuma, Ikuo Ohnuma
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Patent number: 7180176Abstract: Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to heat cycles during joining or in an environment of use, and that has high heat conductivity and cost effectiveness. The heat dissipating plate (4) uses a copper-base alloy having a 0.2% yield strength of at least 300 N/mm2 which is characterized in that the 0.2% yield strength after heating at 400° C. for 10 minutes is at least 90% of the 0.2% yield strength before heating and that said copper-base alloy has a heat conductivity of at least 350 W/m·K and contains at least one element of the group consisting of Fe, Co and Ni plus P in a total amount of 0.01–0.3%; the heat dissipating plate (4) is 10–200 mm long on each side, 0.Type: GrantFiled: August 22, 2002Date of Patent: February 20, 2007Assignee: Dowa Mining Co., Ltd.Inventors: Hideki Endou, Shingo Yanase
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Patent number: 6858102Abstract: The invention includes a sputtering target containing copper of a purity of at least about 99.999 wt. %, and at least one component selected from the group consisting of Ag, Sn, Te, In, B, Bi, Sb, and P dispersed within the copper. The total of Ag, Sn, Te, In, B, Bi, Sb, and P within the copper is from at least 0.3 ppm to about 10 ppm. The sputtering target has a substantially uniform grain size of less than or equal to about 50 micrometers throughout the copper and the at least one component.Type: GrantFiled: November 15, 2000Date of Patent: February 22, 2005Assignee: Honeywell International Inc.Inventors: Janine K. Kardokus, Chi tse Wu, Christopher L. Parfeniuk, Jane E. Buehler
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Publication number: 20040120842Abstract: Use of a low-alloyed, phosphorus-deoxidized copper alloy (DHP—Cu) for manufacturing hollow profile components by internal high-pressure forming, the copper alloy having the following composition: 0.030 to 0.080 wt-% of at least one element of a group including tin (Sn), Zinc (Zn), iron (Fe), silver (Ag) and at least 99.90 wt-% of (Cu) as well as unavoidable impurities as the remainder. Because of its cold work hardening properties, such a copper alloy is especially suitable for the manufacture of hollow profile components by internal high-pressure forming.Type: ApplicationFiled: August 11, 2003Publication date: June 24, 2004Inventors: Mainhard Hecht, Mathias Konczalla, Ulrich Naumann
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Publication number: 20020197531Abstract: A negative electrode active material includes a composition A-B-C containing a first element A which is at least one selected from copper and iron, a second element B which is at least one selected from silicon and tin, and a third element C which is at least one selected from the group consisting of indium, antimony, bismuth, and lead. A nonaqueous electrolyte battery includes a negative electrode containing the negative electrode active material, a positive electrode containing a positive electrode active material, and a nonaqueous electrolyte. The nonaqueous electrolyte battery has a large discharge capacity and excellent cycle performance.Type: ApplicationFiled: November 7, 2001Publication date: December 26, 2002Inventors: Hiroshi Inoue, Shinichiro Yamada, Takuya Endo
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Publication number: 20020110478Abstract: An alloy is provided containing by weight about 1 to 7% bismuth, up to 45% zinc, up to 20% tin, up to 30% nickel, up to 3% selenium, up to 2% aluminum, up to 2% antimony, up to 1% iron, up to 1% lead, up to 2% phosphorus, up to 2% carbon, and calcium and magnesium, singularly or in combination, from 0.02 to 2.0%, and the remainder copper and incidental impurities. The method for producing such an alloy is also provided.Type: ApplicationFiled: December 13, 2000Publication date: August 15, 2002Inventor: Benjamin L. Lawrence
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Publication number: 20020012607Abstract: Variable melting point solders and brazes having compositions comprising a metal or metal alloy powder having a low melting point with a metal powder having a higher melting point. Upon heating, in-situ alloying occurs between the low and high melting point powders such that solidification occurs at the solder or braze temperature thus creating a new, higher solidus (or melting) temperature with little or no intermetallic formation. A solder comprising Sn powder mixed with a Sn—Bi eutectic powder having a composition of 63 wt % Sn, 57 wt % Bi such that the bulk composition of the mixture is 3 wt % BS has an initial melting point of 140° C. and a re-melt temperature of 220° C. after heating due to in-situ alloying. A composition of Pb powder mixed with a Pb—Sn eutectic powder having a composition of 62 wt % Sn:58 wt % Pb such that the bulk composition of the mixture is 15 wt % Sn has an initial melting point of 183° C. and a re-melt temperature of 250° C.Type: ApplicationFiled: May 24, 2001Publication date: January 31, 2002Inventors: Stephen F. Corbin, Douglas J. McIsaac, Xin Qiao
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Patent number: 6241831Abstract: The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, silver in an amount from about 0.001 to about 0.1% by weight, iron in an amount from about 0.01 to about 0.25% by weight, and the balance copper and inevitable impurities. Preferably, the magnesium to phosphorous ratio is greater than 1.0. In a second embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, optionally silver in an amount from about 0.001 to about 0.1% by weight, at least one element selected from the group consisting of nickel, cobalt, and mixtures thereof in an amount from about 0.Type: GrantFiled: June 7, 1999Date of Patent: June 5, 2001Assignee: Waterbury Rolling Mills, Inc.Inventor: Ashok K. Bhargava
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Patent number: 6202703Abstract: The copper alloy tube disclosed here contains 0.05 to 1.5 wt. % of Mn and deoxidized copper containing oxygen concentration at 100 ppm or less. At least one element selected from a group of elements comprising P, B, Li, Pb and Sb can be added at the amount of 0.20 wt. % or less in total. At least one element selected from another group of elements comprising Cr, Ti, Zr, Al and Si also can be added at the amount of 0.50 wt. % or less in total. Further, at least one element selected from other group of elements comprising Mg, Fe, Co, Ag, In and As can be added at the amount of 1.0 wt. % or less in total. Furthermore, at least one element selected from a group of elements comprising Zn and Ni can be added at the amount 5.0 wt. % or less in total. Thereby, an corrosion resistant copper alloy tube having better corrosion resistant property against the ant-nest type corrosion which is specific problem for refrigerant tubes and tubes for the heat exchanger and also better brazing property can be provided.Type: GrantFiled: May 27, 1994Date of Patent: March 20, 2001Assignee: Kabushiki Kaisha Kobe Seiko ShoInventors: Taro Kuroda, Motohisa Miyafuji, Kenju Minamoto, Mitsuhiro Ohkubo, Ryoichi Ozaki, Akinori Tsuchiya
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Patent number: 6197433Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).Type: GrantFiled: January 12, 2000Date of Patent: March 6, 2001Assignee: Nippon Mining & Metals Co., Ltd.Inventor: Takaaki Hatano
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Patent number: 6103188Abstract: We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from the following list:______________________________________ 5-800 mg/Kg Pb (lead) 10-100 mg/Kg Sb (antimony) 5-1000 mg/Kg Ag (silver) 5-700 mg/Kg Sn (tin) 1-25 mg/Kg Cd (cadmium) 1-30 mg/Kg Bi (bismuth) 20-500 mg/Kg Zn (zinc) 10-400 mg/Kg Fe (iron) 15-500 mg/Kg Ni (nickel) 1-15 mg/Kg S (sulfur) ______________________________________in all cases, with 20-500 mg/Kg O (oxygen). The alloy is suitable for all the applications that require an electrical conductivity similar to that of pure copper, but with a better heat resistance, better mechanical properties and lower standard deviation values in strain strength.Type: GrantFiled: March 4, 1999Date of Patent: August 15, 2000Assignee: La Farga Lacambra, S.A.Inventors: Jose Oriol Guixa Arderiu, Miquel Garcia Zamora, Ferran Espiell Alvarez, Miquel Angel Fernandez Lopez, Araceli Esparducer Broco, Merce Segarra Rubik, Josep M.sup.a Chimenos Ribera
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Patent number: 6093265Abstract: A copper alloy having improved resistance to stress relaxation contains controlled additions of iron, phosphorous and magnesium. Free magnesium, in solid solution with the copper, increases the alloy's resistance to stress relaxation. Copper alloys of the invention retain at least 70% of the initial stress following exposure to a temperature of 105.degree. C. for 3000 hours, making the alloys particulary useful for electrical connector components.Type: GrantFiled: June 18, 1998Date of Patent: July 25, 2000Assignee: Olin CorporationInventor: William L. Brenneman
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Patent number: 6059901Abstract: Bismuth bearing copper-nickel-manganese-zinc corrosion and gall resistant castable alloy, particularly for use in food processing machinery, with the following weight percentage range:Nickel=12-28Manganese=12-28Zinc=12-28Aluminum=0.5-2.00Bismuth=2-6Phosphorus=0-0.3Tin =0-1.5Iron=0-1.Type: GrantFiled: September 21, 1998Date of Patent: May 9, 2000Assignee: Waukesha Foundry, Inc.Inventor: Sudhari Sahu
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Patent number: 5997810Abstract: A high-strength Cu based alloy, consists of:Ni: 0.5 to 2.0%;Sn: 1.2 to 2.5%;Si: 0.04 to 0.1%;Zn: 0.1 to 1%;Mg: 0.0001 to 0.02%;Mn: 0.0001 to 0.1%;P: 0.0001 to 0.02%; andCu and inevitable impurities: the balance,wherein the total content of Mg, Mn and P is 0.001 to 0.12%. The Cu based alloy is suitable for use as a material of electrical and electronic parts, and free from smutting during pretreatment for plating thereof.Type: GrantFiled: October 13, 1997Date of Patent: December 7, 1999Assignee: Mitsubishi Shindoh Co., Ltd.Inventors: Rensei Futatsuka, Junichi Kumagai, Shunichi Chiba
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Patent number: 5980656Abstract: A copper alloy achieves high electrical conductivity, in excess of 70% IACS; high strength, ultimate tensile strength in excess of 75 ksi; good surface cosmetics; and good stampability, above 25% break, by controlled additions of magnesium, iron and phosphorous. There is a critical iron content to achieve both good stampability and high electrical conductivity and a critical phosphorous content to achieve high strength and relatively small metal phosphide particles. There is further, a critical relationship between the amount of iron and phosphorous. An additions of magnesium, in amounts of more than 0.03%, broadens the effective ratio of iron to phosphorous, widening the composition box of the alloys of the invention.Type: GrantFiled: July 22, 1997Date of Patent: November 9, 1999Assignee: Olin CorporationInventors: William L. Brenneman, John F. Breedis
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Patent number: 5942056Abstract: A plumbing fixture or fitting fabricated from a bismuth and mischmetal containing copper alloy.Type: GrantFiled: June 7, 1995Date of Patent: August 24, 1999Assignee: Federalloy, Inc.Inventor: Akhileshwar R. Singh
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Patent number: 5868877Abstract: A copper alloy having improved resistance to stress relaxation contains controlled additions of iron, phosphorous and magnesium. Free magnesium, in solid solution with the copper, increases the alloy's resistance to stress relaxation. Copper alloys of the invention retain at least 70% of the initial stress following exposure to a temperature of 105.degree. C. for 3000 hours, making the alloys particularly useful for electrical connector components.Type: GrantFiled: July 22, 1997Date of Patent: February 9, 1999Assignee: Olin CorporationInventor: William L. Brenneman
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Patent number: 5851957Abstract: A composite for preparation of an oxide superconductor includes a primary alloy phase of constituent elements of a desired oxide superconductor; and a secondary phase comprising copper, the secondary phase supported by the primary alloy phase. The composite may additionally include a matrix material for supporting the primary alloy phase and second phase disposed therein. The composite is oxidized to form an oxide superconductor composite.Type: GrantFiled: August 5, 1993Date of Patent: December 22, 1998Assignee: American Superconductor CorporationInventors: Eric R. Podtburg, Kenneth H. Sandhage, Alexander Otto, Lawrence J. Masur, Christopher A. Craven, Jeffrey D. Schreiber
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Patent number: 5665480Abstract: A copper-lead alloy bearing having a high corrosion resistance, especially a high corrosion resistance to sulfur, comprising a back metal and a copper-lead-based bearing alloy bonded thereto. The copper-lead-based bearing alloy consists of more than 10 but not more than 20% Ni, 0.5 to 8% Sn, 8 to 30% Pb, not less an 0.005 but not more than 0.2% P, and the balance of Cu and incidental impurities.Type: GrantFiled: March 12, 1996Date of Patent: September 9, 1997Assignee: Daido Metal Company Ltd.Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Tsukimitsu Higuchi
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Patent number: 5637132Abstract: Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of metal powders having about 90 parts copper, about 10 parts tin and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped bronze part up to about 5% weight are disclosed. Lead-free metallurgy powder for use in manufacturing a shaped brass part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of metal powders about 70-90 parts copper, about 10-30 parts zinc and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped brass part up to about 5% weight are also disclosed.Type: GrantFiled: May 15, 1995Date of Patent: June 10, 1997Assignee: United States Bronze Powders, Inc.Inventors: Paul Matthews, Thomas Pelletier, II
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Patent number: 5637160Abstract: There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.Type: GrantFiled: July 20, 1994Date of Patent: June 10, 1997Assignee: Olin CorporationInventors: Andrew J. Brock, John F. Breedis, Jack Crane, Julius C. Fister, Frank N. Mandigo, David D. McDevitt, Mark N. Pearman, Ronald N. Caron
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Patent number: 5516484Abstract: A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.Type: GrantFiled: February 7, 1995Date of Patent: May 14, 1996Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kenji Kubosono, Iwao Asamizu, Masazumi Iwase, Toshihiro Kurita
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Patent number: 5507885Abstract: A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous solution. The brass of one species has a composition of 59.0 to 62.0 wt % of Cu, 0.5 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.5 to 2.0 wt % of Sn, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities. The brass of another species has a composition of 61.0 to 63.0 wt % of Cu, 2.0 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities.Type: GrantFiled: December 16, 1994Date of Patent: April 16, 1996Assignee: Kitz CorporationInventors: Sadao Sakai, Setsuo Kaneko, Kazuaki Yajima, Kazuhiko Kobayashi
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Patent number: 5489417Abstract: Spray cast copper-manganese-zirconium alloys are disclosed. In one embodiment, the alloy is spray cast in nitrogen and contains from about 1 ppm to about 20 ppm of dissolved nitrogen. In a second embodiment, the alloy contains an addition selected from the group consisting of chromium, titanium, erbium and mixtures thereof. The alloys are useful for sound damping as the combination of zirconium and the addition inhibits degradation of the specific damping capacity of the alloy.Type: GrantFiled: April 14, 1994Date of Patent: February 6, 1996Assignee: Olin CorporationInventors: William G. Watson, Harvey P. Cheskis, Sankaranarayanan Ashok
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Patent number: 5441696Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.Type: GrantFiled: June 26, 1992Date of Patent: August 15, 1995Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kenji Kubosono, Iwao Asamizu, Masazumi Iwase, Toshihiro Kurita
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Patent number: 5441555Abstract: Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of about 90 parts copper, about 10 parts tin and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped bronze part up to about 5% weight are disclosed. Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of about 70-90 parts copper, about 10-30 parts zinc and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped bronze part up to about 5% weight are also disclosed.Type: GrantFiled: July 22, 1994Date of Patent: August 15, 1995Assignee: United States Bronze Powders, Inc.Inventors: Paul Matthews, Thomas Pelletier, II