Tin Containing Patents (Class 420/524)
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Publication number: 20140234158Abstract: Disclosed is a pipe made of an iron-base material, having a corrosion prevention layer formed on the surface thereof. The corrosion prevention layer includes a Zn—Sn sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass and the balance composed of Zn. Alternatively, the corrosion prevention layer includes a Zn—Sn—Mg sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass, Mg in a content of more than 0.01% by mass and less than 5% by mass and the balance composed of Zn. Preferably, the sprayed coating of the corrosion prevention layer includes at least any one of Ti, Co, Ni and P, and the content of each of these elements is more than 0.001% by mass and less than 3% by mass.Type: ApplicationFiled: April 30, 2014Publication date: August 21, 2014Applicant: Kubota CorporationInventors: Hiroaki Shimizu, Goro Funahashi, Hiroaki Fujii
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Publication number: 20140234654Abstract: The invention relates to a thermal spraying material (5) for the coating of a surface of a workpiece by means of a thermal spraying method, wherein the spraying material (5) contains zinc. The invention further relates to a thermal spraying method and to a thermally sprayed coating sprayed with the material (5).Type: ApplicationFiled: January 13, 2014Publication date: August 21, 2014Applicant: Sulzer Metco AGInventors: Arno Refke, Gerard Barbezat, Jacobus Cornelis Doesburg
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Publication number: 20130098691Abstract: Implementations of the present invention include a binder with high hardness and tensile strength that allows for the creation of drilling tools with increased wear resistance. In particular, one or more implementations include a binder having about 5 to about 50 weight % of nickel, about 35 to about 60 weight % of zinc, and about 0.5 to about 35 weight % of tin. Implementations of the present invention also include drilling tools, such as reamers and drill bits, formed from such binders.Type: ApplicationFiled: October 25, 2011Publication date: April 25, 2013Applicant: LONGYEAR TM, INC.Inventors: Cody A. Pearce, Christian M. Lambert
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Publication number: 20120321506Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.Type: ApplicationFiled: June 14, 2011Publication date: December 20, 2012Applicant: INGOT METAL COMPANY LIMITEDInventor: David SHORE
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Publication number: 20100193063Abstract: Disclosed is a pipe made of an iron-base material, having a corrosion prevention layer formed on the surface thereof. The corrosion prevention layer includes a Zn—Sn sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass and the balance composed of Zn. Alternatively, the corrosion prevention layer includes a Zn—Sn—Mg sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass, Mg in a content of more than 0.01% by mass and less than 5% by mass and the balance composed of Zn. Preferably, the sprayed coating of the corrosion prevention layer includes at least any one of Ti, Co, Ni and P, and the content of each of these elements is more than 0.001% by mass and less than 3% by mass.Type: ApplicationFiled: March 18, 2009Publication date: August 5, 2010Inventors: Hiroaki Shimizu, Goro Funahashi, Hiroaki Fujii
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Publication number: 20100136359Abstract: The present application discloses (i) a coating composition comprising a particulate zinc-based alloyed material, said material comprising 0.05-0.7% by weight of bismuth (Bi), the D50 of the particulate material being in the range of 2.5-30 ?m; (ii) a coated structure comprising a metal structure having a first coating of the zinc-containing coating composition applied onto at least a part of the metal structure in a dry film thickness of 5-100 ?m; and an outer coating applied onto said zinc-containing coating in a dry film thickness of 30-200 ?m; (iii) a particulate zinc-based alloyed material, wherein the material comprises 0.05-0.7% (w/w) of bismuth (Bi), and wherein the D50 of the particulate material is in the range of 2.Type: ApplicationFiled: April 11, 2008Publication date: June 3, 2010Applicants: Hempel A/S, UMICOREInventors: Claus Erik Weinell, Jeroen Van Den Bosch, Pascal Verbiest, Hellen Fiedler, Torben Schandel, Gert Simonsen
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Publication number: 20090246463Abstract: An electrode that is used for discharge surface treatment in which, with a compact molded from metal powders or a compact obtained by heating the molded compact as an electrode, pulsed electric discharge is generated between the electrode and a workpiece to form a film of an electrode material, or a film of substance that reacts with the electrode material on a surface of the workpiece by discharge energy. The electrode contains 90 weight percent or more of one of Zn powders, Sn powders, and Ni powders. By using such an electrode for discharge surface treatment, a Zn, Sn, or Ni film less likely to separate from the surface of the workpiece can be formed, and the film can be a phosphide or sulfide reaction film in lubricant containing phosphorus or sulfur.Type: ApplicationFiled: September 29, 2006Publication date: October 1, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Masao Akiyoshi, Akihiro Goto
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Patent number: 7220493Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.Type: GrantFiled: October 23, 2003Date of Patent: May 22, 2007Assignees: Koa Kabushiki Kaisha, Soldercoat Co., Ltd., Okabe Giken Co., Ltd.Inventors: Satoru Kobayashi, Kazuyuki Kato, Masahiro Sugiura, Saburo Okabe
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Publication number: 20040091385Abstract: The invention relates to ternary tin zinc alloy coatings 30-65 wt. % tin, 30-65 wt. % zinc and 0.1-15 wt. % metal from the following group as a third alloy component; iron, cobalt, nickel. Correspondingly, alloy coatings can be produced by means of electrolytic deposition from aqueous galvanic electroplating solutions which contain the components of the alloy in a dissolved form. The alloy coatings are characterised in that they have a particularly high resistance to corrosion and are particularly suitable as anti-corrosion protective coatings on iron-based materials.Type: ApplicationFiled: December 18, 2003Publication date: May 13, 2004Inventors: Klaus Leyendecker, G?uuml;nter Wirth, Klaus Reissmller, Steffen Dumke
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Patent number: 6673310Abstract: Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.Type: GrantFiled: December 28, 2000Date of Patent: January 6, 2004Assignee: Kabushiki Kaisha ToshibaInventors: Masahiro Tadauchi, Izuru Komatsu, Hiroshi Tateishi, Kouichi Teshima, Kazutaka Matsumoto, Tetsuji Hori
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Patent number: 6319617Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.Type: GrantFiled: August 18, 2000Date of Patent: November 20, 2001Assignee: Agere Systems Gaurdian Corp.Inventors: Sungho Jin, Guenther Wilhelm Kammlott, Hareesh Mavoori, Ainissa G Ramirez
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Patent number: 6280795Abstract: An alloy for galvanizing steel comprises, by weight, aluminum in the amount of at least 0.001% to 0.007%, preferably 0.002 to 0.004%, tin in the amount of at least 0.5% to a maximum of 2%, preferably at least 0.8%, and one of an element selected from the group consisting of vanadium in the amount of at least 0.02%, preferably 0.05% to 0.12%, titanium in the amount of at least 0.03%, preferably 0.06% to 0.10%, and both vanadium and titanium together in the amount of at least 0.02% vanadium and at least 0.01% titanium for a total of at least 0.03%, preferably 0.05% to 0.15%, the balance zinc containing up to 1.3 wt. % lead. In another embodiment, the alloy comprises, by weight, aluminum in the amount of at least 0.001%, tin in the amount of 0.5% to 2%, and vanadium and nickel together in the amount of at least 0.02% vanadium and at least 0.02% nickel to a maximum of 0.15% vanadium and nickel collectively. Titanium may be added in an amount, by weight, of at least 0.01% titanium to a collective maximum of 0.Type: GrantFiled: December 2, 1999Date of Patent: August 28, 2001Assignee: Cominco, Ltd.Inventors: John Zervoudis, Gary R. Adams, Victor M. Duarte, Michael Gilles, Richard Sokolowski
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Patent number: 6187116Abstract: This disclosure relates to an Sn-containing and/or Bi-containing zinc alloy for hot galvanizing steel, more particularly for component galvanizing. The alloy is composed of 1 to 5% by weight of Sn+Bi, 0 to saturation of Pb, 0.025 to 0.200% by weight of at least one of Ni, Cr or Mn, 0 to 0.030% by weight of at least one of Al, Ca and Mg, the remainder being zinc and unavoidable impurities.Type: GrantFiled: November 19, 1999Date of Patent: February 13, 2001Assignee: N.V. Union Minere S.A.Inventor: Michael Gilles
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Patent number: 6071359Abstract: Tin and zinc based shot for use as ammunition having a diameter of from 1.5 to 5.5 mm, containing, by weight, in addition to tin and the usual unavoidable contaminants, from 12 to 60% of zinc and from 0 to 5% of aluminum, but less than 0.1% of copper, less than 0.1% of iron, and less than 1% of lead.Type: GrantFiled: October 24, 1997Date of Patent: June 6, 2000Assignee: Grillo-Werke AGInventors: Jurgen Wisniewski, Jochen Spriestersbach
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Patent number: 5728349Abstract: A material primarily for sport-shooting ammunition, both pellet ammunition and ball ammunition, including at least the materials zinc and bismuth. The ammunition material includes above 55 percent by weight zinc and the remainder bismuth and tin, where the amount of tin present does not exceed about 10 percent by weight tin.Type: GrantFiled: October 20, 1995Date of Patent: March 17, 1998Inventor: Leif Persson
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Patent number: 5628933Abstract: Applicant has discovered that aliovalently doped zinc-indium-oxide where In is 40-75% of the metal elements can achieve electrical conductivity comparable to wide band-gap semiconductors presently in use while exhibiting enhanced transparency in both the visible and infrared. The material can be doped to resistivity of less than 1 milliohm-cm by small quantifies of aliovalent dopants, such as tetravalent atoms. It can be deposited on glass substrates in amorphous and polycrystalline films.Type: GrantFiled: March 26, 1996Date of Patent: May 13, 1997Assignee: Lucent Technologies Inc.Inventors: Sue A. Carter, Robert J. Cava, Jueinai R. Kwo, Julia M. Phillips, Gordon A. Thomas
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Patent number: 4451541Abstract: A zinc-based composition comprising from 0.01 to 5 percent lead and 0.01 to 20 percent tin, preferably minor amounts of chromium and/or titanium and/or nickel and with the balance being zinc is provided. A minor amount of copper may also be present. The composition is particularly useful for joining copper and copper alloys because it will wet and readily flow on the copper or copper alloy surfaces. It can be used with or without a flux. It has reduced dissolving action on the copper and copper alloys due to its reduced reactivity with them. It also has improved conductivity vis-a-vis conventional lead-tin and lead-tin-silver solders.Type: GrantFiled: January 7, 1983Date of Patent: May 29, 1984Assignee: Copper Development Association, Inc.Inventor: Roy E. Beal
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Patent number: 4439397Abstract: Process for adjusting the composition of a zinc alloy for the galvanization of steels, the alloy having a composition including the following components expressed in ppm (by weight): lead: 1,000 to 15,000, and as additives aluminium: 100 to 5,000, tin: 300 to 20,000, and magnesium: 10 to 1,000 and being deficient in at least one of said additives, said process comprising adding to the zinc alloy one or more metal compositions which are soluble in molten zinc and which contain a relatively high proportion of the additive in which the alloy is deficient, the amount of the or each metal composition being sufficient to compensate the deficit of the additive. The tin composition is virtually pure tin; the magnesium composition is a ternary alloy of zinc, magnesium (5,000 to 50,000 ppm) and aluminium (10 to 500 ppm); and the aluminium composition is a binary zinc/aluminium alloy containing about 5% of aluminium.Type: GrantFiled: March 23, 1982Date of Patent: March 27, 1984Inventor: Noel Dreulle
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Patent number: 4386051Abstract: A method for soldering aluminum or aluminum alloys is disclosed, together with an alloy useful in the method. The method includes heating, for example by using a torch, at least one aluminum piece to a temperature within the range of 90-150 degrees celsius, cleaning at least one heated surface thereof, for example by wire brushing, further heating the cleaned piece to a temperature within the range of 350-490 degrees celsius, and applying, for example by rub soldering, to the cleaned and further-heated piece a quantity sufficient to enable subsequent soldering, as required, of a tin/lead/zinc alloy consisting essentially of, by weight, from 1.7 to 2.2 percent aluminum, from 0.01 to 0.02 percent magnesium, from 45.9 to 50.4 percent zinc, from 14.2 to 34 percent tin, and from 16.6 to 36.7 percent lead.Type: GrantFiled: July 22, 1982Date of Patent: May 31, 1983Inventor: Robert E. Edgington