Abstract: An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content being effective quantity for forming a protective magnesium oxide film on the solder surface and also for destroying said oxide film during soldering. When solder paste is preserved, the inside of solder particle is protected by the protective magnesium oxide film formed on the surface of solder particle, and a reaction between zinc and an activator is suppressed, so that preservation stability is improved, and at elevated temperature during soldering, a state where said protective oxide film is easily destroyed is obtained, so that good wettability is held.

Abstract: A resin sealed IC has a plurality of external terminals. A metal thin film made of a Sn-Bi alloy is formed in direct contact with the surface of a base member of each external terminal. A Bi content in the Sn-Bi alloy layer is within a range of 0.5 to 6.0 wt %. Further, the Sn-Bi alloy layer has a single-layer plating structure, and the film thickness is within a range of 10 to 25 MIC.

Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, excellent overload characteristic and dielectric breakdown characteristic are attained, the insulation safety after an operation can be sufficiently assured, and a fuse element can be easily thinned. A fuse element having an alloy composition in which Sn is larger than 46% and 70% or smaller, Bi is 1% or larger and 12% or smaller, and In is 18% or larger and smaller than 48% is used.

Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20-60 &mgr;m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the soldering alloy, suppresses the generation of fine cracks at the soldered part and increases the mechanical strength of the soldered part. The Pb-free soldering alloy contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the balance.

Abstract: New and improved substantially lead-free solder compositions are provided exhibiting excellent wettability and mechanical properties. In an embodiment, an improved solder material is a substantially silver-free material including from about 0.5 to about 10% by weight of Zn, from about 0.5 to about 8% by weight of Bi, from about 0.005 to about 0.5% by weight of Ge, from about 0.3 to about 3% by weight of Cu and the balance to make 100% by weight of Sn. In another embodiment, an improved solder material includes from about 0.5 to 8% by weight of Bi, from about 0.5 to about 3% by weight of Ag, from about 0.01 to about 0.1% by weight of Ge, from about 0.3 to about 1% by weight of Cu, and the balance to make 100% by weight of Sn. In a further embodiment, an improved solder material includes from about 3 to about 15% by weight of Zn, from about 3 to about 10% by weight of In, from about 0.01 to about 0.3% by weight of Ge, from about 0.3 to about 3% by weight of Ag and the balance to make 100% by weight of Sn.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy which has a relatively low melting temperature and which is suitable for soldering electronic devices consists essentially of from 5 to 9 mass % of Zn, from 2 to 15 mass % of Bi, optionally from 0.001 to 1 mass % of P or from 0.001 to 0.1 mass % of Ge, and a balance of Sn. The solder alloy has a liquidus temperature of at most 220° C.

Abstract: A lead-free solder alloy which has a relatively low melting temperature and which is suitable for soldering electronic devices consists essentially of from 5 to 9 mass % of Zn, from 2 to 15 mass % of Bi, optionally from 0.001 to 1 mass % of P or from 0.001 to 0.1 mass % of Ge, and a balance of Sn. The solder alloy has a liquidus temperature of at most 220° C.

Abstract: A tin—silver soldering alloy comprising 3 to 4% by weight of silver, 5 to 10% by weight of bismuth, 0 to 5% by weight of indium, and 0.1 to 1.5% by weight of zinc, with the balance being tin.

Abstract: A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

Abstract: Disclosed is a high temperature, high performance lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, and antimony and having a liquidus temperature above 215° C. More particularly, several lead-free solder alloys are disclosed that comprise about (i) at least about 90% Sn, 0.2 to 5.0% Cu, 0.05 to 5.0% Bi; or (ii) at least about 75% Sn, 0.5 to 7.0% Cu, 0.05 to 18% Sb; or (iii) at least about 67% Sn, 3 to 15% Ag, 0.01 to 18% Sb; (iv) at least about 78% Sn, 0.8 to 7.0% Cu, 4 to 15% Ag; (v) at least about 96% Sn, and at least one of 0.01 to 2.0% Ni, and 0.01 to 2.0% Co; (vi) at least about 90% Sn, 0.05 to 5.0% Bi, and 0 to 5.0% Sb; and (vii) at least about 90% Sn, 0.2 to 0.9% Cu, and 0.1 to 5.0% Bi.

Abstract: A fuel filter having a formulation of a stable intermetallic compound of materials such as tin and antimony. The filter may have an integral porous structure or may be in the form of particles. It removes trace metal ions such as Ca and Na ions.

Abstract: A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.

Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Abstract: A lead-free solder composition comprising: 20 to 30 wt. % bismuth, 1.0 to 3.0 wt. % silver, 0.01 to 2.0 wt. % copper, 0.01 to 4.0 wt. % antimony and incidental impurities, the balance being tin.

Abstract: A solder comprising: between 87.2% and 89.5% tin; between 4.0% and 4.8% bismuth; between 3.5% and 4.5% indium; and between 3.0% and 3.5% silver.

Abstract: A solder ball having a diameter of 1.2 mm or less, a dispersion of a diameter distribution of 5% or less and sphericity of 0.95 or more, an area ratio of the maximum dendrite being 80% or less of a cross section including a center of the solder ball, comprises a first additional element of 0.5-8 mass% of Ag and/or 0.1-3 mass % of Cu, and 0.006-10 mass %, in total, of at least one second additional element selected from the group consisting of Bi, Ge, Ni, P, Mn, Au, Pd, Pt, S, In and Sb, the balance being substantially Sn. The solder ball is produced by a uniform droplet-spraying method comprising the steps of vibrating a melt of a solder alloy in a crucible under pressure to force the melt to drop through orifices of the crucible; permitting the melt dropping through the orifices to become spherical droplets in a non-oxidizing gas atmosphere; and rapidly solidifying them.

Abstract: The present invention relates to a soldering alloy composed mainly of Sn and free from lead, a toxic substance. Adding a small quantity of Ag to the soldering alloy can make the alloy structure fine, minimize structural changes of the alloy and increase its thermal fatigue resistance. Adding a small quantity of Bi to the soldering alloy lowers the melting point and improves the alloy's wettability. Further, adding a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.

Abstract: A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230° C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an Sn—Bi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an Sn—Zn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.

Abstract: A novel lead-free Sn—Bi based alloy having an improved wettability in comparison to conventional Sn—Bi based alloys, a melting point lower than 221° C., the eutectic point of an Sn—Ag alloy, and proper bonding and heat-resistant properties is provided. This alloy is an Sn—Bi based alloy containing tin as a major component, and 21 wt.% or less bismuth, 4 wt.% or less silver, 2 wt.% or less copper (inclusive of zero), and 0.2 wt.% or less nickel.

Abstract: A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.

Abstract: Variable melting point solders and brazes having compositions comprising a metal or metal alloy powder having a low melting point with a metal powder having a higher melting point. Upon heating, in-situ alloying occurs between the low and high melting point powders such that solidification occurs at the solder or braze temperature thus creating a new, higher solidus (or melting) temperature with little or no intermetallic formation. A solder comprising Sn powder mixed with a Sn—Bi eutectic powder having a composition of 63 wt % Sn, 57 wt % Bi such that the bulk composition of the mixture is 3 wt % BS has an initial melting point of 140° C. and a re-melt temperature of 220° C. after heating due to in-situ alloying. A composition of Pb powder mixed with a Pb—Sn eutectic powder having a composition of 62 wt % Sn:58 wt % Pb such that the bulk composition of the mixture is 15 wt % Sn has an initial melting point of 183° C. and a re-melt temperature of 250° C.

Abstract: A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400° C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: A tin-silver-based soldering alloy, comprises 3.0 to 4.0% by weight of Ag, 6.05 to 10.0% by weight of In, 2.0 to 5.95% by weight of Bi, and the balance being Sn, wherein In+Bi≦12.0% by weight.

Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Abstract: A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

Abstract: A lead-free solder composition having superior mechanical strength is produced by adding a rare earth element to a Sn—Ag alloy or a Sn—Ag—Bi—Cu alloy. The rare earth element is Sm, Gd, or a mixture of these elements with other rare earth elements.

Abstract: The invention provides a solder alloy of Sn, Sb, Ag and Cu, wherein the Sb is about 1.0-3.0 wt %; the Ag is about 1.0 wt % or more and about 2.0 wt % or less; the Cu is about 1.0 wt % or less; and the remainder is Sn. The solder alloy has a comparatively low Young's modulus and sufficient tensile characteristics. Therefore, it resists peeling from the bonded electrode, etc., even though a heat stress is added. Also, a solder which has an excellent solderbility to metal phases such as Cu and Ni can be provided. Therefore, a solder alloy excellent in thermal shock resistance can be provided. The solder alloy may be used for soldering the inside of an electronic component.

Abstract: An alloy comprising tin, antimony, bismuth and indium and a method for making the same is disclosed. The alloy is used in the hardware, jewelry, statuary, filigree, or other ornament casting art. A preferred embodiment of the alloy comprises 97% by weight tin, 1% by weight antimony, 1% by weight bismuth, and 1% by weight indium.

Abstract: This invention provides a lead-free high temperature solder material comprising 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn) whose liquidus temperature is 200-350° C. The solder material is environmentally-friendly, improved in thermal fatigue property, and it can improve the reliability of electronic apparatuses. A predetermined amount of Sn material and Pd is mixed, vacuum-melted and cast to prepare an ingot. The ingot is rolled to be a tape that is later pressed to obtain a solder pellet. In a preferable composition, at least 95 wt % of Sn and 0.005-3.0 wt 5 of Pd are contained, and 0.1-5.0 wt % of metallic (e.g. Cu, Ni) or alloy particles are added. The average particle diameter is about 40 &mgr;m. A substrate and an IC chip (electronic element) are die-bonded substantially in parallel by a solder material provided between an Ni plating on the lower side of an IC chip (semiconductor) and an Ni plating on a die.

Abstract: A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than about 50 wt % In; optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P; and Sn. Also, lead-free solder powders containing same, and printed circuit boards, electronic components and electronic apparati employing such alloy.

Abstract: There is provided a soldered article comprising a component having a Cu conductor joined with a solder, wherein the solder comprises about 0.1 to 2.0% by weight of Cu, about 1.0 to 7.5% by weight of Bi, and the balance being Sn. By using the above described lead-free solder, the occurrence of leaching is suppressed during soldering, and the solderability and joining strength can be improved. Since the solder does not contain Ag, material cost can be reduced, thus enabling reductions in the cost of the entire soldered article.

Abstract: A solder alloy which is lead free, consists essentially of, in weight %: Sn; 0<Ag≦4.0; 0<Cu≦2.0; 0<Ni≦1.0; and 0<Ge≦1.0, wherein addition of Ni and Ge to the solder alloy enhances wettability and tensile strength, and prevents formation of an oxide film. Additionally, a solder alloy which is lead free, consists essentially of, in weight %: Sn; 0<Sb≦3.5; 0≦Ag ≦4.0; 0<Ge≦1.0; and at least one first additive selected from the group consisting of (a) 0<Ni≦1.0 and (b) a combination of 0<Ni≦1.0 and 0<Cu≦1.0; wherein addition of Ni and Ge to the solder alloy enhances wettability and tensile strength, and prevents formation of an oxide film.

Abstract: Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0.1 or less % by weight. In the second composition, silver is present in the amount of 5% by weight or less and antimony is present in the amount of 5% by weight or less in addition to 0.1% by weight or less of germanium of silver. In the third composition, nickel and copper are included, preferably 0.2 or less % by weight or less of nickel and 1% by weight of copper. In the fourth composition, at least one selected from the group of 5 or less % by weight of silver, 5 or less % by weight of antimony, and 0.1 or less % by weight of germanium in addition to 0.2 or less % by weight of nickel and 1 or less % by weight of copper.

Abstract: A lead-free solder contains nickel, silver and tin. A soldered article is a workpiece containing a transition metal conductor capable of readily diffusing into melted tin; and the lead-free solder; wherein the lead-free solder is applied and bonded to the workpiece so as to be electrically and mechanically bonded to the transition metal conductor. The lead-free solder and soldered article barely cause electrode erosion during soldering or during aging after soldering, and have high tensile strength and thermal impact resistance.

Abstract: A lead-free tin alloy for solder joints comprising up to 0.25% by weight of indium and a grain refiner which is an alloy consisting of, by weight, 2.5 to 10% aluminium, 1 to 5% magnesium and balance zinc. The alloys have improved mechanical properties, such as creep strength, and an improved thermal fatigue strength.

Abstract: The present invention provides a lead-free tin-silver-based soldering alloy which has a low melting point equal to alloy H without containing harmful lead, expensive In or the like, and has excellent mechanical characteristics, that is, a tensile strength, an elongation value and heat fatigue characteristic as compared with alloy H, and thus, is applicable to soldering work at a low temperature and can make products which have a high reliability and long useful life or durability. The lead-free tin-silver-based soldering alloy consists essentially of Ag: 2 to 4% by weight, Zn: 0.5 to 2% by weight, Bi: 2 to 6% by weight, and the balance being substantially Sn.

Abstract: A leadless alloy for soldering containing 0.1 to 5.0% bismuth, 0.1 to 5.0% silver, 0.1 to 3.0% antimony, 0.1 to 5.5% copper, 0.001 to 0.01% phosphorus, 0.01 to 0.1% germanium and 81.4 to 99.6% tin by weight.

Abstract: The present invention provides a soldering alloy which does not include harmful Pb or Cd and which has an excellent tensile strength, elongation value, and melting point property. The soldering alloy according to the present invention can thus solve the conventional environmental problems, set the soldering temperature at a low level to thereby restrict the thermal damage to a soldered portion, and prevent breaking of the soldering alloy due to a heat cycle, with an excellent tensile strength and elongation value. A tin-silver-based soldering alloy according to the present invention consist essentially of 3 to 4% by weight of Ag, 2 to 6% by weight of Bi, 2 to 6% by weight of In, and the balance being Sn.

Abstract: Provided is a lead-free solder for connecting LSI and parts on organic substrates, which can provide soldering at a maximum temperature of 220.degree.-230.degree. C. and which has a sufficient reliability in mechanical strength even at a high temperature of 150.degree. C. Also provided are electronic products prepared using this lead-free solder. The lead-free solder has a solder composition including 3-5% Zn and 10-23% Bi, the balance being Sn. Preferably, the solder composition is a composition (Sn, Zn, Bi) surrounded by lines connecting A and B, B and C and C and A, where A is (85, 5, 10 ), B is (72, 5, 23) and C is (76, 3, 21), of a ternary diagram having pure Sn, pure Zn and pure Bi at the vertices of an equilateral triangle. Through use of this solder, it is possible to solder parts, etc. on conventionally employed organic substrates at reflow temperatures equivalent to those for conventional Pb--Sn eutectic solders. The solder does not damage the environment, can be stably supplied and is low in cost.

Abstract: A method of manufacturing an electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 60-99% Sn, 0-40% Pb and 0-10% Ag. The additive powder metal is selected from the metal group comprising Sn, Pb, Ni, Cu, Ag, and Bi and mixtures thereof.

Abstract: The present invention relates to a soldering alloy composed mainly of Sn and free from lead which is a toxic substance. An addition of a small quantity of Ag to the soldering alloy can fine the alloy structure, minimize structural changes of the alloy and increase thermal fatigue resistance thereof. An addition of a small quantity of Bi to the soldering alloy lowers the melting point and improves the wettability thereof. Further, an addition of a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, an addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.

Abstract: A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.

Abstract: Electrical solder compositions (by weight percent) having between 91.5-96.5% Sn; 2-5% Ag; 0.1-3% Ni; and 0-2.9% Cu; and having a melting temperature 220.degree. C. or less. The solder compositions have microstructure with uniformly dispersed fine grains of Sn--Ni, Sn--Cu and Sn--Cu--Ni intermetallic phases that provide resistance to grain growth during thermal cycling.

Abstract: Lead-free alloys for use as solders for copper and copper alloys. In the alloys, tin (Sn) and bismuth are the basic components and either one or both of antimony (Sb) and zinc (Zn) may be added as major elements to yield a low melting temperature alloy, and small quantities of one or more of aluminum (Al), magnesium (Mg) and tellurium (Te) may be added as elements capable of improving a soldering characteristics and properties of alloy. In preferred embodiments, the alloys contain bismuth (Bi) in a range of 1.0-20 wt %, and one or more of antimony (Sb) in the range of 0.1-8.0 wt %, more preferably 0.1-3.0 wt %, zinc (Zn) in a range of 0.01-3.0 wt %, aluminum (Al) in a range of 0.01-3.0 wt %, magnesium (Mg) in a range of 0.01-3.0 wt %, and tellurium (Te) in a range of 0.01-3.0 wt %, the balance being tin (Sn).

Abstract: A lead-free soldering material for soldering wires of electronic parts is disclosed. The lead-free soldering material is composed of in weight %: 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn, and the soldering material shows a superior solderability.