Physical Dimension Specified Patents (Class 428/332)
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Patent number: 9558724Abstract: A guitar pick comprises a substrate layer and a diamond film layer or coating. The diamond film layer is composed of chemical vapor deposited diamond, or diamond-like carbon. The diamond film coating or layer is applied to the substrate in one or more layers under intense heat and low pressure. The substrate layer can be composed of at least one of steel, stainless steel, molybdenum, titanium, tungsten, copper, aluminum, tantalum and alloys thereof, silicon, silicon carbide, tungsten carbide, quartz, or sapphire. Coating of the diamond film layer may be achieved by plasma enhanced chemical vapor deposition (PECVD), ion beam deposition (IBD), plasma-assisted deposition, cathodic arc deposition, hot filament chemical vapor deposition (HFCVD), or microwave plasma-assisted chemical vapor deposition (MPCVD).Type: GrantFiled: December 18, 2015Date of Patent: January 31, 2017Inventor: Gerald T. Mearini
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Patent number: 9548142Abstract: The high-withstanding-voltage member includes an alumina sintered compact containing alumina as a main crystal. Furthermore, the alumina sintered compact exhibits a peak intensity of 5000 or less at a wavelength of about 330 nm when measured by a cathode luminescence method.Type: GrantFiled: May 31, 2013Date of Patent: January 17, 2017Assignee: KYOCERA CORPORATIONInventors: Satoshi Toyoda, Hidehiro Takenoshita
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Patent number: 9509227Abstract: In a general aspect, a bridge circuit can include a first bridge including a first plurality of MOSFETs and including a first input terminal and a second input terminal, and a second bridge including a second plurality of MOSFETs and including a third input terminal and a fourth input terminal. The first bridge and the second bridge can be coupled in parallel and being coupled to a first load terminal and a second load terminal.Type: GrantFiled: January 9, 2015Date of Patent: November 29, 2016Assignee: Fairchild Semiconductor CorporationInventors: Joseph A. Yedinak, Scott Pearson, Mark L. Rinehimer, Sungjin Kuen
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Patent number: 9493595Abstract: The invention relates to a copolymer composition of poly(vinylidene fluoride-trifluoropropene) copolymers. The copolymers formed have excellent optical properties, with very low haze, as well as high melting points, excellent flexibility and toughness.Type: GrantFiled: June 18, 2009Date of Patent: November 15, 2016Assignee: Arkema Inc.Inventors: Mehdi Durali, David A. Mountz
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Patent number: 9466558Abstract: According to one embodiment, a semiconductor device includes a semiconductor element, amounting substrate which has wiring layers containing copper, and a joining layer which is provided between the semiconductor element and the wiring layer and made of an alloy containing copper and metal other than copper, and in which a melting point of the alloy is higher than a melting point of the metal.Type: GrantFiled: July 31, 2014Date of Patent: October 11, 2016Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Yo Sasaki, Atsushi Yamamoto, Yuuji Hisazato, Hitoshi Matsumura
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Patent number: 9412677Abstract: Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally induced stresses and conform to warped or uneven surfaces. Embodiments of electronic device packages including a semiconductor die mounted to and electrically connected to the interposer, as well as methods for forming the electronic device packages, are also disclosed. In one electronic device package, the semiconductor die is electrically connected to the interposer with wire bonds attached to a routing layer of the interposer. In another electronic device package, the semiconductor die is electrically connected to the interposer by bonding the semiconductor die to the flexible solder pad elements of the interposer in a flip-chip configuration.Type: GrantFiled: August 20, 2007Date of Patent: August 9, 2016Assignee: Micron Technology, Inc.Inventor: Teck Kheng Lee
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Patent number: 9412404Abstract: A magnetic storage medium according to one embodiment includes a substrate; an onset layer formed above the substrate, the onset layer comprising ruthenium and titanium oxide; and a magnetic oxide layer formed directly on the onset layer. A method according to one embodiment includes sputtering using a target of ruthenium and titanium oxide for forming an onset layer above a substrate, the onset layer comprising ruthenium and titanium oxide; and forming a magnetic oxide layer directly on the onset layer. Additional systems and methods are also presented.Type: GrantFiled: December 15, 2009Date of Patent: August 9, 2016Assignee: HGST Netherlands B.V.Inventors: Xiaoping Bian, Jack Jyh-Kau Chang, Mark F. Mercado, Mohammad T. Mirzamaani, Kai Tang
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Patent number: 9394430Abstract: A continuous fiber composite is described and methods for forming the continuous fiber composite. The continuous fiber composite includes a plurality of unidirectionally aligned continuous fibers embedded within a polyarylene sulfide polymer. The continuous fiber composite includes a very high loading of continuous fibers, for instance greater than about 40% by weight of the continuous fiber composite. The continuous fiber composite is formed by reacting a starting polyarylene sulfide with a reactively functionalized disulfide compound in a melt processing unit. Reaction between the starting polyarylene sulfide and the reactively functionalized disulfide compound leads to formation of a reactively functionalized polyarylene sulfide. Upon embedding of the continuous fibers into the reactively functionalized polyarylene sulfide, the reactivity of the polyarylene sulfide can enhance adhesion between the polyarylene sulfide polymer and the fibers.Type: GrantFiled: March 13, 2013Date of Patent: July 19, 2016Assignee: Ticona LLCInventors: Rong Luo, Aaron Johnson, Tim Tibor, Xinyu Zhao, David Eastep
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Patent number: 9376545Abstract: The present invention provides a resin composition which is excellent in gas-barrier properties after a hot-water treatment and excellent in handling properties without increasing viscosity of the resin composition in a melt-kneading step at forming. The invention provides a resin composition containing a thermoplastic resin (A) and a partially dehydrated product or completely dehydrated product (B) of hydrated carboxylic acid salt.Type: GrantFiled: August 7, 2009Date of Patent: June 28, 2016Assignee: THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD.Inventors: Shinji Okamoto, Hiroki Masumoto, Kouji Yamada, Tomonori Yoshida
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Patent number: 9371421Abstract: A crystalline polyamide ester resin is prepared by copolymerizing (A) a dicarboxylic acid component, (B) a diamine component, and (C) a cyclic aliphatic diol component, and has a structure in which a dicarboxylic acid moiety derived from the dicarboxylic acid component (A), a diamine moiety derived from the diamine component (B) and a cyclic aliphatic diol moiety derived from the cyclic aliphatic diol component (C) are repeated. A molar ratio ((B):(C)) of the diamine component (B) to the cyclic aliphatic diol component (C) is about 80 to about 99:about 1 to about 20. The crystalline polyamide ester resin has a melting point (Tm) ranging from about 280° C. to about 320° C. and a crystallization temperature (Tc) ranging from about 260° C. to about 290° C. The crystalline polyamide ester resin can have excellent heat resistance, discoloration resistance and moldability.Type: GrantFiled: July 23, 2013Date of Patent: June 21, 2016Assignee: Cheil Industries Inc.Inventors: So Young Kwon, Jin Kyu Kim, Seung Youb Bang, Sang Kyun Im, Jin A Je, Ki Yon Lee, Suk Min Jun, Sung Chul Choi
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Patent number: 9334424Abstract: The present invention provided is the temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface to a support, and includes a first temporary adhesive layer which is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane resin containing a R21R22R23SiO1/2, and a SiO4/2 unit in a molar ratio of R21R22R23SiO1/2 unit/SiO4/2 unit of 0.6 to 1.7 and an organopolysiloxane represented by the following general formula (1), and a second temporary adhesive layer which is a thermosetting modified siloxane polymer layer (B) which is laminated on the first temporary adhesive layer and is releasably bonded to the support.Type: GrantFiled: April 23, 2013Date of Patent: May 10, 2016Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Masahito Tanabe, Michihiro Sugo, Shohei Tagami, Hiroyuki Yasuda, Hideto Kato
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Patent number: 9327472Abstract: A composite substrate with a degree of porosity, optionally of a carbon based material, and at least a first layer over coating the first portion by a predetermined amount, including at least a portion of the interior surfaces of the first portion and reducing the porosity of the composite substrate by a predetermined amount. The structure and composition of the composite substrate enable functionalities in different classes of completed devices ranging from energy conversion and storage, chemical processing and filtration.Type: GrantFiled: July 19, 2013Date of Patent: May 3, 2016Assignee: Integrated Photovoltaics, Inc.Inventors: Sharone Zehavi, Willibrordus Gerardus Maria van den Hoeck
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Patent number: 9314939Abstract: There is described a heat shield element comprising a hot side which is turned towards the hot medium, a cold side which is turned away from the hot medium, peripheral sides which connect the hot side to the cold side and a material volume which is defined by the hot side, the cold side and the peripheral sides, wherein the material volume comprises at least two material areas which are made of different materials. The materials are different from each other at least in respect of their resistance and/or thermal expansion coefficient.Type: GrantFiled: May 5, 2010Date of Patent: April 19, 2016Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Holger Grote, Andreas Heilos, Marc Tertilt
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Patent number: 9318626Abstract: High performance photovoltaic devices are provided. Certain embodiments relate to the use of Boron-Nitride (BN) thin films as anti-reflection coating (ARC) material on Si and GaAs solar cells. A low and wide reflectance window covering a large energy range of the solar spectrum is available. For a large part of the useful solar spectrum, the index of refraction of the grown BN thin films remains constant at about 2.8. In another embodiment, a BN ARC is applied directly on ordinary window glass providing the device's mechanical strength.Type: GrantFiled: April 23, 2014Date of Patent: April 19, 2016Assignee: THE UNIVERSITY OF HOUSTONInventors: Nacer Badi, Alex Freundlich, Abdelhak Bensaoula, Andenet Alemu
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Patent number: 9309589Abstract: A coated transparency including an electrically conductive multilayer stack is disclosed. The electrically conductive multilayer stack includes a first metal oxide layer including aluminum doped zinc (AZO), a metal layer including gold, and a second metal oxide layer including AZO. The electrically conductive multilayer stack has a low sheet resistance to provide radar attenuation and anti-static or static-dissipative properties, and has greater flexibility and resistance to corrosion than conventional multilayer stacks used to coat aircraft canopies and other substrates.Type: GrantFiled: June 21, 2011Date of Patent: April 12, 2016Assignee: PPG Industries Ohio, Inc.Inventors: Krishna Uprety, Alexander Bimanand, Khushroo H. Lakdawala
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Patent number: 9304461Abstract: The present invention relates to a pressure rotating member which achieves the shortening of a warm-up time while suppressing a non-recording material-contacting area's temperature rise. The pressure rotating member which is used in a thermal fixing apparatus includes: a substrate; and an elastic layer that is formed on the substrate and has a void, wherein the elastic layer contains a needle-shaped filler, wherein the needle-shaped filler has such a thermal conductivity ?1 of the elastic layer in a direction along a rotary axis of the pressure rotating member as to be 6 times or more and 900 times or less of a thermal conductivity ?2 of the elastic layer in a thickness direction.Type: GrantFiled: June 4, 2015Date of Patent: April 5, 2016Assignee: Canon Kabushiki KaishaInventors: Jun Miura, Yutaka Arai
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Patent number: 9297944Abstract: Provided are a composition for an optical film comprising 40 wt % to 94 wt % of an acrylic resin; 5 wt % to 40 wt % of a styrene-acrylonitrile copolymer having a weight-average molecular weight less than 1,000,000; and 1 wt % to 20 wt % of an ultra-high molecular weight styrene-acrylonitrile copolymer having a weight-average molecular weight ranging from 1,000,000 to 9,000,000, and an optical film using the composition.Type: GrantFiled: September 21, 2012Date of Patent: March 29, 2016Assignee: LG CHEM, LTD.Inventors: Jun-Wuk Park, Sang-Min Kwak, Jun-Geun Um, Nam-Jeong Lee, Suk-Il Youn
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Patent number: 9298058Abstract: A compound is disclosed. The compound has the general structure: wherein Y is selected from the group consisting of hydrocarbons, hydrocarbons including nitrogen in the carbon backbone, and hydrocarbons including oxygen in the carbon backbone; wherein R1 and R2 are each independently selected from the group consisting of hydrogen, linear hydrocarbons, branched hydrocarbons, and cyclic hydrocarbons and wherein R1 and R2 are not both hydrogen; wherein X is selected from the group consisting of CH2, O, N—R3, S, and nothing and wherein R3 is selected from the group consisting of hydrogen, branched hydrocarbons, linear hydrocarbons, and cyclic hydrocarbons; wherein m is an integer between 1 and 50, inclusive; wherein n is an integer between 1 and 10,000, inclusive; and wherein p, q, and z are each independently an integer greater than 0.Type: GrantFiled: January 24, 2012Date of Patent: March 29, 2016Assignee: Hewlett Packard Development Company, L.P.Inventors: Zhang-Lin Zhou, Qin Liu, Gregg Combs, James R. Owen
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Patent number: 9276326Abstract: An electromagnetic wave absorber contains cement and carbon nanotubes and has an absolute value of a complex relative permittivity in a range of from 2.0 to 10.0 in a frequency range of from 1 to 110 GHz and a minimum value of a dissipation factor of 0.35 or greater in the frequency range of from 1 to 110 GHz.Type: GrantFiled: July 9, 2013Date of Patent: March 1, 2016Assignee: KABUSHIKI KAISHA RIKENInventors: Keita Hirose, Takashi Ono
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Patent number: 9253924Abstract: An image display device comprising an image display panel, heat dispersion material positioned proximate to the image display panel, a frame system including a framework positioned proximate to the heat dispersion material opposite the image display panel, and a plurality of electronic components engaging the framework, where the image display device exhibits a support factor of less than about 150 mm-W/m° K. The framework can be adhesively bonded to the heat dispersion material. The framework can include a height and a width wherein the heat dispersion material substantially spans the height and the width. Additionally, a first cross support can span the framework and a plurality of second electronic components can engage the first cross support. Additionally a second cross support can span the framework wherein at least one of the second electronic components engages the second cross support.Type: GrantFiled: July 8, 2015Date of Patent: February 2, 2016Assignee: GrafTech International Holdings Inc.Inventors: Gary D. Shives, Gerald Hoffert, William Varela
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Patent number: 9251834Abstract: A magnetic recording medium includes a substrate, a magnetic layer including an alloy having an L10 type crystal structure as a main component thereof, and a plurality of underlayers arranged between the substrate and the magnetic layer. The plurality of underlayers include at least one crystalline underlayer which has a (100) orientation, and includes W as a main component thereof and one or more kinds of elements selected from a group consisting of Fe, Ni, Co, Hf, Zr, Y, Be, Ce, La, and Sc.Type: GrantFiled: October 1, 2014Date of Patent: February 2, 2016Assignee: SHOWA DENKO K.K.Inventors: Lei Zhang, Tetsuya Kanbe, Yuji Murakami, Kazuya Niwa
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Patent number: 9250462Abstract: An image display device comprising an image display panel, a frame system including a framework operatively engaging the image display panel and a plurality of electronic components operatively engaging the framework, heat dispersion material operatively engaging the framework and in operative thermal contact with the electronic components, where the frame system exhibits a support factor of less than about 150 mm-W/m° K.Type: GrantFiled: July 8, 2015Date of Patent: February 2, 2016Assignee: GrafTech International Holdings Inc.Inventors: Gary D. Shives, William Varela
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Patent number: 9238759Abstract: A flexible assembly is configured to be removably applied to a curved or planar surface of an underlying component. The assembly includes a flexible glass layer and an adhesive layer provided on at least one surface of the flexible glass layer. The flexible glass layer and the adhesive layer in combination enable the flexible assembly to be removably secured to the curved or planar surface.Type: GrantFiled: April 22, 2013Date of Patent: January 19, 2016Assignee: ROCKWELL COLLINS, INC.Inventors: Paul R. Nemeth, James D. Sampica, Kyle P. Dotson, Gary N. Prior
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Patent number: 9193209Abstract: A transfix blanket for a printer may include a substrate layer. A conformance layer may be disposed at least partially on the substrate layer. An adhesive layer may be disposed at least partially on the conformance layer. At least one of the conformance layer and the adhesive layer may include a plurality of infrared reflective pigments. A topcoat layer may be disposed at least partially on the adhesive layer. The topcoat may include an infrared absorptive material.Type: GrantFiled: February 14, 2014Date of Patent: November 24, 2015Assignee: XEROX CORPORATIONInventors: Brynn Dooley, Marcel Philippe Breton, Gordon Sisler, Santokh S. Badesha, David J. Gervasi, Mandakini Kanungo
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Patent number: 9186321Abstract: The present disclosure is directed to chemically-stable and pharmaceutically acceptable sildenafil oral spray formulations for the treatment of diseases such as pulmonary arterial hypertension and/or SSRI-induced sexual dysfunction, wherein the oral spray formulation has a pH of about 1.5 to less than 3.0. The present disclosure is also directed to methods for treating diseases such as pulmonary arterial hypertension and/or SSRI-induced sexual dysfunction.Type: GrantFiled: December 4, 2012Date of Patent: November 17, 2015Assignee: Suda Ltd.Inventors: David Bergstrom, Foye Opawale
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Patent number: 9180719Abstract: There is provided a lithographic printing plate substrate comprising (a) a base layer, (b) a layer of a first adhesive covering one side of the base layer except for at least two opposite edges thereof, and (c) an aluminum layer laminated onto the layer of first adhesive and said opposite edges of the base layer, the aluminum layer thereby being sealed with the base layer at said opposite edges of the base layer. There is also provided a method of manufacture thereof as well as a method of processing in view of recycling. Finally, there is provided a lithographic printing plate comprising the above substrate.Type: GrantFiled: April 20, 2011Date of Patent: November 10, 2015Assignee: MYLAN GROUPInventor: My T. Nguyen
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Patent number: 9183870Abstract: Methods to pattern substrates with dense periodic nanostructures that combine top-down lithographic tools and self-assembling block copolymer materials are provided. According to various embodiments, the methods involve chemically patterning a substrate, depositing a block copolymer film on the chemically patterned imaging layer, and allowing the block copolymer to self-assemble in the presence of the chemically patterned substrate, thereby producing a pattern in the block copolymer film that is improved over the substrate pattern in terms feature size, shape, and uniformity, as well as regular spacing between arrays of features and between the features within each array compared to the substrate pattern. In certain embodiments, the density and total number of pattern features in the block copolymer film is also increased. High density and quality nanoimprint templates and other nanopatterned structures are also provided.Type: GrantFiled: December 5, 2008Date of Patent: November 10, 2015Assignees: Wisconsin Alumni Research Foundation, HGST Netherlands B.V.Inventors: Paul Franklin Nealey, Huiman Kang, Francois Detcheverry, Juan J. De Pablo, Ricardo Ruiz, Thomas Albrecht
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Patent number: 9176256Abstract: A plastic mirror that includes a plastic substrate having a front surface, a hardcoating on the front surface, a reflective layer, and an intermediate zone between the hardcoating and the reflective layer, the intermediate zone including at least one layer formed from a material selected from the group consisting of metals and metalloids, oxides and nitrides of metals and metalloids, and carbon.Type: GrantFiled: December 24, 2010Date of Patent: November 3, 2015Assignees: University of South Australia, SMR Patents S.a.r.l. Le DomeInventors: Colin James Hall, Simon David Field, Kamil Zuber
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Patent number: 9162893Abstract: A method for making a carbon nanotube composite preform includes following steps. A substrate is provided. Carbon nanotubes are formed on the substrate. The carbon nanotubes and the substrate are placed in a solvent for a predetermined time. The carbon nanotubes and the substrate are drawn from the solvent. The carbon nanotubes and the substrate are dried.Type: GrantFiled: August 5, 2013Date of Patent: October 20, 2015Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Hai-Zhou Guo, Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Chang-Hong Liu, Kai-Li Jiang
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Patent number: 9164157Abstract: A magnetoresistive device includes a carrier, an xMR-sensor, a magnetic layer formed above an active xMR-region of the xMR-sensor and an insulating layer arranged between the xMR-sensor and the magnetic layer.Type: GrantFiled: February 2, 2011Date of Patent: October 20, 2015Assignee: Infineon Technologies AGInventor: Wolfgang Raberg
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Patent number: 9153435Abstract: Provided is a method of fabricating a semiconductor device. The method includes providing a silicon substrate having opposite first and second sides. At least one of the first and second sides includes a silicon (111) surface. The method includes forming a high coefficient-of-thermal-expansion (CTE) layer on the first side of the silicon substrate. The high CTE layer has a CTE greater than the CTE of silicon. The method includes forming a buffer layer over the second side of the silicon substrate. The buffer layer has a CTE greater than the CTE of silicon. The method includes forming a III-V family layer over the buffer layer. The III-V family layer has a CTE greater than the CTE of the buffer layer.Type: GrantFiled: May 12, 2014Date of Patent: October 6, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Ming Chen, Chung-Yi Yu, Chia-Shiung Tsai, Ho-Yung David Hwang
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Patent number: 9121182Abstract: Disclosed is a weight lifting station floor with a center portion that includes a resilient floor material, a translucent floor material, and a display layer positioned between the resilient floor material and the translucent floor material such that the display layer is visible through the translucent floor material, where the resilient floor material, the translucent floor material and the display layer are integrated together as a unitary structure.Type: GrantFiled: September 25, 2014Date of Patent: September 1, 2015Inventor: George Atkinson
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Patent number: 9111674Abstract: The present invention provides a permanent magnet whose magnetic properties will not be significantly decreased and which is excellent in the temperature properties compared to the existing R-T-B based permanent magnet. In the R-T-B based structure, a stack structure of R1-T-B based crystallizing layer and (Y,Ce)-T-B based crystallizing layer can be formed by alternatively stacking R1-T-B and (Y,Ce)-T-B. In this way, a high magnetic anisotropy field of the R1-T-B based crystallizing layer can be maintained while an improved temperature coefficient of the (Y,Ce)-T-B based crystallizing layer can be obtained. Further, a high coercivity can be obtained by adding the Ce-T-B based crystallizing layer with a low lattice distortion to the Y-T-B based crystallizing layer.Type: GrantFiled: April 21, 2014Date of Patent: August 18, 2015Assignee: TDK CORPORATIONInventors: Ryuji Hashimoto, Kenichi Suzuki, Kyung-Ku Choi
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Patent number: 9105292Abstract: A magnetic recording medium and related method of manufacturing a magnetic recording medium that has a protective layer for the magnetic recording medium and that exhibits excellent corrosion resistance in the protective layer. The magnetic recording medium includes on a nonmagnetic substrate a magnetic layer and a protective layer formed on the magnetic layer. The protective layer is formed of a lower layer in contact with the magnetic layer and an upper layer formed on the lower layer. The material used in the lower layer is a metal having a standard electrode potential of ?0.8 to 0.3 V.Type: GrantFiled: April 9, 2013Date of Patent: August 11, 2015Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yuko Nakamata
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Patent number: 9095063Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.Type: GrantFiled: February 17, 2014Date of Patent: July 28, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Eun Ju Yang, Gyu Seok Kim, Suk Jin Ham, Se Yoon Park, Jin Uk Cha, Hee Suk Chung, Mi Yang Kim
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Patent number: 9082537Abstract: The present invention provides a permanent magnet which is excellent in the temperature properties and the magnetic properties of which will not be significantly decreased, compared to the conventional R-T-B based permanent magnet. In the R-T-B based structure, a stacked structure of R1-T-B based crystal layer and Y-T-B based crystal layer can be formed by alternatively stacking R1-T-B and Y-T-B. In this way, a high magnetic anisotropy field of the R1-T-B based crystal layer can be maintained while the temperature coefficient of the Y-T-B based crystal layer can be improved.Type: GrantFiled: April 25, 2014Date of Patent: July 14, 2015Assignee: TDK CORPORATIONInventors: Ryuji Hashimoto, Kenichi Suzuki, Kyung-ku Choi, Kenichi Nishikawa
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Patent number: 9070500Abstract: The present invention provides a permanent magnet whose magnetic properties will not be significantly decreased and which is excellent in the temperature properties compared to the existing R-T-B based permanent magnet. In the R-T-B based structure, a stacked structure of R1-T-B based crystallizing layer and (Y, La)-T-B based crystallizing layer can be formed by alternatively stacking R1-T-B and (Y, La)-T-B. In this way, a high magnetic anisotropy field of the R1-T-B based crystallizing layer can be maintained while an improved temperature coefficient of the (Y, La)-T-B based crystallizing layer can be obtained. Further, the lattice distortion in the total stacked structure is moderated by setting the rare earth elements in the (Y, La)-T-B based crystallizing layer as both of Y and La, and a high residual flux density can be obtained accordingly.Type: GrantFiled: April 21, 2014Date of Patent: June 30, 2015Assignee: TDK CORPORATIONInventors: Ryuji Hashimoto, Kenichi Suzuki, Kyung-Kun Choi
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Patent number: 9058831Abstract: In one embodiment, a perpendicular magnetic recording medium includes an oxide recording layer including an oxide and a non-oxide recording layer which does not contain an oxide positioned above the oxide recording layer. The oxide recording layer includes a region R1 where a grain boundary width in a direction parallel to a plane of formation of R1 increases therealong from a lowermost portion of the oxide recording layer toward a medium surface, a region R3 positioned above R1 wherein a grain boundary width increases therealong toward the medium surface, a region R2 where a grain boundary width of R2 decreases therealong from R1 to R3, with R2 being positioned between R1 and R3, and a region R4 where a grain boundary width of R4 decreases therealong from R3 toward the medium surface, with R4 being positioned above R3 and near an uppermost portion of the oxide recording layer.Type: GrantFiled: December 14, 2011Date of Patent: June 16, 2015Assignee: HGST Netherlands B.V.Inventors: Shun Tonooka, Kiwamu Tanahashi, Hiroyuki Nakagawa, Ichiro Tamai
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Patent number: 9060460Abstract: The present invention relates to an improved anti-static computer assembly mat having multiple grounding points between the mat and other bodies capable of transmitting or receiving electrostatic discharge (ESD) during the assembly process. The grounding points may be connected to a computer chassis, a system builder, or a grounded outlet to ground the assembly mat and components thereon. The assembly mat has a relatively large assembly area such that a system integrator or builder may be able to place multiple components on the anti-static work surface at the same time while simultaneously preventing surface blemishes to system components. Further, the present invention provides for a wide variety of computer component measurements to assist the system builder in selecting and installing components during the build process. Such measurements may include rulers, motherboard sizing, CPU socket sizing, hard drive thread spacing, fan hole spacing, tubing size, power supply connectors, among other items.Type: GrantFiled: March 15, 2013Date of Patent: June 16, 2015Assignee: FROZENCPU.COMInventor: Mark Friga, Jr.
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Publication number: 20150140256Abstract: The present invention concerns a shaped composite material and a method for producing it. More specifically, the invention concerns a disc for a disc brake made from ceramic composite materials, usually known as “CMC”, i.e. “Carbon Material Ceramic” or “CCM”, i.e. “Carbon Ceramic Material”. These materials consist of carbon matrices containing carbon fibres usually infiltrated with silicon and a product of reaction between C and Si, silicon carbide (SiC). More specifically, the invention concerns a shaped composite material comprising a inner layer (3; 103) of CCM C/SiC/Si material comprising disorderly short filaments consisting mainly of carbon and respective outer layers (2, 2?; 102, 102?) of C/SiC/Si material and having an orderly fabric structure of mainly carbon fibres.Type: ApplicationFiled: May 16, 2012Publication date: May 21, 2015Applicant: Petroceramics S.p.A.Inventor: Massimiliano Valle
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Publication number: 20150140321Abstract: A method and device for improving the adhesion of fluorinated transparent conducting oxide films by incorporating a non-conducting, non-fluorinated adhesion layer between a substrate and a transparent conducting oxide.Type: ApplicationFiled: November 14, 2014Publication date: May 21, 2015Inventors: Thomas GENNETT, John PERKINS, Arrelaine DAMERON
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Publication number: 20150140302Abstract: A high-resistance laminate includes a transparent substrate and a high-resistance layer formed upon the transparent substrate. The high-resistance layer contains an oxide that includes tin and titanium as main components. The atomic ratio of the tin to the titanium (Sn/Ti) is 80/20 to 95/5, and the surface resistivity value of the high-resistance layer is 1 to 100 megaohms per square. A barrier layer can be interposed between the transparent substrate and the high-resistance layer. This high-resistance laminate may form all or part of a high-resistance layer within a front panel for a tactile sensor. Such a tactile sensor may include the high resistance layer and an insulating layer.Type: ApplicationFiled: June 26, 2014Publication date: May 21, 2015Applicant: Senseg Ltd.Inventors: Kensuke FUJII, Kouji SATOU
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Patent number: 9034454Abstract: An apparatus for filling joints in precast concrete structures includes a core that has exceptionally low creep and conforms to ASTM D 1752 made of controlled particle size composites of recycled cellular rubber and plastic materials in the form of a rectangular slab. Holes are drilled through a central area and countersink recesses are formed around the holes. An outer coating of a thermoplastic polyurethane/polyurea elastomer system of a thickness of 0.075 inch covers the slab and countersink recesses. The coated core is abrasion and UV resistant while having the creep characteristics needed to make a dam expansion joint filler.Type: GrantFiled: September 30, 2011Date of Patent: May 19, 2015Assignee: Southern Rubber Company, Inc.Inventor: Stephen Edward Bowman
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Publication number: 20150132605Abstract: A composite composition that includes an MCrAlX alloy and a nano-oxide ceramic is disclosed. In the formula, M includes nickel, cobalt, iron, or a combination thereof, and X includes yttrium, hafnium, or a combination thereof, from about 0.001 percent to about 2 percent by weight of the alloy. The amount of the nano-oxide ceramic is greater than about 40 percent, by volume of the composition. A protective covering that includes the composite composition is also disclosed. The protective covering can be attached to a tip portion of a blade with a braze material. A method for joining a protective covering to a tip portion of a blade, and a method for repair of a blade, are also provided.Type: ApplicationFiled: November 8, 2013Publication date: May 14, 2015Applicant: General Electric CompanyInventors: Sundeep Kumar, Anand Krishnamurthy, Kivilcim Onal, Pazhayannur Ramanathan Subramanian, Dennis Michael Gray, Padmaja Parakala
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Publication number: 20150132569Abstract: A hypersonic refractory material, including a refractory leading edge portion for a hypersonic vehicle and a high emissivity oxide coating adhered to the refractory leading edge portion. The high emissivity oxide coating is selected from the group including Sm2O3, Tm2O3, Yb2O3, Gd2O3, and mixtures thereof, and the refractory leading edge portion includes up to about 15 mole percent of a cation dopant selected from the group including Sm2O3, Tm2O3, Yb2O3, Gd2O3, and mixtures thereof, with the remainder being selected from the group including ZrB2, HfB2, and mixtures thereof. The high emissivity coating is formed by oxidation of cation dopant at elevated temperatures.Type: ApplicationFiled: September 24, 2012Publication date: May 14, 2015Inventors: Rodney Trice, Winnie Tan
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Publication number: 20150132570Abstract: The present disclosure relates to an alkali-aluminosilicate glass which contains between 47.5 and 55 wt.% SiO2, between 21 and 27.5% Al2O3; and between 12 and 16 wt.% Na2O. The molar ratio of Al2O3 and Na2O amounts to between 1:0.9 and 1:1.2. This glass is characterized by high hardness and high surface strengths after its chemical toughening, whereby the resulting extremely high scratch resistance favors its use as a display glass. A further preferred feature of this glass is its much lower viscosity for this group of glasses.Type: ApplicationFiled: November 13, 2014Publication date: May 14, 2015Inventors: Chia-Hung Lin, Sven Wiltzsch, Lars Bienneck, Gunter Carl, Hans-Juergen Linz
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Publication number: 20150132596Abstract: Provided are a heat-absorbing material having high heat resistance and high wavelength selectivity, and a process for producing the same. The heat-absorbing material includes: a heat-resistant metal having the substantially same periodic structure in the light incidence plane as the wavelength of sunlight having a specific wavelength in the wavelength regions of visible light and near-infrared rays; and a cermet formed on the light incidence plane of the heat-resistant metal. Thus, there can be achieved desirable absorption and radiation characteristics being such that absorption is performed in the visible light region meanwhile reflection is performed in the infrared region. Furthermore, the cermet does not need complicated film-formation control, and therefore, the high heat resistance can be maintained.Type: ApplicationFiled: May 1, 2013Publication date: May 14, 2015Inventors: Takatoshi Yamada, Akio Takada, Hiroo Yugami, Fumitada Iguchi, Makoto Shimizu
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Patent number: 9028929Abstract: A light-emitting medium having a light-emitting image including first pattern elements formed on a substrate by using a first fluorescent ink containing a first fluorescent material, and second pattern elements formed on the substrate by using a second fluorescent ink containing a second fluorescent material. The first and second pattern elements form a plurality of micro-character rows m, and the first pattern elements form a latent image in the micro-character rows m. The first fluorescent material is made of a fluorescent material which emits light of blue color when UV-A is irradiated, and emits light of red color when UV-C is irradiated. The second fluorescent material is made of a fluorescent material which emits light of blue color or light of a color that is viewed as the same color as the blue color when the UV-A is irradiated, and emits light of green color when the UV-C is irradiated.Type: GrantFiled: August 4, 2011Date of Patent: May 12, 2015Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoko Sekine, Manabu Yamamoto, Mitsuru Kitamura, Tsuyoshi Yamauchi, Akiko Kitamura, Sakurako Hatori
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Patent number: 9028932Abstract: The invention relates to a glass package (100) for sealing a device (120), to a system (110) comprising the glass package, a light source (210), a luminaire (200), a backlighting system (310), and to a display device (300). The glass package according to the invention comprises a first glass substrate (10), a second glass substrate (20), and a seal (30) sealing an interface between the first glass substrate and the second glass substrate. The seal comprises a frit (30) comprising glass. A CTE of the frit is chosen to be at least 10% lower compared to the CTE of the first glass substrate and/or of the second glass substrate. An effect of the glass package according to the invention is that the difference between the CTE of the frit compared to the CTE of the first glass substrate and/or the second glass substrate enables to generate a gas-tight sealed glass package while using a glass-material as the first glass substrate and/or as the second glass substrate which has a relatively high CTE.Type: GrantFiled: September 15, 2010Date of Patent: May 12, 2015Assignee: Koninklijkle Philips N.V.Inventors: Franciscus Arnoldus Gerardus Van Dijk, Renatus Hendricus Maria Sanders, Petrus Henricus Maria Timmermans
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Patent number: 9030798Abstract: An electrostatic chuck comprises: a dielectric substrate having a protrusion and a planar surface part. The protrusion is formed on a major surface of the dielectric substrate. An adsorption target material is mounted on the major surface. The planar surface part is formed in a periphery of the protrusion. The dielectric substrate is formed from a polycrystalline ceramics sintered body. A top face of the protrusion is a curved surface, and a first recess is formed in the top face to correspond to crystal grains that appear on the surface. The planar surface part has a flat part, and a second recess is formed in the flat part. A depth dimension of the first recess is greater than a depth dimension of the second recess. The electrostatic chuck can suppress the generation of particles and can easily recover a clean state of the electrostatic chuck surface.Type: GrantFiled: August 11, 2011Date of Patent: May 12, 2015Assignee: Toto Ltd.Inventors: Kaduko Ishikawa, Junji Yonezawa, Toshihiro Aoshima, Yoshihide Hayashida