Thickness (relative Or Absolute) Patents (Class 428/213)
  • Publication number: 20140154487
    Abstract: A method for forming a chromium nitride coating over a substrate to provide a chromium nitride coated article, and the resulting chromium nitride coated article, each use a bilayer chromium nitride containing material layer. The bilayer chromium nitride containing material layer includes: (1) a first chromium nitride material layer having a first thickness, a first uniform chromium concentration and a first uniform nitrogen concentration located and formed closer to a substrate which provides the article; and (2) a second chromium nitride material layer having a second thickness, a second increasingly graded chromium concentration and a second decreasingly graded nitrogen concentration located and formed upon the first chromium nitride material layer. This particular bilayer chromium nitride containing material layer provides the article with superior reflectivity and crack resistance.
    Type: Application
    Filed: December 4, 2013
    Publication date: June 5, 2014
    Applicant: Vergason Technology, Inc.
    Inventors: Ricky L. Smith, Mark A. Fitch, Gary E. Vergason
  • Publication number: 20140154448
    Abstract: Multilayer film with high tear propagation resistance of at least 300 mN for a total layer thickness of 45 ?m, a shrinkage of ?1% at 120° C. and release properties, comprising a layer (a) formed of at least one propylene copolymer and optionally at least one olefin homopolymer, at least one internal layer (b) formed of at least one olefin/alkyl (meth)acrylate copolymer, a layer (c) formed of at least one propylene copolymer and optionally at least one olefin homopolymer with optional adhesion layers (d) and (e) arranged between layers (a) and (b), and between layers (b) and (c) respectively.
    Type: Application
    Filed: July 6, 2012
    Publication date: June 5, 2014
    Applicant: Huhtamaki Films Germany GmbH & Co. KG
    Inventor: Heinz Engelhard
  • Patent number: 8734936
    Abstract: A transparent conductive film includes a transparent film substrate; and a first and second crystalline transparent conductive laminate, wherein the second crystalline layer is located between the transparent film substrate and the first transparent conductive layer, and a second content of the tetravalent metal element oxide of the second transparent conductive layer is higher than a first content of the tetravalent metal element oxide of the second transparent conductive layer. The transparent conductive film allows a reduction in crystallization time.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: May 27, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Motoki Haishi, Tomotake Nashiki, Tomonori Noguchi, Yoshifumi Asahara
  • Patent number: 8734937
    Abstract: The present invention provides an interlayer film for a laminated glass which can suppress bubble formation and bubble growth in the laminated glass. An interlayer film 1 for a laminated glass includes a first layer 2 and a second layer 3 laminated on one face 2a of the first layer 2. Each of the first layer 2 and the second layer 3 contains a polyvinyl acetal resin and a plasticizer. The polyvinyl acetal resin in the first layer 2 is obtained by acetalizing a polyvinyl alcohol resin that has a degree of polymerization exceeding 3000.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: May 27, 2014
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Tatsuya Iwamoto, Kohei Kani
  • Publication number: 20140141218
    Abstract: A laminate body of the present invention includes a base material, an atomic layer deposition film that is formed along the outer surface of the base material, and an overcoat layer that covers the atomic layer deposition film with a film having a mechanical strength higher than that of the atomic layer deposition film.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Toshiaki Yoshihara, Kyoko Kuroki, Mitsuru Kano, Jin Sato
  • Publication number: 20140138857
    Abstract: The invention provides an encapsulant equipped with the supporting substrate which is an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant equipped with the supporting substrate comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction.
    Type: Application
    Filed: October 29, 2013
    Publication date: May 22, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hideki AKIBA, Toshio SHIOBARA, Susumu SEKIGUCHI, Tomoaki NAKAMURA
  • Publication number: 20140134370
    Abstract: The present disclosure relates to a multilayered film comprising: an outer polyethylene layer; a core layer comprising 40% to 49% (w/w) of polypropylene homopolymer, 51% to 55% (w/w) of LLDPE, and 0% to 5% (w/w) of at least one additive; and an inner polyethylene layer. The multilayered film of the present disclosure exhibits good mechanical strength with lower thickness. The present disclosure also relates to a laminate comprising: an outer printing layer; a middle barrier layer; and an inner sealant layer; wherein at least one of the outer printing layer or the inner sealant layer is made up of a multilayered film comprising: an outer polyethylene layer; a core layer comprising 40% to 49% (w/w) of polypropylene homopolymer, 51% to 55% (w/w) of LLDPE, and 0% to 5% (w/w) of at least one additive; and an inner polyethylene layer. The present disclosure further relates to a laminated tube.
    Type: Application
    Filed: June 14, 2012
    Publication date: May 15, 2014
    Applicant: ESSEL PROPACK LTD.
    Inventors: Chandrashekhar Ramchandra Abhyankar, Mrinal Kanti Banjerjee
  • Patent number: 8722180
    Abstract: A coated article includes a substrate, and a plurality of molybdenum layers and a plurality of titanium-aluminum-nitrogen layers formed on the substrate. Each molybdenum layer interleaves with one titanium-aluminum-nitrogen layer. One of the molybdenum layers is directly formed on the substrate. A method for making the coated article is also described.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: May 13, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Cong Li
  • Patent number: 8722179
    Abstract: A substrate comprises a first mark and a second mark. The first mark comprises a first pattern with at least one mark feature formed by a first material and at least one further region formed by a second material. The first and second materials have different material characteristics with respect to a chemical-mechanical polishing process such that a step height in a direction substantially perpendicular to the surface of the substrate may be created by applying the chemical-mechanical polishing process. The second mark can be provided with a second step height by applying the chemical-mechanical polishing process. The second step height is substantially different from the first step height.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: May 13, 2014
    Assignee: ASML Netherlands B.V.
    Inventors: Richard Johannes Franciscus Van Haren, Bartolomeus Petrus Rijpers, Harminder Singh, Gerald Arthur Finken
  • Publication number: 20140127483
    Abstract: Disclosed herein are a method for manufacturing a copper-clad laminate (CCL) for a printed circuit board, a CCL manufactured by the method, and a printed circuit board having the CCL applied thereto, the method including: forming a first resin coated copper foil (first RCC foil) and a second resin coated copper foil (second RCC foil) by coating an insulating composition on one surface of each of two copper foils to form insulating layers, respectively, followed by drying of the first and second RCC foils; forming a copper-clad laminate (CCL) by laminating and pressing the first RCC foil and the second RCC foil while the insulating layers of the first and second RCC foils face each other and a glass fiber is placed therebetween; and hardening the copper-clad laminate.
    Type: Application
    Filed: February 7, 2013
    Publication date: May 8, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seok Moon, Sa Yong Lee, Seong Hyun Yoo
  • Publication number: 20140127486
    Abstract: A coating and method of making, using, and applying the coating to protect structures from scratches and/or the undesired collection of slag and/or spatter associated with metal working processes. The coating includes a base layer and a top layer that, when applied, mitigate adhesion of weld slag to the underlying structure. The coating is also transparent such that it does not interfere with the functionality of any indicia associated with the underlying structure or device and also renders the coating suitable for use with photo-reactive or responsive sensors and/or other non-opaque structures—such as goggles, facemasks, and/or shields.
    Type: Application
    Filed: November 2, 2012
    Publication date: May 8, 2014
    Inventors: Roberto S. Santos, Rahul Ganguli, Young Chung
  • Publication number: 20140127857
    Abstract: Carrier wafers, methods of manufacture thereof, and packaging methods are disclosed. In one embodiment, a carrier wafer includes a first glass layer. The carrier wafer includes a second glass layer coupled to the first glass layer. The first glass layer has a first coefficient of thermal expansion (CTE), and the second glass layer has a second CTE.
    Type: Application
    Filed: November 7, 2012
    Publication date: May 8, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Yen-Chang Hu
  • Patent number: 8715808
    Abstract: This invention provides a coupling method for coupling a first and a second stiffening profile element for an outer skin of an aircraft or space craft. In a first step the stiffening profile elements are arranged on the outer skin in such a manner that the stiffening profile elements oppose each other with their respective front sides and enclose within themselves a cavity. Furthermore, a fixing hole is formed through a wall of at least one of the stiffening profile elements in the cavity inside a coupling zone of the stiffening profile element. An access opening is formed through the wall in the cavity along the coupling zone. A coupling strap, which couples the stiffening profile elements together, is fastened to the coupling zone by means of a fastening element guided through the fixing hole.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: May 6, 2014
    Assignee: Airbus Operations GmbH
    Inventors: Thorsten Roming, Thorsten Schroeer, Hauke Kirstein, Hinnik Gensch, Stefan Tacke
  • Patent number: 8715816
    Abstract: A multilayered film is shown and described that is used in particular for packaging, which comprises at least one first layer A and at least one second layer B, wherein layer A contains thermoplastic polyester and layer B contains thermoplastic starch. The multilayered film according to the invention is characterized by excellent barrier properties, low sensitivity to moisture, and good mechanical strength.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: May 6, 2014
    Assignee: Biotec Biologische Naturverpackungen GmbH & Co. KG
    Inventors: Harald Schmidt, Christoph Hess, Johannes Mathar, Ralf Hackfort
  • Patent number: 8715815
    Abstract: The present invention provides an intermediate film for laminated glass which can improve sound insulation. The intermediate film has a layered structure including at least two layers, comprising: a first layer containing a polyvinyl acetal resin and a plasticizer; and a second layer positioned on a first surface of the first layer. In a phase diagram of three values including a degree of acetalization, a degree of acetylation, and a hydroxyl group content of the polyvinyl acetal resin contained in the first layer, the values of the degree of acetalization, the degree of acetylation, and the hydroxyl group content each fall within a region surrounded by a line including four straight lines connecting first, second, third, and fourth coordinates, which respectively have a degree of acetalization:degree of acetylation:hydroxyl group content of 70 mol %:30 mol %:0 mol %, 34 mol %:30 mol %:36 mol %, 94 mol %:0 mol %:6 mol %, and 100 mol %:0 mol %:0 mol %.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: May 6, 2014
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Michio Shimamoto, Shota Matsuda, Sinyul Yang, Kohei Kani, Tatsuya Iwamoto
  • Publication number: 20140120333
    Abstract: The invention provides a multilayer heat-shrink film, comprising a central first layer made up of a first composition comprising at least one polyolefin; intermediate second layers made up of a second composition and covering respective faces of the first layer, the second composition comprising a styrene-based resin; and outer third layers made up of a third composition and covering respective ones of the intermediate second layers, the third composition comprising at least one polyester.
    Type: Application
    Filed: October 15, 2013
    Publication date: May 1, 2014
    Inventor: Eric Fresnel
  • Patent number: 8709575
    Abstract: The invention relates to a multilayered material sheet comprising a consolidated stack of unidirectional monolayers of drawn polymer, whereby the draw direction of two subsequent monolayers in the stack differs. At least one monolayer comprises a plurality of unidirectional tapes of the drawn polymer, aligned in the same direction, whereby adjacent tapes do not overlap. The invention also relates to a process for the preparation of the multilayered material sheet, and to a ballistic resistant article comprising the multilayered material sheet.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: April 29, 2014
    Assignee: DSM IP Assets B.V.
    Inventors: Roelof Marissen, Joseph Arnold Paul Maria Simmelink, Reinard Jozef Maria Steeman, Gijsbertus Hendrikus Maria Calis, Jacobus Johannes Mencke, Jean Hubert Marie Beugels, David Vanek, Johann Van Elburg, Alexander Volker Peters, Steen Tanderup, Marko Dorschu
  • Patent number: 8703283
    Abstract: The invention relates to selected polymer blends which can be used for production of films or sheets having reduced defects, and also to a process for preparation of the polymer blends.
    Type: Grant
    Filed: October 13, 2005
    Date of Patent: April 22, 2014
    Assignee: Topas Advanced Polymers GmbH
    Inventors: Wolfram Goerlitz, Anne-Meike Schauwienold
  • Patent number: 8704362
    Abstract: A composite structure 10 of a resin-diamagnetic material, including a diamagnetic material layer 12 and a resin layer 14 is obtained by a method including disposing particles of a diamagnetic material 22 and a resin 24 in a mold 30, applying a magnetic field to the diamagnetic material 22 disposed in the mold 30, and moving the diamagnetic material 22 in a direction away from at least a part of an inner surface of the mold 30, and then curing the resin 24 in the mold 30 thereby to produce a resin-diamagnetic material composite structure.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: April 22, 2014
    Assignee: Panasonic Corporation
    Inventors: Masanori Minamio, Daisuke Ujihara, Hiroshi Wada
  • Publication number: 20140103669
    Abstract: An automotive bumper assembly and compression member for use therein. The assembly including a compression member having a first compressible region proximate to an outwardly oriented facing surface of a bodyside outer element and an second compressible region composed of a foamed polymeric material that is oriented proximate to an inwardly oriented surface of an outer bumper cover member with the compressibility value of the second compressible region being greater than the compressibility value of the first compressible region.
    Type: Application
    Filed: October 17, 2012
    Publication date: April 17, 2014
    Applicant: Toyota Motor Engineering & Manufacturing, North America, Inc.
    Inventor: Toyota Motor Engineering & Manufacturing, North America, Inc.
  • Publication number: 20140106146
    Abstract: One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article retains its average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. The bridging of a crack from one of the film or the glass substrate into the other of the film or the glass substrate can be prevented by inserting a crack mitigating layer between the glass substrate and the film.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 17, 2014
    Applicant: CORNING INCORPORATED
    Inventors: Heather Bossard Decker, Shandon Dee Hart, Guangli Hu, Fei Li, James Joseph Price, Chandan Kumar Saha
  • Publication number: 20140106147
    Abstract: Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties.
    Type: Application
    Filed: January 2, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Jun Lee, Seong Hyun Yoo, Jeong Kyu Lee, Jin Seok Moon, Keun Yong Lee
  • Publication number: 20140102764
    Abstract: In a conductive laminate, a transparent conductive thin film laminate 2 including at least two transparent conductive thin films and a metal layer 3 are formed in this order on at least one surface of a transparent base. In the transparent conductive thin film laminate 2, a first transparent conductive thin film 21 that is closest to the metal layer 3 is a metal oxide layer, or a composite metal oxide layer containing a principal metal and at least one impurity metal. Transparent conductive thin film 22 other than the first transparent conductive thin film is a composite metal oxide layer containing a principal metal and at least one impurity metal. The content ratio of impurity metal in the first transparent conductive thin film is not the highest of content ratios of impurity metal in the transparent conductive thin films which form the transparent conductive thin film laminate 2.
    Type: Application
    Filed: June 14, 2012
    Publication date: April 17, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Nozomi Fujino, Motoki Haishi, Koichiro Tada, Yoshimasa Sakata
  • Publication number: 20140106148
    Abstract: The present invention relates to a method for the continuous inline production of coated polymeric substrates or laminates and also to an apparatus for implementing this method.
    Type: Application
    Filed: June 15, 2012
    Publication date: April 17, 2014
    Applicant: Evonik Roehm GmbH
    Inventors: Waldemar Kanzler, Thomas Hasskerl, Ghirmay Seyoum, Patrick Kliem, Werner Krebs, Dieter Foerster, Manfred Dannehl
  • Patent number: 8697220
    Abstract: Tape articles having improved properties are made from ultra-high molecular weight (UHMW) multi-filament yarns. The tape articles can have a ratio of the low temperature area under the curve (120° C. to Tm-onset) to the total area under the curve (120° C. to 165° C.) of less than about 0.15 as calculated from an increasing temperature DSC scan from a temperature of 30° C. to a temperature of 200° C. at a constant rate of 10° C. per minute. Additionally, in some examples the tape articles can also have a tenacity at least about 24 g/d (2.06 GPa) when measured by ASTM D882-09 at a 10 inch (25.4 cm) gauge length and at an extension rate of 100%/min. Further, the tape articles can have no long period of less than 450 Angstroms (?) when measured by small angle x-ray analysis.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: April 15, 2014
    Assignee: Honeywell International, Inc.
    Inventors: Thomas Tam, Mark Benjamin Boone, Steven Thomas Correale
  • Publication number: 20140096882
    Abstract: To provide a multilayer structure that may adhere to rubber material without the necessity of providing an adhesive layer, an inner liner and a pneumatic tire using the multilayer structure. According to the present invention, a multilayer structure 1 is formed by alternately laminating elastomer layers 3 containing thermoplastic elastomer and barrier layers 2 containing a gas barrier resin, wherein an outermost layer 4 laminated uppermost among layers constituting the multilayer structure 1 contains an elastomer component that may heat-adhere to diene rubber.
    Type: Application
    Filed: May 29, 2012
    Publication date: April 10, 2014
    Applicants: KURARAY CO., LTD., BRIDGESTONE CORPORATION
    Inventors: Hideki Kitano, Tetsuo Amamoto, Takatsugu Tanaka, Yuwa Takahashi, Nahoto Hayashi, Masao Hikasa, Yusuke Tanaka
  • Publication number: 20140099490
    Abstract: To provide a multilayer structure having high gas barrier property and crack resistance as well as excellent fatigue resistance, an inner liner for a pneumatic tire using such a multilayer structure, and a pneumatic tire comprising the inner liner. According to the present invention, in a multilayer structure 1 including a barrier layer 2 and an elastomer layer 3, a proportion of a thickness of the elastomer layer 3 in the multilayer structure ((U1+U2+ . . . +Un)/T) is 60% or more.
    Type: Application
    Filed: May 31, 2012
    Publication date: April 10, 2014
    Applicants: KURARAY CO., LTD., BRIDGESTONE CORPORATION
    Inventors: Hideki Kitano, Tetsuo Amamoto, Takatsugu Tanaka, Nahoto Hayashi, Masao Hikasa, Yusuke Tanaka
  • Publication number: 20140096622
    Abstract: To provide a film laminate body for a pressure sensitive fingerprint sensor that can provide an accurate pressure distribution corresponding to the degree of ridges and valleys of a fingerprint, and thereby can clearly recognize the shape of the fingerprint. A film laminate body for a pressure sensitive fingerprint sensor containing a base film with a first surface and a second surface, and a conductive layer formed by a dry film forming process provided on the first surface, and an elastic layer provided on the second surface, which is a side opposite the first surface of the base film, wherein the base film has a thickness of 6 ?m or less, and the elastic layer has a thickness no less than the base film, and has elasticity of 108 Pa or less.
    Type: Application
    Filed: May 22, 2012
    Publication date: April 10, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Kohichiro Kawate
  • Patent number: 8691370
    Abstract: A multi-layered support structure provides ergonomic, adaptable seating support. The multi-layered support structure includes multiple cooperative layers to maximize global comfort and support while enhancing adaptation to localized variations in a load, such as in the load applied when a person sits in a chair. The cooperative layers each include elements such as pixels, springs, support rails, and other elements to provide this adaptable comfort and support. The multi-layered support structure also uses aligned material to provide a flexible yet durable support structure. Accordingly, the multi-layered support structure provides maximum comfort for a wide range of body shapes and sizes.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: April 8, 2014
    Assignee: Herman Miller, Inc.
    Inventors: Ryan S. Brill, Christopher C. Hill, James D. Slagh, John F. Aldrich, Timothy P. Coffield, Andrew B. Hartmann, Kelly E. Washburn, Michael D. Stanton, Sr.
  • Publication number: 20140090329
    Abstract: A method of covering a roof deck includes laying a course of starter shingles in a side-by-side relationship at an eave edge of a roof deck. A starter shingle of the course of starter shingles is a laminated starter shingle comprising an underlay sheet laminated below an overlay sheet. A plurality of successive generally horizontal courses of covering shingles are laid above the course of starter shingles. The covering shingles in each of the courses of covering shingles are laid in a side-by-side relationship and horizontally offset from the covering shingles in adjacent courses. Each covering shingle of the courses of covering shingles includes a headlap portion and a butt portion. The butt portion includes a plurality of tabs separated by cutouts. The starter shingles include an exposed portion extending between the tabs of the covering shingles.
    Type: Application
    Filed: August 27, 2013
    Publication date: April 3, 2014
    Applicant: Owens Corning Intellectual Capital, LLC
    Inventors: Bert W. Elliott, David E. Pap
  • Patent number: 8685519
    Abstract: Processes for the production of high strength polyethylene tape articles from high strength ultra-high molecular weight multi-filament yarns, and to the tape articles, fabrics, laminates and impact resistant materials made therefrom.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: April 1, 2014
    Assignee: Honeywell International Inc
    Inventors: Thomas Tam, Mark Benjamin Boone, Ashok Bhatnagar, Steven Correale
  • Patent number: 8685161
    Abstract: Various single crystals are disclosed including sapphire. The single crystals have desirable geometric properties, including a width not less than about 15 cm and the thickness is not less than about 0.5 cm. The single crystal may also have other features, such as a maximum thickness variation, and as-formed crystals may have a generally symmetrical neck portion, particularly related to the transition from the neck to the main body of the crystal. Methods and for forming such crystals and an apparatus for carrying out the methods are disclosed as well.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: April 1, 2014
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: John W. Locher, Steven A. Zanella, Ralph L. MacLean, Jr., Herbert Ellsworth Bates
  • Publication number: 20140087158
    Abstract: The invention comprises a relatively lightweight cementitious-based material panel. The cementitious-based material panel comprises a foam insulating panel having a first surface and a second surface; a first structural layer of cementitious-based material formed on the first surface of the foam insulating panel and affixed thereto; and a second non-structural layer of cementitious-based material formed on the second surface of the foam insulating panel and affixed thereto. The second non-structural layer of cementitious-based material is substantially thinner than the first structural layer of concrete. The second non-structural layer of cementitious-based material is preferably formed from polymer modified concrete, plaster or mortar. A method of making the cementitious-based material panel is also disclosed.
    Type: Application
    Filed: September 25, 2012
    Publication date: March 27, 2014
    Inventor: Romeo Ilarian Ciuperca
  • Publication number: 20140087159
    Abstract: A laminate structure having a first glass layer, a second glass layer, and at least one polymer interlayer intermediate the first and second glass layers. The first glass layer is comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 ?m. The second glass layer can also be comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 ?m.
    Type: Application
    Filed: June 25, 2013
    Publication date: March 27, 2014
    Inventors: Thomas Michael Cleary, James Gregory Couillard, Timothy Scott Huten, Anurag Jain, Brenna Marcellus, Michael John Moore
  • Publication number: 20140087157
    Abstract: Provided is a resin article having a layer-separated structure. The resin article may include a first resin layer and a second resin layer formed on the first resin layer. Also, the component of the first resin layer is detected on a surface of the second resin layer by infrared spectrometer. The resin article may have improved mechanical and surface characteristics. Further, since coating or plating is not required for manufacturing a resin article, a manufacturing time and/or cost can be reduced, and productivity can be increased.
    Type: Application
    Filed: November 20, 2013
    Publication date: March 27, 2014
    Applicant: LG Chem, Ltd.
    Inventors: Houng Sik YOO, Hak Shin KIM, Jin Young RYU, Chong Kyu SHIN, Young Jun HONG, Jeong Min KIM, Eun Joo CHOI
  • Patent number: 8679610
    Abstract: An enhanced polymeric void board for placement between adjacent horizontal layers of masonry materials to maintain an opening in a lower of the layers, the enhanced void board comprising a relatively thin planar element having a plurality of ribs extending along the length of the planar element.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: March 25, 2014
    Assignee: Illinoise Tool Works Inc.
    Inventors: John M. Kruelle, Antonio W. Brister, David J. Duke
  • Patent number: 8679614
    Abstract: Polymeric fibers coated with an olefin block copolymer containing resin, the olefin block copolymer having a density of 0.815 kg/dm3 to 0.920 kg/dm3 and a melting point of 110° C. to 130° C. and laminates comprising polymeric tapes embedded in a resin of olefin block copolymer having a density of 0.815 kg/dm3 to 0.920 kg/dm3 and a melting point of 110° C. to 130° C.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: March 25, 2014
    Assignee: Novameer B.V.
    Inventors: Bart Clemens Kranz, Jan Adolph Dam Backer, Benjamin Slager
  • Patent number: 8679618
    Abstract: An optical film includes a multi-layer sheet including: a plurality of polyethylene terephthalate polymer layers, the polymer layers having a first refraction index in a first direction parallel to a plane of the polymer layers and a second refraction index in a second direction parallel to the plane of the polymer layers, and a plurality of polyethylene terephthalate copolymer layers, the copolymer layers having a third refraction index in the first and second directions, a protection sheet on at least one side of the multi-layer sheet, and an adhesive member between the multi-layer sheet and the protection sheet.
    Type: Grant
    Filed: May 2, 2007
    Date of Patent: March 25, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: Jeong Min Moon, Byung Hwa Ji
  • Publication number: 20140079927
    Abstract: A material for a conductive film 1 contains a transparent base material 2, an underlayer 3, a first amorphous layer 4, and a second amorphous layer 5. The first amorphous layer 4 is laminated on the transparent base material 2 and is made of an indium tin oxide containing from 2 to 15 mass % of tin as calculated as its oxide. Further, the second amorphous layer 5 is laminated on the first amorphous layer 4 and is made of an indium tin oxide containing from 2 to 15 mass % of tin as calculated as its oxide. The content of tin as calculated as its oxide in the second amorphous layer 5 is different from the content of tin as calculated as its oxide in the first amorphous layer 4.
    Type: Application
    Filed: November 20, 2013
    Publication date: March 20, 2014
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Kazuhisa YOSHIOKA, Michihisa Tomida, Masayuki Morino
  • Publication number: 20140078458
    Abstract: The thickness of a rear surface-side inorganic film (9) formed from the same material as that of each of front surface-side inorganic films (11, 13, and 16) and provided at a rear surface side of a resin substrate (10) having a heat resistance is set in a predetermined range with respect to the total thickness of the front surface-side inorganic films (11, 13, and 16) so that the curvature diameter calculated based on the linear elastic modulus, the coefficient of linear expansion, and the thickness of the resin substrate (10); the linear elastic moduli, the coefficients of linear expansion, and the total thickness of the front surface-side inorganic films (11, 13, and 16); and the linear elastic modulus, the coefficient of linear expansion, and the thickness of the rear surface-side inorganic film (9) is 20 mm or more or ?20 mm or less.
    Type: Application
    Filed: June 15, 2012
    Publication date: March 20, 2014
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Yasumori Fukushima
  • Patent number: 8673429
    Abstract: The transparent conductive film of the present invention is a transparent conductive film, comprising a transparent film substrate, and a first transparent dielectric layer, a second transparent dielectric layer and a transparent conductive layer that are formed on one or both sides of the transparent film substrate in this order from the transparent film substrate side, wherein the transparent conductive layer is patterned, the relation n2<n3<n1 is satisfied, wherein n1 is the refractive index of the first transparent dielectric layer, n2 is the refractive index of the second transparent dielectric layer, and n3 is the refractive index of the transparent conductive layer, the first transparent dielectric layer has a thickness of from 2 nm to less than 10 nm, the second transparent dielectric layer has a thickness of from 20 nm to 55 nm, and the transparent conductive layer has a thickness of from 15 nm to 30 nm.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: March 18, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Tomotake Nashiki, Kazuhiro Nakajima, Hideo Sugawara
  • Publication number: 20140072784
    Abstract: Absorbing layers of a low-emissivity (low-E) coating are designed to cause the coating to have a reduced film side reflectance which is advantageous for aesthetic purposes. In certain embodiments, the absorbing layers are metallic or substantially metallic (e.g., NiCr or NiCrNx) and are each provided between first and second nitride layers (e.g., silicon nitride based layers) in order to reduce or prevent oxidation of the absorbing layers during optional heat treatment (e.g., thermal tempering, heat bending, and/or heat strengthening). Coated articles according to certain example embodiments of this invention may be used in the context of insulating glass (IG) window units, other types of windows, etc.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 13, 2014
    Inventors: Anton Dietrich, Bernd Disteldorf, Piotr Kokot, Adam Tokarz
  • Publication number: 20140072785
    Abstract: A laminated body is provided that exhibits impact resistance, wear resistance and scratch resistance, and which enables a reduction in weight together with a reduction in the dielectric constant. The laminated body 100 includes a first tabular member 10 configured from a ceramic material and having a first thickness t1, and a second tabular member 20 configured from a polymer material and having a second thickness t2. The laminated body 100 withstands a falling-ball impact breaking test from a height that is higher than that exhibited by a single layer body that is configured from the ceramic material and of a thickness t3 that is the sum of the first thickness t1 and the second thickness t2.
    Type: Application
    Filed: September 6, 2013
    Publication date: March 13, 2014
    Applicant: NGK INSULATORS, LTD.
    Inventors: Takeshi KAKU, Hidehiko TANAKA, Kazuyoshi SHIBATA, Hideki SHIMIZU
  • Publication number: 20140064052
    Abstract: According to one embodiment, an optical storage medium includes a guide layer, a recording layer group, and a guide layer-side intermediate layer. The recording layer group comprises a plurality of recording layers and a plurality of intermediate layers arranged between the plurality of recording layers. The guide layer-side intermediate layer is arranged between the guide layer and a first recording layer closest to the guide layer out of the plurality of recording layers. A thickness T1 of the guide layer-side intermediate layer does not match a sum S1 of thicknesses of arbitrary continuous intermediate layers comprised in the recording layer group.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 6, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuo Watabe, Hideaki Okano, Akihito Ogawa
  • Publication number: 20140065390
    Abstract: Light weight composites with high flexural strength comprise epoxy foam sandwiched between two layers of facing material have high strength and low weight and can be used to replace steel structures. The facing layer may be fibrous material especially glass or carbon fibres, the facing material is preferably embedded into the epoxy matrix. Alternatively they may be matching box structures or concentric metal tubes. The sandwich structures may be prepared by laying up the fibre; coating and/or impregnating the layer with epoxy resin, laying a layer of heat activatable foamable epoxy material, providing a further layer of the fibrous material optionally coated and/or impregnated with epoxy resin on the foamable material and heating to foam and cure the epoxy materials. Alternatively they may be formed by extrusion of the foamable material between the surface layers.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 6, 2014
    Applicant: ZEPHYROS, INC,
    Inventors: Eric Le Gall, Frederic Ostrowsky, Denis Souvay
  • Publication number: 20140057088
    Abstract: The present disclosure describes compositions, devices, systems, and methods for producing films which simplify the application process by eliminating the need to stretch film before it is wrapped around a load. Such films also provide enhanced load containment and increased resistance to punctures and breaks. In particular, the present disclosure relates to the use of selected resins and an angled die to increase the level of orientation in the film as it is formed.
    Type: Application
    Filed: June 18, 2013
    Publication date: February 27, 2014
    Inventor: Shaun Eugene Pirtle
  • Publication number: 20140048199
    Abstract: There are provided an adhesive tape and a method for producing a substrate using the same. The adhesive tape including: a reinforcement layer supporting the adhesive tape; a buffer layer formed on one surface of the reinforcement layer and performing a buffering operation; and an adhesive layer formed on one surface of the buffer layer.
    Type: Application
    Filed: October 18, 2012
    Publication date: February 20, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Jun Kim, Jong Sik Kim
  • Publication number: 20140050908
    Abstract: A transparent conductive film comprises: a film substrate having two main surfaces; and a transparent conductor layer formed on one main surface of the film substrate. The transparent conductor layer is composed of three layers in which a first indium tin oxide layer, a second indium tin oxide layer, and a third indium tin oxide layer are laminated in this order from the film substrate side. The first indium tin oxide layer has a smaller tin oxide content than the second indium tin oxide layer has. The third indium tin oxide layer has a smaller tin oxide content than the second indium tin oxide layer has.
    Type: Application
    Filed: October 1, 2012
    Publication date: February 20, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomotake Nashiki, Tomonori Noguchi, Motoki Haishi, Kuniaki Ishibashi
  • Publication number: 20140050906
    Abstract: Provided is an injection molded panel, a mold for forming the panel, and its method of manufacture. The panel is configured with a front surface and a back surface, the back surface being configured with one or more ribs integrally extending from the back surface via a transition wall portion. The transition wall portion in accordance with the disclosed subject matter is significantly thinner than the rib and/or the panel.
    Type: Application
    Filed: March 1, 2012
    Publication date: February 20, 2014
    Applicant: KETER PLASTIC LTD.
    Inventor: Efraim Haimoff
  • Patent number: 8652624
    Abstract: The invention provides an article comprising a first layer and a second layer, and wherein the first layer is formed from a first composition comprising an ethylene/?-olefin/diene interpolymer, an isoprene rubber (synthetic), a natural rubber, a butadiene rubber, a styrene butadiene rubber, a chloroprene rubber, a nitrile rubber, a hydrogenated nitrile rubber, a chlorinated polyethylene, a chlorosulfonated polyethylene, an ethylene/propylene rubber, an ethylene/diene copolymer, a fluoro rubber, a polyurethane, a silicone rubber, or a combination thereof; and wherein the second layer is formed from a second composition comprising a butyl rubber, a halobutyl rubber, polyvinylidene chloride, a brominated polymer derived from a copolymer of isobutylene and p-methyl styrene, a nitrile rubber, a chloroprene rubber, a chlorosulfonated polyethylene, a chlorinated polyethylene, a polyurethane, a fluoro rubber, or a combination thereof.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: February 18, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Muthu Subramanian, Jinder Jow, Stephen Y. Cheng, Thiam Aik Lim