Abstract: The invention relates to a mould for producing multilayer plastics mouldings composed of at least two mould halves and of a cavity within which plastic is received, and of a feed system with a feed channel, and also to a process for producing multilayer plastics mouldings.

Abstract: In some embodiments, reconfigurable tooling is provided having an array of actuator columns affixed to a support base. A programmable controller is configured to position the actuator columns. The reconfigurable tooling has a tooling surface which includes a variable stiffness surface capable of controllable states of stiffness, the variable stiffness surface being capable of being deformed by the actuator columns in a soften state, and rigid in a stiff state. In some embodiments, the variable stiffness surface is configurable multiple times.

Abstract: The invention relates to a method and a device for producing a structure made up of at least two bodies in a cavity of a mold defining the structure.

Abstract: Disclosed herein is an apparatus for manufacturing a secondary battery by performing insert injection molding with respect to a portion of a battery cell while the battery cell is located in a mold, wherein the apparatus comprises a pair of upper and lower molds, at which are formed shapes corresponding to the battery cell, the upper and lower molds are provided at the inside surfaces thereof with elastic members, and the elastic members are constructed in a structure in which the elastic members support a cell body of the battery cell and isolate a non-molding region from a molding region while the battery cell is mounted in the upper and lower molds.

Abstract: A method and system for making and forming turbine blades. The method and system can include steps for determining stress loads on amore turbine blades; constructing one or more molds for components of the turbine blade in which a turbine-forming substance is injected; applying a resin to an interior portion of the one or more molds; forming one or more partitions within the one or more molds; coupling the one or more molds; injecting the blade-forming substance into the coupled one or more molds; regulating the pressure in the coupled one or more molds; voiding any excess air or resin in the coupled one or more molds; and allowing the blade-forming substance injected into the coupled one or more molds to harden.

Abstract: A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.

Abstract: The present invention aims at effectively decreasing the installation space of an entire semiconductor chip compression molding apparatus and effectively decreasing the clamping force in dies which are provided in the apparatus. It further aims at performing a clamping, in the case where substrates having a different thickness are used, with an efficient adjustment in accordance with the thicknesses of the substrates. To this end, the semiconductor chip compression molding includes two semiconductor chip compression molding dies (top and bottom dies), and a die opening/closing means for closing the die surfaces of top dies and those of bottom dies in each of the upper and lower dies. The die opening/closing means includes a die opening/closing mechanism having two racks and one pinion, and a thickness adjustment mechanism for adjusting the gaps in accordance with the thicknesses of the substrates supplied to each of the upper and lower dies.

Abstract: An apparatus for manufacturing an electronic component includes: upper and lower metal molds, at least one of which being formed as a porous member on which an electronic component is mounted, including an internal space for accommodating the electronic component therein; a release film providing unit providing a release film to the internal space of the upper and lower metal molds; and a molding resin providing unit providing a molding resin to the internal space to allow the electronic component to be injection-molded.

Abstract: A solidification substrate assembly for making a three-dimensional object from a solidifiable material includes a solidification substrate assembly. In certain examples, the solidifiable material solidifies in contact with the solidification substrate, and the tilting of the substrate and/or or the use of a peeling member facilitates separation of the substrate from the solidified material. In other examples, the solidification substrate assembly includes a film that is adjacent to a rigid or semi-rigid layer. The solidifiable material solidifies in contact with the film, and a peeling member peels the film away from the solidified material. Intelligent solidification substrate assemblies are also described in which a force sensor determines when to expose the solidifiable material to solidification energy and/or whether to use a peeling member to separate the solidification substrate from a solidified objection section.

Abstract: A device intended for creating a reinforcing strip formed by flattening a tube (t) comprising a first means for dispensing a tape (b) comprising an interleaf (D on one of its faces, at a given linear speed, and a second means comprising two rolls intended to flatten the said tube (t), in which device the said first and second means are able to be set in rotation relative to one another about an axis of rotation (XX?) parallel to the direction (p) in which the tape (b) progresses through the device, so that when the device is operating, the tape (b) is wound in a spiral on itself in contiguous turns to form a tube (t) the axis of which corresponds substantially to the axis (XX?) of rotation of the first means with respect to the second means, characterized in that it comprises a means (3) of calibrating the diameter of the tube (t) and positioned between the first and second means, and in that the said calibration means (3) rests against the exterior surface of the said tube (t), and a separation means (27) po

Abstract: A suction roller (65) is used as a drive roller for feeding a film in a solution casting method. The suction roller (65) has a surface (65a) on which a plurality of circular suction holes (91) is formed. The suction hole (91) has a diameter of 4 mm and a chamfered edge. The width of chamfer is 10% in ratio to the diameter of the hole. The surface (65a) is hardened by chrome plating so as to have a hardness of 900 in Vicars hardness. A roller temperature controller (100) is provided near the suction roller (65) to control the surface temperature of the roller by the air supply. The surface temperature of the suction roller (65) is about 10° C. higher than temperature of the film (61)immediately before contacting to the suction roller (65).

Abstract: The invention relates to a process or a device for the production of a three-dimensional object by layer-wise solidification of a photo-polymerizable resin by means of a planar or essentially planar construction/reference plane, at which the photo-polymerizable resin contained in the liquid material is to be hardened by electromagnetic irradiation, and wherein the material application for the subsequent layer automatically results from the separation of the last hardened layer from the construction/-reference plane, whereby the construction/reference plane is formed by an elastic film. The film is fixed in a frame, and the height position of the frame with the film is adjusted in a basin containing the liquid material such that the pressure of the liquid material compensates the sagging of the film (formation of a negative meniscus), and that the lower side of the film is permanently in contact with the material during the whole construction process.

Abstract: In a plant for producing thin articles in the form of a slab, manufactured with a mix (M) based on agglomerate stone or ceramic material, the mix is distributed in a thin layer on a support (90) using a distributor (100) comprising a hopper (120) and an underlying extractor belt (150). Means (132, 151) are provided for preventing interruption of the article production cycle, required to eliminate the incrustations resulting from contact of at least part of the hopper (120) and/or the extractor belt (150) with the mix.

Abstract: A tape for use in automated tape laying machines that includes a multi-layer substrate composed of a plastic layer that includes at least one plastic film having an outer film surface and an inner film surface. The plastic film is adhered to a fibrous layer so that the inner surface of the fibrous layer is bonded to the inner film surface. An uncured composite material layer composed of a fibrous reinforcement and an uncured resin matrix is releasably adhered to either the plastic layer surface or the outer fiber layer surface to provide a tape suitable for use in an automatic tape layer.

Abstract: The present invention relates to a three-dimensional molding device for producing a three-dimensional molded object. The three-dimensional molding device comprises a receptacle for retaining a light-curing resin, a light source for irradiating light to cure the light-curing resin retained inside the receptacle, wherein the three-dimensional molded object is produced by curing the light-curing resin, and a flexible three-dimensional molded object holding plate, which adheres to the light-curing resin and holds the three-dimensional molded object when the resin in the receptacle is cured.

Abstract: The present invention relates to a mold half for making an ophthalmic lens, in particular a contact lens, wherein the mold half comprises a release sheet removably arranged on the mold surface of said mold half to separate a lens forming material from the mold surface, as well as to a method for applying a removable mold release sheet to said mold half. The mold half of the invention comprises a vacuum means to removably attach said release sheet to said mold surface, and preferably the mold half further comprises a pinch-off rim for forming the edge of said ophthalmic lens.

Abstract: One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a moldings cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied. The upper contact area is covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as an adhesive film forming an interface with the underside of the plastic housing composition, with the result that a warpage of the composite board of less than 1% is obtained.

Abstract: A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection.

Abstract: Disclosed are a printing mold and a manufacturing method thereof, and a method of forming a thin film pattern using the printing mold. The printing mold comprises a polymer-based main body with convex and concave surface portions, and an ink-phobic layer disposed on the concave surface portions of the main body.

Abstract: An apparatus for manufacturing a semiconductor device is provided. The semiconductor device includes a chip packaged with a resin mold. The apparatus includes a first mold, a second mold, and a buffer sheet. The first mold has a first cavity for forming the resin mold on a first side of the semiconductor device, and a convex part for forming an exposed area of the chip. The second mold has a second cavity for forming the resin mold on a second side of the semiconductor device. The buffer sheet is disposed between the convex part and the chip for covering the exposed area.

Abstract: The invention relates to compositions useful as release agents containing saponified fatty and/or rosin acids, as well as methods of making and using the same.

Abstract: A block tool for surface finishing operations, which has a support and coupling member (2) for connection to a machine tool, and an abrasive block (3) held by the support member (2), the abrasive block being obtained from a solution or emulsion of a granular abrasive material dispersed in a matrix comprising a thermoplastic resin.

Abstract: A nanoimprint stamper with a novel structure is provided that can simultaneously conform to two types of anomaly in the shape of a transfer substrate, i.e., a warpage and surface protrusions (including foreign objects) that differ greatly in the wavelength of variation, and which is capable of performing transfer with a smaller number of defects and in a uniform way. The nanoimprint stamper comprises a light-transmitting rigid substrate, a light-transmitting resilient plate, a light-transmitting and flexible rigid stamper base, a light-transmitting stamper buffer layer, and a light-transmitting patterned stamp layer, the stamper buffer layer having a lower Young's modulus than the patterned stamp layer.

Abstract: A compression molding method capable of preventing contamination of abrasion powders generated by scoring to thereby improve the product yield is provided. The compression molding method, including a fixed mold and a movable mold arranged opposite each other, includes: contacting a slide board connected with a movable die plate on the movable mold side via a spring, with the parting face of the fixed mold by a spring force; further advancing the movable mold after injecting resin into a cavity in the mold, and compressing and molding the resin filled in the cavity by a core, provided in the movable mold, penetrating through the slide board. A resin film is disposed between the fixed mold and the slide board, and one surface of the resin in the cavity is compressed by the core via the resin film.

Abstract: A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate faces the cavity, wherein the lower half includes a projecting part which has a top surface which faces the cavity and which projects from the bottom surface of the lower half toward a substantial center point of the substrate mounting plate, wherein the substrate mounting plate is adjustably mounted on the upper half and movable toward the lower half, and wherein the upper half includes a clamp mounted thereon which surrounds the projecting part when the upper and lower halves are coupled with each other.

Abstract: The present invention relates to an apparatus for manufacturing a roll-type liquid silicone rubber foam having no surface viscosity and a thin film shape with a greatly reduced thickness of 0.2 mm, which is capable of manufacturing a roll-type liquid silicone rubber foam having a predetermined width (300 mm-1,000 mm) in a continuous process useful for mass production.

Abstract: The invention provides methods and moulding devices for moulding three-dimensional productions from a mass of foodstuff which is suitable for human consumption, in particular from a mass of meat, in particular chicken. The method comprises filling a mould cavity with a portion of the mass and for a filling period via a filling opening associated with the mould cavity, closing the filling opening of the mould cavity and holding the mass in the mould cavity for a fixing period. Then, the mould cavity is opened and the moulded product is removed from the mould cavity. The method uses fixing-pressure-exerting mechanism designed to exert a fixing pressure which acts on the mass in the mould cavity after the filled mould cavity has been closed.

Abstract: By clamping upper and lower molds, a semiconductor chip and a stacking connection electrode are immersed in a resin material heated and molten in a cavity coated with a mold release film. The mold release film is pressed into contact with a tip portion of the connection electrode by a cavity bottom face member, so that a collective resin portion having a shape corresponding to the shape of the cavity is molded in the cavity. Accordingly, the semiconductor chip and the connection electrode are compression molded with the resin material. Here, a tip portion of the connection electrode is exposed from the collective resin portion.

Abstract: A method for fabricating lens of light emitting diode and device thereof is disclosed, and the method includes providing a lead frame with multiple light emitting diode modules, positioning a mold releasing member on the lead frame, connecting a lens pattern device with the lead frame, injecting a resin into each lens mold, and curing the resin to lenses on the light emitting diodes modules.

Abstract: An apparatus and a method for the separation of a material layer (4) hardened on a flat plane (2) serving as a reference by means of a flexible, elastic separating layer (1) arranged between plane and material layer and designed in the form of a film or a gel-like material, are provided.

Abstract: A method for forming composite articles from a thermoplastic preform using a bladder molding system. In one aspect, the method comprises suspending the preform above a tensioned release layer in an indexed manner prior to heating and forming the preform. In another aspect, the method comprises cold loading the preform into the bladder molding system about the mold cavity and subsequently heating and forming the preform without further handling the preform.

Abstract: In a continuous molding apparatus equipped with a long core 10 having a curvature disposed on a plane, a release film supplied from a lower release film feeder 20 is sent onto the core 10, and prepreg sheets supplied from a prepreg sheet feeder 30 are laminated thereon and preformed. A release film supplied from a release film feeder 40 is disposed on top of the laminated body, before the body is sent into a hot press 50. A puller 60 moves the laminated body without loading tension thereto. The laminated body enters a postcure device 70 in which thermosetting of the material is completed.

Abstract: Provided are a method of manufacturing wafer-level chip-size packages and a molding apparatus suitable for practicing the method whereby a semiconductor wafer having a plurality of semiconductor chips formed thereon may be encapsulated. The semiconductor wafer, typically with a plurality of conductive bumps extending from the semiconductor chips, will be placed in a cavity formed between upper and lower molds. Injection molding of an encapsulant composition or compression molding of encapsulant sheets may then be used to apply encapsulating layers to the upper and lower surfaces of the semiconductor wafer in a substantially simultaneous manner, thereby reducing the likelihood of warping and mechanical damage to the semiconductor wafer. The wafer-level chip-size packages can then be separated from the encapsulated semiconductor wafer.

Abstract: The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

Abstract: The present invention is directed to methods and apparatuses for processing food products and utilizes a series of guides for moving platens through several operative zones to press a food product intermediate. In particular, the present invention relates to an apparatus and method for forming generally flat dough products such as tortillas, taco shells, snacks and the like by gradually pressing a dough intermediate between movable platens that are disposed on concentric, endless belts.

Abstract: The invention provides methods and moulding devices for moulding three-dimensional products from a mass of foodstuff which is suitable for human consumption, in particular from a mass of meat, in particular chicken. The method comprises filling a mould cavity with a portion of the mass under the influence of a filling pressure exerted on the mass and for a filling period via a filling opening associated with the mould cavity, closing the filling opening of the mould cavity and holding the mass in the mould cavity for a fixing period. Then, the mould cavity is opened and the moulded product is removed from the mould cavity. The method uses fixing-pressure-exerting means which are designed to exert a fixing pressure which acts on the mass in the mould cavity after the filled mould cavity has been closed.

Abstract: The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and liquid resin 434 supplied to multiple semiconductor devices is supported by an electrically insulated lower die 200. An upper die 110 in which multiple shape-forming parts (cavities) 112 are formed is pressed against lower die 200 through the medium of a polymer release film 300, and liquid resin 434 on the substrate is molded.

Abstract: A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such that corners of the body segments do not include the trapped air.

Abstract: In an in-mold decoration apparatus, with decorating sheets pinched between a fixed mold half and a movable mold half, molten resin is injected into the mold so that the decorating sheets are respectively bonded to surfaces of a resin molded article. The in-mold decoration apparatus includes a vertical direction decorating sheet feeding machine for performing the feed and take-up of the decorating sheet in the vertical direction, and a horizontal direction decorating sheet feeding machine for performing the feed and take-up of the decorating sheet in the horizontal direction, so that the in-mold decoration apparatus can be set up even with a narrow installation space.

Abstract: A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device.

Abstract: An apparatus and a method for the separation of a material layer (4) hardened on a flat plane (2) serving as a reference by means of a flexible, elastic separating layer (1) arranged between plane and material layer and designed in the form of a film or a gel-like material, are provided.

Abstract: Production of foamed materials in a horizontal machine, and said machine itself, reactants being fed to a conveyor at one end of the machine and foam produced being removed at the other end, wherein the foam is generated in an expansion chamber defined at its inlet by a closed reactant feed zone, at its outlet by a body of foam already expanded or partly expanded, and laterally and vertically by travelling webs, the webs giving a diverging cross section to the chamber.

Abstract: Disclosed is an apparatus for continuously producing an artificial marble plate capable of simultaneously and uniformly hardening a raw material compound for an artificial marble plate, preventing the warpage of the artificial marble plate, and improving heat transmission efficiency and productivity. The apparatus includes upper and lower carrier films facing each other and receiving a raw material compound for the artificial marble plate into a gap therebetween; upper and lower horizontal heating plates receiving the upper and lower carrier films into a gap therebetween, each including temperature controller and heater for heating upper and lower surfaces of the raw material compound at the same temperature by the same heat transmission manner to harden the raw material compound; and a pair of gaskets disposed at horizontal edges of the upper and lower carrier films for regulating thickness and width of the artificial marble plate obtained by hardening the raw material compound.

Abstract: The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a molding die; a cavity plate having a cavity hole, which defines a shape and thickness of a resin mold section of the work; a mechanism for repeatedly carrying the cavity plate into and out from the press section; and a mechanism for positioning the cavity plate onto the molding die.

Abstract: A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The encapsulation compound has a plurality of side areas (812) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed (813) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.

Abstract: Slabstock foam free of cavities can be produced without any restriction, i.e. also from rapidly reacting chemical systems, by introducing the liquid reaction mixture from underneath, in front of, and/or through an optionally swivellable floor plate, wherein the floor plate and the inlet for introducing the liquid reaction mixture is arranged in a manner such that the reaction mixture above the floor plate is substantially still liquid.

Abstract: An apparatus for forming panels from moldable material comprising: a material storage and feeding container for placing moldable material on a sheet of peel ply material on top of a conveyor. The conveyor has a roughened surface for gripping the sheet of peel ply material. The moldable material is leveled by a sizing plate which also places a second sheet of peel ply material over the moldable material to form a web. The web is compressed in a compression zone and is stabilized in thickness to form panels of compressed, dimensionally stabilized material as it is moved by the conveyor. Also disclosed is a method for making such panels from moldable material.

Abstract: An apparatus and method of producing polyurethane rubber bands. The apparatus includes a first device for heating and simultaneously drawing a polyurethane sheet produced by incising polyurethane tubular film obtained according to an inflation procedure, a second device for coating a release agent onto both sides of the drawn polyurethane sheet and drying the release agent-coated polyurethane sheet, a third device for longitudinally fine-cutting the dried polyurethane sheet using fine-cutting rollers to form several tens of strips of polyurethane rubber bands, depositing starch or talc powder on both sides of the polyurethane rubber bands, and heat-processing the polyurethane rubber bands deposited by the starch or talc powder, a fourth device for dispersing the heat-processed polyurethane rubber bands to impartially stuff the polyurethane rubber bands into packing receptacles, and a fifth device for heat-aging the packed polyurethane bands in an aging compartment.

Abstract: An apparatus and a method for impressing three-dimensional patterns in a slip-formed concrete wall. At least one impression roller is provided at the discharge end of a slip form. The impression roller includes an outer periphery, provided with a layer or coating of resilient material. The layer is pre-formed or pre-cast to include an aesthetically pleasing, three-dimensional pattern. The axis of the roller is maintained in parallel relation to the plane of the exposed surface of the wall, with the outer periphery of the roller slightly depressed into the wall surface. As the uncured concrete wall emerges from the slip form, the impression roller places a pattern into the wall surface which corresponds to the pattern on the roller. Movement of the roller along the wall causes the impression roller to rotate, impressing successively formed portions of the wall with the pattern. Additional rollers may be used to impress patterns on the opposing wall surface, as well as the top wall surface.

Abstract: A dough press machine is provided for flattening a quantity of dough. The dough press machine includes a cabinet having an upper platen and a lower platen and an extendable and retractable mechanism interposed between at least one of the platens and the cabinet to decrease and increase a space between the upper and lower platens. A sheet is interposed between the upper and lower platens and arranged such that the upper and lower platens will sandwich the sheet therebetween as the space between the platens decreases. The sheet is movable from between said platens to provide access to the sheet while being held in a horizontal orientation. A support structure extends between an upper and lower portion of the cabinet to interconnect such portions around a circumference of the platens such that no non-interconnected portion exceeds an angular extent of 165°.