Abstract: A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 ?m or less and a number density of 0.015/?m2 or higher. A method for producing a ceramic circuit substrate includes bonding at a temperature of 855 to 900° C. for a retention time of 10 to 60 minutes.

Abstract: A joined body 10 is manufactured by joining a Mo- or Ti-made terminal 14 having a Ni coating, a Au coating, a Ni—Au coating (with Ni Serving as a base) to a recess 12a formed in a plate-shaped ceramic member 12 made of alumina or aluminum nitride through a joint layer 16. The joint layer 16 contains Au, Sn, Ag, Cu, and Ti and is in contact with a bottom surface of the recess 12a and with at least part of a side surface of the recess 12a (the entire side surface in this case). In the joint layer 16, its joint interface with the ceramic member 12 is Ti-rich. When the joined body 10 is cut in its thickness direction, the ratio of the total cross sectional area of pores to the cross-sectional area of the joint layer 16 (porosity) is 0.1 to 15%.

Abstract: A method includes disposing a braze material adjacent a first body and a second body; heating the braze material and forming a transient liquid phase; and transforming the transient liquid phase to a solid phase and forming a bond between the first body and the second body. The braze material includes copper, silver, zinc, magnesium, and at least one material selected from the group consisting of nickel, tin, cobalt, iron, phosphorous, indium, lead, antimony, cadmium, and bismuth.

Abstract: The invention provides a method of treating sensitive teeth comprising attaching a sealant composition comprising a basic amino acid to a person's tooth and allowing the basic amino acid to be slowly released over time in order to reduce chrome and/or acute tooth sensitivity together with compositions and methods of use.

Abstract: A process for making a finished or semi-finished article of silver alloy, said process comprising the steps of providing a silver alloy containing silver in an amount of at least 77 wt %, copper and an amount of germanium that is preferably at least 0.5 wt % and is effective to reduce tarnishing and/or firestain, making or processing the finished or semi-finished article of the alloy by heating at least to an annealing temperature, gradually cooling the article; and reheating the article to effect precipitation hardening thereof. The avoidance of quenching reduces the risk of damage to the article.

Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.

Abstract: A cylindrical core portion, at least a part of which is made of a noble metal alloy and which has a diameter larger than a maximum diameter of a shape obtained by lathe machining, and a hollow-cylindrical peripheral portion, which is made of a material different from the material of the core portion, are included. The core portion is arranged in a hollow portion of the peripheral portion with no space. The material applied to the peripheral portion is a free-cutting material selected from a group of, for example, free-cutting brass, free-cutting phosphor bronze, free cutting nickel silver, and free-cutting beryllium copper. The noble metal alloy applied to the core portion is, for example, alloy mainly consisting of silver, palladium, gold, platinum, zinc, copper, iron, and nickel, alloy mainly consisting of palladium, silver, and copper, or alloy mainly consisting of silver, platinum, zinc, gold, and copper.

Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.

Abstract: The present invention addresses the problem of providing a novel, sold metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal in a finely mixed state at the nanolevel in a specific region where the two types of metal are unevenly distributed. This metal alloy has a substitutional solid solution of the two or more types of metal as the principal constituent thereof. This metal alloy is preferably one obtained by precipitation after mixing ions of two or more types of metal and a reducing agent in a thin-film fluid formed between processing surfaces, at least one of which rotates relative to the other, which are arranged so as to face one another and are capable of approaching and separating from one another.

Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.

Abstract: A light emitting diode with a front surface adapted to emit light and a rear surface is provided with a reflective coating on the rear surface, the reflective coating being primarily silver and containing either 0.4% bismuth or a combination of 0.5% tin, 0.2% copper, and 0.2% samarium.

Abstract: Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10?9 m to 10?6 m) and micrometers (10?6 m to 10?3 m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy.

Abstract: It is an object of the present invention to provide a Ag—Pd—Cu—Ge type silver alloy which can form a reflective electrode film having such two characteristics that it is very reduced in the lowering of reflectance caused by thermal deterioration and has resistant to yellowing caused by sulfurization even after a heating step in a process of producing a color liquid crystal display. The silver alloy according to the present invention includes a composition containing at least four elements including Ag as its major component, 0.10 to 2.89 wt % of Pd, 0.10 to 2.89 wt % of Cu and 0.01 to 1.50 wt % of Ge, and the total amount of Pd, Cu and Ge is 0.21 to 3.00 wt %.

Abstract: A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties: I. an average size of crystal grains of the core is between 0.8 ?m and 3 ?m, II. the amount of crystal grains having an orientation in the <001> direction in a wire cross section is in a range of 10-20%, III. the amount of crystal grains having an orientation in the <111> direction in a wire cross section is in a range of 5-15%, and IV. the total amount of crystal grains having orientations in the <001> and <111> directions in a wire cross section is in a range of 15-40%.

Abstract: The present invention provides an active metal brazing material composed of a Ag—Cu—Ti—Sn alloy containing by weight 20 to 40% of Cu, 1.0 to 3.0% of Ti, 1.2 to 6.0% of Sn and the balance being Ag, and having a metallographic structure including a Sn—Ti or Cu—Ti intermetallic compound dispersed in a Ag—Cu alloy matrix, wherein the weight ratio Sn/Ti between Ti and Sn is 1.2 or more, and additionally the particle size of the intermetallic compound is 20 ?m or less. The foregoing active metal brazing material improves the workability of the hitherto known Ag—Cu—Ti alloy active metal brazing material and enables a critical dimension processing with a high processing rate, and can be produced by melting and casting the foregoing Ag—Cu—Ti—Sn alloy, and by subsequently plastically working the cast at a working rate of 90% or more to make finer the intermetallic compound involved.

Abstract: Titanium sterling silver alloy compositions that exhibit enhanced tarnish resistance while maintaining an acceptable hardness. Applications and manufacturing methods thereof are disclosed.

Abstract: In an electric contact material of silver matrix capable of resisting arc erosion and containing no cadmium-composite, an Ag—(SnO2+In2O3) composite containing 9˜11% of (SnO2+In2O3) or an Ag—Cu oxide, composite containing 15˜25% of Cu oxide is used. The electrical contact material has a contact resistance of 5˜60 milliohms (mohm) and an arc erosion resistance capability up to 2*103˜10*103 times provided that the Vickers hardness (Hv) of the material is 100˜150, the measured current is 1˜5 amperes, and the measured voltage is 10˜20 volts. Two electrical contacts maintain an arc erosion resisting capability at the condition of a low contact resistance when the electrical contact material is formed on a surface of a metal substrate of an electric connector.

Abstract: The present invention is a silver alloy suitable for use in a probe pin made of an Ag-Cu alloy, wherein the silver alloy comprises 30 to 50% by weight of Cu and Ag as balance. This silver alloy further comprises 2 to 10% by weight of Ni to further improve strength. A probe pin made of these materials has stable contact resistance even under low contact pressure. The probe pin has excellent strength and antifouling property to adhesion of a foreign matter from a contact object due to repetitive use. Thereby, the probe pin usable in a stable manner for a long period of time can be obtained.

Abstract: Compositions for forming Au-based bulk-solidifying amorphous alloys are provided. The Au-based bulk-solidifying amorphous alloys of the current invention are based on ternary Au—Cu—Si alloys, and the extension of this ternary system to higher order alloys by the addition of one or more alloying elements. Additional substitute elements are also provided, which allow for the tailoring of the physical properties of the Au-base bulk-solidifying amorphous alloys of the current invention.

Abstract: A bonding wire for semiconductor devices and a method of manufacturing the wire are provided. The bonding wire contains at least one element selected from zinc, tin, and nickel in an amount of 5 ppm to 10 wt %, the remainder containing silver and inevitable impurities. The method involves pouring a silver alloy according to the invention into a mold and melting the silver alloy, continuously casting the melted silver alloy, and drawing the continuously casted silver alloy.

Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.

Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.

Abstract: Provided are a brazing material capable of being restrained from protruding unnecessarily in a joint region; a heat dissipation base having a high reliability of electric insulation, and does not easily cause a short circuit even when the base dissipates heat repeatedly; and an electronic device wherein an electronic component is mounted on circuit members of this heat dissipation base. The brazing material comprises silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten.

Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.

Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.

Abstract: The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.

Abstract: The present invention is a silver alloy suitable for use in a probe pin made of an Ag—Cu alloy, wherein the silver alloy comprises 30 to 50% by weight of Cu and Ag as balance. This silver alloy further comprises 2 to 10% by weight of Ni to further improve strength. A probe pin made of these materials has stable contact resistance even under low contact pressure. The probe pin has excellent strength and antifouling property to adhesion of a foreign matter from a contact object due to repetitive use. Thereby, the probe pin usable in a stable manner for a long period of time can be obtained.

Abstract: An alloy composition comprises 73.0 to 74.5 wt % of Ag and 25.5-27.0 wt % of Sn; 30.0-67.5 wt % of Ag and 32.5-70.0 wt % of In; or 29.0-60.0 wt % of Ag, 19.0-35.0 wt % of Sn and 20.0-35.2 wt % of In, wherein the particle diameter of Ag is between 10 nm to 200 ?m. The alloy composition in the present invention has characters of low melting point, low hardness and high ductility. On the other hand, after a heat treatment, the alloy composition is tended to be high in melting point, hardness, strength, stability and conductivity.

Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.

Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.

Abstract: A process for making a finished or semi-finished article of silver alloy, said process comprising the steps of providing a silver alloy containing silver in an amount of at least 77 wt %, copper and an amount of germanium that is preferably at least 0.5 wt % and is effective to reduce tarnishing and/or firestain, making or processing the finished or semi-finished article of the alloy by heating at least to an annealing temperature, gradually cooling the article; and reheating the article to effect precipitation hardening thereof. The avoidance of quenching reduces the risk of damage to the article.

Abstract: A firestain and tarnish-resistant ternary alloy of silver, copper and germanium contains from more than 93.5 wt % to 95.5 wt % Ag, from 0.5 to 3 wt % Ge, optionally 0.5 wt % Zn and the remainder, apart from incidental ingredients (if any), impurities and grain refiner, copper. In order to further protect an article made from the alloy, it may be surface treated with an alkanethiol, alkyl thioglycollate, dialkyl sulphide or dialkyl disulphide. Embodiments of the above alloy exhibit relatively low elution of copper when subjected to a simulated sweat test.

Abstract: A silver alloy reflective film for optical information storage media, which can maintain superior environmental resistance, such as high hygrothermal resistance and high light stability, over the long term even when the metal reflective film is in direct contact with a resin layer. An optical information storage medium includes the reflective film and a sputtering target deposits the reflective film. The silver alloy reflective film includes one or more specific elements selected from Pr, Ho, Yb, Sm, Er, Tm, and Tb, to suppress deterioration occurring when the silver alloy reflective film is in direct contact with a resin layer, where silver in the reflective film migrates and aggregates into the adjacent resin layer.

Abstract: A silver-palladium alloy formulated to provide an alloy with a whiter color and superior casting and fabrication properties as compared to nickel-based white gold and also to impart to an article of jewelry or the like favorable properties afforded by white gold. The alloy generally includes silver and palladium, with silver being the predominant component. In some embodiments, the alloy contains about 75%-85% silver and about 5%-15% palladium by weight.

Abstract: A metal nanoparticle composition includes a thermally decomposable or UV decomposable stabilizer. A method of forming conductive features on a substrate, includes providing a solution containing metal nanoparticles with a stabilizer; and liquid depositing the solution onto the substrate, wherein during the deposition or following the deposition of the solution onto the substrate, decomposing and removing the stabilizer, by thermal treatment or by UV treatment, at a temperature below about 180° C. to form conductive features on the substrate.

Abstract: Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects.

Abstract: A semi-reflective film and reflective film for an optical recording medium, which is made of a silver alloy having a composition consisting of 0.001 to 0.1% by mass of Ca, 0.05 to 1% by mass of Mg, and a remainder containing Ag and inevitable impurities, and a target which is made of a silver alloy having a composition consisting of 0.001 to 0.1% by mass of Ca, 0.05 to 1% by mass of Mg, and a remainder containing Ag and inevitable impurities; and a semi-reflective film for an optical recording medium, which is made of a silver alloy having a composition consisting of 0.05 to 1% by mass of Mg, 0.05 to 1% by mass of one or more of Eu, Pr, Ce and Sm, and a remainder containing Ag and inevitable impurities, and an Ag alloy sputtering target for forming a semi-reflective film for an optical recording medium, which is made of a silver alloy having a composition consisting of 0.05 to 1% by mass of Mg, 0.05 to 1% by mass of one or more of Eu, Pr, Ce and Sm, and a remainder containing Ag and inevitable impurities.

Abstract: Lead-free solder compositions for bonding and sealing flat panel displays, CCD's, solar cells, light emitting diodes, and other optoelectronic devices are disclosed. The solders are based on alloys of Sn, Au, Ag, and Cu and one or more rare earth metals chosen from the following, Y, La, Ce, Pr, Sc, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. Optionally, the compositions may comprise In, Bi, or Zn. The solder compositions exhibit superior bonding capability in joining dissimilar surfaces such as those present in both the flat panel display and light emitting devices. Additionally the solders provide a strong barrier to the diffusion of both water and oxygen into these devices thus promoting longer device life times.

Abstract: A brazing material for brazing tungsten/carbide/cobalt substrates (e.g., wear pads) to substrates comprising titanium or alloys thereof (e.g., fan or compressor blades). The brazing material includes silver, aluminum, nickel, copper, and titanium present in respective amounts to provide a post-braze hardness of between 450 and 550 KHN to thereby increase the impact resistance of the braze joint. The substrates may be brazed by induction heating at temperatures up to about 1750° F. (about 954° C.).

Abstract: A brazing material including about 20 to about 60 percent by weight silver, about 1 to about 4 percent by weight aluminum, about 20 to about 65 percent by weight copper, about 3 to about 18 percent by weight titanium and about 1 to about 4 percent by weight nickel.

Abstract: An Ag-based alloy wire for a semiconductor package is highly reliable and can be fabricated with low costs. The Ag-based alloy wire includes 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder.

Abstract: A master metal composition adapted for alloying with silver to give an alloy containing at least 77 wt % Ag and at least 0.5 wt % Ge comprises Cu, Ge and boron together with any further ingredients for said alloy and any impurities. It further provides a process for making silver alloy containing silver in an amount of at least 77 wt % Ag, 1-7.2 wt % Cu copper, at least 0.5 wt % Ge and B together with any further ingredients for said alloy and any impurities, comprising the step of melting together fine silver and a master metal composition which is at least a ternary alloy of copper, germanium and boron, e.g. 92.5-92.8 wt % Ag, 6.0-6.3 wt % Cu, about 1.2 wt % Ge and 1-15 ppm boron as grain refiner. The resulting silver alloy exhibits good tarnish and firestain resistance and can exhibit significant precipitation hardening on gradual air cooling.

Abstract: A sterling silver alloy composition of exceptional and reversible hardness and enhanced tarnish resistance, consists essentially of the following parts by weight: at least about 92.5% silver; about 4.4% to about 5.25% copper; about 0% to about 1.0% zinc; about 0.85% tin; about 0.05% to about 0.3% lithium; about 0.05% to about 0.5% silicon; about 0% to about 1.2% germanium; and about 0% to about 0.02% boron.

Abstract: The invention provides a material for sliding contacts that is suitable for a small-sized DC motor used in recent downsized CD players and is excellent in durability. A material for sliding contacts used in a commutator of a small-sized DC motor that consists essentially of 0.01 to 3.0% Ni by weight, 0.01 to 6.0% ZnO by weight and/or 0.01 to 3.0% MgO by weight, furthermore, in some cases, 0.01 to 5.0% Cu by weight, and the balance Ag, in which Ni metal particles, ZnO particles or MgO particles are dispersed in the matrix of Ag.

Abstract: A silver-colored, tarnish-resistant, corrosion-resistant alloy is provided. The alloy includes 92.5–95% silver, combined with a master alloy of 24–34% zinc; 60–74% copper; 0.5–1.8% silicon; 0.0–8.0% tin, or 0.0–1.5% indium, wherein percentages are in terms of weight. The alloy can be used for jewelry items, tableware items, dental items or other items that should resist tarnishing or corrosion and which require a non-brittle alloy.

Abstract: The present invention relates to a silver braze alloy having improved wetting properties. The silver braze alloy consists essentially of from about 52.25 wt % to about 57.0 wt % silver, from about 38.95 to about 43.0 wt % copper, from about 0.5 wt % to about 5.5 wt %, preferably from about 1.0 wt % to about 5.5 wt %, manganese, and up to about 2.5 wt %, preferably from about 1.5 wt % to about 2.5 wt %, nickel. The alloy further may contain 0.15 wt % total of other trace elements.

Abstract: A silver alloy with color fastness includes silver as major component; and a small quantity of copper, zinc and nickel so that it can be prevented to oxidize, and it can use metal with easy procurement without special metal and manufacture a alloy with color fastness.

Abstract: A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted of gadolinium Gd only, or gadolinium Gd and at least one element selected from the group consisting of rare-earth elements other than Gd, alkaline-earth elements, silicon Si, aluminum Al, and boron B.

Abstract: A high strength, tarnish resistant composition of matter includes approximately 90 percent Ag, 3 to 5 percent Pt and 7 to 5 percent Cu. In a preferred embodiment, the composition of matter includes 90 percent Ag, 3 percent Pt and 7 percent Cu. In another preferred embodiment, the composition of matter includes 90 percent Ag, 5 percent Pt and 5 percent Cu.

Abstract: The optical recording medium has a substrate (1) with a recording layer (2), a reflecting layer (3) and a protecting layer (4) laminated successively on the substrate (1). The reflecting layer (3) is a thin film of an alloy containing 99.7 to 73.0% by weight of Cu as a major component, as well as, 0.2 to 18.0% by weight of Ag and 0.1 to 9.0% by weight of Ti. The reflecting layer has a film thickness of 50 nm to 150 nm. The optical recording medium provided with the reflecting layer (3) shows improved corrosion resistance and also retains high reflectance. The present invention also provides a target for forming the reflecting layer (3).