Of Epoxy Ether Patents (Class 428/413)
  • Patent number: 10444626
    Abstract: A hologram recording composition includes at least: a photopolymerizable compound containing at least a first photopolymerizable monomer; binder resin that is inactive to photopolymerization; and a photopolymerization initiator. A change in polarity of the first photopolymerizable monomer by photopolymerization reduces compatibility with the binder resin of the photopolymerizable compound than that before polymerization, the compatibility of the photopolymerizable compound before the polymerization being high.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: October 15, 2019
    Assignee: SONY CORPORATION
    Inventors: Eri Igarashi, Yuko Taki, Hisaya Hara, Daisuke Hobara
  • Patent number: 10428238
    Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar? represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: October 1, 2019
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Ming-Jaan Ho, Mao-Feng Hsu, Shou-Jui Hsiang, Nan-Kun Huang, Yu-Wen Kao, Chia-Yin Teng, Ching-Hsuan Lin
  • Patent number: 10426045
    Abstract: Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 ?m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: September 24, 2019
    Assignee: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
    Inventors: Xiang Xiong, Zhilong Hu
  • Patent number: 10422053
    Abstract: The present invention discloses an electrospinning composition comprising a catalyst and a functionalized polymer or copolymer bearing one or more epoxy ring. The mixture further comprises an anhydride, preferably phthalic anhydride as a cross-linking agent. Wherein a molar ratio of epoxy to anhydride in the electrospinning composition is within the range of 1:1 to 50:1. The present invention further discloses a preparation method of the electrospinning composition and an electrospun nano-/submicrostructures prepared using the method and composite material comprising the electrospun nano-/submicrostructures.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: September 24, 2019
    Assignee: SABANCI UNIVERSITESI
    Inventors: Melih Papila, Ayca Ürkmez, Kaan Bilge, Eren Simsek, Yusuf Z. Menceloglu, Elif Özden Yenigun
  • Patent number: 10414854
    Abstract: A process for preparing an aliphatic or cycloaliphatic epoxy resin composition including the steps of: (I) reacting a mixture of the following components: (a) an aliphatic or cycloaliphatic hydroxyl-containing material, (b) an epihalohydrin, (c) a stoichiometric excess of a base compound or basic acting substance, (d) a catalyst, and (e) optionally, a solvent; wherein the reacting step (I) is carried out under reaction conditions sufficient to form a crude aliphatic or cycloaliphatic epoxy resin composition product in the resultant reaction mixture; (II) neutralizing the resultant reaction mixture of step (I) containing the crude aliphatic or cycloaliphatic epoxy resin composition product with a phosphate neutralizing agent sufficient to partially neutralize the base or basic acting substance and to form a neutralized fluid medium containing aliphatic or cycloaliphatic epoxy resin composition product; (III) removing at least a portion of unreacted epihalohydrin from the reaction mixture of step (II); and (IV)
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: September 17, 2019
    Assignee: Blue Cube IP LLC
    Inventors: Robert E. Hefner, Jr., Daryoosh Beigzadeh, David J. Couling, Robert W. Coyle, David A. Carr
  • Patent number: 10391748
    Abstract: The present invention relates to a plastic film laminate, and more specifically, the present invention relates to a plastic film laminate showing impact resistance and excellent properties. According to the present invention, the plastic film laminate showing high hardness, impact resistance, scratch resistance, and transparency and having excellent processability can be provided.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: August 27, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Joon Koo Kang, Hang Suk Choi, Yeong Rae Chang, Hyeok Jeong
  • Patent number: 10385161
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: August 20, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Min Gyum Kim, Jin Woo Choi, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon
  • Patent number: 10364347
    Abstract: To provide an epoxy-resin composition and prepreg for producing a fiber-reinforced composite material which exhibits excellent curability and has excellent flame retardance and heat resistance, as well as to provide fiber-reinforced composite materials produced using the prepreg and to provide housing for electronic/electrical devices. The epoxy resin composition contains component (A): a phosphorus compound; component (B): an epoxy resin which has at least three epoxy groups in the molecule, and which does not correspond to component (A) nor include component (A); component (C): an epoxy resin curing agent which does not have a urea structure in the molecule; and component (D): a dimethylurea compound represented by formula (a) (in formula (a), “R” is a hydrogen atom or an alkyl group having any number of 1 to 10 carbons).
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: July 30, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masao Tomioka, Manabu Kaneko, Miyuki Hagiwara
  • Patent number: 10361029
    Abstract: The invention provides a paint immersing process for insulating paper, comprising the following steps: step 1, adding insulating paint in a container to blend paint; step 2, drying a base band of the insulating paper; step 3, entirely immersing the processed base band of the insulating paper into the insulating paint; or spraying the insulating paint onto the base band to cover the surface thereof; and step 4, taking out the base band to dry at controlled temperature till solidifying the insulating paint and the base band of the insulating paper. The paint immersing process is simple and practical to operate. The base band can directly cover a conductor as an insulator. As the insulating paint has a certain adhesive property, the structure of conductor with the insulating paper becomes more stable. After the conductor is wound into a coil, free of another immersing process, simplifying production.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: July 23, 2019
    Assignee: Haihong Electric Co., Ltd
    Inventors: Kaixuan Xu, Xianqing Guo, Qingning Liang, Danju Song
  • Patent number: 10354795
    Abstract: A method includes forming a first conductive spiral and a second conductive spiral of a spiral inductor coupled to a substrate. The second conductive spiral overlays the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate. The second thickness is greater than the first thickness. The portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: July 16, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang, Jonghae Kim, Je-Hsiung Lan
  • Patent number: 10336899
    Abstract: A polybutylene terephthalate resin composition containing a polybutylene terephthalate resin, 10 to 20% by mass of glass fiber relative to a total mass of the composition, an ethylene/ethyl acrylate copolymer, and an epoxy compound having an epoxy equivalent weight of 600 to 1,500 g/equivalent, and having a comparative tracking index (CTI) of 600 V or higher, measured in accordance with the third edition of IEC 60112.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 2, 2019
    Assignee: WinTech Polymer Ltd.
    Inventors: Shotaro Moriya, Kouichi Sakata
  • Patent number: 10317598
    Abstract: An optical film in which heat resistance or moisture resistance is excellent, and visibility is able to be sufficiently ensured. In the optical film used in a display apparatus including a polarizer, Re is 1,000 nm to 30,000 nm, and Rth is ?30,000 nm to ?1,000 nm. Further, a polarization plate including the optical film, a transparent conductive film including the optical film, a surface protection film including the optical film including the optical film, and a liquid crystal display apparatus including the optical film.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: June 11, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Ryuta Takegami, Naoyoshi Yamada
  • Patent number: 10308758
    Abstract: Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: June 4, 2019
    Assignee: DAICEL CORPORATION
    Inventors: Hiroki Tanaka, Katsuhiro Nakaguchi
  • Patent number: 10245766
    Abstract: The invention relates to a method for manufacturing a composite casing for an axial turbomachine low-pressure compressor. The casing comprises a circular wall and a fixing flange which with the wall forms a sharp-edged corner. The method comprises the steps of: supplying a mold with a corner configured to form the edge corner of the casing; placing a filled thermoplastic resin profile section along the corner; placing a fibrous reinforcement in the mold to hug the profile section; closing the injection mold; polymerizing a resin injected into the mold and demolding the casing. The invention also relates to a composite casing with an annular wall and a flange at one end of the wall forming a sharp-edged corner on the inside of the casing. The casing is reinforced by a fibrous perform and the edge corner is reinforced with short fibers with a mean length of less than 5.00 mm.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: April 2, 2019
    Assignee: Safran Aero Boosters SA
    Inventors: Benoit Hannecart, Angela Durie
  • Patent number: 10245764
    Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: April 2, 2019
    Assignee: Cytec Industries Inc.
    Inventors: Jonathan E. Meegan, Olivia Denman, Marco Aurilia
  • Patent number: 10246373
    Abstract: A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the fiberglass is in the form of building insulation. In other embodiments the product is a microglass-based substrate for use in a printed circuit board, battery separator, filter stock, or reinforcement scrim.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: April 2, 2019
    Assignee: Johns Manville
    Inventor: Kiarash Alavi
  • Patent number: 10233204
    Abstract: The present invention relates to a phosphazene compound and a composite metal laminate. The phosphazene compound with a partial structure of carboxylic esters has a structure as shown in Formula (I). The present invention obtains a phosphazene compound with a partial structure of carboxylic esters using an M group having specific components. The cured products of the phosphazene compound have good flame retardancy, heat resistance, mechanical properties, flame retardancy, and low dielectric constant, and are a low dielectric flame retardant material having great economic properties and being environmental friendly.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: March 19, 2019
    Assignee: GUANGDONG GUANGSHAN NEW MATERIALS CO., LTD.
    Inventor: Qingchong Pan
  • Patent number: 10233203
    Abstract: The present invention relates to a phosphazene compound and a prepreg and a composite metal laminate. The phosphazene compound has a structure as shown in Formula (I). The present invention obtains a phosphazene compound using an M group having specific components. The composite metal laminates prepared by the epoxy resin composition comprising the phosphazene compound have low dielectric properties, good heat resistance and mechanical properties and is a low dielectric material also having great economic properties and being environmental friendly.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: March 19, 2019
    Assignee: GUANGDONG GUANGSHAN NEW MATERIALS CO., LTD.
    Inventor: Qingchong Pan
  • Patent number: 10213743
    Abstract: A process for preparing an ion-exchange membrane having a textured surface profile comprising the steps (i) and (ii): (i) applying a radiation-curable composition to a membrane in a patternwise manner; and (ii) irradiating and thereby curing the radiation-curable composition present on the membrane; wherein the radiation-curable composition comprises: a) 10 to 65 wt % of curable ionic compound(s) comprising one ethylenically unsaturated group; b) 3 to 60 wt % of crosslinking agent(s) comprising at least two ethylenically unsaturated groups and having a number average molecular weight below 800; c) 0 to 70 wt % of inert solvent(s); d) 0 to 10 wt % of free-radical initiator(s); and e) 0.5 to 25 wt % of thickening agent(s).
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: February 26, 2019
    Assignee: Fujifilm Manufacturing Europe B.V.
    Inventors: Bastiaan Van Berchum, Johannes Van Engelen, Willem Van Baak, Adam Batting
  • Patent number: 10212813
    Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: February 19, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takaaki Ogashiwa, Hiroshi Takahashi, Tetsuro Miyahira, Yoshihiro Kato
  • Patent number: 10160826
    Abstract: A hardener composition comprising: a) an isolated adduct comprising a reaction product of i) a polymer with a functionality of at least three, wherein said polymer contains at least one epoxy group; and ii) an amine wherein the isolated adduct is present as an aqueous solution; and b) a capping agent. This hardener can be used with a liquid epoxy resin to form a curable composition.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: December 25, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Markus Schroetz, Ludwig Huelskaemper, Marcus Pfarherr, Sabine Dobler, Carmen Wiedmann
  • Patent number: 10158082
    Abstract: A semiconducting component for an electrographic device, comprising a crosslinked body obtained by crosslinking a copolymer containing 9.9 to 39.9% by mole of structural units (a) originating from an epihalohydrin, 60 to 90% by mole of structural units (b) originating from an alkylene oxide, and 0.1 to 10% by mole of structural units (c) originating from a cyclic ether monomer having a (meth)acryloyl or alkoxysilyl group with use of reactivity of the structural units originating from the cyclic ether monomer having a (meth)acryloyl or alkoxysilyl group.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: December 18, 2018
    Assignee: OSAKA SODA CO., LTD.
    Inventors: Kazuki Uno, Kohji Ohnuki, Shinichi Udo, Yoritaka Yasuda
  • Patent number: 10150898
    Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: December 11, 2018
    Assignee: XEROX CORPORATION
    Inventors: Yanjia Zuo, Mandakini Kanungo, Hong Zhao, John R. Andrews, Pratima Gattu Naga Rao, Mark A. Cellura, Santokh S. Badesha
  • Patent number: 10138393
    Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 ?m to 100 ?m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: November 27, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Daisuke Ueyama, Kentaro Nomizu
  • Patent number: 10137475
    Abstract: A coating system comprising an epoxy coating layer prepared from an epoxy formulation which comprises an epoxy resin; a curing agent with no more than 4.5 wt % free amine based on a weight solids of the curing agent; and an adjacent layer prepared from a non-isocyanate polyurethane formulation wherein the epoxy formulation and/or non-isocyanate polyurethane formulation optionally further comprise one or more additives selected from the group consisting of solvent, reactive diluent, plasticizer, pigment, filler; rheology modifiers, dispersants, surfactants, UV stabilizers, and corrosion inhibitors is provided. Also provided are a method of applying a multi-layer coating system and an article comprising a coating system.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: November 27, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Yanxiang Li, Paul J. Popa, John N. Argyropoulos, Sandra Hofmann, Ray E. Drumright
  • Patent number: 10141538
    Abstract: A sealant, a display panel and a display device are provided. The sealant includes: a main body material and a reflective material distributed in the main body material. In the case that the display device adopts the sealant, due to the scattering effect of the reflective material, the light incident onto the sealant is scattered by the reflective material and the light scattered by the reflective material cannot be continuously propagated along an original total reflection propagation direction, so that the light, which is originally totally reflected, emerges from the display panel, and thus the light extraction efficiency of the display panel is improved.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: November 27, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Changdi Chen, Tao Yang
  • Patent number: 10125289
    Abstract: To provide a composition which satisfies a high K1c value, a high glass transition temperature and a low viscosity simultaneously, and which is capable of forming an interlayer filler layer for a layered semiconductor device of which stable bonding is maintained even regardless of changes of environment. A composition comprising an epoxy compound (A) having a viscosity at 25° C. of at most 50 Pa·s, an amine compound (B) having a melting point or softening point of at least 80° C., and an amine compound (C) having a melting point or softening point of less than 80° C., wherein the proportion of the amine compound (C) is at least 1 part by weight and less than 40 parts by weight per 100 parts by weight of the total amount of the amine compound (B) and the amine compound (C).
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: November 13, 2018
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masaya Sugiyama, Yasuhiro Kawase, Makoto Ikemoto, Hideki Kiritani, Masanori Yamazaki
  • Patent number: 10072173
    Abstract: A coating composition is disclosed. The coating composition includes a poly(methyl methacrylate) polymer or copolymer having a weight average molecular weight of at least 50,000 grams per mole; monomer comprising at least one of an alkylene diacrylate, alkylene dimethacrylate, cycloalkylene diacrylate, or cycloalkylenedimethacrylate, wherein the at least one of an alkylene diacrylate, alkylene dimethacrylate, cycloalkylene diacrylate, or cycloalkylenedimethacrylate provides at least 80 percent by weight of the monomer; and a stabilizer against ultraviolet light. An article including a coating on a surface of a substrate and a method of making the article are also disclosed. The coating on the surface of the substrate is obtained by curing the disclosed coating composition.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 11, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Susannah C. Clear, Raghunath Padiyath, Garry W. Lachmansingh, Mark A. Strobel, Sonja S. Mackey, Naiyong Jing
  • Patent number: 10062625
    Abstract: An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240° C. calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: August 28, 2018
    Assignee: DEXERIALS CORPORATION
    Inventor: Hironobu Moriyama
  • Patent number: 10030141
    Abstract: An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: July 24, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Takaaki Ogashiwa
  • Patent number: 9994697
    Abstract: The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), R1 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydroxymethyl group, R2 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydrogen atom.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: June 12, 2018
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Yasuhiro Fukuhara, Hisaya Ushiyama, Manabu Kaneko
  • Patent number: 9994482
    Abstract: A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the composition when applied to fiberglass provides a sufficient blackness required in facer products.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: June 12, 2018
    Assignee: Johns Manville
    Inventors: Bernhard Eckert, Bernd Christensen, Kiarash Alavi Shooshtari, Souvik Nandi, Jawed Asrar, Mingfu Zhang
  • Patent number: 9976041
    Abstract: Provided in various embodiments are methods for making ultraviolet radiation curable (UV-curable) silicone compositions and the UV-curable silicone compositions prepared by such methods. Provided in various embodiments are methods for making anti-dust coatings using such UV-curable silicone compositions and the anti-dust coatings using such UV-curable silicone compositions prepared by such methods. The UV-curable silicone compositions may be used in the coating of silicone-based articles for LED packages, encapsulants, lamps, luminaires, optical articles and the like, substantially reducing and/or eliminating the pick-up of dust and improving optical properties of the silicone-based articles.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: May 22, 2018
    Assignee: Dow Silicones Corporation
    Inventors: Peng-Fei Fu, Eric Moyer, Wei Rong
  • Patent number: 9969852
    Abstract: Epoxy formulations comprising a polyfunctional epoxy resin, a solid bisphenol A epoxy resin, a phenolic end capped bisphenol A resin, a rubber epoxy adduct and a curative are provided as is their use in prepregs and as matrix materials in laminates of metal foil and fiber reinforced epoxy resins.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: May 15, 2018
    Assignee: Hexcel Composites Limited
    Inventor: Matthew Cleaver
  • Patent number: 9951521
    Abstract: A self-confining structural article includes a ceramic matrix with a reinforcement member disposed within the ceramic matrix. The reinforcement member is continuous, and has a mesh with holes not exceeding 4 mm in size.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: April 24, 2018
    Assignee: Wayne State University
    Inventor: Hwai-Chung Wu
  • Patent number: 9955573
    Abstract: It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: April 24, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshihiro Kato, Takaaki Ogashiwa, Hiroshi Takahashi, Tetsuro Miyahira
  • Patent number: 9945032
    Abstract: Under one aspect, a structure is provided that includes a substrate including a first material having a threshold temperature above which the first material is damaged and a layer consisting essentially of a second material molecularly bonded to the first material of the substrate. The second material is formed on the substrate at a reaction temperature that is higher than the threshold temperature of the first material. An interface between the substrate and the second material is a substantially defect-free surface.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: April 17, 2018
    Assignee: The Aerospace Corporation
    Inventor: Henry Helvajian
  • Patent number: 9938435
    Abstract: The present invention relates to an adhesive composition comprising a component A and a component B, wherein said component A comprises bisphenol A resin; a hydrophilic solvent, preferably acetone or ethanol or mixtures thereof; and silica gel (SiO2) or alumina (Al2O3) and said component B comprises aliphatic or aromatic polyamines, preferably polyamidoamines; polythiol; a combination of primary and tertiary amines, preferably 1-(2-aminoethyl)piperazine and ethylenediamine; optionally a hydrophilic solvent and optionally silica (SiO2) or alumina (Al2O3) gel. Said composition has the advantage that it cures, in addition to under dry conditions, in the presence of water or humidity in a time of 30 minutes as much and is flexible. The present invention also relates to a process for obtaining said adhesive composition.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: April 10, 2018
    Assignees: INSTITUT QUIMIC DE SARRIA CETS FUNDACIO PRIVADA, PJM PUJADAS, S.A.
    Inventors: Jorge Parellada Llobet, Jordi Arbusá Amorós, Salvador Borrós Gómez
  • Patent number: 9917063
    Abstract: A semiconductor die package includes a semiconductor die, a film for improving die warpage bonded to a first face of the semiconductor die, a plurality of electrically conductive bumps formed on a second face of the semiconductor die, a substrate onto which the electrically conductive bumps of the second face of the semiconductor die are bonded to electrically connect the semiconductor die and the substrate, and a mold compound applied these components to form an exposed surface of the semiconductor die package that is coplanar with an exposed surface of the film.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: March 13, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Seong Kim, Byong Woo Cho, Cha Gyu Song
  • Patent number: 9896908
    Abstract: Stimulation valves for a well tubular having a cylindrical housing adapted for assembly into a tubular for a well. The valves have ports allowing fluid communication between a central conduit and the exterior of the housing and a valve body adapted for movement from a closed position to an open position allowing fluid communication through the ports. A ball seat is mounted in the valve conduit above the ports. The ball seat has an initial ball-catch state in which a ball may be received in the ball seat to move the valve body from its closed position to its open position. The ball seat is adapted to transition to a ball-pass state and release the ball as the valve body is moved to the open position. The ball seat remains in the ball-pass state after the transition from the ball-catch state.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: February 20, 2018
    Assignee: TEAM OIL TOOLS, LP
    Inventors: Michael J. Harris, Kenneth J. Anton
  • Patent number: 9884960
    Abstract: Provided are a white heat-curable epoxy resin composition having a high strength, high toughness and superior heat resistance; and a semiconductor device whose light receiving and other semiconductor elements are encapsulated by a cured product of such composition. The composition includes: (A) a prepolymer obtained by heating, melting and mixing components (A-1) triazine derivative epoxy resin, (A-2) acid anhydride and (A-3) acrylic block copolymer so as to react them at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0; (B) a white pigment including at least a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: February 6, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro Tsutsumi, Tadashi Tomita
  • Patent number: 9887382
    Abstract: The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: February 6, 2018
    Assignee: Cheil Industries, Inc.
    Inventors: Mi Sun Kim, Taek Jin Baek, Gyu Seok Song, In Jae Song, Jin Ah Lee, Seung Jib Choi
  • Patent number: 9829791
    Abstract: A photosensitive resin composition comprises a component (A): a resin having a phenolic hydroxyl group; a component (B): an aliphatic compound having two or more functional groups, the functional groups being one or more group selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group; a component (C): a photosensitive acid generator; and a component (D): an inorganic filler having an average particle diameter of 100 nm or less.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: November 28, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kenichi Iwashita, Tetsuya Kato, Masahiko Ebihara, Yasuharu Murakami
  • Patent number: 9820396
    Abstract: A housing forms the appearance of an electronic device. A method of manufacturing the housing includes selecting at least one fiber substrate for securing rigidity and at least one fiber substrate for securing ductility, determining quantity and stacking sequence of the selected fiber substrates, and laminating and attaching the fiber substrates according to the determined quantity and stacking sequence.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: November 14, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang-Jin Bae, Hee-Cheul Moon, Ik-Su Jung, Jong-Chul Choi
  • Patent number: 9777196
    Abstract: A fluid activatable adhesive for a liner-free label and methods of using are described. Preferably, the adhesive composition includes a polymer, such as an emulsion polymer formed from monomers selected from the group consisting of butyl acrylate, 2-ethylhexyl acrylate, methyl acrylate, 2-acrylamido-2-methylpropane sulfonic acid (AMPS), a salt of AMPS, such as its sodium salt, styrene, and combinations thereof. The adhesive composition adheres to the liner-free label to the surface of a substrate that is at room temperature, at room temperature and wet, cold, or cold and wet. In preferred embodiments, the substrate is glass or plastic, such as polyethylene terephthalate.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: October 3, 2017
    Assignee: NuLabel Technologies, Inc.
    Inventors: Raymond Thibault, Heidi Munnelly
  • Patent number: 9777140
    Abstract: The present invention relates to a composite material obtained by in situ polymerization of a thermoplastic resin with a fibrous material. More particularly the present invention relates to a polymeric composite material obtained by in-situ polymerization of a thermoplastic (meth) acrylic resin and a fibrous material containing long fibers and its use, a process for making such a composite material and manufactured mechanical or structured part or article comprising this polymeric composite material.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: October 3, 2017
    Assignee: Arkema France
    Inventors: Pierre Gerard, Michel Glotin, Gilles Hochstetter
  • Patent number: 9771464
    Abstract: An insulating material and its method of use of insulating material for rotating machines such as motors and generators. The insulating material includes a resin embedded with a filler that is not based only on a monomodal nanoparticle size particle distribution. Radiation erodes the material and is conductive to the formation of in situ protective layers on the body to be insulated.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: September 26, 2017
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Peter Gröppel, Christian Meichsner
  • Patent number: 9772553
    Abstract: The present invention relates to a modified epoxy acrylate and a method for producing the same, a photoresist composition and a method for producing the same, and a transparent photoresist formed from the photoresist composition. The modified epoxy acrylate is an epoxy acrylate modified with phosphate monomer which has a structure represented by Formula I wherein, n is an integer selected from 1˜21, R is a short-chain carboxylic acid ester group having the structural formula ?in which p is a bivalent saturated or unsaturated carbon chain having 1˜10 carbon atoms, and the carbon chain is optionally substituted by alkyl, alkenyl, hydroxy, nitro or halogen. Since the phosphate can react with the multi-valence metal in substrates so as to connect the polymer onto the substrates firmly through covalent bonds, therefore the adhesion force is improved significantly and the protective function of the tranparent photoresist is improved accordingly.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: September 26, 2017
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xuelan Wang, Haifeng Zhou
  • Patent number: 9757973
    Abstract: A film for decorative forming includes a layered structure in which a protective layer and a colored layer are arranged sequentially in this order on a base material film, wherein, when a storage elastic modulus of the protective layer at 100° C. is written as E?a(100) and a storage elastic modulus of the colored layer at 100° C. is written as E?b(100), E?a(100) and E?b(100) satisfy conditions (1) to (3): (1) E?a(100)/E?b(100) is less than or equal to 8, (2) E?a(100) is greater than or equal to 10 MPa, (3) E?b(100) is less than or equal to 12 MPa.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: September 12, 2017
    Assignee: Toray Industries, Inc.
    Inventors: Katsuhiro Minomo, Kentaro Mori
  • Patent number: 9761476
    Abstract: The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*105 to 4*106 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: September 12, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Se Ra Kim, Jung Ho Jo, Young Kook Kim, Hee Jung Kim, Kwang Joo Lee, Jung Hak Kim, Seung Hee Nam