Abstract: A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.

Abstract: A thick-film sheet member producing method including: (a) a support-body preparing step of preparing a support body having a film formation surface provided by a particle layer constituted by high-melting-point particles which are held together with a resin and which have a melting point higher than a predetermined temperature; (b) a paste-film forming step of forming a paste film on the film formation surface, by applying a paste onto the film formation surface; and (c) a firing step of subjecting the support body on which the paste film has been formed, to a heat treatment effected at the predetermined temperature, so as to burn the resin included in the particle layer, whereby the high-melting-point particles become unbound from each other in absence of the resin that has been burned. The paste film is sintered in the firing step, whereby a thick film is formed of the sintered paste film.