Abstract: A grey gold alloy which is nickel-free, cobalt-free, iron-free, silver-free, copper-free, zirconium-free, niobium-free, chromium-free and manganese-free, including, expressed in weight percent, from 75.0 to 76.5% of Au, from 15 to 23% of Pd, from 0.5 to 5% of Rh, from 0 to 7% of Pt, and from 0 to 5% of at least one of the alloying elements Ir, Ru, Ti, In, Ga, B and Re, the respective percentages of all the alloying elements adding up to 100%.

Abstract: A brazed article comprising a ceramic component, a metallizing layer comprising tungsten and yttrium oxide disposed against a surface of the ceramic component, and a bonding layer disposed between the metallizing layer and a metal component wherein said bonding layer comprises a nickel-rich portion proximal to the ceramic component and a gold-rich portion interfacing against the metal component.

Abstract: Layers of conductive foil and insulating material are configured to interconnect an array of rear-contact solar cells. An embodiment provides that the layer of conductive foil may be patterned to form repeating sets of electrically isolated, interdigitated fingers. Each set of interdigitated fingers may be used to connect the positive polarity contacts of a first rear-contact solar cell to the negative polarity contacts of a second, adjacent rear-contact cell. The insulating layer is attached to the patterned conductive foil and provides mechanical support and/or electrical isolation. In some embodiments, a protective backsheet may be disposed beneath the conductive foil and/or insulating layer to provide further mechanical support and environmental protection. In some embodiments, the layers of conductive foil and insulating material may be incorporated as an interconnect circuit in a rear-contact PV module.

Abstract: The present invention relates to a gray gold alloy free of nickel and copper having a hardness that is suitable in particular for watchmakers and jewellers. Said alloy consists of (in wt %): more than 75% of Au; more than 18% to less than 24% of Pd; more than 1% to less than 6% of at least one element selected from among Mn, Hf, Nb, Pt, Ta, V, Zn and Zr; optionally, no more than 0.5% of at least one element selected from among Si, Ga and Ti; and optionally, no more than 0.2% of at least one element selected from among Ru, Ir and Re. The invention also relates to a method for preparing said alloy.

Abstract: An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999% or higher, 2-5 mass % of palladium having a purity of 99.99% or higher, and remaining mass % of silver (Ag) having a purity of 99.999% or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.

Abstract: Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase separation of the binary alloy are determined, and the stable phase of the binary alloy is identified based on the first thermodynamic parameter and the second thermodynamic parameter, wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase.

Abstract: The disclosure provides gold alloys. The alloys can have improved strength and hardness. The gold alloys can have various gold colors, including yellow gold and rose gold. The gold alloys can be used as enclosures for electronic devices.

Abstract: The present invention is directed to a reduced-cost 18K white gold alloy that is Ni-free, and otherwise contains a low w % of precious metals, including about 7 w % palladium, exhibits a color which is considered white, and shows age hardening characteristics commensurate with nickel containing 18 Karat gold alloys.

Abstract: A timepiece or piece of jewellery made of a nickel free and cobalt free gold alloy, the composition of which includes by weight between 75% and 77.5% gold, between 1.2 and 1.6% palladium, and between 20.1 and 23.8% copper.

Abstract: Compositions for forming Au-based bulk-solidifying amorphous alloys are provided. The Au-based bulk-solidifying amorphous alloys of the current invention are based on ternary Au—Cu—Si alloys, and the extension of this ternary system to higher order alloys by the addition of one or more alloying elements. Additional substitute elements are also provided, which allow for the tailoring of the physical properties of the Au-base bulk-solidifying amorphous alloys of the current invention.

Abstract: Metal alloys for dental porcelain fusing and dental prosthetic appliances are provided. The metal alloy includes: gold (Au) in an amount that is greater than 0 and equal to or smaller than 35 weight %; silver (Ag) in an amount of 5 to 35 weight %; indium (In) in an amount of 6 to 40 weight %; palladium (Pd) in an amount of 30 to 70 weight %; and at least one element selected from the group consisting of boron (B), germanium (Ge), zirconium (Zr), silicon (Si) and iron (Fe) in a total amount that is greater than 0 and equal to or smaller than 5.0 weight %.

Abstract: A porous catalyst layer formed from discrete particles of unsupported metal, wherein at least 80%, suitably at least 90%, of the discrete particles have a mass of from 1 to 1000 zeptograms, and wherein the catalyst layer has a metal volume fraction of less than 30% and a metal loading of less than 0.09 mg/cm2 is disclosed. The catalyst layer is suitable for use in fuel cells and other electrochemical applications.

Abstract: An electrode material capable of making more satisfactory the dispersion at the time of production and the aging property of a resonator than Au and capable of reducing the price as compared to Au. An resonator electrode material including a ternary alloy composed of Au and two metals M1 and M2, and being used as an excitation electrode to excite oscillation in a piezoelectric element, wherein the two metals M1 and M2 are, respectively, (a) metal M1: a metal exhibiting a tendency to decrease the temporal frequency property (?f1/f1) from the reference value f1, and (b) metal M2: a metal exhibiting a tendency to increase the temporal frequency property (?f1/f1) from the reference value f1. The metal M1 is preferably at least any one of Ag, Al and Ni, and the metal M2 is preferably at least any one of Pd, Ru, Pt, Ir, Rh and Cu.

Abstract: The present invention relates to a white gold alloy free of nickel and copper having a hardness that is suitable in particular for watchmakers and jewellers. Said alloy consists of (in wt %): more than 75% of Au; more than 18% to less than 24% of Pd; more than 1% to less than 6% of at least one element selected from among Mn, Hf, Nb, Pt, Ta, V, Zn and Zr; optionally, no more than 0.5% of at least one element selected from among Si, Ga and Ti; and optionally, no more than 0.2% of at least one element selected from among Ru, Ir and Re. The invention also relates to a method for preparing said alloy.

Abstract: A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.

Abstract: A near field transducer includes gold and at least one dopant. The dopant can include at least one of: Cu, Rh, Ru, Ag, Ta, Cr, Al, Zr, V, Pd, Ir, Co, W, Ti, Mg, Fe, or Mo. The dopant concentration may be in a range from 0.5% and 30%. The dopant can be a nanoparticle oxide of V, Zr, Mg, Ca, Al, Ti, Si, Ce, Y, Ta, W, or Th, or a nitride of Ta, Al, Ti, Si, In, Fe, Zr, Cu, W or B.

Abstract: A sliding contact material containing 40 to 60% by weight of Au, 15 to 25% by weight of Pd, and Sn and In as essential elements, the total amount of Sn and In being 1 to 4% by weight and the balance being Ag, and a sliding contact material containing 40 to 60% by weight of Au, 15 to 25% by weight of Pd, and Zn, the amount of Zn being 0.1 to 5% by weight and the balance being Ag. The sliding contact material is insusceptible to the interaction with grease essential for the use of such contact materials, and has stable contact resistance, and therefore can be used for a long time.

Abstract: [Issues to be Solved] Second bonding failures caused by attached oxide of additive elements on high purity Au bonding wire are to be resolved. [Solution Means] Au alloy bonding wires comprising: 5-100 wt ppm Mg, 5-20 wt ppm In, 5-20 wt ppm Al, 5-20 wt ppm Yb, and residual Au of 99.995 wt % purity or higher, and adding 5-20 wt ppm Ca, and for these alloys adding at least one element among 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, 5-100 wt ppm Sr to the alloy, and/or, moreover, adding 0.01-1.2 wt % Pd to these alloys. Bonding wire, which contains these trace additive elements do not cause a disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding on the tip of the capillary, transferring to the wire at second bonding.

Abstract: There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.

Abstract: A nickel-free white gold alloy composition having selectively reversible hardness characteristics between its annealed- and aged-hardness values, consists essentially of: about 55–60% gold; about 6.0–10.0% palladium; about 5.0–12.0% copper; about 0.1–2.0% zinc; and about 20–30% silver. A 14-karat nickel-free white gold alloy composition, consists essentially of: about 58.5% gold; about 25.0–27.15% silver; about 6.0% palladium; about 5.0–12.0% copper; about 0–2.0% zinc; about 0–0.2% cobalt; about 0–0.005% iridium; and about 0–0.01% lithium.

Abstract: A gold (Au) alloy bonding wire for a semiconductor device is provided. The Au alloy bonding wire is manufactured by adding at least one of polonium (Po), promethium (Pm), thulium (Tm), and boron (B) to high-purity gold of 99.999% or more in an amount of 3–30 parts per million (ppm) by weight and at least one of magnesium (Mg), sodium (Na), vanadium (V), molybdenum (Mo), and technetium (Tc) in an amount of 3–30 ppm by weight to the high-purity gold. In the Au alloy bonding wire, high-temperature reliability after ball bonding is not reduced and damage near a ball neck in forming an ultra low loop of the Au alloy bonding wire can be prevented.

Abstract: A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted of gadolinium Gd only, or gadolinium Gd and at least one element selected from the group consisting of rare-earth elements other than Gd, alkaline-earth elements, silicon Si, aluminum Al, and boron B.

Abstract: An alloy is provided for dental porcelain fused to metal restorations, having a rich gold color and light oxide coating for bonding the porcelain to the cast alloy substrate. The alloy has suitable mechanical properties for the support of the porcelain and is readily polished to a bright sheen. The alloy includes from 96 to 98 weight % Au with up to 3 weight % Pt, Pd, Ru, Ir, or combinations thereof and 0 to 1.5 wt % In, Sn, Fe, Mn, Cu, B, or combinations thereof.

Abstract: A nickel-free white gold alloy comprises, expressed by weight, in addition to between 75% and 76% Au and between 5% and 14% Pd, between 7% and 17% of Cu, the proportion of Cu being approximately inversely proportional to that of Pd, and the balance being formed by at least one of the elements Ir, In, Ag, Zn, Ga, Re, Zr, Nb, Si, Ta and Ti.

Abstract: A decorative article with a whitish gold color that can retain an exceptionally beautiful appearance over a long period of time, a surface processing method manufacturing such decorative articles, and a timepiece having such decorative parts. The surface processing method includes forming a primary coat on at least part of a surface of base material, and forming a film composed of an Au—Pd—Fe—In alloy containing about 0.1 to about 10 wt % Pd, about 0.1 to about 8 wt % Fe, and about 0.1 to about 10.0 wt % In using a dry plating method. The primary coat preferably is, or includes, a buffer layer for buffering the potential difference between the base material and the film. The film is preferably formed in a dry plating method using multiple targets of different metal compositions.

Abstract: A nickel-free white gold alloy comprises, expressed by weight, in addition to between 75% and 76% Au and between 5% and 14% Pd, between 7% and 17% of Cu, the proportion of Cu being approximately inversely proportional to that of Pd, and the balance being formed by at least one of the elements Ir, In, Ag, Zn, Ga, Re, Zr, Nb, Si, Ta and Ti.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: A process of producing a gold decorative item, including, sequentially producing an alloy of gold, silver, copper and zinc, forming the gold alloy into a specific shape according to the design of the decorative item and polishing the surface of the decorative item so formed, submerging the decorative item in an acid solution and etching its surface to form a scale pattern, submerging the decorative item in an alkaline solution removing unwanted substances formed on the surface during etching.

Abstract: A nickel-free white gold alloy comprises, expressed by weight, in addition to between 75% and 76% Au and between 5% and 14% Pd, between 7% and 17% of Cu, the proportion of Cu being approximately inversely proportional to that of Pd, and the balance being formed by at least one of the elements Ir, In, Ag, Zn, Ga, Re, Zr, Nb, Si, Ta and Ti.

Abstract: The invention relates to a composition and a process for the reactive brazing of ceramic materials containing alumina. This composition comprises at least one precious metal chosen from among Pd, Pt and Au, as well as magnesium, preferably at the most 5 wt. % magnesium. Brazing takes place at a temperature of 1300 to 1600° C., in the absence of hydrogen.

Abstract: A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.

Abstract: The present invention provides a gold alloy thin wire for semiconductor devices, which inhibits corrosion after heating and which improves long term reliability, in portions bonded to the aluminum electrodes. The gold alloy thin wires of the present invention comprise the following group elements. (1) The gold alloy thin wire contains, as basic alloying components, 0.005 to 0.3% by weight of Mn and 0.005 to 1.0% by weight of Pd. (2) A gold alloy thin wire further contains at least one element selected from Pt, Ag and Cu in a total amount of 0.01 to 1.0% by weight in addition to the basic alloying components mentioned above. (3) A gold alloy thin wire further contains at least one element selected from Ca, Be, In and rare earth elements in a total amount of 0.0005 to 0.05% by weight in addition to the components in (1) or (2).

Abstract: A gold alloy wire in which 0.2 to 5.0% by weight of palladium (Pd) and 1 to 100 ppm by weight of bismuth (Bi) are added to gold having a purity of at least 99.99% by weight. Preferably, at least one element selected from the group consisting of yttrium (Y), lanthanum (La), calcium (Ca) and beryllium (Be) in an amount of 3 to 250 ppm by weight is further added to said gold. The gold alloy wire is especially adapted to forming a gold bump.

Abstract: A silverless gold alloy for dental prosthesis comprising 60-70 wt. % gold, 20-30 wt. % palladium, 0-1 wt. % of ruthenium, iridium, rhenium or of a combination thereof, as grain refiner, and the balance to 100 wt. % being indium and gallium.

Abstract: Fine wires of a gold alloy of 0.05 to 0.95 wt % platinum, palladium or a mixture thereof; 0.001 to 0.1 wt % mischmetal containing at least 50 wt. % of cerium; and 0 to 0.1 wt % of alkaline earth metal. The wire has a favorable strength-to-elongation ratio and is suitable both for wire bonding and for making the ball bumps of flip chips.

Abstract: To provide a gold alloy thin wire advantageously applicable to high density packaging of semiconductor devices, in which the wire deformation upon resin molding is reduced to successfully achieve reduction in the bonding pitch and the wire diameter, a gold alloy thin wire according to the present invention consists of 0.015 to 1.0 wt % Cu, 0.0002 to 0.02 wt % Ca, and the balance consisting of Au and unavoidable impurities. Preferably, the Cu content is 0.1 to 1.0 wt % and the Ca content is 0.001 to 0.02 wt %, and more preferably, Cu and Ca are present in a weight content ratio Cu/Ca of from 40 to 800. The gold alloy thin wire further preferably contains one or more of Pt, Pd and In in a total amount of from 0.01 to 3.0 wt % and/or one or more of Y, La, and Ce in a total amount of from 0.0003 to 0.03 wt %.

Abstract: The present invention relates to an alloy for bonding wire used to connect a semiconductor chip and a lead frame and, more particularly, to a gold-based alloy for bonding wire of a semiconductor device which is excellent in the strengths at room temperature and under hot conditions after bonding, capable of controlling the ball size to be smaller in bonding, and preventive of a short between wires, the gold-based alloy for bonding wire of a semiconductor device being characterized by containing 0.5 to 5.0 wt. % of Pd, 5 to 50 wt.PPM of Ba, each 1 to 10 wt.PPM of at least one selected from the group consisting of Be and Ca, and Au for the rest, thereby having excellent strengths at room temperature and under hot conditions after bonding, controlling the size of a ball smaller, and preventing a short between wires.

Abstract: A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile strength of not less than 33.0 kg/mm.sup.2 and an elongation of 1 to 3%. The gold alloy wire has a gold purity of not less than 99.9% or further comprises 0.2 to 5.0% by weight of at least one element selected from the group consisting of Pd, Ag and Pt.

Abstract: A dental alloy is provided for use in porcelain-fused-to-metal dental restorations, which has an excellent oxide color and which can be cast and recast without deleterious effect, which comprises at least 99.5 wt. % gold, 0.1-0.25 wt. % zinc, 0.1-0.25 wt. % indium and 0-0.3 wt. % total of Rt, Pd, Rh, Ir, Re or combinations thereof.

Abstract: A hardenable white gold alloy consists essentially of about 55-60 % gold, about 12-20% silver, about 8-15% copper, about 8-18% palladium, about 0.0-1.0% tin, zinc indium or cobalt, and, optionally, about 0.005-0.02% iridium and/or ruthenium, and also about 0.01-0.03 weight percent lithium. The alloy is nickel-free, but has a pleasing white color similar to that of nickel-containing white gold alloys. The alloy has a fine grain structure, a lower hardness in its annealed condition, but is capable of being hardened to an exceptional hardness value. The hardening procedure is reversible.

Abstract: Sliding contacts comprising alloys such as Pd/Cu/Ag, Pt/Cu/Ag, Pd/Cu/Ag/Ni, Pt/Cu/Ag/Ni, Ag/Pd/Cu,Au, Ag/Pt/Cu/Au and two-layered composites comprising a surface layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy. Also, three-layered composites comprising a surface layer of one of the foregoing alloys, an intermediate layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy as well as direct current motors comprising commutators comprising a three-layered composite.

Abstract: An electrical conductor for a spacecraft solar generator with at least one solar module, wherein the electrical conductor is made of an alloy containing gold and traces of at least one of silver, palladium or copper and which can be used as a solar cell connector. The electrical conductor advantageously cannot be oxidized by atomic oxygen, has a high hardness and elasticity and can thus withstand high thermal stresses. Furthermore, the electrical conductor can be processed by resistance welding without damaging the cell.

Abstract: Gold-palladium alloys with a high gold content for dental applications should, for reasons of biocompatibility, not contain any toxically dubious components. For particularly corrosion-resistant and biocompatible Type 4 alloys, tin is needed as the only base-metal component in amounts between 0.7 and 5.8 wt % if one remains within defined limits in a palladium-tin diagram of FIG. 1, for Pt values less than 2%. Such alloys contain, in addition to gold and tin, 6 to 25 wt % palladium, 0 to 12 wt % platinum and 0 to 2 wt % of at least one of iridium, rhodium and/or ruthenium.

Abstract: A ceramic superconductive material (1) including a compound containing oxygen and at least two types of metal elements and having layer structure is molten in a vessel (2), at least an inner surface (3) of which is formed of a solid solution alloy having a base of gold or silver. Preferably the alloy is prepared from Au--5 to 40 wt. % Pd or Ag--5 to 40 wt. % Pd.

Abstract: A ring setting is made from a nickel-free palladium white gold alloy that contains 7-12% by weight palladium; 50-65% by weight gold; 25-32% by weight silver; and 1-5% by weight zinc. Such ring settings are resistant to chemical or stress corrosion cracking.

Abstract: A dental alloy is provided which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870.degree. C. and 1230.degree. C. and a coefficient of thermal expansion of between 15.5.times.10.sup.-6 and 17.5.times.10.sup.-6 in/in/.degree. C. when heated from room temperature to 500.degree. C. The alloy contains between one and 85 percent by weight gold, between two and 65 percent by weight of a thermal expansion adjuster, between 0.25 and 34 percent by weight of a strengthener and oxide former, up to about one percent by weight grain refiner, and up to about 0.25 percent by weight deoxidizer.

Abstract: A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the wire is characterized as having a tensile strength exceeded when the wire is further elongated in length in a range of 0.5% to 3.5% of its original length by breaking of the wire during tension testing. It has been determined that an insulated bonding fine wire exhibiting such relatively low ductility produces a loop profile maintainable in a stable condition during a bonding operation while providing reliable bonding strength.

Abstract: A white gold alloy composition consisting essentially of about 35 to 50 weight percent of gold, about 35 to 63 weight percent of silver, about 0.1 to 7 weight percent of a whitening component of zinc, germanium or both, and palladium in an amount of about 9 weight percent or less. The whitening component and the palladium are present in an amount sufficient to impart a white gold appearance and a liquidus temperature of no greater than about 1950.degree. F. to the alloy, preferably between about 1700.degree. and 1900.degree. F., and more preferably less than about 1850.degree. F. Thus, the preferred amount of palladium is about 2 to 5 weight percent and the preferred amount of the whitening component is about 0.5 to 6 weight percent.

Abstract: Bonding wire for a semiconductor device contains high purity Au or Au alloy as a base metal and 25-10000 atppm of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au, or contains high purity Au or Au alloy as a base metal and 5-500 atppm of low boiling point element II having a boiling point lower than a melting point of the base metal and insoluble in Au, or contains high purity Au or Au alloy as a base metal and 5-10000 atppm of a mixture of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au and low boiling point element II having a boiling point lower than the melting point of the base metal and insoluble in Au under the condition of (content of the low boiling point element I)/25+(content of the low boiling point element II)/5.gtoreq.1.gtoreq.(content of the low boiling point element I)/10000+(content of the low boiling point element II)/500.

Abstract: A brazing alloy in accordance with this invention has the following composition, by weight: 91 to 99 gold, 0.5 to 7% nickel; 0.10 to 2% titanium. Alternatively, with palladium present, the composition is as follows, by weight: 83 to 96% gold; 3 to 10% palladium; 0.5 to 5% nickel; 0.10 to 2% titanium.