Abstract: A manufacturing device for a synthetic resin hollow molded body molds a first split assembly member, a second split assembly member, and a third split assembly member by a first injection, and joints each of contact portions of the three members with a corresponding contact portion by a second injection. The manufacturing device includes an ejecting mechanism which moves the second split assembly member in a die opening/closing direction, a rotating mechanism which rotates the third split assembly member around a shaft center in the die opening/closing direction, and a sliding mechanism which slides the second split assembly member and the third split assembly member in a direction perpendicular to the die opening/closing direction.

Abstract: A method of manufacturing an overmolded trim component includes providing a first mold portion and a movable mold element. The movable mold element includes first and second mold surfaces positioned at a first angle with respect to one another. The movable mold element is then positioned into the first position to define a first cavity. A first material is then introduced into the first cavity, thereby forming a substrate. The substrate includes a first substrate surface is at a second angle with respect to a second substrate surface. The movable mold element is then positioned into the second position to define a second cavity. A second material is then introduced into the second cavity, thereby forming an overmolded trim component. The movable mold element is oriented at a third angle with respect to the first substrate surface and at a fourth angle with respect to the second substrate surface.

Abstract: An apparatus and related techniques for making a golf ball with deep dimples are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides deep dimples that extend through the cover layer and/or into a layer or component underneath are disclosed. At least one percent (1%), preferably about five percent (5%), of the dimples of the ball comprise deep dimples. The cover may be a single layer or include multiple layers. If the cover is a multi-layer cover, the dimples extend to or into at least the first inner cover layer, and may extend to or into two or more inner cover layers. If the cover is a single layer, the dimples extend to or into the core. The dimples may be spherical or non-spherical, and the portion of the dimple that extends to or into the next inner layer may be the same or different shape as the outer portion of the dimple.

Abstract: An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.

Abstract: Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.

Abstract: Resin or pitch is melted in a melt blender apparatus (11) and then loaded, into a heated jacketed holding tank (12). A pair of feed lines (14, 16) receives resin from the holding tank (12) and feeds an upper gear pump (15) and a lower gear pump (17). A mixing enhancement such as a static mixer (18, 19) is located in each of the feed lines (14, 16) between the gear pumps (15, 17) and the resin delivery ends (25, 26) of the feed lines. The resin-melt feed lines may be equipped with pressure indicators (27, 28, 32, 34) and pressure relief valves (23, 24). The resin-melt feed lines may also be equipped with pump accumulators (31, 33). Resin melt pressure created by the gear pumps (15, 17) forces a piston inside the accumulator back to the desired position. The accumulators (31, 33) can also be used to maintain constant pressure in the feed stock. Resin can be recycled from the accumulators (31, 33) into the melt blender (11).

Abstract: A process for the production by a moulding process of a micro-cellular or non-cellular elastomeric polyurethane skin layer or, more generally, to a process for the production of a composite comprising a first layer shaped part, which is made by a moulding process from a polyurethane reaction mixture, and a second layer shaped part which is adhered to the first part to form the composite. In order to avoid the use of release agents on the back side of the first layer shaped part, and thus the negative effect on the adhesion of the second layer shaped part, and the penetration of reaction mixture on this back side between the slides (9–10) of the mould, the mould surface (4) is covered on the back side of the moulding with a removable flexible covering (12), with a removable rigid pre-shaped covering or with a permanent non-stick coating layer.

Abstract: A first injection mechanism of an apparatus for molding articles injects coating material into a cavity defined in a clamped mold, thereby forming a predetermined coating on the inner surface of the cavity. After the coating material is injected into the cavity, a decompression mechanism lowers the pressure in the cavity through at least one vent. After the coating is formed on the inner surface of the cavity, a second injection mechanism injects molding material into the cavity. When the pressure in the cavity is being lowered, an opening-closing mechanism opens the vent. Before or during the injection of the molding material, the opening-closing mechanism closes the vent.

Abstract: Method and apparatus for manufacturing a synthetic resin-made hollow member incorporating an intermediate element are provided which enable operations of molding half bodies, abutting and joining the half bodies together, and molding an intermediate element in a series of steps, and which eliminate the necessity of such a manual work as may otherwise be required in incorporating the intermediate element into the half bodies. A pair of rotary injection molding dies are used which can be opened and closed relative to each other and are rotatable relative to each other over an angle of 60° for each turn, each die having a half body molding section including one male molding portion and two female molding portions in the direction of rotation for each rotational run over an angle of 120°, each die also having an intermediate element molding portion provided between specified half body molding portions in the direction of each rotational run over an angle of 120°.

Abstract: In the field of vacuum-assist-resin-transfer-mold (VARTM) processing, a new system is provided to lower production times and to create a high permeability mold cavity with reduced directionality to yield an optimum flow-front. The system comprises the use of a high permeability layer to evacuate air from the mold cavity and may include a reusable port-runner device for introduction of resin into the fiber mat. In the preferred embodiment, the high permeability layer is a “felt-like” material constructed of synthetic fibers, and the reusable port device is a flat, modular unit. In another embodiment, the high permeability layer is a fluid-impervious material with sporadic protrusions, and the reusable port-runner device is a flexible, silicone unit. Other embodiments are comprised of any combination thereof. Each embodiment is designed to minimize set-up times and to create a mold cavity with a low resistance to fluid flow through the application of pressure differentials.

Abstract: A form, fill and seal packaging machine for forming, filling and sealing a carton, molds a closure directly onto the carton. The machine includes a carton erection station adapted to receive a carton in a generally flat form and to erect the flat form carton into a tubular form defining an internal carton region. A direct injection molding station has an internal mold tool and an external mold tool. The internal mold tool is configured for receipt within the internal carton region and the internal mold tool and the external mold tool are configured to receive and clamp the carton therebetween. The direct injection molding station further includes a polymer injection system for injecting polymer from a location external of the carton to the internal mold tool. The closure is directly molded in place on the carton. A mold tool set, a method for carrying out the molding and a closure molded thereby are also disclosed.

Abstract: The present invention relates to a packaging mold with electrostatic discharge protection comprising a pot block and at least one receiver. The pot block comprises a plurality of pots and runners. Each of the pots branches and connects the runners for injecting molding compound into the runners through the pots. The receiver for supporting a plurality of substrate plates connects the runners for receiving the molding compound from the runners to package the dice on the substrate plates. Each receiver comprises a receiving surface contacting the substrate plate; wherein the receiving surface is roughened to reduce static electric charges generated when separating the substrate plates and the packaging mold. Additionally, the surfaces of the runners are roughened to reduce static electric charges generated in the runners when separating the molding compound and the runners. It prevents the dice packaged from damage due to static electric charges to raise the yield rate of semiconductor package products thereby.

Abstract: Apparatus for manufacturing a multicolor slide fastener includes an upper die 110, a lower die 120, and a plurality of unit fastening teeth-forming slots 101 formed in a lengthwise direction. Molding material-injecting passages and a plurality of sprue holes 102 are provided for injecting the molding materials S into the slots 101. Inclined passages 201 and 202 are connected to the molding material injecting passages respectively, for carrying the molding materials S from a raw material source. Heaters 240 and heat sensors 241 heat the passages 201 and 202. Pressing means 300 press the molding materials S into the inclined passages 201 and 202. Valves 400 control injection of the molding materials S into the sprue holes 102 of the upper die 110.

Abstract: There is provided an arrangement of a mold including a mold base (1), a cavity block (2) provided within the mold base (1), a heat insulating layer (5) provided between the mold base (1) and the cavity block (2), and a system of a flow passage (A) through which a heating medium and a cooling medium are alternately and repeatedly supplied, wherein a space is provided at a contact portion between the cavity block (2) and the mold base (1) based on anticipation of a thermal expansion of the cavity block (2). Further, the cavity block (2) may be arranged to have inlet and outlet slots communicating with the channel (A), and the inlet and outlet slots may be attached with conduits thermally insulated from the mold base (1).

Abstract: A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.

Abstract: A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.

Abstract: A covering or trim part includes an injection molding compound and a decor part durably connected with the molding compound. The decor part may contain a real-wood veneer as well as a metal part. The covering a trim part is made by combining an injection molding operation with a cutting operation of the decor part in the injection. A multi-part injection mold permits more complicated molding and undercutting and/or the forming of variable wall thicknesses.

Abstract: The present invention provides a molding system as well as a method for encapsulating semiconductor packages, wherein a cavity plate is kept at a desired temperature during molding. The system includes a mold comprising a first mold piece and a second mold piece adapted to define a mold cavity for enclosing one or more semiconductor devices for molding, and a cavity plate adapted for mounting in the cavity to introduce encapsulation material to the semiconductor device(s). The system also includes retaining means adapted selectively to hold the cavity plate against the first mold piece or the second mold piece whereby to maintain the cavity plate at the desired temperature.

Abstract: A method and apparatus for reducing or eliminating the formation of air pockets or voids in a flowable material provided in contact with at least one substrate. The flowable material is provided in a non-horizontal direction and flows from a lower portion to an upper portion. As a result, the flowable material is provided uniformly with a single, uniform flow front due to gravity acting thereon and gravity thereby substantially preventing voids and air pockets from forming in the flowable material. In one embodiment, the at least one substrate is provided in the cavity of a transfer mold in which the cavity is filled from a gate at a lower portion of the cavity to a vent at an upper portion of the cavity. In another embodiment, a bumped semiconductor device is attached to a substrate having a gap therebetween, in which the gap is oriented longitudinally perpendicular to a horizontal plane so that the flowable material may fill the gap in a vertical direction.

Abstract: An assembly for manufacturing carriers of information or decoration, characterised by a mould unit comprising two mould means which are joinable with each other. The mould unit comprises an injection moulding station for injection moulding of said carriers, and a printing station with a stamping unit for applying to said carrier a covering formed in accordance with the current information or decoration. The present invention also concerns a corresponding method.

Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.

Abstract: A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold has a recessed cavity for receiving the fixture therein, and adapted to be engaged with the top mold, wherein a resilient member is disposed on an inner wall of the recessed cavity, and interposed between the fixture and the recessed cavity of the bottom mold, allowing the resilient member to provide a resilient force for properly positioning the fixture. By using the above mold structure, chips mounted on a substrate can be firmly supported in the mold structure without causing chip cracks during a molding process for encapsulating the chips.

Abstract: The present invention is a mould and a method of moulding a plastic component using the mould that enable the manufacturer of a moulded component (45) which has an external covering. The method of moulding comprises either locating a pre-formed component (41) into a first part of the mould or vacuum forming a thin film (40) into a mould cavity. A first mould part (15) has a mould cavity into which the pre-formed component (41) is placed or the thin film (40) is vacuumed formed into. The method continues by partly closing a second part of the mould (25) into the first part of the mould (15) and injecting molten plastic (34) onto the surface of the pre-formed component (41) or thin film (40). The second mould part (25) is then fully closed to force the molten plastic (34) to fill the resultant mould cavity (36). This bonds the molten plastic to either the pre-formed component (41) or the thin film (40) to form the final shape of the moulded component (45).

Abstract: The invention relates to a device for the plastic sheathing of connections, which are produced by circular weld seams, of a pipeline comprising steel pipes which are provided with a factory-fitted plastic insulation and are reinsulated in the region of the circular weld seam by injection molding, having a split injection mold, which can be connected to an injection-molding fixture and, in the region of the weld seam, can be laid and secured, in the manner of a sleeve, around the steel pipes in such a manner that the injection mold in each case covers the end of the factory-fitted plastic insulation of the two steel pipes which have been welded together, the injection mold having an internal diameter, at least in the axial region between the factory-fitted plastic insulations, which corresponds to the external diameter of the plastic sheathing which is to be produced in the region of the weld seam and having an internal diameter, at its ends, which corresponds to the external diameter of the factory-fitted pla

Abstract: A device for impregnating an insulation of a winding bar of an electric machine includes a container accommodating the winding rod and connected to a tank containing an impregnation agent. The container, which remains open during the impregnation process, is surrounded by an evacuation container to create a negative pressure within the container. To achieve a more rapid penetration of the impregnation agent and to simplify the overall process, a vacuum-tight sleeve acts as the container, the sleeve being encompassed by a pressure-resistant sleeve, and a conduit of an assembly that generates a vacuum leads into the interior of the sleeve. The impregnation agent is supplied with a pressure that is lower than the prevailing pressure in the pressure-resistant sleeve. The container can be a multi-part tool defining an interior for surrounding and accommodating the winding bar in a positive fit at least during an evacuation and impregnation process.

Abstract: A die mold machine for molding a plurality of semiconductor assemblies on multiple substrate/leadframes includes a plurality of die mold layers stacked vertically one above the other to form a plurality of die mold sections. The top die mold layer has at least one aperture or die hall in the top most die layer and apertures or die halls in the in-between layers for passing molding compound which flows through the die hall in the top layer down through the die halls or apertures between the die mold layers into the die mold sections for molding semiconductor assemblies on said substrate/leadframes between said die mold layers.

Abstract: A resin infusion mold tool system for use in a vacuum assisted resin transfer molding process with a subsequent pressure bleed step. The mold tool system includes a mold assembly having an outer mold line tool connected to resin supply lines and supplying resin to the preform. A plurality of inner mold line tools form a hard interface with the inner mold line of the fiber preform and are held to within tight tolerances by an external locating fixture. Excess resin is drawn out of the fiber preform using a vacuum bag connected to vacuum lines and disposed over the inner mold line tools but not between the tools and the fiber preform. The mold assembly is placed in an autoclave, the resin supply lines are detached and the autoclave pressurized to bleed additional resin out of the preform to raise the fiber volume of the composite structure.

Abstract: A form, fill and seal packaging machine for forming, filling and sealing a carton, molds a closure directly onto the carton. The machine includes a carton erection station adapted to receive a carton in a generally flat form and to erect the flat form carton into a tubular form defining an internal carton region. A direct injection molding station has an internal mold tool and an external mold tool. The internal mold tool is configured for receipt within the internal carton region and the internal mold tool and the external mold tool are configured to receive and clamp the carton therebetween. The direct injection molding station further includes a polymer injection system for injecting polymer from a location external of the carton to the internal mold tool. The closure is directly molded in place on the carton. A mold tool set, a method for carrying out the molding and a closure molded thereby are also disclosed.

Abstract: Production device and method for producing fiber-reinforced plastic components comprising a semi-finished prepreg product and a dry semi-finished textile product with an aeration and deaeration chamber and an exhaust line opening into the same for producing a vacuum and a semi-finished textile product chamber to receive a dry semi-finished textile product. Into the semi-finished textile product chamber an injection line for inserting resin opens, whereby a prepreg chamber for receiving a semi-finished prepreg product is provided. The prepreg chamber is located against the aeration and deaeration chamber in an air-permeable manner and the semi-finished textile product chamber is located against it at least in areas in an air-impermeable and resin-permeable manner. Due to the air-permeable membranes, a vacuum in the aeration and deaeration chamber generates a vacuum both in the prepreg chamber and in the semi-finished textile product chamber.

Abstract: An apparatus and method for moulding opening devices onto a packaging material sheet at respective holes provided in the sheet includes first and second mould tools arrangeable in a closed position so as to be in contact with opposite sides of the sheet and in an open position so as to be positioned distally from the sheet. In the closed positions a mould cavity is formed between the first and second mould tools for accommodating a hole edge in the sheet. One of the mould tools includes a pair of half mould tools which are simultaneously moved from the open position to the closed position and vice versa such that the direction of movement of each of said half mould tools between the open and closed positions have a directional component extending substantially parallel to the extension plane and a directional component extending substantially perpendicularly to the extension plane, for reducing wear of the mould tools.

Abstract: A method for producing a multilayer molded article in which an skin material having nap on the outer surface thereof is integrally molded with a substrate of a synthetic resin, using a mold comprising a pair of male and female mold halves. In this method, after the fabric skin material and the molten resin are clamped in the mold and primary cooling is carried out, the mold is opened halfway to form a predetermined gap between the mold halves, and the molten synthetic resin undergoes secondary cooling and hardens while the mold is held in the half-open state. In the present invention, the time period for the operation to open the mold halfway is set at one second or less. By limiting the half-opening operation time period to the short period of one second or less, recovery of the nap is reliably achieved without the nap tending to stay flattened.

Abstract: A mould tool for use in resin transfer moulding operations is provided, the tool comprising one or more shape-defining portions which together define the shape of a component to be manufactured within the tool, and an inlet path for allowing resin to be injected into the mould tool. The mould tool further comprises at least one bleed cavity and a removable closure member, the closure member being capable of closing the bleed cavity and, in use, substantially sealing the bleed cavity to prevent fluid egress from the bleed cavity. A method of resin transfer moulding is also provided.

Abstract: The disclosure relates to a tool (1a, 1b, 2) for injection moulding of an opening arrangement (20) of plastic in a hole in a packaging material (9), the hole defining a hole edge (8) and the tool displaying a mould cavity (7) which surrounds the hole edge (8) together with a part of a first side (9a), as well as a part of a second side (9b) of the packaging material in connection with the hole edge, the mould cavity (7) displaying an inlet (10) for molten plastic and, opposing the inlet, an end gap (11) for the extension of the packaging material (9) out of the tool, the inlet (10) displaying a deflection from a first flow direction (F1) in a flow gap (5) to a second flow direction (F2) into the mould cavity (7). According to the invention, the tool (1a, 1b) displays, at said inlet (10), a throttle lip (12) which projects in a direction which substantially coincides with said first flow direction (F1).

Abstract: A method of manufacturing a roller includes: forming a hollow cylindrical body that includes a fully solidified outer peripheral surface and a semi-solidified interior, with an inner peripheral surface swelling inwardly; and pressing the swollen portion of the inner peripheral surface outwardly by pulling an insert die from the semi-solidified cylindrical body, to thereby allow the outer periphery of the cylindrical body to swell outwardly in a barrel-like manner. A primary molded product including a through hole along a central axis is thereby formed, and a secondary resin is injected into the through hole of the primary molded product.

Abstract: A molding die includes an upper die, upper-die pins arranged in the upper die to be movable up and down, springs arranged in the upper die to urge the upper-die pins downwardly, a lower die, lower-die pins arranged in the lower die to be movable up and down and springs arranged in the die to urge the pins upwardly. In molding, a hollow primary molded piece is accommodated in a cavity defined by the upper die and the lower die. Then, the piece is mounted on the pins with retained apart from a concave bottom surface of the lower die. Before closing the molding die, it is started to inject molten resin into the cavity. As a result, the molten resin enters a space between the primary molded piece and the concave bottom surface of the lower die. Even after completing to close the molding die, the injection of the molten resin is continued.

Abstract: An improved golf ball injection mold is characterized by upper and lower support plates each containing corresponding hemispherical cavities which define spherical mold cavities when the plates are brought together. A plurality of retractable core pins are arranged in each cavity for supporting a core of a golf ball. Fluid thermoplastic material is supplied to each cavity to form the cover layer on the golf ball core. A valve pin is arranged in a gate in the upper plate in the center of the upper hemispherical cavity adjacent to a pole of the golf ball being formed in the cavity. The valve pin is operable between extended and retracted positions relative to the gate to deliver the thermoplastic material to the cavity and a closed position intermediate of the extended and retracted positions to stop the flow of thermoplastic material during curing of the cover layer.

Abstract: To provide a method and an apparatus that can execute simultaneous injection molding of a plurality of different resin components using a mold construction that makes possible simultaneous main-sub component molding, without having to make the mold and device larger. A simultaneous main-sub component molding method utilizes a mold device having a first cavity C1 for molding a first resin component and a second cavity C2 for molding a second resin component. The mold cavities C1 and C2 are provided in a pair of opposed mold halves 100, 200 which close for the molding operation and open to remove the molded parts. In this mold device, injection molding of a plurality of different types of resin components 20, 23 is simultaneous. The first resin component is configured from a large resin component that is substantially circular, U-shaped, or L-shaped. The second resin component is configured from a small resin component that can be positioned inside an open portion of the first resin component.

Abstract: Manufacturing a coating for an impression cylinder whereby a carrier and a cylinder shape is provided. A hollow cylinder is positioned between the carrier and the cylinder shape, and material to form the coating in the spaces is introduced between the carrier and the hollow cylinder (the internal field) and between the hollow cylinder and the cylinder shape (the external field). The hollow cylinder is removed at a certain pre-selected velocity from between the carrier and the cylinder shape.

Abstract: Described is an assembly, which includes a housing and a window member therein. Also, described is a method and system for manufacturing such assembly. In particular, a first part and a second part are approximated into a molding configuration to create a first mold therebetween. The first mold includes first and second molding cavities. When the first and second parts are in the molding configuration, the second molding cavity is sealed with respect to the first molding cavity. Then, a first molding material is added into the first molding cavity to create a housing. A window member is inserted into the second molding cavity. The second part is replaced with a third molding cavity surrounding a perimeter of the window member. Subsequently, a second molding material is added to the third molding cavity to create a seal surrounding the perimeter of the window member.

Abstract: An in-mold coat-forming mold and an in-mold coat-forming method are provided, wherein the mold prevents leakage of a coating material for the long term, which is likely to occur when the in-mold coat-forming method is carried out.

Abstract: Resin or pitch is melted in a melt blender apparatus (11) and then loaded, into a heated jacketed holding tank (12). A pair of feed lines (14, 16) receives resin from the holding tank (12) and feeds an upper gear pump (15) and a lower gear pump (17). A mixing enhancement such as a static mixer (18, 19) is located in each of the feed lines (14, 16) between the gear pumps (15, 17) and the resin delivery ends (25, 26) of the feed lines. The resin-melt feed lines may be equipped with pressure indicators (27, 28, 32, 34) and pressure relief valves (23, 24). The resin-melt feed lines may also be equipped with pump accumulators (31, 33). Resin melt pressure created by the gear pumps (15, 17) forces a piston inside the accumulator back to the desired position. The accumulators (31, 33) can also be used to maintain constant pressure in the feed stock. Resin can be recycled from the accumulators (31, 33) into the melt blender (11).

Abstract: A composition, apparatus, and system, as well as fabrication methods and processes therefor, may include a resin and a filler having a negative coefficient of thermal expansion.

Abstract: The present invention relates to a method and to Apparatus for molding a receptacle fitted with a covering label. The technical field of the invention is that of molding a receptacle out of plastics material. In a method of molding a receptacle fitted with a covering label (1b) which is inserted into the mold (93) prior to injection, the label is shaped and at least two edges of the label are joined together, after which the shaped label is placed on a male portion (91) of the mold.

Abstract: A mold to make a plastics material piece includes two parts defining a cavity corresponding to the piece to be made, each part has a peripheral zone for coming into contact with the other part's peripheral zone to define the mold's joint face. One part is made up of two blocks, namely a central block and a peripheral block, the two blocks suitable for sliding relative to each other in the mold closure direction, and the peripheral block capable of movement so as to move the peripheral zone away from the edges of the sheet. A method of making a plastics material piece includes placing a sheet in a part of a mold, moving a peripheral block, closing the mold, and moving the peripheral block to a molding position while keeping the first and second peripheral zones in contact.

Abstract: A device (1) and method for injection molding articles (25) with several plastic material components. The device (1) includes a fixed, first half mold (3), a second half-mold (6) that is movable relative to the first half-mold (3) for the purpose of opening and closing the device (1). The device also includes at least two further half-molds (10, 11), which are jointly movable relative to the first and second half-molds (3, 6), and which, in the closed position of the device (1), are situated between the first and the second half-molds (3, 6) such that cavities are formed in each of a first and a second parting plane (32, 33). The two further half-molds (10, 11), which are jointly movable, include a device (22), which in the case of an opened device (1) serves to transport the article (25) out of a first cavity (21.1) into a second cavity (21.2) so that the article (25) can be injection molded around with a further material component in the second cavity (21.2).

Abstract: A form, fill and seal packaging machine for forming, filling and sealing a carton, molds a closure directly onto the carton. The machine includes a carton erection station adapted to receive a carton in a generally flat form and to erect the flat form carton into a tubular form defining an internal carton region. A direct injection molding station has an internal mold tool and an external mold tool. The internal mold tool is configured for receipt within the internal carton region and the internal mold tool and the external mold tool are configured to receive and clamp the carton therebetween. The direct injection molding station further includes a polymer injection system for injecting polymer from a location external of the carton to the internal mold tool. The closure is directly molded in place on the carton. A mold tool set, a method for carrying out the molding and a closure molded thereby are also disclosed.

Abstract: The invention provides a boots for a resin constant velocity universal joint in which a different thickness portion is integrally formed in an inner diameter of a large diameter side end portion of a primarily molded resin bellows in accordance with a secondary molding. A resin bellows (8) constituted by a bellows portion (55), and a small diameter side end portion (40) and a large diameter side end portion (41) which are provided in both end sides of the bellows portion (55) is molded in accordance with a primary molding, and a different thickness portion (56) corresponding to a secondarily molded product is integrally formed in an inner periphery of the large diameter aide end portion (41) of the primarily molded resin bellows (8) by being secondarily molded within an injection metal mold (64). At this time, a molten material of the different thickness portion (56) is injected into a secondary molding space from an optional position of a thin portion.

Abstract: A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

Abstract: Disclosed is an injection mod for a display panel of a washing machine, by which the display panel can be simply formed in one body. The present invention includes a first mold having a first film attached to an inside and a second mold assembled to the first mold to form a cavity with the first mold, the second mold having a second film attached to an inside, the second mold having a gate communicating with an opening provided to the second film.

Abstract: Solid rollers of a urethane material are formed in closed mold formed by a tube and two end plugs spaced by a shaft, the latter becoming the shaft for the roller. The closed mold avoids rough grinding to a cylindrical shape, as well as avoiding the resulting waste of material and introduction of defects that arise from rough grinding. The formation of bubbles during injection of the urethane material is avoided by filling the closed mold with carbon dioxide gas prior to injection. The formation of gate marks in the urethane material is avoided by repositioning the end caps after injection to separate the injection gate from the cylindrical cavity. The need to trim the ends of the roller is avoided by providing an annular cavity between the top end cap and the tube that receives excess urethane material to be drawn into the cylindrical cavity as the urethane shrinks during curing.