With Interposed Non-adhering Web Or Sheet Type Parting Means Patents (Class 425/89)
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Patent number: 6814556Abstract: The resin molding machine is capable of executing many functions and easily expanding and modifying the structure. In the resin molding machine, a loader and an unloader are moved on common rail sections so as to convey a work piece and a molded product. An additional rail unit has a rail section, on which the loader and the unloader can be moved. The additional rail unit is detachably attached between a work piece feeding unit and a product accommodating unit. The common rail sections and the rail section of the additional rail unit are disconnectably connected.Type: GrantFiled: April 20, 2001Date of Patent: November 9, 2004Assignee: Apic Yamada CorporationInventors: Junji Hirano, Tsutomu Miyagawa, Tomio Katsuie, Yasuhiko Miyashita
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Patent number: 6784397Abstract: The present invention is directed to a release composition for molds and formers used in the production of natural and synthetic latex articles. The release coating contains a water-borne, high Tg polymer formed from at least one hydrophobic monomer and at least one hydrophilic monomer, where the Tg of the polymer is at least −10° C. One advantage of the release composition is that it is compatible with a coagulant solution used in the formation of latex gloves. Articles formed using the release coating have good anti-blocking properties.Type: GrantFiled: June 15, 2001Date of Patent: August 31, 2004Assignee: National Starch and Chemical Investment Holding CorporationInventors: Zhixin Li, Joseph B. Gardner, Chaodong Xiao, John S. Thomaides, Yasuo Tokimori, Stanislaw Petrash, Christopher G. Gore
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Publication number: 20040159968Abstract: Disclosed is an apparatus and method of producing polyurethane rubber bands.Type: ApplicationFiled: May 5, 2003Publication date: August 19, 2004Applicant: EVER GREEN FRIENDS Co., Ltd.Inventors: Han -Woo Lee, Sang-Woo Shim
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Patent number: 6773247Abstract: A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.Type: GrantFiled: November 2, 2000Date of Patent: August 10, 2004Assignees: Towa Corporation, Shimizu Co., Ltd.Inventors: Michio Osada, Keiji Maeda, Yoshihisa Kawamoto, Yoshiji Shimizu, Toshiyuki Nishimura, Susumu Yamahara
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Patent number: 6743389Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.Type: GrantFiled: October 5, 2001Date of Patent: June 1, 2004Assignee: Apic Yamada CorporationInventors: Fumio Miyajima, Kunihiro Aoki, Tsutomu Miyagawa, Hideaki Nakazawa
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Publication number: 20040089965Abstract: For manufacturing a moulded article comprising at least an elastomeric polyurethane skin (9) and optionally a structural backing layer (10) and an intermediate foam layer (12) a mould is used having at least a first mould part (1) comprising at least two mutually movable mould sections (2-4). The skin (9) is moulded with its front against a surface (7) of the first mould part (1) by applying at least one reactive polyurethane mixture to this mould surface. In order to prevent the seam between the mutually movable mould sections (2-4) of the first mould part to leave traces on the front of the moulded skin (9), the first mould part (1) further comprises a removable, flexible liner (6) which is positioned onto these mould sections to cover at least partially the seam therebetween.Type: ApplicationFiled: July 8, 2003Publication date: May 13, 2004Inventors: Guy Malfliet, Hugo De Winter, Jan Willems
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Publication number: 20040075184Abstract: A method of manufacturing a foamed plastic article includes disposing a release film on a mold surface of a mold cavity. At least a portion of a bushing is inserted through the release film to form an aperture in the release film. The bushing defines an inlet for foamable material. The mold cavity is then sealed. The foamable material is then injected into the mold cavity through the inlet, wherein the foamable material is conformed to the shape of the mold cavity.Type: ApplicationFiled: October 16, 2002Publication date: April 22, 2004Inventors: Bari William Brown, George Bernard Byma
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Patent number: 6652799Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.Type: GrantFiled: December 31, 2001Date of Patent: November 25, 2003Assignee: Micron Technology, Inc.Inventors: Toh Kok Seng, Liang C. Tay, Kay Kit-Tan
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Patent number: 6592795Abstract: A continuous forming method and device for an H-shaped FRP member for forming semi-hardened preimpregnated members produced by impregnating thermosetting resin to carbon fiber or glass fiber and the like into a predetermined H-shape. The forming device comprises of a device for mounting a plural number of bobbins having strip-shaped preimpregnated material spooled thereto, providing tension when pulling the impregnated material out from the bobbin. The device the shapes the preimpregnated material to a predetermined H-shape that feeds release films from four sides of upper, lower, left and right. The device then provides heat and pressure to the preimpregnated material from said four sides with a heating furnace for after-curing the preimpregnated material. The device then hauls and holds the preimpregnated material for cutting the cured product.Type: GrantFiled: January 8, 2001Date of Patent: July 15, 2003Assignee: Jamco CorporationInventors: Toru Kasai, Kazumi Asari
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Patent number: 6563207Abstract: A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.Type: GrantFiled: July 2, 2002Date of Patent: May 13, 2003Assignee: Fujitsu LimitedInventor: Yasuhiro Shinma
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Publication number: 20030082253Abstract: A mold includes a bottom die, and an upper die closed on the bottom die and defining with the bottom die a cavity for folding molding food materials into a predetermined shape, the upper die having a coupling flange around the cavity and retaining means in the coupling flange, the bottom die having a coupling flange fitted into the coupling flange of the upper die, retaining means adapted for engaging the retaining means of the upper die, and an overflow outlet through which an overflow of inserted food passes to the outside of said mold.Type: ApplicationFiled: October 30, 2001Publication date: May 1, 2003Inventor: Wei-Hwang Chang
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Patent number: 6554598Abstract: A mold assembly including: a first mold half; a second mold half relatively movable with respect to the first mold half; and a thin film disposes between the both mold halves and in contact with the surface of a semiconductor chip. Because of the contact between the edges of the surface of the semiconductor chip and the thin film, the portion of the semiconductor chip at which the burr is liable to be generated is protected and no burrs are generated.Type: GrantFiled: May 25, 2000Date of Patent: April 29, 2003Assignee: NEC Electronics CorporationInventor: Hisayuki Tsuruta
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Patent number: 6517333Abstract: A mold for flat treads of tire casings which includes first and second molding parts respectively defining the outer surface and the inner surface of a tread, at least one of the molding parts being movable between two positions corresponding to opening and closing of the mold and in which one of the molding parts bears at least one elastically deformable element for molding a longitudinal edge of the tread surface and forming and maintaining a tight connection with the two molding parts between a closed position and a slightly-open position of the mold.Type: GrantFiled: May 31, 2000Date of Patent: February 11, 2003Assignee: Pneu Laurent SNCInventor: Robert Mas
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Publication number: 20030020191Abstract: An apparatus and a method for impressing three-dimensional patterns in a slip-formed concrete wall. At least one impression roller is provided at the discharge end of a slip form. The impression roller includes an outer periphery, provided with a layer or coating of resilient material. The layer is pre-formed or pre-cast to include an aesthetically pleasing, three-dimensional pattern. The axis of the roller is maintained in parallel relation to the plane of the exposed surface of the wall, with the outer periphery of the roller slightly depressed into the wall surface. As the uncured concrete wall emerges from the slip form, the impression roller places a pattern into the wall surface which corresponds to the pattern on the roller. Movement of the roller along the wall causes the impression roller to rotate, impressing successively formed portions of the wall with the pattern. Additional rollers may be used to impress patterns on the opposing wall surface, as well as the top wall surface.Type: ApplicationFiled: July 30, 2001Publication date: January 30, 2003Inventor: Michael B. Allen
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Publication number: 20020195744Abstract: Provided by the present invention is a mold release film for sealing a semiconductor element, which does not deform or cause deformation of the terminals of the semiconductor and which has good releasability during the semiconductor element sealing process, and a sealing method for a semiconductor element using the mold release film, which can improve efficiency of manufacturing a semiconductor.Type: ApplicationFiled: June 6, 2002Publication date: December 26, 2002Inventors: Yusuke Otsuki, Hiroyasu Yamato, Osamu Isogai
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Publication number: 20020171164Abstract: A thermosetting foam, preferably a polyurethane foam is prepare by mixing all the components in one or more extruders and directing the chemical streams to a mixing head where the catalyst is added. Thus, the reaction can be controlled in a facile manner, whereby clogging of the extrusion head is avoided.Type: ApplicationFiled: May 15, 2001Publication date: November 21, 2002Inventors: Steve Halterbaum, David G. Wernsing
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Patent number: 6478562Abstract: The method of resin molding and a resin molding machine are capable of uniformly control amount of the resin for molding a work piece and pressure of the melted resin. A parting face of one of molding dies, which includes a pot and a cavity, is covered with release film. A work piece to be molded is set in the cavity. Resin is set in the pot. Parts of the release film, which enclose the work piece except a resin path, are clamped by the molding dies. Capacity of the cavity is reduced when the parts of the release film are clamped. The resin is sent from the pot to the cavity so as to mold the work piece in the cavity.Type: GrantFiled: September 14, 2000Date of Patent: November 12, 2002Assignee: Apic Yamada Corp.Inventor: Fumio Miyajima
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Publication number: 20020164391Abstract: A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.Type: ApplicationFiled: July 2, 2002Publication date: November 7, 2002Applicant: Fujitsu Limited of KawasakiInventor: Yasuhiro Shinma
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Publication number: 20020131926Abstract: Processes and systems are provided to reduce sticking of graphite materials and particularly resin impregnated graphite materials to forming tools, such as an embossing roller, during a process of manufacturing articles from the graphite materials. In one embodiment, an aerosol spray non-stick material is intermittently sprayed upon the embossing rollers. In a second embodiment, one or more sheets of thin flexible solid non-stick material, such as polyethylene, are sandwiched between the graphite material and the embossing rollers. The system is particularly useful for manufacturing materials useful in producing components of fuel cells.Type: ApplicationFiled: May 3, 2001Publication date: September 19, 2002Inventor: Jeremy H. Klug
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Patent number: 6439869Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films and also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.Type: GrantFiled: August 16, 2000Date of Patent: August 27, 2002Assignee: Micron Technology, Inc.Inventors: Toh Kok Seng, Liang C. Tay, Kay Kit-Tan
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Patent number: 6375448Abstract: A system for automatically cooling and further processing chewing gum base materials is disclosed. The hot molten chewing gum base material is deposited in lined or coated pans, the pans are picked up by an industrial robot and placed into a pair of spiral cooling towers where the molten material is cooled and solidified. The same or a second industrial robot picks up the pans of cooled gum base material and transports them to a final staging and processing area. The pans of cooled gum base material are placed on a conveyor system or on pallets for further handling and processing.Type: GrantFiled: May 8, 1998Date of Patent: April 23, 2002Assignee: Warner-Lambert CompanyInventors: James A. Duggan, Kevin R. Tebrinke, Tony R. Puri, Arthur W. Upmann
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Patent number: 6355343Abstract: A flexible composite release sheet providing a replicative surface with a desired surface effect and a method of manufacturing such a release sheet is disclosed. The release sheet is suitable for use in multicomponent reactive urethane casting systems. The invention further provides flexible composite release sheets having a first acrylic functional coating layer containing the desired surface effect and a second silicone release coating layer overlying the acrylic functional coating layer.Type: GrantFiled: July 8, 1998Date of Patent: March 12, 2002Assignee: S. D. Warren Services CompanyInventor: Judith I. Glassock
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Publication number: 20020025352Abstract: In the method of resin molding of the present invention, air can be perfectly discharged from a specific area of a molding die including cavities, resin paths, pots, etc. so as to mold high quality products. The method comprises the steps of: covering a specific area of a molding die, in which air is left, with release film; clamping a work piece and the release film between an upper die and a lower die of the molding die so as to air-tightly seal the specific area; discharging the air from the sealed specific area; and filling a molding section with resin.Type: ApplicationFiled: August 22, 2001Publication date: February 28, 2002Inventor: Fumio Miyajima
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Patent number: 6350113Abstract: A resin molding machine is capable of preventing molded products from forming resin flash on their surfaces. The resin molding machine includes a press section, a loading section, an unloading section, an accommodating section, a film feeding section, and an air sucking mechanism. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.Type: GrantFiled: February 25, 2000Date of Patent: February 26, 2002Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Publication number: 20020020934Abstract: In order to provide a process for the production of a component consisting of a fiber reinforced material, with which liquid resin is supplied to a semifinished fiber article by way of application by vacuum pressure, it is provided for a heat curing resin to be used as resin and for application by vacuum pressure and temperature to be controlled such that in relation to the liquid resin the boiling point curve of the resin is not exceeded.Type: ApplicationFiled: February 13, 2001Publication date: February 21, 2002Applicant: Deutsches Zentrum fur Luft-und Raumfahrt e.V.Inventor: Bernhard Hinz
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Publication number: 20020015748Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.Type: ApplicationFiled: October 5, 2001Publication date: February 7, 2002Inventors: Fumio Miyajima, Kunihiro Aoki, Tsutomu Miyagawa, Hideaki Nakazawa
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Patent number: 6344162Abstract: The method of manufacturing semiconductor devices is capable of efficiently manufacturing semiconductor devices and preventing production of bad products. The method is executed in a molding machine including an tipper die and a lower die, in one of which a plurality of cavities corresponding to resin-molded parts of the semiconductor devices are formed. And, the method comprises the steps of: covering inner faces of the cavities and a parting face of one of the dies, which contacts a substrate of the semiconductor devices, with release film, which is easily peelable from the dies and resin for molding; clamping the substrate with the dies; filling the resin in the cavities; and forming the semiconductor devices by cutting the molded substrate.Type: GrantFiled: June 22, 1999Date of Patent: February 5, 2002Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Publication number: 20020012731Abstract: The invention provides methods and molding devices for molding three-dimensional products from a mass of foodstuff which is suitable for human consumption, in particular from a mass of meat, in particular chicken.Type: ApplicationFiled: May 23, 2001Publication date: January 31, 2002Inventors: Maurice Eduardus Theodorus van Esbroeck, Henricus Franciscus Jacobus Maria van de Eerden, Petrus Christianus Marius Janssen, Adrianus Josephes van den Nieuwelaar
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Publication number: 20010024727Abstract: An apparatus and method for continuously forming composites comprising filler materials and thermoactive materials, particularly waste cellulosic materials and waste thermoplastics, are described. One embodiment of the apparatus includes either a batchwise or continuous mixer, such as a cyclone, for forming mixtures comprising filler and thermoactive material. The mixtures are conveyed to a continuous consolidation apparatus. Alternatively, the mixtures may be densified in a densifying apparatus before entering the consolidation apparatus. The consolidation apparatus includes a hot-gas distribution system having plural paired gas cells, such as rollers or hoods, for applying hot air to the charge. A first cell of each pair applies gas to the mixture. The second cell of each pair operates at a pressure less than that of the first cell, thereby creating a pressure differential across the charge.Type: ApplicationFiled: March 8, 2001Publication date: September 27, 2001Applicant: Boise Cascade CorporationInventors: Paul Dubelsten, Lorence E. Knowles, Erik J. Van Kleek
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Patent number: 6264454Abstract: A transfer/injection molding apparatus and process is defined that includes a charge forming unit. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. The charge forming unit includes a cutter for cutting sheet material into strips and a wind-up fork for rolling the strips into wrapped charges. The wrapped charges are formed by winding the strips around prongs extending from the wind-up fork. Further, the fork is attached to a robotic arm which loads the wrapped charge into the molding die.Type: GrantFiled: March 11, 1998Date of Patent: July 24, 2001Assignee: The Budd CompanyInventor: Patrick Steven Hale
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Patent number: 6227836Abstract: A method and an apparatus for manufacturing tablets of moist powder which is produced by adding an additive agent such as an excipient or a binder to medical ingredients, further adding a solvent such as water, ethanol or the like, and kneading the mixture.Type: GrantFiled: February 9, 2000Date of Patent: May 8, 2001Assignee: Sankyo Seisakusho Co & Eisai Co., Ltd.Inventors: Heizaburo Kato, Yuki Tsushima, Takayuki Ohwaki, Masaharu Nakajima, Yutaka Morita
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Patent number: 6224360Abstract: A resin sealing method for a chip size package electrically connected to electrodes of a semiconductor chip in a chip face of the semiconductor chip with one end of leads joined and the other end thereof exposed to an outer face of a sealing resin for sealing the chip face as connection parts to a package substrate, includes the steps of: providing a first transfer mold formed with a cavity recess in which an object to be molded including the semiconductor chip joined to leads is set, and a second transfer mold mated with the first transfer mold; setting the object to be molded in the cavity recess with a transfer mold face containing the cavity recess of the transfer mold; covering the mold face of the first and second mold with release films having flexibility and heat resistance, respectively; clamping the object to be molded with the transfer mold face of the second mold; and filling the cavity of the first mold with a resin for sealing the package with the resin.Type: GrantFiled: May 19, 1999Date of Patent: May 1, 2001Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Patent number: 6202277Abstract: Hard tooling for consolidation of a workpiece there between is preserved for reuse by disposing between the tooling and a workpiece a plurality of distinct, superimposed sacrificial sheets, for example metal foils, to isolate the workpiece from the tooling. The sacrificial sheets are substantially non-adherent one to another; and a sheet in contact with a workpiece surface is substantially chemically non-reactive with such workpiece surface.Type: GrantFiled: October 28, 1999Date of Patent: March 20, 2001Assignee: General Electric CompanyInventors: Ahmad P. Zahedi, Nicholas Damlis, Paul A. Siemers
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Patent number: 6187243Abstract: The method of resin molding is capable of preventing molded products from forming resin flash on their surfaces. The method comprises the steps of: covering over a parting face, of at least one of molding dies with release film; clamping a work piece, with the release film, by the molding dies; and filling the melted resin in the molding section of the molding die, wherein the release film is tightly pressed on a surface of a part of the work piece, which is exposed after molding, in the clamping step. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.Type: GrantFiled: July 8, 1998Date of Patent: February 13, 2001Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Patent number: 6048191Abstract: A machine which is appropriate to flatten pastry or dough and to obtain disks of different diameter size or thickness with or without peripheral edge. The machine is used for preparing typical dishes, such as: pizza pies, tarts, cakes, piadine romagnole, tigelle, montanare, etc. The characteristic feature of the machine is that of having realized a device which, by imitating manual work, flattens a pastry ball without squeezing it, starting from the center towards the periphery, without modifying the characteristic softness, uniformity and rising capacity which are typical of manually manipulated pastry or dough.Type: GrantFiled: September 16, 1997Date of Patent: April 11, 2000Inventor: Lauro Beltrami
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Patent number: 6000244Abstract: A mold assembly for forming a glass sheet includes a mold block having a surface for holding a glass sheet and a fibrous metal liner for covering the surface of the mold block to prevent marking of the glass sheet when held against the mold block.Type: GrantFiled: June 8, 1998Date of Patent: December 14, 1999Assignee: Ford Motor CompanyInventor: Premakaran T. Boaz
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Patent number: 5935613Abstract: Apparatus (10) is disclosed including first and second forming rollers (18, 21) which rotatably abut with an anvil roller (20). The forming rollers (18, 21) each include a periphery forming a continuous forming surface including a plurality of axially and circumferentially spaced grooves (24) each formed as a continuous depression arranged in a serpentine and non-intersecting manner. Food (14) is simultaneously fed between a continuous strip of support material (16) and a continuous ribbon of film material (66) as they pass between a first abutment nip of the first forming roller (18) and the anvil roller (20). After extending partially around the periphery of the first forming roller (18), the materials (16, 66) and the food therebetween pass around an adjustable idler roller (70) to between a second abutment nip of the second forming roller (21) and the anvil roller (20).Type: GrantFiled: May 21, 1998Date of Patent: August 10, 1999Assignee: General Mills, Inc.Inventors: Richard O. Benham, Sheryl S. Brunken, Robert C. Dechaine, Timothy J. Gluszak, Rene K. Smethers, Craig E. Zimmermann
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Patent number: 5891483Abstract: The automatic molding machine of the present invention comprises: molding dies; a press mechanism to which the molding dies are attached, the press mechanism clamping and molding a work piece which is set in the molding die; a film feeding mechanism linking with molding action of the press mechanism, the film feeding mechanism feeding release film, which is formed into a long belt form, prescribed length so as to correspond a setting position of the work piece, which is set in the molding die; and a conveying mechanism linking with the molding action of the press mechanism, the conveying mechanism feeding the work piece and resin for molding into the molding die and taking out a molded product therefrom, wherein the work piece is molded by the molding dies whose molding sections are covered with the release film.Type: GrantFiled: August 21, 1996Date of Patent: April 6, 1999Assignee: Apic Yamada Corp.Inventor: Fumio Miyajima
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Patent number: 5824252Abstract: A method and apparatus for resin molding upon an insert-member. The molding machine includes an upper die and a lower die, a cavity in at least one of the dies, a pot in which resin is introduced, and a resin path which allows the resin to flow from the pot into the cavity and onto the insert-member set in the dies. A film member is set between a parting face of the die and the insert-member. The film member covers a part of the insert-member corresponding to the resin path. An edge of the film member coincides with at least one of side edges of the cavity. The insert-member is clamped by the dies together with the film member when molding occurs.Type: GrantFiled: February 15, 1996Date of Patent: October 20, 1998Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Patent number: 5800841Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies. A member to be molded by the molding dies is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.Type: GrantFiled: November 22, 1995Date of Patent: September 1, 1998Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Patent number: 5756028Abstract: A method of manufacturing resin articles with naturally formed patterns is provided. The method uses organic matter, such as portions of a fern like the "Sphaeropteris lepifera", and a resin, to be molded together and then machined into a desired shape. The inner surfaces of the upper mold section and the lower mold section are covered by aluminum foil sheets and enclose a portion of a fern, such as the "Sphaeropteris lepifera" therein. A resin is injected into the mold through an opening in one foil sheet and the mold is heated to an appropriate temperature. Subsequently, the mold is cooled by room temperature air and dried by a drying machine. The resin is removed from the mold and machined into a particular shape in accordance with a predetermined design. The shaped molded resin is smoothed by grinding or filling in uneven portions with resin. After smoothing, the molded resin is polished to provide a naturally-formed pattern on the surface thereof.Type: GrantFiled: March 11, 1996Date of Patent: May 26, 1998Inventor: Ju-Liang Liao
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Patent number: 5672364Abstract: A method and an apparatus for manufacturing tablets of moist powder which is produced by adding an additive agent such as an excipient or a binder to medical ingredients, further adding a solvent such as water, ethanol or the like, and kneading the mixture.Type: GrantFiled: June 26, 1995Date of Patent: September 30, 1997Assignee: Sankyo Seisakusho Co. & Eisai Co., Ltd.Inventors: Heizaburo Kato, Yuki Tsushima, Takayuki Ohwaki, Masaharu Nakajima, Yutaka Morita
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Patent number: 5649473Abstract: A platen cover feed system includes a frame supporting a pair of spools. A belt is connected at each end to the spools and can be fed from one spool to the other or vice versa. The spools can be mounted on supports located at the four top corners of the frame, and the rear supports can be adjusted to various heights. The system may include clamps associated with the spools. The clamps can be tightened or loosened manually in order to either fix the belt in place or feed it forward or backward. Thus, the belt can be fed a varying distance in either direction. The belt is generally made of, or coated with, Teflon or a similar non-sticking material.Type: GrantFiled: December 11, 1995Date of Patent: July 22, 1997Assignee: Lawrence Equipment, Inc.Inventor: Eric Clay Lawrence
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Patent number: 5639483Abstract: A process and a system for the continuous manufacture of polymeric foams. Reactive chemical components and additives comprising a low boiling blowing agent are mixed under pressure; the mixture is then frothed before chemical reaction takes place by feeding the mixture through a pressure equalizing and frothing device having a pressure-drop zone opening into a frothing cavity having an output aperture to discharge the froth onto a moving substrate.Type: GrantFiled: June 7, 1995Date of Patent: June 17, 1997Assignee: Foaming Technologies Cardio BVInventors: Carlo Fiorentini, Anthony C. Murray Griffiths
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Patent number: 5629027Abstract: A process and a system for the continuous manufacture of polymeric foams. Reactive chemical components and additives comprising a low boiling blowing agent are mixed under pressure; the mixture is then frothed before chemical reaction takes place by feeding the mixture through a pressure equalizing and frothing device having a pressure-drop zone opening into a frothing cavity having an output aperture to discharge the froth onto a moving substrate.Type: GrantFiled: June 7, 1995Date of Patent: May 13, 1997Assignee: Foaming Technologies Cardio BVInventors: Carlo Fiorentini, Anthony C. M. Griffiths
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Patent number: 5620710Abstract: A process and a system for the continuous manufacture of polymeric foams. Reactive chemical components and additives comprising a low boiling blowing agent are mixed under pressure; the mixture is then frothed before chemical reaction takes place by feeding the mixture through a pressure equalizing and frothing device having a pressure-drop zone opening into a frothing cavity having an output aperture to discharge the froth onto a moving substrate.Type: GrantFiled: June 7, 1995Date of Patent: April 15, 1997Assignee: Foaming Technologies Cardio BVInventors: Carlo Fiorentini, Anthony C. Murray Griffiths
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Patent number: 5590499Abstract: A process is disclosed for manufacturing an angular insulating wall element consisting of an angular rigid foam plate linked to brick fillets. Angular, one-piece fillets are space apart in a lying mold having an essentially V-shaped cross-section and the spacings between the fillets are filled with a mixture of san and isocyanate. Between the backs of the fillets and the sand and isocyanate mixture on the one hand and a countermold on the other hand is introduced a rigid foam layer, whereas part of the rigid foam partially impregnates the sand and isocyanate mixture. The areas of the mixture that are not impregnated with rigid foam are removed after curing the rigid foam layer. A molding box for carrying out this process is also disclosed.Type: GrantFiled: April 18, 1994Date of Patent: January 7, 1997Inventor: Dieter A. Pischel
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Patent number: RE37012Abstract: A process and a system for the continuous manufacture of polymeric foams. Reactive chemical components and additives comprising a low boiling blowing agent are mixed under pressure; the mixture is then frothed before chemical reaction takes place by feeding the mixture through a pressure equalizing and frothing device having a pressure-drop zone opening into a frothing cavity having an output aperture to discharge the froth onto a moving substrate.Type: GrantFiled: April 14, 1999Date of Patent: January 9, 2001Assignee: Foaming Technologies, Cardio BVInventors: Carlo Fiorentini, Anthony C. M. Griffiths
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Patent number: RE37075Abstract: A process and a system for the continuous manufacture of polymeric foams. Reactive chemical components and additives comprising a low boiling blowing agent are mixed under pressure; the mixture is then frothed before chemical reaction takes place by feeding the mixture through a pressure equalizing and frothing device having a pressure-drop zone opening into a frothing cavity having an output aperture to discharge the froth onto a moving substrate.Type: GrantFiled: April 14, 1999Date of Patent: February 27, 2001Inventors: Carlo Fiorentini, Anthony C. M. Griffiths
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Patent number: RE37115Abstract: A process and a system for the continuous manufacture of polymeric foams. Reactive chemical components and additives comprising a low boiling blowing agent are mixed under pressure; the mixture is then frothed before chemical reaction takes place by feeding the mixture through a pressure equalizing and frothing device having a pressure-drop zone opening into a frothing cavity having an output aperture to discharge the froth onto a moving substrate.Type: GrantFiled: April 14, 1999Date of Patent: March 27, 2001Assignee: Foaming Technologies Cardio BVInventors: Carlo Fiorentini, Anthony C. M. Griffiths