Abstract: A dielectric substrate comprises a resin composition impregnated with non-woven fibrous mat material having a thickness of 5 mils (127 micrometers), wherein the fibrous mat material comprises fibers, having a diameter of 1 nm to 10 ?m, that have been extruded through one or more openings to produce fibers that have been collected in the form of a fibrous non-woven mat, and wherein the fibers exhibit a multi-directional orientation in the non-woven mat material. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent electrical and mechanical properties.

Abstract: A pigment ink for ink-jet recording which is excellent in freezing resistance and fixability includes a pigment, an aqueous resin emulsion, polyethylene glycol and diethylene glycol. This ink satisfies the following formulae (1), (2) and (3): A<15??(1) A+B>10??(2) 30?A×?+B?64??(3) wherein: A is the content of polyethylene glycol (%); B is the content of diethylene glycol (%); and ? is the molecular weight ratio of polyethylene glycol to diethylene glycol.

Abstract: A black pigmented disposable food container is preferably made from a polypropylene matrix polymer, optionally including polyethylene and further includes a mineral filler and a black colorant composition consisting essentially of a black iron oxide pigment and a green pigment.

Abstract: A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle.

Abstract: On a support, a porous resin layer which is opaque in a water-unabsorbed state and capable of turning transparent in a water-absorbed state is formed, and also a water-repellent resin layer is so provided as to exist in the porous resin layer at its some area or areas in a co-existent state, to make up a water-metachromatic laminate. A novel toy element can be provided in which latent images standing invisible in a normal condition are rendered visible by means of water as a medium so as to be visually distinguished.

Abstract: On a support, a porous resin layer which is opaque in a water-unabsorbed state and capable of turning transparent in a water-absorbed state is formed, and also a water-repellent resin layer is so provided as to exist in the porous resin layer at its some area or areas in a co-existent state, to make up a water-metachromatic laminate. A novel toy element can be provided in which latent images standing invisible in a normal condition are rendered visible by means of water as a medium so as to be visually distinguished.

Abstract: On a support, a porous resin layer which is opaque in a water-unabsorbed state and capable of turning transparent in a water-absorbed state is formed, and also a water-repellent resin layer is so provided as to exist in the porous resin layer at its some area or areas in a co-existent state, to make up a water-metachromatic laminate. A novel toy element can be provided in which latent images standing invisible in a normal condition are rendered visible by means of water as a medium so as to be visually distinguished.

Abstract: An insulating paper container's body has a low m.p. thermoplastic synthetic resin film laminated on its outer wall surface and a compatibly expansile ink applied to the outer surface either as a primer or as indicia to provide stock material improved in its printability for bar codes or the like as well as in its insulating property. In addition there is provided a process for making such stock material.

Abstract: An insulation sheet for use in producing a wiring substrate comprises, as via bole conductors, conductive paste filled in via holes formed through the insulation sheet, and a curing-starting temperature of the conductive paste is lower than a melting-starting temperature of the insulation sheet. A wiring substrate is produced by laminating such insulation sheets, that have conductive paste in via holes, and subjecting this laminate to thermo-compression bonding, wherein deformation of via holes and dislocation of the via holes, because of a molten insulation sheet, does not occur.

Abstract: A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle.

Abstract: An insulating paper container's body has a low m.p. thermoplastic synthetic resin film laminated on its outer wall surface and a compatibly expansile ink applied to the outer surface either as a primer or as indicia to provide stock material improved in its printability for bar codes or the like as well as in its insulating property. In addition there is provided a process for making such stock material.

Abstract: A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle.

Abstract: A receptor medium with a sheet having a random microembossed imaging surface as one major surface thereof. The receptor medium can receive jettable materials, which include inks, adhesives, biological fluids, chemical assay reagents, particulate dispersions, waxes, electrically, thermally, or magnetically modifiable materials, and combinations thereof. The random microembossed medium unexpectedly solves such common inkjet printing problems as feathering, banding, and mudcracking in inkjet printing systems by controlling how an inkjet drop contacts and dries on an inkjet receptor medium and also Moire' effects. Clear lines of demarcation between adjoining colors of a pigmented inkjet image graphic can be obtained without creation of the Moire' effects. Methods of making and using the inkjet receptor medium are also disclosed.

Abstract: An irreversible heat-sensitive composition comprises a mixture of a granular or powdery heat-fusible substance having a melting point corresponding to a temperature to be recorded and a granular or powdery dyestuff diffusible into the fused heat-fusible substance through dispersion or dissolution. A heat-sensitive ink comprises the irreversible heat-sensitive composition and an ink vehicle capable of diffusing the fused heat-fusible substance therein. A heat-sensitive ink according to another embodiment comprises microcapsules, which encapsulate the irreversible heat-sensitive composition. A heat-sensitive indicator comprises a substrate provided thereon with a printed heat-sensitive ink, the heat-sensitive ink being one of these heat-sensitive inks.

Abstract: The insulation sheet for use in producing a wiring substrate comprises, as via hole conductors, conductive paste filled in via holes formed through the insulation sheet, and the curing-starting temperature of the conductive paste is lower than the melting-starting temperature of the insulation sheet.

Abstract: The present invention relates to a colored, preferably natural porous material comprising in its pores an effectively coloring amount of an organic pigment which is obtained by fragmenting a meltable or solvent-soluble pigment precursor in the presence of a thermally activated acid precursor, and to a low to medium temperature process for its preparation.

Abstract: The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.

Abstract: In an image-forming substrate, a layer of microcapsules is coated over a sheet of paper, and contains at least one type of microcapsule filled with a solid ink. A shell element of each microcapsule is constituted so as to be squashed and broken under a predetermined pressure when the solid ink of each microcapsule is thermally melted at a predetermined temperature to discharge thermally-molten ink from the squashed and broken microcapsule.

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a flexible resin film 1 which is provided with a copper foil 2 bonded to one surface thereof and an adhesive layer 3 bonded to the other surface, opening a through hole 7 in the copper plated resin film 10 through the resin film 1 and the adhesive layer 3, filling the through hole by screen printing from the copper foil 2 with a conductive paste to form a conductive paste filler 8 having a projection 8b as projected from the adhesive layer 3.

Abstract: A printing sheet used in a stamp includes a porous layer in which ink can be impregnated and a fibrous layer provided to a side of the porous layer opposite to the pattern. The porous layer carries a pattern on a surface thereof, the pattern including a non-print portion which blocks the permeation of the ink and a print portion which allows the permeation of the ink. The fibrous layer prevents the deformation of the porous layer. The fibrous layer is so constituted that ink can be impregnated therein.

Abstract: A through-hole wiring board comprising through-holes passing through a substrate and filled with an electroconductive material; copper foil lands and copper foil circuits formed on surfaces of the substrate; insulating layers formed on the copper foil circuits and between necessary portions of the copper foil lands and the copper foil circuits; and printed circuits (jumper circuits) formed by another electroconductive material having a different composition from that filling the through-holes on a part of the copper foil circuits, and the copper foil lands and the insulating layers except for unnecessary portions for electroconductivity; wherein the printed circuits and ends of the through-holes are electrically connected with an electroconductive material having a different composition from that filling the through-holes, permits easy formation of an electrical connection of the through-holes, has a high reliability on connection and is suitable for industrial production.

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract: A printed wiring board (PWB) and assembly are described which are suitable for high density mounting of an electronic component and which can provide a thin and light assembly. A recess is formed in one part of a PWB and components are received in this recess. The components are lower than the surface of the PWB. A conductive pad is provided to the bottom of the recess and a connecting terminal and the conductive pad are electrically connected by using a solder ball or a conductive adhesive material. The recess is formed by partially removing one or more layers of plural conductive layers and insulating layers which make up the multilayer PWB.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: A decorative laminated sheet, sequentially comprising (A) a completely amorphous polyester resin layer and (B) a substrate layer composed of a polyolefin resin, a polyvinyl chloride resin, an acrylonitrile-butadiene-styrene resin, an acrylonitrile-styrene-acrylic acid ester resin, an acrylonitrile-ethylene propylene-styrene resin, a methyl methacrylate-butadiene-styrene resin, a polyethylene terephthalate or a completely amorphous polyester resin. Or a decorative laminated sheet comprising a substrate layer composed of (B) a completely amorphous polyester type resin layer and a transfer foil formed thereon.

Abstract: An information handling system is provided which comprises: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at lea