Abstract: An improved sterling silver alloy. Like all sterlings, the improved alloy is at least 92.5 percent silver by weight. It has less copper than traditional sterlings: 3.0 percent versus the traditional 7.5 percent. Additionally, the improved alloy includes about 2.75 percent palladium, about 1.0 percent tin, and about 0.75 percent zinc, all by weight. A grain refiner, such as ruthenium, may also be provided. The components of the preferred alloy are melted, degassed, remelted, and then formed into casting grains, wire, and etc. The resulting alloy is significantly harder, as cast, than traditional sterlings: 95-120 Vickers versus 65 Vickers for traditional sterlings. The improved alloy also exhibits improved corrosion resistance. Other than a slightly higher (<200° F.) liquidus temperature, the improved alloy may be worked in substantially the same manner as traditional sterlings. Pieces cast from the improved alloy may be age hardened to about 160 Vickers, if desired.

Abstract: An improved sterling silver alloy. Like all sterlings, the improved alloy is at least 92.5 percent silver by weight. It has less copper than traditional sterlings: 3.0 percent versus the traditional 7.5 percent. Additionally, the improved alloy includes about 2.75 percent palladium, about 1.0 percent tin, and about 0.75 percent zinc, all by weight. A grain refiner, such as ruthenium, may also be provided. The components of the preferred alloy are melted, degassed, remelted, and then formed into casting grains, wire, and etc. The resulting alloy is significantly harder, as cast, than traditional sterlings: 95-120 Vickers versus 65 Vickers for traditional sterlings. The improved alloy also exhibits improved corrosion resistance. Other than a slightly higher (<200° F.) liquidus temperature, the improved alloy may be worked in substantially the same manner as traditional sterlings. Pieces cast from the improved alloy may be age hardened to about 160 Vickers, if desired.

Abstract: A platinum-free silver alloy may include about 0.1% to 0.9% Au, about 83% to 90% Ag, about 2% to 3% Pd, about 3% to 5% Zn, about 2% to 8% Cu, about 0.01% to 0.4% B, about 0.1% to 0.3% Ge, and about 0.01% to 0.03% Ir.

Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.

Abstract: The present invention provides an Ag alloy film which exhibits a low-level electrical resistivity nearly equivalent to that of a pure Ag film and which is superior to a conventional Ag alloy film in durability (specifically, resistances to salt water and halogen) and in the adhesion to a substrate. Further, the deposition rate of this Ag alloy film by sputtering is as high as that of a pure Ag film. Provided is an Ag alloy film useful as a reflecting film and/or a transmitting film or as an electrical wiring and/or an electrode, including 0.1 to 1.5 atomic % of at least one element selected from Pd, Au and Pt, and 0.02 to 1.5 atomic % of at least one element selected from at least one rare earth element, Bi and Zn with the balance being Ag and inevitable impurities.

Abstract: A silver alloy with exceptional resistance to both tarnishing and firestain includes at least 92.50% silver, from 0.70 to 1.65% germanium, from 1.30 to 1.80% indium, from 0.000 to 0.015% boron, not more than 1.0% palladium and not more than 0.20% copper.

Abstract: A high tarnish resistant silver alloy composition formulated for jewelry and flatware manufacture is provided. In certain implementations, the alloy contains about 92%-97% by weight silver, about 0.25%-3.5% by weight palladium, about 0%-3.5% by weight platinum, about 0%-2.5% by weight gold, about 0.1%-1.0% by weight copper, about 0.5%-3.5% by weight zinc, about 0.1%-1.5% by weight tin, about 0.25%-1.5% by weight indium, about 0.03%-1.1% by weight silicon, about 0%-0.5% by weight germanium, about 0.15%-0.5% by weight gallium, about 0.25%-0.5% by weight cobalt and about 0%-0.5% by weight ruthenium. These unique combinations of elements result in the alloys with the tarnish resistance superior to typical 10K gold alloy.

Abstract: A silver-based alloy composition which is soft and workable in an annealed condition, is hardenable through heat treatment, and is tarnish resistant. The preferred embodiment of the composition of the present invention includes a small percentage of palladium and a reduction from typical percentages of copper found in a sterling silver alloy. In one embodiment the silver-based alloy includes no copper at all.

Abstract: It is an object of the present invention to provide a Ag—Pd—Cu—Ge type silver alloy which can form a reflective electrode film having such two characteristics that it is very reduced in the lowering of reflectance caused by thermal deterioration and has resistant to yellowing caused by sulfurization even after a heating step in a process of producing a color liquid crystal display. The silver alloy according to the present invention includes a composition containing at least four elements including Ag as its major component, 0.10 to 2.89 wt % of Pd, 0.10 to 2.89 wt % of Cu and 0.01 to 1.50 wt % of Ge, and the total amount of Pd, Cu and Ge is 0.21 to 3.00 wt %.

Abstract: A platinum-free silver alloy may include about 0.1% to 0.9% Au, about 83% to 90% Ag, about 2% to 3% Pd, about 3% to 5% Zn, about 2% to 8% Cu, about 0.01% to 0.4% B, about 0.1% to 0.3% Ge, and about 0.01% to 0.03% Ir.

Abstract: Compositions for forming Au-based bulk-solidifying amorphous alloys are provided. The Au-based bulk-solidifying amorphous alloys of the current invention are based on ternary Au—Cu—Si alloys, and the extension of this ternary system to higher order alloys by the addition of one or more alloying elements. Additional substitute elements are also provided, which allow for the tailoring of the physical properties of the Au-base bulk-solidifying amorphous alloys of the current invention.

Abstract: A bonding wire for semiconductor devices and a method of manufacturing the wire are provided. The bonding wire contains at least one element selected from zinc, tin, and nickel in an amount of 5 ppm to 10 wt %, the remainder containing silver and inevitable impurities. The method involves pouring a silver alloy according to the invention into a mold and melting the silver alloy, continuously casting the melted silver alloy, and drawing the continuously casted silver alloy.

Abstract: An improved sterling silver alloy. Like all sterlings, the improved alloy is at least 92.5 percent silver by weight. It has less copper than traditional sterlings: 3.0 percent versus the traditional 7.5 percent. Additionally, the improved alloy includes about 2.75 percent palladium, about 1.0 percent tin, and about 0.75 percent zinc, all by weight. A grain refiner, such as ruthenium, may also be provided. The components of the preferred alloy are melted, degassed, remelted, and then formed into casting grains, wire, and etc. The resulting alloy is significantly harder, as cast, than traditional sterlings: 95-120 Vickers versus 65 Vickers for traditional sterlings. The improved alloy also exhibits improved corrosion resistance. Other than a slightly higher (<200° F.) liquidus temperature, the improved alloy may be worked in substantially the same manner as traditional sterlings. Pieces cast from the improved alloy may be age hardened to about 160 Vickers, if desired.

Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.

Abstract: A silver-palladium alloy formulated to provide an alloy with a whiter color and superior casting and fabrication properties as compared to nickel-based white gold and also to impart to an article of jewelry or the like favorable properties afforded by white gold. The alloy generally includes silver and palladium, with silver being the predominant component. In some embodiments, the alloy contains about 75%-85% silver and about 5%-15% palladium by weight.

Abstract: The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.

Abstract: It is an object of the present invention to provide a Ag—Pd—Cu—Ge type silver alloy which can form a reflective electrode film having such two characteristics that it is very reduced in the lowering of reflectance caused by thermal deterioration and has resistant to yellowing caused by sulfurization even after a heating step in a process of producing a color liquid crystal display. The silver alloy according to the present invention includes a composition containing at least four elements including Ag as its major component, 0.10 to 2.89 wt % of Pd, 0.10 to 2.89 wt % of Cu and 0.01 to 1.50 wt % of Ge, and the total amount of Pd, Cu and Ge is 0.21 to 3.00 wt %.

Abstract: A boron-free, low-gold, and low-palladium metal alloy composition formulated to provide an alloy with an attractive yellow color, improved tarnish resistance, and enhanced castability. In certain implementations, the alloy contains gold, silver, copper, palladium and indium. The alloy preferably contains less than 25% by weight gold and the weight percent ratio of silver to copper is between 0.65 and 2.65 and the weight percent ratio of palladium to indium is between 1 and 5.

Abstract: The present invention is related to a novel sterling silver compound for use in vermeil jewelry and other articles of manufacture. The compound includes an alloy composed of at least 92.5% by weight of silver, up to 7.5% by weight of gold, and the remainder in copper. The invention further relates to an article of jewelry including at least 92.5% by weight of silver, up to 7.5% by weight of gold, and the remainder in copper. The invention also relates to a method for making an article. The method includes providing a vessel and adding 3.75% by weight of gold, 94.0% by weight of silver, and 2.25% by weight of copper to the vessel. The method also includes melting the metals and mixing them until a homogenous mixture is formed. The method further includes pouring the homogenous mixture into a mold to form a semi-finished article and plating the semi-finished article with 18K rose gold.

Abstract: A silver alloy reflective film for optical information storage media, which can maintain superior environmental resistance, such as high hygrothermal resistance and high light stability, over the long term even when the metal reflective film is in direct contact with a resin layer. An optical information storage medium includes the reflective film and a sputtering target deposits the reflective film. The silver alloy reflective film includes one or more specific elements selected from Pr, Ho, Yb, Sm, Er, Tm, and Tb, to suppress deterioration occurring when the silver alloy reflective film is in direct contact with a resin layer, where silver in the reflective film migrates and aggregates into the adjacent resin layer.

Abstract: A sterling silver jewelry alloy that has approximately 0.01-7.50% fine gold content that has similar color huge and shine and characteristics of sterling silver. Karatium Sterling is a unique alloy blend that will provide the traditional sterling silver jewelry designer with a special metal that is slightly more tarnish resistant than traditional sterling silver. The alloy has the following compositions by weight; Gold 0.01.00-7.50%, Silver 92.50-97.50%, Copper 0.01-7.00%. In addition to its nice silver color it also polishes easier with a better luster and provides jewelry craftsmen a slightly higher cost silver alloy that responds well to the jewelry manufacturing process (e.g., casting, milling, soldering, tooling, stone setting, polishing and plating).

Abstract: A manufacturing method for a silver alloy bonding wire and products thereof A primary material of Ag is melted in a vacuum melting furnace, and then a plurality of secondary metal materials are added into the vacuum melting furnace and co-melted with the primary material to obtain a silver alloy ingot. The obtained silver alloy ingot is drawn to obtain a silver alloy wire. The silver alloy wire is then drawn to obtain a silver alloy bonding wire with a predetermined diameter.

Abstract: A silver-palladium alloy formulated to provide an alloy with a whiter color and superior casting and fabrication properties as compared to nickel-based white gold and also to impart to an article of jewelry or the like favorable properties afforded by white gold. The alloy generally includes silver and palladium, with silver being the predominant component. In some embodiments, the alloy contains about 75%-85% silver and about 5%-15% palladium by weight.

Abstract: A manufacturing method for a composite metal bonding wire and products thereof. A material of Ag and Au is co-melted in a vacuum melting furnace, and then a plurality of trace metal elements are added into the vacuum melting furnace and co-melted with the material to obtain a composite metal ingot. The obtained composite metal ingot is drawn to obtain a composite metal wire. The composite metal wire is then drawn to obtain a composite metal bonding wire with a predetermined diameter.

Abstract: A jewelry alloy that is approximately a 10% or 2.4 karat alloy that has similar color huge and shine and characteristics of 10 karat gold and higher. This alloy is considerably less expensive than traditional 10 karat gold and higher, but has all the similar working characteristics as working in sterling or 10 karat gold metal alloys. The alloy has the following compositions by weight; Gold 5.00-20.00%, Silver 35.00-55.00%, Copper 40.00-60.00%. In addition to its nice pink color and low cost it provides retailers with an affordable alloy for jewelry and provides jewelry craftsmen a low cost pink alloy that responds well to the jewelry manufacturing process (e.g., casting, milling, soldering, tooling, stone setting, polishing and plating).

Abstract: A jewelry alloy that is approximately a 10% or 2.4 karat alloy that has similar color huge and shine and characteristics of 10 karat white gold and higher. This alloy is considerably less expensive than traditional 10 karat white gold and higher, but has all the similar working characteristics as working in sterling or 10 karat white gold metal alloys. The alloy has the following compositions by weight; Gold 5.00-20.00%, Silver 75.00-92.50%, Copper 01.00-10.00%. In addition to its nice white (silver) color and low cost it provides retailers with an affordable alloy for jewelry and provides jewelry craftsmen a low cost white (silver) alloy that responds well to the jewelry manufacturing process (e.g., casting, milling, soldering, tooling, stone setting, polishing and plating).

Abstract: A metal nanoparticle composition includes a thermally decomposable or UV decomposable stabilizer. A method of forming conductive features on a substrate, includes providing a solution containing metal nanoparticles with a stabilizer; and liquid depositing the solution onto the substrate, wherein during the deposition or following the deposition of the solution onto the substrate, decomposing and removing the stabilizer, by thermal treatment or by UV treatment, at a temperature below about 180° C. to form conductive features on the substrate.

Abstract: Provided is a sputtering target material which has a high reflectance and which is excellent in a sulfurization resistance, comprising an Ag alloy prepared by alloying Ag with a specific small amount of the metal component (A) selected from In, Sn and Zn, a specific small amount of the metal component (B) selected from Au, Pd and Pt and, if necessary, a small amount of Cu.

Abstract: An Ag-based alloy wire for a semiconductor package is highly reliable and can be fabricated with low costs. The Ag-based alloy wire includes 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder.

Abstract: Silver alloy compositions having reduced susceptibility to sulphidation and reduced susceptibility to fire stain relative to 92.5% silver 7.5% copper alloy, and having mechanical properties for casting and forming comparable to or better than 92.5% silver 7.5% copper alloy, and having an appearance similar to 92.5% silver 7.5% copper alloy. The silver alloy compositions include at least 92.5% silver 2.0%-4.0% tin; 1.7%-2.6% zinc and 0.50%-1.5% indium.

Abstract: A silver-platinum alloy formulated to provide improved tarnish resistance and hardness as compared to sterling silver. The alloy can be incorporated in various jewelry, flatware, and like articles. The alloy generally includes silver and platinum, with silver being the predominant component. In certain applications, the alloy includes about 90–95.5% silver and about 0.5–6% platinum. A small amount of gallium can also be added to the composition to provide ease of manufacture of the alloy. The resulting alloy has the favorable properties afforded by sterling silver, but also has brighter surface finish, greater tarnish resistance and increased hardness as compared to traditional sterling silver.

Abstract: A silver alloy with color fastness includes silver as major component; and a small quantity of copper, zinc and nickel so that it can be prevented to oxidize, and it can use metal with easy procurement without special metal and manufacture a alloy with color fastness.

Abstract: A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted of gadolinium Gd only, or gadolinium Gd and at least one element selected from the group consisting of rare-earth elements other than Gd, alkaline-earth elements, silicon Si, aluminum Al, and boron B.

Abstract: A high strength, tarnish resistant composition of matter includes approximately 90 percent Ag, 3 to 5 percent Pt and 7 to 5 percent Cu. In a preferred embodiment, the composition of matter includes 90 percent Ag, 3 percent Pt and 7 percent Cu. In another preferred embodiment, the composition of matter includes 90 percent Ag, 5 percent Pt and 5 percent Cu.

Abstract: The present invention relates to a metal material for electronic parts, electronic parts, electronic apparatuses, a method of processing metal materials, and electro-optical parts. For example, the present invention is applied to liquid crystal display panels, various semiconductor devices, wiring boards, chip parts, and the like. The present invention proposes a metal material for electronic parts which is characterized by lower resistivity, higher stability, and more excellent processability than the prior art. The present invention also proposes electronic parts and electronic apparatuses which use this metal material. An applicable metal material is an alloy containing Ag as a main component, 0.1 to 3 wt % of Pd, and 0.1 to 3 wt % in total of elements such as Al.

Abstract: The present invention is related to an alloy target used for producing thin film electrodes, consisting of silver (Ag), copper (Cu), and at least one precious metal selected from the group consisting of palladium (Pd), gold (Au) and platinum (Pt); wherein the mole ratio of said silver ranges from 0.8 to 0.999; the mole ratio of said copper ranges from 0.001 to 0.1; the mole ratio of said precious metal ranges from 0.001 to 0.1; and the total mole ratio of said alloy target is 1.

Abstract: An optical data recording and storage medium includes a reflective layer formed from a silver alloy that contains, in addition to silver, about 0.1 to about 4.0 wt. %, based on the total weight of alloy, of samarium (Sm).

Abstract: A composition of an Ag alloy film as a thin film for electronic devices and target material to form thereof by a sputtering process are disclosed. The Ag alloy film consists of 0.1 to 0.5 atomic % of any one element selected from the group of Sm, Dy and Tb, 0.1 to 1.0 atomic % in total of at least one element selected from the group of Au and Cu, and the balance of Ag and incidental impurities. The Ag alloy film may be used as a wiring film or a reflective film for flat panel display devices. The sputtering-target material for forming the Ag alloy film consists of 0.1 to 0.5 atomic % of any one element selected from the group of Sm, Dy and Tb, 0.1 to 1.0 atomic % in total of at least one element selected from the group of Au and Cu, and the balance of Ag and incidental impurities.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: An alloy material, a thin film and an optical recording medium to achieve various tasks such as maintenance of a high reflectivity, improved corrosion resistance, simplified production of the alloy, and realization of stability and simplicity/easiness of a sputtering process when being used as a sputtering target. An AgPd alloy including Ag as a main component and Pd in the range of 0.5 to 4.9 atomic % is used as a thin film formation use sputtering target material, with the target material a thin film, that is a reflecting film, constituting an optical recording medium is formed and the optical recording medium containing the reflecting film as a constituent is produced.

Abstract: A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.

Abstract: Sliding contacts comprising alloys such as Pd/Cu/Ag, Pt/Cu/Ag, Pd/Cu/Ag/Ni, Pt/Cu/Ag/Ni, Ag/Pd/Cu,Au, Ag/Pt/Cu/Au and two-layered composites comprising a surface layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy. Also, three-layered composites comprising a surface layer of one of the foregoing alloys, an intermediate layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy as well as direct current motors comprising commutators comprising a three-layered composite.

Abstract: A silver/palladium alloy for electrical contact applications comprises, on a weight percent basis, 20-50 silver, 20-50 palladium, 20-40 copper, less than 1.0 nickel, 0.1-5 zinc, 0.01-0.3 boron, and up to 1 percent by weight of modifying elements selected from the group consisting of rhenium, ruthenium, gold, and platinum. The combination of zinc and boron provides an alloy of high strength and hardness and permits the use of lower amounts of both copper and palladium.

Abstract: A silver colored alloy highly tarnish resistant, sterling silver is provided or having included therein: 90% to 92.5% by weight Silver; 5.75% to 7.5% by weight Zinc; 0.25% to less than 1% by weight Copper; 0.25% to 0.5% by weight Nickel; 0.1% to 0.25% by weight Silicon; and 0.0% to 0.5% by weight Indium.

Abstract: A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selected from the group consisting of ruthenium, zirconium and platinum. This alloy exhibits high oxidation and tarnish resistance and is formed into wrought electronic components such as contacts and brushes to provide low noise.

Abstract: The present invention provides a new and useful via fill paste for use in the construction of electronic circuit devices. The unique via fill paste is capable of electrically connecting conductive layers made of dissimilar metals such as gold and silver. The via fill paste includes gold, silver, palladium and a refractory oxide. The refractory oxide comprises one or more metals selected from the group consisting of zirconium, yttrium, niobium, tantalum, lanthanum, thorium, hafnium, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium.

Abstract: The amount of mercury released from amalgam restorations in the teeth of living beings is significantly reduced without changing the composition of the silver-tin-copper alloy or changing the mercury-alloy ratio. This is achieved by introducing a mercury-absorbing metal component which acts only during the final setting stage of the amalgam. In a process embodiment, this is achieved by introducing a mercury-absorbing metal component which is applied to the prepared tooth cavity walls where it absorbs excess mercury from the setting amalgam. In a composition embodiment, the composition of the amalgam restoration consists of three components: a finely divided silver-tin-copper alloy; mercury; and a mercury-absorbing metal powder containing at least 50% by weight of palladium and the remainder of the group consisting of gold, copper, platinum, indium, zinc, and silver, some of which may be present as a coating on the palladium base powder.

Abstract: A dental alloy having, upon amalgamation, a desirable combination of physical properties and both a desirable condense time and carve time. The alloy contains from 48.75 to 50.75% silver, 20.25 to 21.75% copper, 28.25 to 29.25% tin, 0.05 to 0.8% palladium and up to 2.7% of elements selected from the group consisting of zinc, indium, manganese, cadmium, aluminum, gallium, ruthenium and mercury.

Abstract: An electric contact material comprising 0.01 to 2.0 weight % of Li, 0.01 weight % or more to less than 0.2 weight % of at least one rare earth metal and the remainder being Ag. The electric contact material may further comprise 0.1 to 1.0 weight % of at least one element selected from a group consisting of In, Sn, Zn, Mn, Pd, Sb, Cu, Mg, Pb, Cd, Cr and Bi, however, for Zn and Mn, the amount is less than 0.5 % by weight; and/or 0.03 to 0.6 weight % of at least one element selected from a group consisting of Fe, Ni and Co. The electric contact material is excellent in arc resistance, wear resistance and lubricity in a small current region and is suitable as a material for a slide contact and a rotary slide contact.

Abstract: An Ag-Cu-WC contact forming material for a vacuum interrupter comprising a highly conductive component comprising Ag and Cu and an arc-proof component comprising WC wherein the content of the highly conductive component is such that the total amount of Ag and Cu(Ag+Cu) is from 25% to 65% by weight and the percentage of Ag based on the total amount of Ag and Cu[Ag/(Ag+Cu)] is from 40% to 80% by weight; wherein the content of the arc-proof component is from 35% to 75% by weight; wherein the structure of the highly conductive component comprises a matrix and a discontinuous phase, the discontinuous phase having a thickness or width of no more than 5 micrometers and wherein said arc-proof component comprises a discontinuous grain having a grain size of no more than 1 micrometer.