Composite Having A Component Wherein A Constituent Is Liquid Or Is Contained Within Preformed Walls (e.g., Impregnant-filled, Previously Void Containing Component, Etc.) Patents (Class 428/320.2)
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Patent number: 11643584Abstract: A process for forming an extruded composition using a wet-spin dry-jet technique including forming a dispersion dope by mixing phase change material with a first portion of solvent, and sonicating the mixture, forming a prime dope by combining a first portion of polymer and a second portion of solvent, forming an extrusion composition by combining the dispersion dope, the prime dope and a second portion of the polymer, rolling the extrusion composition, degassing the extrusion composition, extruding the extrusion composition through a spinneret, drying the extruded composition, and quenching the extruded composition. The weight fraction of the phase change material in the extruded composition can be greater than approximately 60%, and preferably greater than approximately 75%.Type: GrantFiled: August 27, 2018Date of Patent: May 9, 2023Assignee: Georgia Tech Research CorporationInventors: Stephen John Amon DeWitt, Ryan P. Lively, Héctor Octavio Rubiera Landa, Matthew J. Realff, Yoshiaki Kawajiri
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Patent number: 11570933Abstract: Exfoliated graphite materials, and composite materials including exfoliated graphite, having enhanced through-plane thermal conductivity can be used in thermal management applications and devices. Methods for making such materials and devices involve processing exfoliated graphite materials such as flexible graphite to orient or re-orient the graphite flakes in one or more regions of the material.Type: GrantFiled: December 18, 2018Date of Patent: January 31, 2023Assignee: 0908905 B.C. Ltd.Inventor: John Kenna
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Patent number: 11403446Abstract: The invention discloses a method for predicting a residual strength of a composite material after impact. The method includes: acquiring a first frequency value of a composite material to be tested after impact damage; determining a first frequency change rate according to an initial frequency value and the first frequency value of the composite material to be tested; inputting the first frequency change rate to a pre-constructed residual strength prediction model to predict a first residual strength of the composite material to be tested; the first frequency value and the initial frequency value being obtained by a modal test. Further, residual strength prediction may be performed on the composite material in service, the position and the size of impact damage, the impact energy, the shape and quality of the impact object are not required to be determined, which avoids a rigidity test of the composite material in service.Type: GrantFiled: September 10, 2021Date of Patent: August 2, 2022Assignee: GUANGZHOU UNIVERSITYInventors: Zhifang Zhang, Jingwen Pan, Jiyang Fu, Airong Liu, Jiurong Wu
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Patent number: 11337640Abstract: Provided are systems, methods, and kits for multifunctional smell assessment. The kits may comprise a first surface adhered by a first releasable adhesive comprising an odorous volatile compound; and the system for registering if the odorous volatile compound is detected by a user. The system or method may comprise queries for obtaining a first input on whether the user detects and identifies the odorous volatile compound, and an intensity by which the odor is perceived.Type: GrantFiled: December 3, 2020Date of Patent: May 24, 2022Assignees: MONELL CHEMICAL SENSES CENTER, TEMPLE UNIVERSITY—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATIONInventors: Pamela H. Dalton, Danielle Reed, Valentina Parma, Maureen O'Leary, Mackenzie Hannum
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Patent number: 11260611Abstract: Aspects of the present disclosure are directed to a doped composite rework material including a fiber-containing material, a resin-containing material, and a dopant, with the dopant configured to impart an identifying characteristic to the doped composite rework material; and methods for precluding rework of a previously reworked composite material.Type: GrantFiled: January 2, 2019Date of Patent: March 1, 2022Assignee: The Boeing CompanyInventors: Tony Dean Hicks, William B. Nichols, Kathryn Mary Nowicki
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Patent number: 10670186Abstract: A fiber reinforced energetic composite is provided. The fiber reinforced energetic composite includes reinforcing fiber embedded in a cured polymer matrix and energetic polymer nanocomposite disposed in the reinforcing fiber. The energetic polymer nanocomposite including core-shell nanoparticles entrained in a polymer matrix. The core-shell nanoparticles include a core made of a metal and at least one shell layer made of a metal oxide disposed on the core or a core made a metal oxide and at least one shell layer made of a metal disposed on the core. The method of making a fiber reinforced energetic composite is also provided. Further, a composite container made of fiber reinforced energetic composite is further provided.Type: GrantFiled: November 18, 2016Date of Patent: June 2, 2020Assignee: Cornerstone Research Group, Inc.Inventors: Michael D. Rauscher, Thomas J. Barnell, Gary N. Cupp, Michael J. Fisher, Ryan D. Snyder
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Patent number: 10383232Abstract: A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.Type: GrantFiled: March 27, 2018Date of Patent: August 13, 2019Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen
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Patent number: 10366634Abstract: A method of making a chemiluminescent label by creating an outer layer of the chemiluminiscent label, creating a bottom layer of the chemiluminiscent label, and fusing the outer layer and the bottom layer to form at least one cavity between the outer layer and the bottom layer. The outer layer includes an image with a first plurality of regions. The bottom layer includes an adhesion material on a side not proximate to the outer layer, and a second plurality of regions corresponding to the first plurality of regions that are configured to break at a plurality of different pressure values.Type: GrantFiled: February 1, 2018Date of Patent: July 30, 2019Assignee: Xerox CorporationInventor: George A. Gibson
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Patent number: 9676148Abstract: A system and method for temporarily sealing holes in a perforated material layer of a composite acoustic panel so as to reduce potential migration of a release agent through the holes during a curing process and to reduce ingression of water through the holes during a subsequent testing process. The release agent is applied to a tool, the barrier layer is arranged over the release agent, and a lay-up of elements, beginning with the perforated layer, are arranged over the barrier layer prior to heating the lay-up to form the panel. The barrier layer may be a substantially solid film, such as a plastic or nylon film, having a width of at least approximately twelve inches and a low vapor permeability with regard to the release agent. After the testing process is complete, the barrier layer may be peeled from the panel.Type: GrantFiled: August 4, 2014Date of Patent: June 13, 2017Assignee: Spirit AeroSystems, Inc.Inventor: Mark Anthony Wadsworth
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Patent number: 9435014Abstract: The invention discloses the internal structures and processes to synthesize the structure of self-healing materials, especially metallic materials, metal matrix micro and nanocomposites. Self-healing is imparted by incorporation of macro, micro or nanosize hollow reinforcements including nanotubes, filled with low melting healing material or incorporation of healing material in pockets within the metallic matrix; the healing material melts and fills the crack. In another concept, macro, micro and nanosize solid reinforcements including ceramic and metallic particles, and shape memory alloys are incorporated into alloy matrices, specially nanostructured alloy matrices, to impart self healing by applying compressive stresses on the crack or diffusing material into voids to fill them.Type: GrantFiled: June 27, 2013Date of Patent: September 6, 2016Inventor: Pradeep Kumar Rohatgi
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Patent number: 9162220Abstract: A process for preparing a catalyst material comprising an electrically conducting support material, a proton-conducting, polyazole-based polymer and a catalytically active material. A catalyst material prepared by the process of the invention. A catalyst ink comprising a catalyst material of the invention and a solvent. A catalyst-coated membrane (CCM) comprising a polymer electrolyte membrane and also catalytically active layers comprising a catalyst material of the present invention. A gas diffusion electrode (GDE) comprising a gas diffusion layer and a catalytically active layer comprising a catalyst material of the invention. A membrane-electrode assembly (MEA) comprising a polymer electrolyte membrane, catalytically active layers comprising a catalyst material of the invention, and gas diffusion layers. And a fuel cell comprising a membrane-electrode assembly of the present invention.Type: GrantFiled: October 21, 2011Date of Patent: October 20, 2015Assignee: BASF SEInventors: Ömer Ünsal, Sigmar Bräuninger, Claudia Querner, Ekkehard Schwab
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Patent number: 8837151Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.Type: GrantFiled: December 19, 2011Date of Patent: September 16, 2014Assignee: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Publication number: 20140242375Abstract: Laminated glass articles and methods for making the same are disclosed. In one embodiment, a laminated glass article may include a glass core layer and at least one glass cladding layer fused to the glass core layer. The at least one glass cladding layer may be phase separated into a first phase and at least one second phase having different compositions. The first phase of the at least one glass cladding layer may have an interconnected matrix. The at least one second phase of the at least one glass cladding layer may be dispersed throughout the interconnected matrix of the first phase of the at least one glass cladding layer. In some embodiments, the at least one second phase may be selectively removed from the interconnected matrix leaving a porous, interconnected matrix of the first phase.Type: ApplicationFiled: March 12, 2013Publication date: August 28, 2014Applicant: Corning IncorporatedInventors: John Christopher Mauro, Ronald John Parysek, Natesan Venkataraman
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Publication number: 20140227510Abstract: An at least two layer rotomoulded article can include a layer A and a layer B. Layer A can include an aliphatic polyester selected from polyhydroxyalkanoate, poly(lactic acid), polycaprolactone, copolyesters and polyesteramides. Layer A can include a polyolefin. Layer A can include a co- or ter-polymer that includes ethylene or styrene monomer, an unsaturated anhydride-containing monomer, epoxide-containing monomer, or carboxylic acid-containing monomer, and a (meth)acrylic ester monomer. Layer B can include a polyolefin and a polyester. Layer B can include a co- or ter-polymer that includes an ethylene or a styrene monomer, an unsaturated anhydride-containing monomer, epoxide-containing monomer, or carboxylic acid-containing monomer, and a (meth)acrylic ester monomer.Type: ApplicationFiled: September 7, 2012Publication date: August 14, 2014Applicant: TOTAL RESEARCH & TECHNOLOGY FELUYInventor: Eric Maziers
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Patent number: 8741978Abstract: A prepreg which is capable of being cured-in-place into a solid surface by irradiation, heating or a combination of the two is prepared. The cured-in-place solid surfaces can be used as veneer cladding for rigid substrates such as floor and wall tiles, kitchen and bath counter tops, sinks, cabinet door veneers, bath surrounds, architectural surfaces such as columns and roofs and the like.Type: GrantFiled: November 30, 2006Date of Patent: June 3, 2014Assignee: Ashland Licensing and Intellectual Property LLCInventors: Thomas M. Moy, Becky E. Bushong, David A. Hutchings, Danny G. Hartinger, John Martin, Jr.
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Patent number: 8734941Abstract: The present invention is directed to an energy absorption system for absorbing mechanical impact energy using one or more chemicals for promoting absorption of a liquid, and optionally including one or more promoter, recovery agent, and/or viscosity adjusting agent, which allows the system to release the absorbed energy.Type: GrantFiled: December 6, 2005Date of Patent: May 27, 2014Inventor: Yu Qiao
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Patent number: 8722172Abstract: There is disclosed a honeycomb structure onto which a large amount of catalyst can be carried while suppressing an increase in pressure drop. In a honeycomb structure comprising porous partition walls by which a plurality of cells that become through channels of a fluid are partitioned and in which a plurality of pores are formed. In each of the partition walls, pores having pore diameters larger than a thickness of the partition wall in a section thereof which is perpendicular to an extending direction of the cells are formed so as to occupy 4 to 11% of the total volume of the pores formed in the partition walls.Type: GrantFiled: March 1, 2012Date of Patent: May 13, 2014Assignee: NGK Insulators, Ltd.Inventors: Koichi Sendo, Hiroyuki Suenobu, Shogo Hirose
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Patent number: 8722196Abstract: Proposed are a composite material having a high adhesiveness, wherein non-penetrating pores that are formed in a silicone surface layer are filled up with a metal or the like without leaving any voids by using the plating technique and the silicone surface layer is coated with the metal or the like, and a method of producing the composite material. A composite material, which has a high adhesiveness between a second metal or an alloy of the second metal (106a, 106b) and a silicone surface, can be obtained by filling up non-penetrating pores that are formed in the surface of a silicone substrate (100) substantially with a second metal or an alloy of the second metal (106a) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point, and coating the surface of the silicone substrate (100) with the second metal (106b).Type: GrantFiled: March 2, 2009Date of Patent: May 13, 2014Assignee: Japan Science and Technology AgencyInventors: Shinji Yae, Tatsuya Hirano, Hitoshi Matsuda
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Patent number: 8651850Abstract: The invention concerns a device for stiffening a flat component, a process for the production of a flat component, in particular a fiber composite component, and a fiber composite component. The device has a portion for producing a space for receiving a mold core for the transmission of a pressure for pressing the flat component and the device. It is characterised by means for positively lockingly and/or frictionally lockingly positioning the mold core in the space of the device. The process according to the invention includes the following steps: introducing the mold core into the portion of the device, positively lockingly and/or frictionally lockingly positioning the mold core in the portion of the device by means of the means, applying the device including the mold core to the non-hardened material layer or layers, pressing the material layers, and hardening the material layer or layers and joining the device to the material layer or layers.Type: GrantFiled: July 14, 2009Date of Patent: February 18, 2014Assignee: Airbus Operations GmbHInventors: Torben Jacob, Ivar Wiik
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Publication number: 20140017485Abstract: The assembly is made up of: a) a support including a mesoporous coating whose pores have an average diameter dimensioned so as to enable molecules from the family of cyanines to penetrate them, and b) a layer of molecules from the family of cyanines and organized into J-aggregates within the pores of the coating. The assembly moreover includes Quantum Dots located within the same pores as those containing the J-aggregates, the Quantum Dots maintaining J-aggregates structure. A method for producing such an assembly is also described.Type: ApplicationFiled: July 15, 2013Publication date: January 16, 2014Applicant: CSEM Centre Suisse d'Electronique et de Microtechnique SA Recherche et DeveloppementInventors: Bernard WENGER, Emmanuel SCOLAN, Raphael PUGIN, Rolf STEIGER
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Publication number: 20130344316Abstract: A composite material combining—a precious metal or an alloy containing a precious metal—and a boron-based ceramic having a melting point greater than that of said precious metal and a density at most equal to 4 g/cm3.Type: ApplicationFiled: March 8, 2011Publication date: December 26, 2013Inventors: Senad Hasanovic, Andreas Mortensen, Ludger Weber, Reza Tavangar
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Publication number: 20130309484Abstract: The invention provides nanostructure composite porous silicon and carbon materials, and also provides carbon nanofiber arrays having a photonic response in the form of films or particles. Composite materials or carbon nanofiber arrays of the invention are produced by a templating method of the invention, and the resultant nanomaterials have a predetermined photonic response determined by the pattern in the porous silicon template, which is determined by etching conditions for forming the porous silicon. Example nanostructures include rugate filters, single layer structures and double layer structures. In a preferred method of the invention, a carbon precursor is introduced into the pores of a porous silicon film. Carbon is then formed from the carbon precursor.Type: ApplicationFiled: September 29, 2011Publication date: November 21, 2013Applicant: THE REGENTS OF THE UNIVERSITY OFCALIFORNIAInventors: Michael J. Sailor, Timothy Kelly
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Patent number: 8580374Abstract: A resin molded body comprises a front surface layer disposed on a front surface side, a back surface layer disposed on a back surface side, and an intermediate layer disposed between the front surface layer and the back surface layer, each of the layers has a micro-phase separated structure including lamellar micro domains, each of the micro domains of the layers has a wave-like shape having amplitudes in the opposite direction of the front surface and the back surface, a maximum value of predetermined distances in the micro domains of the front surface layer and a maximum value of predetermined distances in the micro domains of the back surface layer are larger than the wavelength in the visible light range, and predetermined distances in the micro domains of the intermediate layer are equal to or less than the wavelength in the visible light range.Type: GrantFiled: June 27, 2012Date of Patent: November 12, 2013Assignee: Hamamatsu Photonics K.K.Inventors: Shigeo Hara, Takahiko Yamanaka
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PREPREG AND PRINTED CIRCUIT BOARD COMPRISING THE SAME AND MANUFACTURING METHOD PRINTED CIRCUIT BOARD
Publication number: 20130269989Abstract: The present invention relates to a prepreg including an insulating resin composition impregnated into a substrate including a fibrous material and a porous support, and a printed circuit board including the same as an insulating layer. According to the present invention, it is possible to improve fire resistance, reduce weight, and reinforce mechanical characteristics by using a mixture of the fibrous material and the porous support as the substrate used for impregnation of the insulating resin composition and disposing the porous support around the fibrous material. Further, it is possible to reinforce local/overall strengths, facilitate manufacture of the product, increase resistance to bending stress, aseismatic, fireproof, and durable types, and secure improvement in a coefficient of thermal expansion by combining the porous support and a base resin and disposing the fibrous material in a main structural part which receives a force.Type: ApplicationFiled: April 9, 2013Publication date: October 17, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Yoon Shik KIM -
Patent number: 8518531Abstract: The invention discloses the internal structures and processes to synthesize the structure of self-healing materials, specially metallic materials, metal matrix micro and nanocomposites. Self healing is imparted by incorporation of macro, micro or nanosize hollow reinforcements including nanotubes, filled with low melting healing material or incorporation of healing material in pockets within the metallic matrix; the healing material melts and fills the crack. In another concept, macro, micro and nanosize solid reinforcements including ceramic and metallic particles, and shape memory alloys are incorporated into alloy matrices, specially nanostructured alloy matrices, to impart self healing by applying compressive stresses on the crack or diffusing material into voids to fill them.Type: GrantFiled: August 7, 2009Date of Patent: August 27, 2013Inventor: Pradeep K. Rohatgi
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Patent number: 8512856Abstract: The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate, which is made of an aluminum plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.Type: GrantFiled: August 7, 2008Date of Patent: August 20, 2013Assignee: Ain Co., Ltd.Inventors: Koji Takeuchi, Masami Matsuda, Kaoru Ono, Makoto Hosoda
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Patent number: 8507079Abstract: A structural color body is film-like and comprises a front surface layer disposed on a front surface side and a back surface layer disposed on a back surface side, the front surface layer and the back surface layer contain block copolymers and have micro-phase separated structures including lamellar micro domains, each of the micro domains has a wave-like shape having amplitudes in the thickness direction of the structural color body, a maximum value of distances predetermined in the micro domains of the front surface layer is larger than the wavelength in the visible light range, and distances predetermined in the micro domains of the back surface layer are equal to or less than the wavelength in the visible light range.Type: GrantFiled: June 27, 2012Date of Patent: August 13, 2013Assignee: Hamamatsu Photonics K.K.Inventors: Shigeo Hara, Takahiko Yamanaka
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Patent number: 8501305Abstract: The present invention relates to laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterized in that the first melt flow index is lower than the second melt flow index. The invention also relates to a microfluidic device comprising the laminate and a method for incorporating an ink pattern in the laminate.Type: GrantFiled: January 16, 2008Date of Patent: August 6, 2013Assignee: Agilent Technologies, Inc.Inventor: David Barlow
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Patent number: 8497021Abstract: Superoleophilic particles and surfaces and methods of making the same are described. The superoleophilic particles can include porous particles having a hydrophobic coating layer deposited thereon. The coated porous particles are characterized by particle sizes ranging from at least 100 nm to about 10 ?m and a plurality of nanopores. Some of the nanopores provide flow through porosity. The superoleophilic particles also include oil pinned within the nanopores of the porous particles The plurality of porous particles can include (i) particles including a plurality of spaced apart nanostructured features comprising a contiguous, protrusive material, (ii) diatomaceous earth particles, or (iii) both. The surfaces can include the superoleophilic particles coupled to the surface.Type: GrantFiled: October 8, 2010Date of Patent: July 30, 2013Assignee: UT-Battelle, LLCInventors: John T. Simpson, Brian D'Urso
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Patent number: 8481152Abstract: A treated refractory material includes a porous refractory material having one or more protective materials disposed within pores of the refractory material. Methods of preparing the treated refractory material are also provided. The treated refractory material provides protection from the penetration of slag and extends the service life of the refractory material.Type: GrantFiled: August 14, 2008Date of Patent: July 9, 2013Assignee: General Electric CompanyInventors: Roman Shuba, Wei Chen, Anthony Mark Thompson
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Patent number: 8475890Abstract: The present invention provides transparent chips with natural metal-like texture by coating silica-containing transparent chips with colored material, such as a metal powder, in a transparent resin as a base resin. The present invention also provides artificial stone with natural metal-like texture and patterns by mixing the colored material coated transparent chips and inorganic filler with a matrix resin. The artificial stone of the present invention can be prepared by mixing about 4 to about 24 parts by weight of inorganic filler and about 0.1 to about 5.0 parts by weight of the colored material coated transparent chips, per about 1 part by weight of the matrix resin. The colored material coated transparent chips can have a specific gravity of about 2.0 to about 2.65, while the matrix resin can have a specific gravity of about 2.2 to about 2.Type: GrantFiled: October 6, 2010Date of Patent: July 2, 2013Assignee: Cheil Industries Inc.Inventors: Doo Kyo Jeong, Soo Jheong Choi, Hee Cheol Lee, Han Ju Kang, Chang Ho Son
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Patent number: 8465669Abstract: To obtain a non-particle-aggregation-type organic polymer monolith separation medium, there is provided a monolith separation medium comprising a skeletal phase and pores being continuous in the form of three-dimensional network, which skeletal phase on its surface has a functional group permitting introduction of a new functional group. The skeletal phase has a non-particle-aggregation-type co-continuous structure having an average diameter of submicron to micrometer size, and is constituted of an addition polymer from an epoxy compound of bi- or higher functionality and an amine compound of bi- or higher functionality. Further, the skeletal phase is enriched in organic matter and does not contain any carbon atoms derived from aromatic series.Type: GrantFiled: August 3, 2011Date of Patent: June 18, 2013Assignee: Shimadzu CorporationInventor: Ken Hosoya
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Patent number: 8460791Abstract: The present invention concerns microcapsules comprising a capsule core and a capsule wall composed of thermoset polymer and also, disposed on the outer surface of the capsule wall, a polyelectrolyte having an average molecular weight in the range from 500 g/mol to 10 million g/mol, and also a process for their production and their use in bindered building materials, textiles, heat transfer fluids and dumped beds.Type: GrantFiled: July 5, 2007Date of Patent: June 11, 2013Assignee: BASF AktiengesellschaftInventors: Hans-Peter Hentze, Dieter Niederberger, Hans Willax, Joachim Burger, Daniel Pascual Gienap
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Publication number: 20130143030Abstract: Disclosed herein are a prepreg including an insulating resin composition impregnated into a porous support, and a printed circuit board including the same as an insulating layer. According to the present invention, the porous support used for impregnation of the insulating resin composition has excellent thermal stability and wide surface area, a coefficient of thermal expansion (CTE) of the porous support is not changed according to directivity, and the prepreg has a structure in which fillers included in the insulating resin composition are dispersed between the porous supports, such that the CTE may be efficiently improved. In addition, although damage is generated from the outside, the damage is not enlarged due to adjacent porous supports but is only locally generated and physical properties for pressure load is excellent due to the porous structure, such that damage of the printed circuit board may be reduced.Type: ApplicationFiled: December 3, 2012Publication date: June 6, 2013Applicant: C/O SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: c/o Samsung Electro-Mechanics Co., Ltd.
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Patent number: 8455091Abstract: A product made by the method comprising forming a porous body of a first material, forming a plurality of recesses in a surface of such body, inserting wicks into such recesses and infusing a molten second material into the interior of the first material by injecting the second material into and through such wicks.Type: GrantFiled: July 20, 2011Date of Patent: June 4, 2013Assignee: Audi AGInventors: Adam Drozny, Juergen Joos, Gregor Stuehler
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Patent number: 8440294Abstract: A structural color body is film-like and formed of a resin layer containing a block copolymer, the resin layer has a micro-phase separated structure including lamellar micro domains, each of the micro domains has a wave-like shape having amplitudes in the thickness direction of the structural color body, and in each of the micro domains, a maximum value of distances in the direction between the tops of convexities and the bottoms of concavities is larger than the wavelength in the visible light range.Type: GrantFiled: June 27, 2012Date of Patent: May 14, 2013Assignee: Hamamatsu Photonics K.K.Inventors: Shigeo Hara, Takahiko Yamanaka
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Patent number: 8415411Abstract: A filler composition comprising one or more ester-containing compounds and one or more ether-containing compounds.Type: GrantFiled: October 2, 2007Date of Patent: April 9, 2013Inventor: John Paul Simmons, II
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Patent number: 8394490Abstract: A film-like structural color body comprises a front surface layer disposed on a front surface side, a back surface layer disposed on a back surface side, and an intermediate layer disposed between the front surface layer and the back surface layer, the front surface layer, the back surface layer and the intermediate layer contain block copolymers and have micro-phase separated structures including lamellar micro domains, each of the micro domains has a wave-like shape having amplitudes in the thickness direction of the structural color body, a maximum value of predetermined distances in the micro domains of the front surface layer and a maximum value of predetermined distances in the micro domains of the back surface layer are larger than the wavelength in the visible light range, and predetermined distances in the micro domains of the intermediate layer are equal to or less than the wavelength in the visible light range.Type: GrantFiled: June 27, 2012Date of Patent: March 12, 2013Assignee: Hamamatsu Photonics K.K.Inventors: Shigeo Hara, Takahiko Yamanaka
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Publication number: 20130052429Abstract: A multiwall sheet can comprise plastic walls, wherein the walls comprise a first wall; a second wall; and a transverse wall, wherein the first wall, the second wall, and the transverse wall extend longitudinally; and a rib extending between adjacent walls; and a sound insulating material disposed in an area between two adjacent walls, wherein the sound insulating material has a velocity of sound greater than the velocity of sound of the plastic walls. A method of sound insulating a structure can comprise: filling the multiwall sheet with a sound insulating material; and attaching the multiwall sheet to the structure.Type: ApplicationFiled: August 22, 2011Publication date: February 28, 2013Applicant: SABIC INNOVATIVE PLASTICS IP B.V.Inventors: Chinniah Thiagarajan, Arun Selvaraj Kousalya, Frans Adriaansen
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Publication number: 20130001803Abstract: A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.Type: ApplicationFiled: June 30, 2011Publication date: January 3, 2013Applicant: Infineon Technologies AGInventors: Manfred Mengel, Joachim Mahler, Khalil Hosseini, Horst Theuss
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Patent number: 8313825Abstract: A curable resin with at least one electrically conductive metal region on its surface formed by depositing on the surface a composition comprising activator, contacting the activator with a solution of a reducing agent and a solution of a metal ion, the reducing agent and metal ion undergoing chemical reaction activated by the activator to form an electrically conductive metal region on the surface, and method of forming is provided.Type: GrantFiled: September 19, 2007Date of Patent: November 20, 2012Assignees: Hexcel Composites Limited, Conductive Inkjet Technology LimitedInventors: Martin Simmons, John Leslie Cawse, Ian Rees, Xiuyan Sun
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Patent number: 8309210Abstract: A laminate for a printed wiring board (PWB) in which the laminate has a resin system containing a binder. The binder is made of ultra-fine binding particles that reinforce the resin system thereby reducing adhesive and cohesive failure of the laminate. The particles in addition to reducing occurrences such as pad cratering, eyebrowing, and tail-cracking, have the benefits of increasing thermal heat transfer and reducing resin shrinkage. The particles are preferably the same material as a reinforcing material contained in the laminate which can be a woven glass.Type: GrantFiled: September 13, 2010Date of Patent: November 13, 2012Assignee: Rockell Collins, Inc.Inventor: Roy M. Keen
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Patent number: 8273208Abstract: A structural composite laminate and method of making the same are provided. The laminate includes first and second skins or laminas, and a core positioned between the first and second laminas. The core contains thermoplastic and/or substantially inelastic polymeric particles with inter-particle interstices between the polymeric particles. Optionally, the polymeric particles are arranged discontinuously to establish gaps between adjacent particles along at least one dimension of the laminate.Type: GrantFiled: September 14, 2005Date of Patent: September 25, 2012Assignee: Intrinsix, LLCInventor: Timothy Alan Brinner
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Publication number: 20120202046Abstract: A densified silicon carbide body having excellent mechanical strength. This body is obtained by a method of densifying a porous silicon carbide substrate that includes the steps of impregnating a porous silicon carbide substrate with a curable silicone composition that contains a silicon carbide powder, curing the silicone composition, and thermally decomposing the cured product in a non-oxidizing atmosphere. The porous silicon carbide substrate can be densified and improved easily.Type: ApplicationFiled: October 7, 2010Publication date: August 9, 2012Inventor: Yoshitaka Aoki
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Patent number: 8216668Abstract: The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 ?m to 0.8 ?m, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment.Type: GrantFiled: October 2, 2007Date of Patent: July 10, 2012Assignee: Sumitomo Bakelite Company, Ltd.Inventor: Michio Kimura
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Publication number: 20120167666Abstract: An article comprises one or more porous particles. Each porous particle comprises a polymer that provides a continuous solid phase including an external particle surface, and first and second discrete pores that are isolated from each other and dispersed within the continuous solid phase. The porous particle further comprises a first marker material present in the first discrete pores, and a second marker material that is detectably different from the first marker material and is present within the second discrete pores. The marker materials can provide a means for identifying documents, clothing, or other articles as genuine, and providing a detectable security system.Type: ApplicationFiled: January 4, 2011Publication date: July 5, 2012Inventors: Mridula Nair, David F. Jennings, Tamara K. Jones, Joseph S. Sedita, Myra T. Olm
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Patent number: 8187696Abstract: A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.Type: GrantFiled: July 17, 2009Date of Patent: May 29, 2012Assignee: World Properties, Inc.Inventors: Sankar K. Paul, Christopher J. Caisse, Dirk M. Baars, Allen F. Horn, III
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Patent number: 8158239Abstract: An identification medium provided with a laminated structure comprises laminated layers of a magnetically controllable layer, in which magnetic microcapsules are dispersed, and a color shifting layer.Type: GrantFiled: December 19, 2006Date of Patent: April 17, 2012Assignee: NHK Spring Co., Ltd.Inventors: Itsuo Takeuchi, Hidekazu Hoshino, Shinya Nasubida
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Patent number: 8153229Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150° C., per 100 parts by weight of an epoxy resin (A).Type: GrantFiled: April 24, 2007Date of Patent: April 10, 2012Assignee: The Yokohama Rubber Co., Ltd.Inventors: Takashi Kousaka, Mitsuhiro Iwata, Tomohiro Ito
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Patent number: 8142875Abstract: Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing: an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90° C.; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90° C. and has a softening point of not less than 120° C.; and a curing agent (D).Type: GrantFiled: April 24, 2007Date of Patent: March 27, 2012Assignee: The Yokohama Rubber Co., Ltd.Inventors: Takashi Kousaka, Mitsuhiro Iwata, Tomohiro Ito