Abstract: Pre-impregnated composite material (prepreg) is provided that can be molded to form composite parts that have high levels of both strength and damage tolerance without causing any substantial negative impact upon the physical or chemical characteristics of the uncured prepreg or cured part. This is achieved by including in the matrix resin a substantial amount of a multifunctional aromatic epoxy resin that has at least one phenyl group that is meta-substituted.

Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract: A method for making a pre-impregnated composite material (prepreg) is provided. The prepreg can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Abstract: Film-forming coating compositions are disclosed. The composition comprises a) an epoxy-containing polymer system; and b) a polyacid curing agent comprising two acid functional groups per molecule; wherein the epoxy-containing polymer system comprises: (i) an epoxy resin comprising at least two epoxy functional groups per molecule and which is different from (ii); and (ii) an epoxy functional silsesquioxane. Also disclosed are processes for applying the film-forming composition to a basecoat, and substrates coated in part by a coating deposited from the film-forming compositions.

Abstract: The present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents, and, more specifically, the present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents that selectively absorb infrared radiation. In various embodiments of the present invention, an interlayer includes lanthanum hexaboride, which effectively absorbs infrared radiation at about 1,000 nanometers, and an epoxy, which stabilizes the lanthanum hexaboride agent.

Abstract: The present invention relates to an afterglow coating comprising a clear varnish and a photoluminescent pigment, wherein the pigment comprises a white luminous colour in which the clear varnish is distributed. The present invention furthermore relates to methods for producing these coatings and to their use for coating surfaces in the cabin of aircraft.

Abstract: An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.

Abstract: The invention relates to a method of making a coating composition for coating glass. The method includes the steps of combining an epoxy resin component, a methacrylate component, a silane coupling agent, an epoxy curing agent, and an initiator agent.

Abstract: A water repellent glass plate, manufacturing method thereof, and a vehicle or a paned window having the same can include a glass plate having a film coating that includes a transparent micro particle covalently bound to the surface of the glass.

Abstract: A dual component (aqueous) hybrid reactive system obtained by a) the production of an epoxy-functional (aqueous) binding agent component (I) with an epoxide equivalent of 100 to 12,500 g/eq, and average molecular mass of 200 to 25,000 Daltons and a viscosity of 1,000 to 15,000 mPas 920° C., Brookfield) and b) the production of a (latent) amino-functional hardener component (II).

Abstract: Polymeric thermosetting systems that are formaldehyde free binder systems and composites utilizing such systems include a formaldehyde free binder formed one or more hydroxyl polymers and one or more hydroxyl polymer crosslinkers.

Abstract: A structural component for use in oil, gas, exploration, refining and petrochemical applications in the form of a pipe system is provided. The structural component comprises a plurality of layers, a structural layer comprising a composite material; a corrosion resistant layer for contacting the corrosive petroleum products, the corrosion resistant layer comprising a ceramic material; a fire resistive layer having a thermal conductivity of less than 0.4 W/m° C. In one embodiment, the structural component has a burn-through time of greater than 5 minutes. In another embodiment, the structural component meets level II fire endurance standard according to IMO A 18/Res.753 fire testing protocol.

Abstract: There is provided a flame-retardant resin composition which can maintain heat resistance at a high level and simultaneously provide low dielectric constant and low dielectric loss tangent while ensuring flame-retardancy without containing any halogen compound causing the generation of harmful substances. This flame-retardant resin composition comprises 0.1 to 200 parts by mass of a cyclophosphazene compound represented by the following formula (1): wherein n=3 to 25; and one of R1 and R2 is CN and the other is H, or both of R1 and R2 are CN, based on 100 parts by mass of a resin component containing a polyfunctional epoxy resin having a biphenyl aralkyl structure, wherein the ratio of cyanophenoxy groups in the compound is 2 to 98% of the total number of phenoxy groups and cyanophenoxy groups in the compound.

Abstract: A base plate having a surface on which a plurality of hydroxyl groups can be introduced, a metallic membrane disposed on the base plate and having a plurality of wells reaching the base plate, and a crosslinkable polymer membrane disposed on the metallic membrane are included.

Abstract: Provided are multilayer laminates having one or more layers comprising twisted nematic liquid crystals and one or more layers of a polymeric sheet comprising a polymer with a modulus between 20,000 psi (138 MPa) and 100,000 psi (690 MPa). The twisted nematic liquid crystal layers reflect infrared radiation. Thus, the multilayer laminates are useful to reduce the transmission of infrared energy. For example, in some embodiments the multilayer laminates are useful as windows to reduce energy consumption necessary to cool the interior of a structure such as an automobile or building. Preferably, the multilayer laminates retain the beneficial properties of safety glass. The multilayer laminates may include additional layers such as infrared absorbing layers, half wave plates, and the like, to minimize the transmission of infrared energy. The multilayer laminates may also include further additional layers such as polymeric films, polymeric sheets, rigid sheets, and the like.

Abstract: Provided are multilayer laminates having one or more layers comprising twisted nematic liquid crystals and one or more layers of a polymeric sheet comprising a polymer with a modulus of 20,000 psi (138 MPa) or less. The twisted nematic liquid crystal layers reflect infrared radiation. Thus, the multilayer laminates are useful to reduce the transmission of infrared energy. For example, in some embodiments the multilayer laminates are useful as windows to reduce energy consumption necessary to cool the interior of a structure such as an automobile or building. Preferably, the multilayer laminates retain the beneficial properties of safety glass. The multilayer laminates may include additional layers such as infrared absorbing layers, half wave plates, and the like, to minimize the transmission of infrared energy. The multilayer laminates may also include further additional layers such as polymeric films, polymeric sheets, rigid sheets, and the like.

Abstract: The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.

Abstract: There is provided a substrate for a display device that has excellent gas barrier properties, flexibility, heat resistance and transparency, and has excellent dimensional stability, operability, and secondary processing characteristics. A substrate for a display device according to the present invention includes: an inorganic glass; and resin layers placed on both sides of the inorganic glass. Preferably, a ratio drsum/dg between a total thickness drsum of the resin layer and a thickness dg of the inorganic glass is 0.5 to 2.2. Preferably, the resin layers on both sides of the inorganic glass are each composed of the same material, each have the same thickness, and a thickness of each of the resin layers is equal to the thickness of the inorganic glass. Preferably, an average coefficient of linear expansion at 170° C. of the substrate for a display device is 20 ppm° C.?1 or less.

Abstract: Provided is a transparent and light-weight ballistic resistant safety glazing comprising an ionomer sheet. The ionomer sheet comprises an ionomer derived from a parent acid copolymer that comprises copolymerized units of an ?-olefin having 2 to 10 carbon atoms and, based on the total weight of the acid copolymer, about 20 to about 30 wt % of copolymerized units of an ?,?-ethylenically unsaturated carboxylic acid having 3 to 8 carbon atoms. The ionomer is neutralized to a level of about 5% to about 90%, based on the total carboxylic acid content of the acid copolymer, and further comprises at least one cation. Further provided are articles comprising the light-weight ballistic resistant safety glazing.

Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.

Abstract: It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

Abstract: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; and (c) a catalytic amount of a catalyst system comprising a combination of: (i) at least a first catalyst compound comprising at least one nitrogen-containing catalyst compound; and (ii) at least a second catalyst compound comprising at least one phosphorus-containing catalyst compound; wherein at least one or more of the above components (a)-(c) is halogenated or contains halogen; or if none of the above components are halogenated wherein the resin composition includes (d) a halogenated or halogen-containing flame retardant compound that does not contain nitrogen. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 170° C.

Abstract: A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement, where the polymeric resin comprises; at least one difunctional epoxy resin; and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.

Abstract: The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.

Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.

Abstract: The present invention provides a safety laminate or solar cell module comprising an acid terpolymer containing film or sheet, wherein the acid terpolymer comprises copolymerized units derived from an ?-olefin, about 15 to about 30 wt. % of an ?,?-ethylenically unsaturated carboxylic acid having 3 to 8 carbons, and about 0.5 to about 40 wt. % of an ?,?-ethylenically unsaturated carboxylic acid ester having 4 to 12 carbons, based on the total weight of the acid terpolymer.

Abstract: Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same. The epoxy resin composition in accordance with the present invention exhibits excellent flame retardancy without use of a halogen flame retardant, and also advantageously provides well-balanced various physical properties which are to be required in copper-clad laminates, such as higher heat resistance and copper peel strength, and lead heat-resistant characteristics after moisture absorption.

Abstract: The present invention is directed to a salt optic provided with a multilayer coating in order to improve upon the moisture resistance of a salt optic, when compared to the moisture resistance of an uncoated salt optic. In one aspect, the present invention is comprised of a coated salt optic having at least a first coating layer and a second coating layer, the first coating layer being surface-smoothing layer and adhesion layer, and the second coating layer being a moisture barrier layer.

Abstract: Multi-layered cellular metallic glass structures and methods of preparing the same are provided. In one embodiment, the cellular metallic glass structure includes at least one patterned metallic glass sheet and at least one additional sheet. The at least one patterned metallic glass sheet may include multiple sheets connected together to form a group of sheets, and the structure may include a group of sheets sandwiched between two outer sheets. The patterned metallic glass sheets may be patterned by thermoplastically forming two- and/or three-dimensional patterns in the metallic glass sheets.

Abstract: A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic resin to form a nanoporous laminate. Advantageously, the nanoporous electrical laminate has a low dielectric constant (Dk) because of the nanopores present in the laminate matrix.

Abstract: The invention provides an optical thin sheet having a reinforced structure, comprising a substrate and at least one protective layer, said protective layer formed on at least one of the surfaces of the substrate and comprising an organic layer, wherein the organic layer comprises a thermosetting resin and is used to enhance the toughness of the substrate. There is good adhesion between the protective layer and the substrate. The optical thin sheet protected by the protective layer of the invention does not wrap and possesses high transparency.

Abstract: A self-healing composite material comprising a fibre-reinforced polymeric matrix, wherein the polymeric matrix comprises a thermosetting polymer and a thermoplastic polymer.

Abstract: A reinforcing sheet, including a constraining layer and a reinforcing layer; a reinforced substrate, including the reinforcing sheet on a side of a substrate; and a method for reinforcing a substrate, including providing the reinforcing sheet on a side of the substrate. The reinforcing layer contains a foam composition containing (A) an epoxy resin, (B) an epoxy-modified rubber, and (C) a hydrophobic hydrocarbon oil. The reinforcing sheet may exhibit an improved resistance to water.

Abstract: A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: A protective sheet for a solar battery module comprises a weather-resistant sheet (1) of, for example, a fluorocarbon resin, and a deposited inorganic oxide thin film (2) formed on one of the surfaces of the weather-resistant sheet (1). A surface-treated layer (3) is formed in the weather-resistant sheet (1) to enhance adhesion between the weather-resistant sheet (1) and the deposited inorganic oxide thin film (2).

Abstract: An optically clear structural laminate includes a thermosetting resin, a silane coupling agent and a filler. The laminate has a high weight to strength ratio and is capable of optical transmission over a wide range of temperatures. The laminate has increased tensile strength and is capable of being easily formed into complex shaped components. The structural properties of the laminate make it useful as aircraft canopies and windows.

Abstract: Hardeners for water-based epoxy resin systems, the hardeners being obtainable by reacting a mixture of: (A) at least one epoxidized polyalkylene oxide selected from the group of epoxidized polyethylene oxides, epoxidized polypropylene oxides and polyethylene propylene oxides, (B) at least one epoxidized aromatic hydroxy compound selected from the group of bisphenol A epoxides and bisphenol F epoxides and (C) at least one aromatic hydroxy compound selected from the group of bisphenol A and bisphenol F, to form an intermediate product and subsequently reacting this intermediate product with a polyamine (E), are disclosed.

Abstract: Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler.

Abstract: Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy-type material on the article surface, where the coating has the high Tg phenoxy-type material and a PHAE; or the article surface comprises a coating includes a PHAE; or the coating has the high Tg phenoxy-type material and a PHAE, and the article surface includes a coating layer of a PHAE.

Abstract: Hard-carbon films with unique structures, methods for producing the films, and articles coated by the films are provided. These hard-carbon films are synthesized by the plasma surface treatment of a polymer substrate or a polymer-coated substrate in a plasma containing SFx species, where x is less than 6, and may be produced under room temperature, low pressure environments.

Abstract: A transparent composite composition is provided which comprises an epoxy resin (a) and a glass filler (b) and in which the epoxy resin (a) comprises at least one epoxy resin whose refractive index after curing is lower than the refractive index of the glass filler (b) and at least one epoxy resin whose refractive index after curing is higher than the refractive index of the glass filler (b). The transparent composite composition of the invention has a low coefficient of linear expansion and is excellent in transparency, heat resistance and solvent resistance, among others and, therefore, is judiciously used, for example, in the form of liquid crystal display device substrates and organic EL device substrates (in particular of the active matrix type) and, further, transparent sheets, optical lenses, color filter substrates, solar cell substrates, touch panels, optical devices, optical waveguides, LED sealing materials and so forth.

Abstract: A method to reduce undesirable outgassing includes bonding at least two optical components with a bonding material and encapsulating the bonding material with a capping material. The capping material inhibits the outgassing of species that would otherwise be emitted from the bonding material to the surrounding. In one example, the bonding material is silicone and the capping material is epoxy.

Abstract: The present invention provides ultraviolet (UV) curable powders for powder coatings comprising one or more than one free radical curable epoxy resin and one or more than one second free radical curable resin, or, alternatively, one or more than one free radical curable unsaturated polyester resin in combination with one or more than one wax, and one or more than one free radical photoinitiator, wherein the coating powder has an average particle size of 5 to 25 microns. Further, the present invention provides a method for making a powder for thin (1.0 to 4.0 mil), smooth coatings having an average particle size of from 5 to 25 microns, the method preferably comprising jet milling dry powder or spray drying an aqueous emulsion, fluid mixture, or a supercritical suspension of a powder or of the composition for making the powder.

Abstract: Provided is a gas barrier film in which in coating or laminating a single layer film or a multiplayer film comprising at least one (a) thermoplastic resin layer on which an inorganic compound is vapor deposited or (b) layer comprising metal foil, wherein 40% by weight or more of a skeletal structure represented by the following Formula (1) is contained in an epoxy resin-cured product formed from an epoxy resin composition comprising an epoxy resin and an epoxy resin curing agent as principal components.

Abstract: The invention relates to a transparent substrate coated on at least one of its faces with a polymer layer deposited under vacuum. This polymer layer is provided with an adhesion prelayer of organic or organoinorganic nature. The invention also relates to the process for manufacturing such a coated substrate and to its applications.

Abstract: The glass transmittance of UV light having a wavelength of 365 nanometers is reduced by compounding an oxide or salt of at least one of Fe, Cu, Cr, Ce, Mn and mixtures thereof. The fiberglass cloth can be used for providing reinforced prepregs used in producing printed circuit boards or laminated chip carrier substrates.

Abstract: A composition of matter comprising a mixture of an oxide powder or powders and a Reactive Organic Medium (ROM) which can be used to create electronic components on a suitable. The materials are applied to conventional polymer-based circuit substrates by any convenient printing process and thermally cured to well-consolidated oxide components at a temperature, which the substrate can withstand. Mixtures for various components, including resistors, capacitor dielectrics and magnetic cores and processes to apply them are disclosed.

Abstract: The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(?NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2 and R2NHR1, wherein R1 is a hydrocarbon group, R2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1 or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates.