Abstract: A continuous coating line includes a roll assembly exposed to molten metal. The roll assembly includes a roll rotatable relative to a bearing block. The roll includes a roll portion and a journal protruding from each end of the roll portion. The roll is made from a refractory ceramic material that is resistant to wear, abrasion, and corrosion when the roll is exposed to the molten metal.

Abstract: Metallization pastes for use with semiconductor devices are disclosed. The pastes contain silver particles, low-melting-point base-metal particles, organic vehicle, and optional crystallizing agents. Specific formulations have been developed that produce stratified metal films that contain less silver than conventional pastes and that have high peel strengths. Such pastes can be used to make high contact resistance metallization layers on silicon.

Abstract: A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.

Abstract: According to an embodiment, a thermoelectric conversion material is made of a polycrystalline material which is represented by a composition formula (1) shown below and has a MgAgAs type crystal structure. The polycrystalline material includes a MgAgAs type crystal grain having regions of different Ti concentrations. (AaTib)cDdXe??Composition formula (1) wherein 0.2?a?0.7, 0.3?b?0.8, a+b=1, 0.93?c?1.08, and 0.93?e?1.08 hold when d=1; A is at least one element selected from the group consisting of Zr and Hf, D is at least one element selected from the group consisting of Ni, Co, and Fe, and X is at least one element selected from the group consisting of Sn and Sb.

Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.

Abstract: Provided is a super elastic alloy for biological use having a high biocompatibility, good processability and super elasticity, said super elastic alloy being a super elastic zirconium alloy for biological use comprising 27-54 mol % inclusive of titanium, 5-9 mol % inclusive of niobium which is a ? phase-stabilizing element capable of stabilizing the ? phase of zirconium, and 1-4 mol % inclusive in total of tin and/or aluminum which are ? phase-suppressing elements capable of suppressing the ? phase of zirconium, with the balance consisting of zirconium and inevitable impurities.

Abstract: Disclosed is a pipe made of an iron-base material, having a corrosion prevention layer formed on the surface thereof. The corrosion prevention layer includes a Zn—Sn sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass and the balance composed of Zn. Alternatively, the corrosion prevention layer includes a Zn—Sn—Mg sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass, Mg in a content of more than 0.01% by mass and less than 5% by mass and the balance composed of Zn. Preferably, the sprayed coating of the corrosion prevention layer includes at least any one of Ti, Co, Ni and P, and the content of each of these elements is more than 0.001% by mass and less than 3% by mass.

Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

Abstract: A light emitting diode chip a support layer having a first face and a second face opposite the first face, a diode region on the first face of the support layer, and a bond pad on the second face of the support layer. The bond pad includes a gold-tin structure having a weight percentage of tin of 50% or more. The light emitting diode chip may include a plurality of active regions that are connected in electrical series on the light emitting diode chip.

Abstract: A negative electrode active material for an electric device includes an alloy containing Si in a range of greater than or equal to 27% by mass and less than 100% by mass, Sn in a range of greater than 0% by mass and less than or equal to 73% by mass, V in a range of greater than 0% by mass and less than or equal to 73% by mass, and inevitable impurities as a residue. The negative electrode active material can be obtained with, for example, a multi DC magnetron sputtering apparatus by use of Si, Sn, and V as targets. An electric device using the negative electrode active material can achieve long cycle life and ensure a high capacity and cycle durability.

Abstract: The negative electrode active material for an electric device of the present invention has an alloy containing Si in a range from 12% by mass or more to less than 100% by mass, Sn in a range from more than 0% by mass to 45% by mass or less, Al in a range from more than 0% by mass to 43% by mass or less, and indispensable impurities as remains. The negative electrode active material can be obtained, for example, using a multiple DC magnetron sputtering apparatus with Si, Sn and Al as targets. Electric devices to which the negative electrode active material of the present invention is applied have an improved cycle life and are excellent in the capacity and cycle durability.

Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

Abstract: The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.

Abstract: A tin-carbon compound that is a reaction product of tin and carbon, wherein the tin and the carbon form a single phase material that is meltable. The compound is one in which the carbon does not phase separate from the tin when the single phase material is heated to a melting temperature.

Abstract: Implementations of the present invention include a binder with high hardness and tensile strength that allows for the creation of drilling tools with increased wear resistance. In particular, one or more implementations include a binder having about 5 to about 50 weight % of nickel, about 35 to about 60 weight % of zinc, and about 0.5 to about 35 weight % of tin. Implementations of the present invention also include drilling tools, such as reamers and drill bits, formed from such binders.

Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

Abstract: A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

Abstract: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

Abstract: A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

Abstract: The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting point depressant metal, such that the solidus point of the solder composition is reduced to an initial solidus temperature. Said base metal or base metal alloy, alloyed with at least one melting point depressant metal is mixed with at least one additive metal or additive metal alloy. When heated to a process temperature above said initial solidus temperature, a reaction occurs between the melting point depressant metal, and the additive metal, such that solidification occurs at the process temperature via the formation of intermetallic phases, effectively increasing the solidus of the base metal, and of the overall solder.

Abstract: Micro-addition of a metal to a Sn-based lead-free C4 ball is employed to enhance reliability. Specifically, a metal having a low solubility in Sn is added in a small quantity corresponding to less than 1% in atomic concentration. Due to the low solubility of the added metal, fine precipitates are formed during solidification of the C4 ball, which act as nucleation sites for formation multiple grains in the solidified C4 ball. The fine precipitates also inhibit rapid grain growth by plugging grain boundaries and act as agents for pinning dislocations in the C4 ball. The grain boundaries enable grain boundary sliding for mitigation of stress during thermal cycling of the semiconductor chip and the package on the C4 ball. Further, the fine precipitates prevent electromigration along the grain boundaries due to their pinned nature.

Abstract: A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.

Abstract: A palladium-dominated dental alloy, in particular a ceramic-bonding dental alloy for the manufacture of dental prostheses such as crowns, bridges, inlays, or onlays, containing at least gold, palladium, and silver, as well as a grain-growth inhibitor in the form of ruthenium. In order to achieve a fine-grained separation without the formation of agglomerates to obtain a dental alloy with high mechanical stability and excellent polishing characteristics, it is proposed that the dental alloy contain—in addition to ruthenium as grain-growth inhibitor—at least one element of the group tantalum, niobium, yttrium, zirconium, chromium, and molybdenum as grain-refinement control element.

Abstract: A clathrate compound of formula (I): M8AxBy-x (I) wherein: M is an alkaline earth metal, a rare earth metal, an alkali metal, Cd, or a combination thereof, A is Ga, Al, In, Zn or a combination thereof; B is Ge, Si, Sn, Ni or a combination thereof; and 12?x?16, 40?y?43, x and y each is or is not an integer. Embodiments of the invention also include method of making and using the clathrate compound.

Abstract: Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.

Abstract: A first multi phase niobium silicide alloy composition consists essentially of: from 15 to 24 at % of Si; from 0 to 25 at % of one or more sp outer electron configuration element which is not Si; from 1 to 26 at % of one or more sd outer electron configuration element which is not Nb; and a balance of Nb, interstitials and impurities. This alloy may be used to increase the creep resistance of an article, for example a gas turbine engine blade. A second multi phase niobium silicide alloy composition consists essentially of: from 1 to 24 at % of Si; from 0 to 34 at % of one or more sp outer electron configuration element which is not Si; from 19.5 to 48.5 at % of one or more sd outer electron configuration element which is not Nb or Cr; from 0.5 to 9 at % Cr; and a balance of Nb, interstitials and impurities. This alloy may be used to increase the creep resistance and/or to increase the oxidation resistance of an article, for example a gas turbine engine blade.

Abstract: A sliding contact material containing 40 to 60% by weight of Au, 15 to 25% by weight of Pd, and Sn and In as essential elements, the total amount of Sn and In being 1 to 4% by weight and the balance being Ag, and a sliding contact material containing 40 to 60% by weight of Au, 15 to 25% by weight of Pd, and Zn, the amount of Zn being 0.1 to 5% by weight and the balance being Ag. The sliding contact material is insusceptible to the interaction with grease essential for the use of such contact materials, and has stable contact resistance, and therefore can be used for a long time.

Abstract: The present invention relates to a fusible alloy for pressure relief devices (PRDs), and the present invention provides a fusible alloy for PRD, the alloy comprising 29.0 to 33.0% by weight of Bi, 14.0 to 21.0% by weight of Sn, 2.0 to 5.0% by weight of In, and substantially Pb for the balance. The fusible alloy for PRD of the invention has a melting point appropriate for use according to the 110° C.-grade standards, and has excellent wettability upon melting.

Abstract: Non-toxic shot having 40-60% tungsten, 20-60% tin and 0-10% iron. A process of formulating the material is disclosed in which 95% by weight of the particles of each component having mesh sizes less than 325 are blended with a flux having 99.9% by weight particles less than 100 mesh. The blended material is then compaction formed into shape at a pressure range of between 20 and 40 tons per square inch. Finally, the blended material is sintered at a temperature in the range of 350 and 425° F. bonding the powdered metals and driving off the flux.

Abstract: Disclosed is a pipe made of an iron-base material, having a corrosion prevention layer formed on the surface thereof. The corrosion prevention layer includes a Zn—Sn sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass and the balance composed of Zn. Alternatively, the corrosion prevention layer includes a Zn—Sn—Mg sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass, Mg in a content of more than 0.01% by mass and less than 5% by mass and the balance composed of Zn. Preferably, the sprayed coating of the corrosion prevention layer includes at least any one of Ti, Co, Ni and P, and the content of each of these elements is more than 0.001% by mass and less than 3% by mass.

Abstract: The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided.

Abstract: The present invention relates to a magnesium aluminum alloy with enhanced creep resistance. The alloy contains barium and calcium in low proportions, and possesses a higher creep resistance in comparison to alloys containing rare earth elements. The alloy may additionally include zinc, tin, lithium, manganese, yttrium, neodymium, cerium and/or praseodymium in proportions of up to 7% by weight, respectively.

Abstract: A melting temperature adjustable metal thermal interface material (TIM) is provided. The metal TIM includes In, Bi, Sn, and Ga. A content of Ga ranges from 0.01 wt % to 3 wt %. The metal TIM has an initial melting temperature lower than 60° C. and has no element hazardous to the environment.

Abstract: The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn is subjected to heat treatment for five minutes to ten hours at 200° C. to 270° C., and subsequently the foil-form soldering metal is slit. Thus, the heat treatment of the Au—Sn soldering metal before slitting enables continuous slitting of the Au—Sn foil-form soldering metal in room temperature and facilitates the production of a ribbon-form soldering metal.

Abstract: A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum; either at least 0.01% or 0.01–10% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); either at least 0.5% or 0.5–10% by weight of an element or a mixture of elements selected from the group consisting of silver, copper, and indium; optionally either at least 0.01% or 0.01–1% by weight of gallium; and a remainder consisting of tin, lead, or of a mixture of tin and lead.

Abstract: The present invention discloses a white gold composition consisting essentially of copper, silver, zinc, and manganese, and further consisting of small amounts of tin, cobalt, silicon/copper and boron/copper. More particularly, the white gold composition of the present invention discloses a white gold composition consisting essentially of about 36% to about 57% copper, about 10% silver, about 18.2% to about 24.2% zinc, about 14% to about 28.9% manganese, and the balance further consisting of about 1% tin, about 0.025% to about 0.03% cobalt, about 0.52% silicon/copper, and about 0.2% boron/copper. An objective of the present invention is to provide for methods and compositions of casting, fabricating and soldering white gold that does not incorporate nickel or palladium. The present invention also discloses no tarnish results when hydrogen is used as a catalyst to all compositions.

Abstract: A fuel catalyst for improving combustion efficiency is provided that includes at least one hydride producing element, and at least one element of greater activity on the electrolytic scale than the hydride producing element and at least one element of lesser activity on the electrolytic scale than the hydride producing element. The hydride producing element preferably includes an element from at least one of a Group IV and Group V of the periodic table. The element of greater activity and the element of lesser activity preferably includes at least one of zinc, magnesium, aluminum, palladium, silver, copper and cerium. Preferred formulations of the catalyst element include: a) 20-60% wt antimony, 10-30% wt tin, 10-80% wt zinc and 1-5% wt silver; b) 40% wt antimony, 18 % wt tin, 40% wt zinc and 2% wt silver; c) 20-60% wt antimony, 10-30% wt tin, 20-80 % wt magnesium, 1-8% wt cerium and 0.1-1.0% wt palladium; d) 40% wt antimony, 25 % wt tin, 30% wt magnesium, 4.8% wt cerium and 0.

Abstract: A turbine component comprises a substrate; and a crystalline coating disposed on a surface of the substrate, wherein the crystalline coating comprises tin and yttrium in an amount greater than or equal to about 0.05 atomic percent based upon the total coating. A method of making a turbine component comprises disposing a coating composition on a substrate, wherein the coating composition comprises tin and yttrium in an amount greater than or equal to about 0.1 atomic percent based upon the total coating composition. A crystalline coating comprises tin and yttrium in an amount greater than or equal to about 0.05 atomic percent based upon the total coating.

Abstract: The invention relates to ternary tin zinc alloy coatings 30-65 wt. % tin, 30-65 wt. % zinc and 0.1-15 wt. % metal from the following group as a third alloy component; iron, cobalt, nickel. Correspondingly, alloy coatings can be produced by means of electrolytic deposition from aqueous galvanic electroplating solutions which contain the components of the alloy in a dissolved form. The alloy coatings are characterised in that they have a particularly high resistance to corrosion and are particularly suitable as anti-corrosion protective coatings on iron-based materials.

Abstract: The present invention concerns a non-precious dental alloy, including the following components, with the approximate proportions, in weight, given in %: gold, between 0.5 and 4, molybdenum, between 4 and 6, tungsten, between 2 and 7, indium, between 0.5 and 4, gallium, between 0.5 and 4, tin, between 0 and 4, titanium, between 0 and 2, copper, between 0 and 2, the remainder being obtained with a mixture containing approximately 70% cobalt and 30% chromium.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: A fuel catalyst for improving combustion efficiency is provided that includes at least one hydride producing element, and at least one element of greater activity on the electrolytic scale than the hydride producing element and at least one element of lesser activity on the electrolytic scale than the hydride producing element. The hydride producing element preferably includes an element from at least one of a Group IV and Group V of the periodic table. The element of greater activity and the element of lesser activity preferably includes at least one of zinc, magnesium, aluminum, palladium, silver, copper and cerium. Preferred formulations of the catalyst element include: a) 20-60% wt antimony, 10-30% wt tin, 10-80% wt zinc and 1-5% wt silver; b) 40% wt antimony, 18% wt tin, 40% wt zinc and 2% wt silver; c) 20-60% wt antimony, 10-30% wt tin, 20-80% wt magnesium, 1-8% wt cerium and 0.1-1.0% wt palladium; d) 40% wt antimony, 25 % wt tin, 30% wt magnesium, 4.8% wt cerium and 0.

Abstract: The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to promote bonding, and further contains sufficient Au and/or Ag to act as carriers for the rare earths. Because rare earths have some solid solubility in Au and Ag, the problem of intermetallic formation is lessened or eliminated, and improved bonding to oxide surfaces is attained.

Abstract: The present invention provides a non-stoichiometric alloy comprising a composition having the formula AB5+X an atomic ratio wherein A is selected from the group consisting of the rare earth metals, yttrium, mischmetal, or a combination thereof; B is nickel and tin, or nickel and tin and at least a third element selected from the group consisting of the elements in group IVA of the periodic table, aluminum, manganese, iron, cobalt, copper, antimony or a combination thereof; X is greater than 0 and less than or equal to about 2.0; and wherein at least one substituted A site is occupied by at least one of the B elements. An electrode incorporating said alloy and an electrochemical cell incorporating said electrode are also described.

Abstract: The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. The alloy proposed is characterized in that it contains at least 1% by wt. of an element or a mixture of elements from sub-group IVa and/or Va in the periodic table, at least 0.01% by wt. of an element or a mixture of elements from the lanthanide series; optionally at least 0.5% of silver or copper or indium or a mixture silver and/or copper and/or indium; and optionally at least 0.01% by wt. of gallium, the remainder consisting of tin or lead or a mixture of tin and lead plus, as applicable, the usual impurities. The alloy proposed can be used as solder in oxygen-containing atmospheres such as air, can be used at relatively low temperatures and efficiently wets normally difficult to wet surfaces such as ceramic surfaces.

Abstract: Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0.1 or less % by weight. In the second composition, silver is present in the amount of 5% by weight or less and antimony is present in the amount of 5% by weight or less in addition to 0.1% by weight or less of germanium of silver. In the third composition, nickel and copper are included, preferably 0.2 or less % by weight or less of nickel and 1% by weight of copper. In the fourth composition, at least one selected from the group of 5 or less % by weight of silver, 5 or less % by weight of antimony, and 0.1 or less % by weight of germanium in addition to 0.2 or less % by weight of nickel and 1 or less % by weight of copper.

Abstract: Tin and zinc based shot for use as ammunition having a diameter of from 1.5 to 5.5 mm, containing, by weight, in addition to tin and the usual unavoidable contaminants, from 12 to 60% of zinc and from 0 to 5% of aluminum, but less than 0.1% of copper, less than 0.1% of iron, and less than 1% of lead.

Abstract: Low temperature electrical solder compositions (by weight percent) having between 45-60% Sn; 25-40% Pb; 5-15% Bi; and 0.5-2.5% In. Preferably, the solder compositions have a melting temperature of about 154.degree.-162.degree. C. The solder compositions have microstructure similarly to Sn/Pb eutectic microstructure which makes them have excellent properties like higher yield strength and better creep resistance providing long term reliability to solder joints.

Abstract: Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133.degree.-167.degree. C. The solders are lead-free and have low melting points making them particularly useful for applications wherein components being joined involve thermoplastic substrates.

Abstract: Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.