Abstract: The present invention provides an organosiloxane comprising at least 80 weight percent of Formula 1: [Y0.01-1.0SiO1.5-2]a{Z0.01-1.0SiO1.5-2]b[H0.01-1.0SiO1.5-2]c (where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula 1; b is from 2 percent to 50 percent of Formula 1; and c is from 20 percent to 80 percent of Formula 1. The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.

Abstract: The present invention relates to a substrate for attachment of biomolecules. The substrate is coated with a multiamino organosilane. If desired, the substrate can be further modified prior to coating with a multiamino organosilane. Optional surface modifications include coating the substrate with SiO2 or leaching with acid to form a SiO2 rich layer. DNA, nucleic acids, or any bimolecules can be attached to the coated substrates of the invention. Although a variety of substrates are contemplated, the preferred substrate is a low self-fluorescent glass.

Abstract: The invention concerns a method which comprises irradiating at least one face of an article with UV radiation, causing the article to be photodegraded over a thickness of at least 1 ?m and contacting the irradiated face of the article with a coloring agent, so as to diffuse the coloring agent in the entire thickness of the photodegraded surface layer of the article. The invention is useful for optical and ophthalmologic articles.

Abstract: An epoxy resin composition suitable for forming a film of excellent water repellency which comprises an epoxy resin having one or more water repellent groups and two or more cyclic aliphatic epoxy groups per molecule, a triazine-base catalyst for cationic polymerization and a non-polar solvent.

Abstract: The invention relates to a method for producing a sealed impregnation and/or release coating of flat joints, in particular of cylinder-head gaskets such as composite seals, metallic joints and multi-layered steel joints. The invention uses a silicone composition including at least a polyorganosiloxane A crosslinkable by a cationic and/or radical process by appropriate crosslinking functional groups, for example, of the alkenyl ether, acrylic, acrylate, epoxide and/or oxethane type; at least an initiator salt B selected among onium borates or an organometallic complex; and at least a reactive diluent C including a nonorganosilicon or organosilicon compound comprising in its structure at least a crosslinking functional group and optionally a secondary functional group different from the crosslinking functional group but capable of chemically reacting with a crosslinking functional group, for example of the hydroxyl, alkoxy and/or carboxyl type.

Abstract: Apparatus and method to improve vapor phase diffusion coating of articles. The apparatus provides a barrier to segregate the portion of the article requiring coating from the portion of the article not requiring coating. The fixture is reusable, being unaffected by the coating gases. The fixture reduces the exposure of the coating gases with the portion of the article not requiring coating. By use of an optional seal, the portion of the article not requiring coating can be isolated from the coating gases.

Abstract: A method for forming an electrically insulating thin film coating the surface of an electronic device with an electrically insulating thin-film-forming resin composition and crosslinking the composition by a method selected from the group consisting of heating and irradiation with high-energy rays.

Abstract: A method for improving the coating capability of low dielectric layer is disclosed. The method includes steps of an etching stop layer is deposited a semiconductor substrate, an adhesion promoter layer is spun-on the etching stop layer. The pre-wetting process being performed on the adhesion promoter layer to enhance the coating capability of the low-k dielectric layer, and thus improve the coating quality through the pre-wetting process of baked adhesion promoter layer before the low-k dielectric layer is applied.

Abstract: A method and apparatus for depositing a low dielectric constant film includes depositing a silicon oxide based film, preferably by reaction of an organosilicon compound and an oxidizing gas at a low RF power level from about 10 W to about 500 W, exposing the silicon oxide based film to water or a hydrophobic-imparting surfactant such as hexamethyldisilazane, and curing the silicon oxide based film at an elevated temperature. Dissociation of the oxidizing gas can be increased in a separate microwave chamber to assist in controlling the carbon content of the deposited film. The moisture resistance of the silicon oxide based films is enhanced.

Abstract: An alkylsiloxane-containing epoxy resin composition can suitably be used as water-repellent agent or a water-repellent coating to be advantageously applied to areas that are apt to be brought into contact with solutions and substances containing one or more than one components that can damage the film forming property and the adhesion of an ordinary water-repellent agent. The resin composition comprises at least an alkylsiloxane-containing epoxy resin having two or more than two alkylsiloxane groups and two or more than two cyclic aliphatic epoxy groups in a molecule and a cationic polymerization catalyst.

Abstract: A method for forming a self aligned pattern on an existing pattern on a substrate comprising applying a coating of the masking material to the substrate; and allowing at least a portion of the masking material to preferentially attach to portions of the existing pattern. The pattern is comprised of a first set of regions of the substrate having a first atomic composition and a second set of regions of the substrate having a second atomic composition different from the first composition. The first set of regions may include one or more metal elements and the second set of regions may include a dielectric. The masking material may comprise a polymer containing a reactive grafting site that selectively binds to the portions of the pattern.

Abstract: A paper machine substrate modified to resist contamination by adhesive materials. The paper machine substrate includes: a paper machine substrate; and an active agent that is grafted to the surface of the paper machine substrate to lower the surface energy of the paper machine substrate so that the substrate resists contamination by adhesive material. The papermachine substrate may be made by a process that includes the steps of: providing a paper machine substrate; applying an active agent to the paper machine substrate; and exposing the paper machine substrate to greater than about 2 million rads (Mrad) of radiation to cause a reaction between the active agent and the substrate so the active agent becomes joined to the substrate. The active agent may be a fluorinated monomer, a fluorinated polymer, a perfluorinated polymers, or a polyalkyl siloxane.

Abstract: In a method for the manufacture, by means of lithography, of ceramic small and micro-parts, a pre-ceramic silicon containing polymer layer is deposited on a highly temperature resistant substrate and then dried at room temperature. The layer is then exposed in an image pattern to electromagnetic radiation and the exposed layer is developed in an organic solvent to remove the non-exposed areas. The preparation is then pyrolyzed at more than 900° C. and finally sintered at a temperature of at least 1600° C. to form a ceramic structured layer on the substrate.

Abstract: A silicon-containing polymer having a tetrafunctional siloxane portion as the basic skeleton, and containing a carboxylic acid group-containing triorganosiloxane portion and a carboxylic acid derivative group-containing triorganosiloxane portion in a specific proportion. It may be advantageously used as a negative non-chemical amplification resist polymer or a positive chemical amplification resist polymer.

Abstract: The invention relates to a process for combating the appearance of mist (misting) during the coating of flexible supports with at least one liquid silicone (RTV polyaddition) composition which is a precursor of silicone coating(s) using a roll coating device operating at high speed. The targeted aim is to increase the speed of appearance of the misting and subsequently to improve the appearance, the coverage and the mechanical properties of the silicone coating and industrial hygiene. For this, use is made of a liquid coating composition obtained by mixing: a silicone phase comprising one or more POSs (A) and optionally one or more (crosslinking) compound(s) (B), the viscosity &eegr; of which at 25° C. is between 100 and 800 mPa·s; with 1 to 10% by weight of noncellulose antimist particles (talc, silica, kaolin, TiO2), the D50 (in &mgr;m) of which is: 0.01≦D50≦2; and optionally with a liquid (D)—water/solvent.

Abstract: The present invention relates to an electrically conductive coating that is producible by hydrolytic condensation of a mixture comprising at least one silicon compound of the general formula SiXnR(4−n) (I), wherein at least one of the groups R is a mercapto-substituted alkyl or aryl group; and a compound of the general formula ZaSiYbR(a−4−b) (II), wherein the group Z is a quaternary ammonium salt, for example. Said coating is particularly suitable for toner transfer drums, and exhibits high scratch resistance and good adhesion to the substrate.

Abstract: A ceramer composition is provided that comprises a plurality of colloidal inorganic oxide particles and a free-radically curable binder precursor. The free-radically curable binder precursor comprises a fluorochemical component that further comprises at least two free-radically curable moieties and at least one fluorinated moiety. By virtue of the inclusion of the fluorochemical component, the ceramer compositions of the present invention can be used to provide ceramer composites and ceramer composite structures with excellent stain, oil and/or water repellency characteristics as well as a high level of abrasion resistance and hardness.

Abstract: A curable composition is disclosed that is useful for securing color coded optical fibers in a matrix of an optical fiber cable. The matrix material can be stripped from the individual fibers without removing the color coding associated with the individual fibers. The matrix material is also resistant to solvents used in the stripping process.

Abstract: A method and apparatus for depositing a low dielectric constant film includes depositing a silicon oxide based film, preferably by reaction of an organosilicon compound and an oxidizing gas at a low RF power level from about 10W to about 500W, exposing the silicon oxide based film to water or a hydrophobic-imparting surfactant such as hexamethyldisilazane, and curing the silicon oxide based film at an elevated temperature. Dissociation of the oxidizing gas can be increased in a separate microwave chamber to assist in controlling the carbon content of the deposited film. The moisture resistance of the silicon oxide based films is enhanced.

Abstract: The invention pertains to dielectric films for the production of microelectronic devices. A spin-on glass film is produced by depositing a silazane polymer containing composition film onto a substrate and then exposing the film to electron beam radiation. The electron beam exposing step is conducted by overall exposing the dielectric layer with a wide, large beam of electron beam radiation from a large-area electron beam source.

Abstract: A transparent coated molded product comprising a transparent synthetic resin substrate and two or more transparent cured material layers provided on at least one part of the surface of the transparent synthetic resin substrate, wherein an inner layer in contact with the outermost layer of the two or more transparent cured material layers is an abrasion-resistant layer which is a cured material of an active energy ray-curable coating agent (A) containing a polyfunctional compounds (a) having at least 2 active energy ray-curable polymerizable functional groups and the outermost layer is a silica layer which is a cured material of a curable coating agent (B) of polysilazane or a curable coating agent (B) containing polysilazane.

Abstract: The invention provides a system and a method for densifying a surface of a porous film. By reducing the porosity of a film, the method yields a densified film that is more impenetrable to subsequent liquid processes. The method comprises the steps of providing a film having an exposed surface. The film can be supported by a semiconductor substrate. When the film is moved to a processing position, a focused source of radiation is created by a beam source. The exposed surface of the film is then irradiated by the beam source at the processing position until a predetermined dielectric constant is achieved. The film or beam source may be rotated, inclined, and/or moved between a variety of positions to ensure that the exposed surface of the film is irradiated evenly.

Abstract: A substantially water-free, water-washable, energy-curable composition includes an epoxy oligomer and/or urethane oligomer having at least two ethylenically unsaturated moieties, at least one alkoxylated polyol monomer having at least two ethylenically unsaturated moieties and capable of being copolymerized with the oligomer, and a surface active agent capable of being integrated into the molecular structure of the cured polymer and further capable of rendering the uncured composition dispersible in water. Optionally, the composition can contain a photoinitiator. The composition is self-dispersible in water and is especially suitable for use as a coating material for a printing screen.

Abstract: A low refractive index SiO2 film is provided which uses a starting material for forming an SiO2 film and has a lower refractive index than the conventional SiO2 film.

Abstract: A ceramer composition is provided that comprises a plurality of colloidal inorganic oxide particles and a free-radically curable binder precursor. The free-radically curable binder precursor comprises a fluorochemical component that further comprises at least two free-radically curable moieties and at least one fluorinated moiety. By virtue of the inclusion of the fluorochemical component, the ceramer compositions of the present invention can be used to provide ceramer composites and ceramer composite structures with excellent stain, oil and/or water repellency characteristics as well as a high level of abrasion resistance and hardness.

Abstract: The invention provides a system and a method for densifying a surface of a porous film. By reducing the porosity of a film, the method yields a densified film that is more impenetrable to subsequent liquid processes. The method comprises the steps of providing a film having an exposed surface. The film can be supported by a semiconductor substrate. When the film is moved to a processing position, a focused source of radiation is created by a beam source. The exposed surface of the film is then irradiated by the beam source at the processing position until a predetermined dielectric constant is achieved. The film or beam source may be rotated, inclined, and/or moved between a variety of positions to ensure that the exposed surface of the film is irradiated evenly.

Abstract: The present invention provides a process for forming a hydrophilic inorganic coated film on a surface of a base material, the process comprising the steps of: (1) preparing an inorganic coating composition which contains, as a major component, a silicone resin obtained by hydrolyzing and condensation-polymerizing only the tetra-functional alkoxysilane represented by the formula: Si(OR)4 [wherein R represents an alkyl group having carbon atoms up to and including 7 or an aryl group], and has a total solid content of not more than 5% by weight; (2) applying the inorganic coating composition to a surface of the base material to form a coated layer; and (3) drying and curing the coated layer to form a cured coated film having a thickness of 0.01 to 0.5 &mgr;m. The hydrophilic inorganic coated film formed by the process of the present invention is highly hydrophilic just after the film is formed, even in the case that it is not irradiated with ultraviolet rays.

Abstract: A method and apparatus for depositing a low dielectric constant film by reaction of an organosilicon compound and an oxidizing gas at a constant RF power level from about 10 W to about 200 W or a pulsed RF power level from about 20 W to about 500 W. Dissociation of the oxidizing gas can be increased prior to mixing with the organosilicon compound, preferably within a separate microwave chamber, to assist in controlling the carbon content of the deposited film. The oxidized organosilane or organosiloxane film has good barrier properties for use as a liner or cap layer adjacent other dielectric layers. The oxidized organosilane or organosiloxane film may also be used as an etch stop and an intermetal dielectric layer for fabricating dual damascene structures. The oxidized organosilane or organosiloxane films also provide excellent adhesion between different dielectric layers.

Abstract: Release liners and processes for making the same are disclosed. The release liners include no more than about 1.5 micrograms/square centimeter of nonreacted silicone materials (extractables). The release liners are prepared using solvent coating of radiation curable silicone release materials.

Abstract: A method and apparatus for depositing a low dielectric constant film by reaction of an organosilane or organosiloxane compound and an oxidizing gas at a low RF power level from 10-250 W. The oxidized organosilane or organosiloxane film has good barrier properties for use as a liner or cap layer adjacent other dielectric layers. The oxidized organosilane or organosiloxane film may also be used as an etch stop or an intermetal dielectric layer for fabricating dual damascene structures. The oxidized organosilane or organosiloxane films also provide excellent adhesion between different dielectric layers. A preferred oxidized organosilane film is produced by reaction of methylsilane, CH3SiH3, or dimethylsilane, (CH3)2SiH2, and nitrous oxide, N2O, at an RF power level from about 10 to 200 W or a pulsed RF power level from about 20 to 250 W during 10-30% of the duty cycle.

Abstract: An electrically insulating thin-film-forming resin composition comprising (A) an inorganic or organic electrically insulating resin having silicon atom-bonded hydrogen atoms, (B) a compound having groups able to react with the silicon atom-bonded hydrogen atoms in component (A) and having a boiling point under atmospheric pressure of at least 250° C., and (C) a solvent; and a method for forming an electrically insulating thin film therefrom.

Abstract: A method and apparatus for depositing a low dielectric constant film includes depositing a silicon oxide based film, preferably by reaction of an organosilicon compound and an oxidizing gas at a low RF power level from about 10 W to about 500 W, exposing the silicon oxide based film to water or a hydrophobic-imparting surfactant such as hexamethyldisilazane, and curing the silicon oxide based film at an elevated temperature. Dissociation of the oxidizing gas can be increased in a separate microwave chamber to assist in controlling the carbon content of the deposited film. The moisture resistance of the silicon oxide based films is enhanced.

Abstract: An interconnection structure includes an interlevel insulating film, made of organic-containing silicon dioxide, between lower- and upper-level metal interconnects. A phenyl group, bonded to a silicon atom, is introduced into silicon dioxide in the organic-containing silicon dioxide.

Abstract: A ceramer composition is provided that comprises a plurality of colloidal inorganic oxide particles and a free-radically curable binder precursor. The free-radically curable binder precursor comprises a fluorochemical component that further comprises at least two free-radically curable moieties and at least one fluorinated moiety. By virtue of the inclusion of the fluorochemical component, the ceramer compositions of the present invention can be used to provide ceramer composites and ceramer composite structures with excellent stain, oil and/or water repellency characteristics as well as a high level of abrasion resistance and hardness.

Abstract: A surface of a given base material is hydrophilized by irradiating, for example, a vacuum ultraviolet light to itself. Then, on the surface is formed a monomolecular film made of a fluoroalkylsilane preferably having at least one of a long fluoroalkyl-chain and a long alkyl-chain which preferably have lengths of not less than 1 nm. Then, the base material and the monocular film are thermally treated and thereby a member having a high lubricative surface can be obtained which has strong couplings between the base material and the molecular film through a dehydrating condensation reaction.

Abstract: The instant invention pertains to a composition that can form silica thin films, wherein said composition performs well as a substrate planarizing coating when applied to a substrate and can be converted by exposure to high-energy radiation into silica thin film with an excellent electrical insulating performance. The composition for the formation of silica thin films comprises (A) a hydrogen silsesquioxane resin that contains at least 45 weight % hydrogen silsesquioxane resin with a molecular weight no greater than 1,500; and (B) solvent. A silica thin film is produced by evaporating the solvent (B), and then converting at least a portion of the hydrogen silsesquioxane resin (A) to silica by exposing the surface of the said substrate to high-energy radiation. The preferred substrate is a semiconductor substrate having at least one electrically conductive layer.

Abstract: An apparatus for forming a film on a substrate includes a gas inlet and an insert attached to the gas inlet, the insert including a deposition source material such as lithium. To form the film on the substrate, the substrate is mounted in a vacuum chamber. After the vacuum chamber is pumped down to a subatmospheric pressure, a first process gas such as argon is provided through the gas inlet and insert and into a plasma region proximate the substrate. Power is then coupled to generate a plasma inside of the insert which heats the insert and causes the deposition source material to vaporize. The deposition source material vapor is mixed with a plasma polymerizable material in the plasma region proximate the substrate causing a plasma enhanced chemical vapor deposition (PECVD) thin film such as silicon oxide including the deposition source material (e.g. lithium) to be deposited on the substrate.

Abstract: An apparatus for forming a film on a substrate includes a gas inlet and an insert attached to the gas inlet, the insert including a deposition source material such as lithium. To form the film on the substrate, the substrate is mounted in a vacuum chamber. After the vacuum chamber is pumped down to a subatmospheric pressure, a first process gas such as argon is provided through the gas inlet and insert and into a plasma region proximate the substrate. Power is then coupled to generate a plasma inside of the insert which heats the insert and causes the deposition source material to vaporize. The deposition source material vapor is mixed with a plasma polymerizable material in the plasma region proximate the substrate causing a plasma enhanced chemical vapor deposition (PECVD) thin film such as silicon oxide including the deposition source material (e.g. lithium) to be deposited on the substrate.

Abstract: The present invention relates to a method of forming a ceramic or ceramic-like coating on a substrate in the absence of oxygen. The method comprises coating the substrate with a solution comprising a solven and one or more preceramic materials selected from the group consisting of hydrogen silsesquioxane and hydrolyzed or partially hydrolyzed RxSi(OR)4-x wherein R is independently selected from the group consisting of alkyl, aryl and unsaturated hydrocarbons and x is 0-2. The solvent is evaporated and a preceramic coating thereby deposited on the substrate. The preceramic coating is then ceramified by heating the coated substrate to a temperature of between about 500 up to about 1000° C. under an inert gas atmosphere to thereby produce a ceramic or ceramic-like coating on the substrate. The process of the invention is useful for forming protective coatings on any substrate prone to oxidation at the temperature necessary for ceramification.

Abstract: Described is a process for producing an adherent organic polymeric layer on organic polymeric substrates following the steps of (a) treating the surface of the polymeric substrate to provide reactive groups; (b) applying to the treated surface a polymerizable composition of a surface modifying amount of an organofunctional silane, a catalyzing amount of material which generates acid upon exposure to actinic radiation, and a solvating amount of solvent; (c) exposing the coated surface to an adhesion improving amount of actinic radiation; and (d) applying and curing a photochromic or non-photochromic polymer-forming composition on the coated surface. Also described are articles produced by the process.

Abstract: A curable composition is disclosed that is useful for securing color coded optical fibers in a matrix of an optical fiber cable. The matrix material can be stripped from the individual fibers without removing the color coding associated with the individual fibers. The matrix material is also resistant to solvents used in the stripping process.

Abstract: A single crystal quartz thin film having a thickness of 5 nm to 50 .mu.m can be prepared by forming the thin film on a single crystal substrate by a sol-gel process and peeling the thin film from the substrate. The present invention can provide the single crystal quartz thin film at a low price without a large and complex apparatus.

Abstract: A free-radical curable polish composition is described. The composition can be applied and cured as an ultra thin film on finished surfaces to provide enhanced chemical and mar resistance. The composition comprises an aqueous emulsion including an olefin-functional polymer or an olefin-functional prepolymer, and a silicone or silicone copolymer preferably with photoinitiators for UV and EB cure. The polish/emulsion can be applied, for example, to wet the surface of nitrocellulose lacquer wood finishes. The polish wet surface is first wiped to remove excess polish and thereafter exposed to UV radiation to provide a thin, polymerized protective film.

Abstract: Electron beam radiation curing of inks on game balls, golf balls and the like is disclosed. Production inks, logo inks and methods for forming production prints and logos on golf balls, game balls and the like are disclosed. To form an electron beam radiation curable water-insoluble production ink, at least an adhesion promoting component is added to an ink base.

Abstract: This invention relates to a process for applying a coating material comprising a release coating composition or a pressure sensitive adhesive composition to a substrate, the process comprising: (A) atomizing and electrically charging said coating material; and (B) spraying the atomized and charged coating material from step (A) on to a substrate which overlies a grounded support structure. In one embodiment, the coating material sprayed during step (B) is a release coating composition, said process further comprising the additional steps of: (C) curing said release coating composition; (D) atomizing and electrically charging a pressure sensitive adhesive composition; (E) spraying the pressure sensitive adhesive composition from step (D) on to said substrate over the cured release coating composition from step (C); and (F) placing another substrate over the sprayed pressure sensitive adhesive composition from step (E).

Abstract: An an improved process for surface modification of solid substrates, such as polymers and carbon-based materials, is disclosed. The preferred process comprises three steps: a first activation step wherein reactive hydrogen groups are formed in a surface layer of a polymeric or carbon-based material; a second silylation step wherein the reactive hydrogen groups are reacted with a silylating agent to form silicon-containing groups; and a third stabilization step wherein an upper portion of the activated, silylated layer is oxidatively converted to a silicon and oxygen enriched surface layer. The process can be performed using materials not having pre-existing reactive hydrogen groups or precursor groups. Modified materials according to the present invention have improved properties, such as erosion resistance and oxygen and water barrier properties, and are potentially useful in numerous industries, such as aerospace and packaging.

Abstract: A coating agent composition comprising an organopolysiloxane resin: with the organopolysiloxane resin having a number average molecular weight of at least 500 and acrylic or methacrylic functional group-attached silicon atoms in a proportion of 5 to 100 mole % to the total silicon atoms; and with the resin comprising units represented by formula R.sup.1 LSiX.sub.3 in a proportion of 30 to 100 mole %, wherein R.sup.1 is a hydrogen atom or a substituted or unsubstituted organic group having 1 to 18 carbon atoms and X is a hydroxyl group, a hydrolyzable group or a siloxane residue, provided that at least one X is a siloxane residue; wherein from 30 to 80 mole % of the R.sup.1 SiX.sub.3 units are one silanol group-containing units represented by formula R.sup.1 Si(OH)Y.sub.2 wherein Y is a siloxane residue.

Abstract: A method of contacting s substrate having a surface containing hydroxyl groups with a non-aqueous solution containing a material having a chrolosilyl group; washing if desired; coating the substrate with a non-aqueous solvent containing a compound having a fluorocarbon group and a chlorosilane group or a solvent containing a compound containing a fluorocarbon group and an alkoxysilane; and baking the substrate if necessary in order to form a fluorocarbon-based polymer coating film chemically bonded to the substrate surface. The hydroxyl groups on the substrate surface and chlorosilyl groups are reacted to form a thin film having a large number of silanol groups (—SiOH) capable of connecting the polymer coating film to the substrate to form a heat-, weather-, and wear-resistant film on various surfaces.

Abstract: An interconnection structure includes an interlevel insulating film, made of organic-containing silicon di oxide, between lower- and upper-level metal interconnects. A phenyl group, bonded to a silicon atom, is introduced into silicon di oxide in the organic-containing silicon di oxide.

Abstract: A method of contacting a substrate having a surface containing hydroxyl groups with a non-aqueous solution containing a material having a chrolosilyl group; washing if desired; coating the substrate with a non-aqueous solvent containing a compound having a fluorocarbon group and a chlorosilane group or a solvent containing a compound containing a fluorocarbon group and an alkoxysilane; and baking the substrate if necessary in order to form a fluorocarbon-based polymer coating film chemically bonded to the substrate surface. The hydroxyl groups on the substrate surface and chlorosilyl groups are reacted to form a thin film having a large number of silanol groups (—SiOH) capable of connecting the polymer coating film to the substrate to form a heat-, weather-, and wear-resistant film on various surfaces.