Of Epoxy Ether Patents (Class 428/413)
  • Patent number: 10809562
    Abstract: A liquid crystal display device includes a liquid crystal panel including at least a liquid crystal cell and a polarizing plate; and a backlight including at least a light source, in which the polarizing plate includes a polarizer and at least one sheet of protective film, the protective film included in the polarizing plate is positioned closest to the backlight side in the liquid crystal panel, and the protective film positioned closest to the backlight side in the liquid crystal panel is an organic solvent-soluble resin film in which an apparent shear strength measured at a surface on the backlight side is 106 MPa or greater and an apparent shear strength measured at a surface on the polarizer side is 101 MPa or less.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: October 20, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Masato Nagura, Ryuji Saneto, Yuuichi Fukushige
  • Patent number: 10800904
    Abstract: The present invention relates to a composite material obtained by in situ polymerization of a thermoplastic resin with a fibrous material. More particularly the present invention relates to a polymeric composite material obtained by in-situ polymerization of a thermoplastic (meth)acrylic resin and a fibrous material containing long fibers and its use, a process for making such a composite material and manufactured mechanical or structured part or article comprising this polymeric composite material, especially wind turbine parts including welded parts.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: October 13, 2020
    Assignee: Arkema France
    Inventors: Pierre Gerard, Michel Glotin, Gilles Hochstetter
  • Patent number: 10723880
    Abstract: A cyanate ester resin composition contains: a cyanate ester resin; a curing agent or a curing accelerator; silica microparticles; and core-shell rubber particles; in which the resin composition includes from 1 to 5 parts by mass of the silica microparticles and from 2 to 10 parts by mass of the core-shell rubber particles based on 100 parts by mass of the cyanate ester resin, and a mass ratio of the silica microparticles to the core-shell rubber particles is from 1/1 to 1/5.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: July 28, 2020
    Assignee: The Yokohama Rubber Co., LTD.
    Inventors: Mitsuhiro Iwata, Yukihiro Kamimura, Tomohiro Ito
  • Patent number: 10717807
    Abstract: Disclosed are an epoxy resin composition and an article made therefrom, the epoxy resin composition comprising an epoxy resin and a co-hardener, wherein: relative to the epoxy resin having a total equivalent of epoxy group of 1, the co-hardener comprises: (A) an acid anhydride having a total equivalent of acid anhydride group of 0.044-0.183; (B) a polyester having a total equivalent of ester group of 0.120-0.550; (C) a first phenolic resin having an equivalent of hydroxyl group of 0.092-0.550; and (D) a second phenolic resin having an equivalent of hydroxyl group of 0.143-0.592; and a sum of equivalent of functional groups of the co-hardener is 0.84-1.11.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: July 21, 2020
    Assignee: ELITE MATERIAL CO., LTD.
    Inventor: Yu-Te Lin
  • Patent number: 10721826
    Abstract: In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: July 21, 2020
    Assignee: Medtronic, Inc.
    Inventors: Songhua Shi, Darrin T. Schauble, Rachel M. Day
  • Patent number: 10711169
    Abstract: The present invention relates to a thermally activatable adhesive composition for use in a method for producing a stack of metal sheets from glued together sheet metal components, the use of the adhesive composition in a method for producing a stack of metal sheets from glued together sheet metal components, the method for producing a stack of metal sheets from glued together sheet metal components, a sheet metal component coated with the adhesive composition, and a stator or rotor core containing one or more of such sheet metal components.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: July 14, 2020
    Assignee: Universität Kassel
    Inventors: Holger Thiede, Stefan Böhm
  • Patent number: 10711117
    Abstract: The present invention relates to a composite material obtained by in situ polymerization of a thermoplastic resin with a fibrous material. More particularly the present invention relates to a polymeric composite material obtained by in-situ polymerization of a thermoplastic (meth)acrylic resin and a fibrous material containing long fibers and its use, a process for making such a composite material and manufactured mechanical or structured part or article comprising this polymeric composite material.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: July 14, 2020
    Assignee: Arkema France
    Inventors: Pierre Gerard, Michel Glotin, Gilles Hochstetter
  • Patent number: 10689547
    Abstract: The present invention concerns a curable adhesive composition, wherein the composition is a two-component composition comprising: (A) an adhesive component comprising: (i) an aliphatic glycidyl ether; (ii) a cycloaliphatic epoxy and/or an aromatic glycidyl ether; and (iii) a silane reducing agent; and (B) a catalyst component comprising: (iv) a Group 9 or Group 10 noble metal catalyst, wherein the adhesive component (A) and/or the catalyst component (B) further comprises an initiator; articles coated by the composition or component compositions thereof; methods of bonding articles using the composition or component compositions thereof; and kits comprising the composition or component compositions thereof.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: June 23, 2020
    Assignee: POWDERTECH (BICESTER) LIMITED
    Inventors: Stuart Corstorphine, Jana Kolbe
  • Patent number: 10676837
    Abstract: An electrocoating composition and a coating formed from the composition are described herein. The electrocoating composition includes at least an epoxy resin component, an isocyanate-functional component and a silica-based additive. The coating shows about 40 to 70% reduction in edge corrosion relative to a conventional coating.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: June 9, 2020
    Assignee: SWIMC LLC
    Inventor: Jill Tersteeg
  • Patent number: 10653784
    Abstract: A material comprising a highly branched carbohydrate polymer, a polyalkylene glycol (or polyalkylene oxide) linked to the highly branched carbohydrate polymer, and a hydrophobic or amphiphilic group linked to the highly branched carbohydrate polymer and/or the polyalkylene glycol (or polyalkylene oxide), is described. Methods of making and using the material, as well as a soluble composition that contains the material and a hydrophobic solute compound, are also described.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: May 19, 2020
    Assignee: Purdue Research Foundation
    Inventors: Yuan Yao, Jingmin Zhang
  • Patent number: 10655033
    Abstract: A floor coating composition that has a long pot life and dries fast, and a coating made therefrom having good slip resistance and high adhesion strength to the floor.
    Type: Grant
    Filed: September 5, 2015
    Date of Patent: May 19, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Liang Zhang, Haipeng Xu, Zhi Gang Hua, Wei Li, Jingui Jiang, Xiaohong Zhang
  • Patent number: 10625554
    Abstract: According to one embodiment, a vehicle suspension member includes a body of a vehicle suspension member made of a metal, a first layer provided to cover a surface of the body and a second layer provided to cover at least a portion of a surface of the first layer. The first layer includes an epoxy resin, and the second layer includes an epoxy resin and a fluororesin.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: April 21, 2020
    Assignee: NHK SPRING CO., LTD.
    Inventors: Mitsuo Mori, Tatsuya Nishimura, Masayoshi Tanaka
  • Patent number: 10557002
    Abstract: A resin composition for fiber reinforced plastic which is a resin composition comprising an epoxy resin (A), a cyanate resin (B) and a liquid aromatic amine curing agent (C), and, as necessary, further an active energy radiation absorbable component (D), wherein 20 to 100 percent by mass of the aforementioned epoxy resin (A) is an epoxy compound expressed by the following general formula (1), a cured product obtained by curing a composition containing said resin composition and a high-strength fiber-reinforced plastic; wherein (a) and (b) each independently express an integer from 2 to 10, (c) expresses an integer from 0 to 3, R1 and R2 each independently express a bivalent hydrocarbon group having 2 to 5 carbon atoms, and R3 expresses a single bond, a methylene group or —C(CH3)2—.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: February 11, 2020
    Assignee: ADEKA CORPORATION
    Inventors: Naohiro Fujita, Kazuhide Morino, Tasuku Aoki, Tomoko Kimura, Masato Inadome
  • Patent number: 10513577
    Abstract: An epoxy resin composition includes an organic phosphinic acid metal salt; an epoxy resin; dicyandiamide or a derivative thereof; a curing accelerator having a dimethylureido group; and an imidazole-based curing accelerator having a curing initiation temperature of 100° C. or higher. The curing initiation temperature is measured by a method includes preparing a sample resin composition by adding 10 parts by mass of an imidazole-based curing accelerator to 100 parts by mass of a bisphenol A type epoxy resin having an epoxy equivalent of 180 to 220, and mixing the components; measuring a calorific value of the sample resin composition using a differential scanning calorimeter at a rate of temperature increase of 10° C./min, and designating a temperature at the intersection point of the tangent line at the inflection point of the DSC curve thus obtained and the baseline as the curing initiation temperature.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: December 24, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Hisaya Ushiyama, Kenichi Watanabe
  • Patent number: 10509320
    Abstract: There is provided an underlayer coating forming composition for lithography that is used in lithography process of the manufacture of semiconductor devices and that has a high dry etching rate in comparison to photoresists, does not intermix with photoresists, and is capable of flattening the surface of a semi conductor substrate having holes of a high aspect ratio. The underlayer coating forming composition for lithography comprises, a compound having two or more protected carboxylic groups, a compound having two or more epoxy groups, and a solvent.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: December 17, 2019
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Satoshi Takei, Tetsuya Shinjo, Keisuke Hashimoto, Yasushi Sakaida
  • Patent number: 10494475
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: December 3, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Tooru Kondou, Mitsuru Kutsuwada
  • Patent number: 10499461
    Abstract: A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: December 3, 2019
    Assignee: Intel Corporation
    Inventors: Mohit Mamodia, Kyle Yazzie, Dingying Xu, Kuang Liu, Paul J. Diglio, Pramod Malatkar
  • Patent number: 10486397
    Abstract: A side glazing for a transport vehicle, particularly glazing for a train, the glazing being fixed multiple glazing, the glazing including at least one connecting bridge which is separate from the glazing frame structure and makes a connection between a peripheral edge of the lamination and a surface, situated transversely opposite, on the other side of the glazing cavity.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: November 26, 2019
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventor: Guillaume Gastal
  • Patent number: 10478280
    Abstract: Devices and methods for placing an adjunct at a tissue treatment site prior to delivering staples through the tissue and adjunct are provided. In one embodiment, a flowable adjunct precursor can be deposited on the surface of the tissue at the tissue treatment site. The flowable adjunct precursor can be configured to solidify after deposition to form an adjunct. In another embodiment, an adjunct delivery device can include a non-stapling end effector configured to deliver an adjunct to a tissue treatment site. In either case, staples can be delivered through the adjunct and tissue after placement of the adjunct at the tissue treatment site.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: November 19, 2019
    Assignee: Ethicon LLC
    Inventors: Michael J. Vendely, Charles J. Scheib, Susanne Landgrebe, Frederick E. Shelton, IV, Susan Cooper, Dennis D. Jamiolkowski
  • Patent number: 10465037
    Abstract: High purity epoxide compounds, methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: November 5, 2019
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Edward Norman Peters, Scott Michael Fisher, Jaykisor Pal
  • Patent number: 10453780
    Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: October 22, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Nobuya Nishida, Hiroyuki Okabe
  • Patent number: 10450479
    Abstract: Thermosetting powdered coating compositions comprising (a) a high Acid Value carboxylic acid functional polyester resin having an Acid Value of at least 100 mg KOH/g and a functionality of at least 4.5, (b) a low Acid Value carboxylic acid functional polyester resin having an Acid Value of 20 to 50 mg KOH/g and a functionality of about 2.5 or less, and (c) a cross-linking agent. The high Acid Value polyester resin is the reaction product of a polycarboxylic acid or its anhydride reacted with a polyester polyol obtained from reacting 0 mol % to 100 mol % of isophthalic acid and/or 0 to 100 mol % terephthalic acid, or a mixture thereof, with a polyol mixture comprising at least one diol and at least one polyol having at least three hydroxyl groups.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: October 22, 2019
    Assignee: Stepan Company
    Inventors: Thomas Stevenson, James Poole, Jackie Howell
  • Patent number: 10444626
    Abstract: A hologram recording composition includes at least: a photopolymerizable compound containing at least a first photopolymerizable monomer; binder resin that is inactive to photopolymerization; and a photopolymerization initiator. A change in polarity of the first photopolymerizable monomer by photopolymerization reduces compatibility with the binder resin of the photopolymerizable compound than that before polymerization, the compatibility of the photopolymerizable compound before the polymerization being high.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: October 15, 2019
    Assignee: SONY CORPORATION
    Inventors: Eri Igarashi, Yuko Taki, Hisaya Hara, Daisuke Hobara
  • Patent number: 10428238
    Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar? represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: October 1, 2019
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Ming-Jaan Ho, Mao-Feng Hsu, Shou-Jui Hsiang, Nan-Kun Huang, Yu-Wen Kao, Chia-Yin Teng, Ching-Hsuan Lin
  • Patent number: 10422053
    Abstract: The present invention discloses an electrospinning composition comprising a catalyst and a functionalized polymer or copolymer bearing one or more epoxy ring. The mixture further comprises an anhydride, preferably phthalic anhydride as a cross-linking agent. Wherein a molar ratio of epoxy to anhydride in the electrospinning composition is within the range of 1:1 to 50:1. The present invention further discloses a preparation method of the electrospinning composition and an electrospun nano-/submicrostructures prepared using the method and composite material comprising the electrospun nano-/submicrostructures.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: September 24, 2019
    Assignee: SABANCI UNIVERSITESI
    Inventors: Melih Papila, Ayca Ürkmez, Kaan Bilge, Eren Simsek, Yusuf Z. Menceloglu, Elif Özden Yenigun
  • Patent number: 10426045
    Abstract: Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 ?m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: September 24, 2019
    Assignee: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
    Inventors: Xiang Xiong, Zhilong Hu
  • Patent number: 10414854
    Abstract: A process for preparing an aliphatic or cycloaliphatic epoxy resin composition including the steps of: (I) reacting a mixture of the following components: (a) an aliphatic or cycloaliphatic hydroxyl-containing material, (b) an epihalohydrin, (c) a stoichiometric excess of a base compound or basic acting substance, (d) a catalyst, and (e) optionally, a solvent; wherein the reacting step (I) is carried out under reaction conditions sufficient to form a crude aliphatic or cycloaliphatic epoxy resin composition product in the resultant reaction mixture; (II) neutralizing the resultant reaction mixture of step (I) containing the crude aliphatic or cycloaliphatic epoxy resin composition product with a phosphate neutralizing agent sufficient to partially neutralize the base or basic acting substance and to form a neutralized fluid medium containing aliphatic or cycloaliphatic epoxy resin composition product; (III) removing at least a portion of unreacted epihalohydrin from the reaction mixture of step (II); and (IV)
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: September 17, 2019
    Assignee: Blue Cube IP LLC
    Inventors: Robert E. Hefner, Jr., Daryoosh Beigzadeh, David J. Couling, Robert W. Coyle, David A. Carr
  • Patent number: 10391748
    Abstract: The present invention relates to a plastic film laminate, and more specifically, the present invention relates to a plastic film laminate showing impact resistance and excellent properties. According to the present invention, the plastic film laminate showing high hardness, impact resistance, scratch resistance, and transparency and having excellent processability can be provided.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: August 27, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Joon Koo Kang, Hang Suk Choi, Yeong Rae Chang, Hyeok Jeong
  • Patent number: 10385161
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: August 20, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Min Gyum Kim, Jin Woo Choi, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon
  • Patent number: 10364347
    Abstract: To provide an epoxy-resin composition and prepreg for producing a fiber-reinforced composite material which exhibits excellent curability and has excellent flame retardance and heat resistance, as well as to provide fiber-reinforced composite materials produced using the prepreg and to provide housing for electronic/electrical devices. The epoxy resin composition contains component (A): a phosphorus compound; component (B): an epoxy resin which has at least three epoxy groups in the molecule, and which does not correspond to component (A) nor include component (A); component (C): an epoxy resin curing agent which does not have a urea structure in the molecule; and component (D): a dimethylurea compound represented by formula (a) (in formula (a), “R” is a hydrogen atom or an alkyl group having any number of 1 to 10 carbons).
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: July 30, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masao Tomioka, Manabu Kaneko, Miyuki Hagiwara
  • Patent number: 10361029
    Abstract: The invention provides a paint immersing process for insulating paper, comprising the following steps: step 1, adding insulating paint in a container to blend paint; step 2, drying a base band of the insulating paper; step 3, entirely immersing the processed base band of the insulating paper into the insulating paint; or spraying the insulating paint onto the base band to cover the surface thereof; and step 4, taking out the base band to dry at controlled temperature till solidifying the insulating paint and the base band of the insulating paper. The paint immersing process is simple and practical to operate. The base band can directly cover a conductor as an insulator. As the insulating paint has a certain adhesive property, the structure of conductor with the insulating paper becomes more stable. After the conductor is wound into a coil, free of another immersing process, simplifying production.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: July 23, 2019
    Assignee: Haihong Electric Co., Ltd
    Inventors: Kaixuan Xu, Xianqing Guo, Qingning Liang, Danju Song
  • Patent number: 10354795
    Abstract: A method includes forming a first conductive spiral and a second conductive spiral of a spiral inductor coupled to a substrate. The second conductive spiral overlays the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate. The second thickness is greater than the first thickness. The portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: July 16, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang, Jonghae Kim, Je-Hsiung Lan
  • Patent number: 10336899
    Abstract: A polybutylene terephthalate resin composition containing a polybutylene terephthalate resin, 10 to 20% by mass of glass fiber relative to a total mass of the composition, an ethylene/ethyl acrylate copolymer, and an epoxy compound having an epoxy equivalent weight of 600 to 1,500 g/equivalent, and having a comparative tracking index (CTI) of 600 V or higher, measured in accordance with the third edition of IEC 60112.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 2, 2019
    Assignee: WinTech Polymer Ltd.
    Inventors: Shotaro Moriya, Kouichi Sakata
  • Patent number: 10317598
    Abstract: An optical film in which heat resistance or moisture resistance is excellent, and visibility is able to be sufficiently ensured. In the optical film used in a display apparatus including a polarizer, Re is 1,000 nm to 30,000 nm, and Rth is ?30,000 nm to ?1,000 nm. Further, a polarization plate including the optical film, a transparent conductive film including the optical film, a surface protection film including the optical film including the optical film, and a liquid crystal display apparatus including the optical film.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: June 11, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Ryuta Takegami, Naoyoshi Yamada
  • Patent number: 10308758
    Abstract: Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: June 4, 2019
    Assignee: DAICEL CORPORATION
    Inventors: Hiroki Tanaka, Katsuhiro Nakaguchi
  • Patent number: 10245766
    Abstract: The invention relates to a method for manufacturing a composite casing for an axial turbomachine low-pressure compressor. The casing comprises a circular wall and a fixing flange which with the wall forms a sharp-edged corner. The method comprises the steps of: supplying a mold with a corner configured to form the edge corner of the casing; placing a filled thermoplastic resin profile section along the corner; placing a fibrous reinforcement in the mold to hug the profile section; closing the injection mold; polymerizing a resin injected into the mold and demolding the casing. The invention also relates to a composite casing with an annular wall and a flange at one end of the wall forming a sharp-edged corner on the inside of the casing. The casing is reinforced by a fibrous perform and the edge corner is reinforced with short fibers with a mean length of less than 5.00 mm.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: April 2, 2019
    Assignee: Safran Aero Boosters SA
    Inventors: Benoit Hannecart, Angela Durie
  • Patent number: 10245764
    Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: April 2, 2019
    Assignee: Cytec Industries Inc.
    Inventors: Jonathan E. Meegan, Olivia Denman, Marco Aurilia
  • Patent number: 10246373
    Abstract: A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the fiberglass is in the form of building insulation. In other embodiments the product is a microglass-based substrate for use in a printed circuit board, battery separator, filter stock, or reinforcement scrim.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: April 2, 2019
    Assignee: Johns Manville
    Inventor: Kiarash Alavi
  • Patent number: 10233204
    Abstract: The present invention relates to a phosphazene compound and a composite metal laminate. The phosphazene compound with a partial structure of carboxylic esters has a structure as shown in Formula (I). The present invention obtains a phosphazene compound with a partial structure of carboxylic esters using an M group having specific components. The cured products of the phosphazene compound have good flame retardancy, heat resistance, mechanical properties, flame retardancy, and low dielectric constant, and are a low dielectric flame retardant material having great economic properties and being environmental friendly.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: March 19, 2019
    Assignee: GUANGDONG GUANGSHAN NEW MATERIALS CO., LTD.
    Inventor: Qingchong Pan
  • Patent number: 10233203
    Abstract: The present invention relates to a phosphazene compound and a prepreg and a composite metal laminate. The phosphazene compound has a structure as shown in Formula (I). The present invention obtains a phosphazene compound using an M group having specific components. The composite metal laminates prepared by the epoxy resin composition comprising the phosphazene compound have low dielectric properties, good heat resistance and mechanical properties and is a low dielectric material also having great economic properties and being environmental friendly.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: March 19, 2019
    Assignee: GUANGDONG GUANGSHAN NEW MATERIALS CO., LTD.
    Inventor: Qingchong Pan
  • Patent number: 10213743
    Abstract: A process for preparing an ion-exchange membrane having a textured surface profile comprising the steps (i) and (ii): (i) applying a radiation-curable composition to a membrane in a patternwise manner; and (ii) irradiating and thereby curing the radiation-curable composition present on the membrane; wherein the radiation-curable composition comprises: a) 10 to 65 wt % of curable ionic compound(s) comprising one ethylenically unsaturated group; b) 3 to 60 wt % of crosslinking agent(s) comprising at least two ethylenically unsaturated groups and having a number average molecular weight below 800; c) 0 to 70 wt % of inert solvent(s); d) 0 to 10 wt % of free-radical initiator(s); and e) 0.5 to 25 wt % of thickening agent(s).
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: February 26, 2019
    Assignee: Fujifilm Manufacturing Europe B.V.
    Inventors: Bastiaan Van Berchum, Johannes Van Engelen, Willem Van Baak, Adam Batting
  • Patent number: 10212813
    Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: February 19, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takaaki Ogashiwa, Hiroshi Takahashi, Tetsuro Miyahira, Yoshihiro Kato
  • Patent number: 10160826
    Abstract: A hardener composition comprising: a) an isolated adduct comprising a reaction product of i) a polymer with a functionality of at least three, wherein said polymer contains at least one epoxy group; and ii) an amine wherein the isolated adduct is present as an aqueous solution; and b) a capping agent. This hardener can be used with a liquid epoxy resin to form a curable composition.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: December 25, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Markus Schroetz, Ludwig Huelskaemper, Marcus Pfarherr, Sabine Dobler, Carmen Wiedmann
  • Patent number: 10158082
    Abstract: A semiconducting component for an electrographic device, comprising a crosslinked body obtained by crosslinking a copolymer containing 9.9 to 39.9% by mole of structural units (a) originating from an epihalohydrin, 60 to 90% by mole of structural units (b) originating from an alkylene oxide, and 0.1 to 10% by mole of structural units (c) originating from a cyclic ether monomer having a (meth)acryloyl or alkoxysilyl group with use of reactivity of the structural units originating from the cyclic ether monomer having a (meth)acryloyl or alkoxysilyl group.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: December 18, 2018
    Assignee: OSAKA SODA CO., LTD.
    Inventors: Kazuki Uno, Kohji Ohnuki, Shinichi Udo, Yoritaka Yasuda
  • Patent number: 10150898
    Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: December 11, 2018
    Assignee: XEROX CORPORATION
    Inventors: Yanjia Zuo, Mandakini Kanungo, Hong Zhao, John R. Andrews, Pratima Gattu Naga Rao, Mark A. Cellura, Santokh S. Badesha
  • Patent number: 10138393
    Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 ?m to 100 ?m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: November 27, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Tomo Chiba, Hiroshi Takahashi, Eisuke Shiga, Daisuke Ueyama, Kentaro Nomizu
  • Patent number: 10137475
    Abstract: A coating system comprising an epoxy coating layer prepared from an epoxy formulation which comprises an epoxy resin; a curing agent with no more than 4.5 wt % free amine based on a weight solids of the curing agent; and an adjacent layer prepared from a non-isocyanate polyurethane formulation wherein the epoxy formulation and/or non-isocyanate polyurethane formulation optionally further comprise one or more additives selected from the group consisting of solvent, reactive diluent, plasticizer, pigment, filler; rheology modifiers, dispersants, surfactants, UV stabilizers, and corrosion inhibitors is provided. Also provided are a method of applying a multi-layer coating system and an article comprising a coating system.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: November 27, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Yanxiang Li, Paul J. Popa, John N. Argyropoulos, Sandra Hofmann, Ray E. Drumright
  • Patent number: 10141538
    Abstract: A sealant, a display panel and a display device are provided. The sealant includes: a main body material and a reflective material distributed in the main body material. In the case that the display device adopts the sealant, due to the scattering effect of the reflective material, the light incident onto the sealant is scattered by the reflective material and the light scattered by the reflective material cannot be continuously propagated along an original total reflection propagation direction, so that the light, which is originally totally reflected, emerges from the display panel, and thus the light extraction efficiency of the display panel is improved.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: November 27, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Changdi Chen, Tao Yang
  • Patent number: 10125289
    Abstract: To provide a composition which satisfies a high K1c value, a high glass transition temperature and a low viscosity simultaneously, and which is capable of forming an interlayer filler layer for a layered semiconductor device of which stable bonding is maintained even regardless of changes of environment. A composition comprising an epoxy compound (A) having a viscosity at 25° C. of at most 50 Pa·s, an amine compound (B) having a melting point or softening point of at least 80° C., and an amine compound (C) having a melting point or softening point of less than 80° C., wherein the proportion of the amine compound (C) is at least 1 part by weight and less than 40 parts by weight per 100 parts by weight of the total amount of the amine compound (B) and the amine compound (C).
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: November 13, 2018
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masaya Sugiyama, Yasuhiro Kawase, Makoto Ikemoto, Hideki Kiritani, Masanori Yamazaki
  • Patent number: 10072173
    Abstract: A coating composition is disclosed. The coating composition includes a poly(methyl methacrylate) polymer or copolymer having a weight average molecular weight of at least 50,000 grams per mole; monomer comprising at least one of an alkylene diacrylate, alkylene dimethacrylate, cycloalkylene diacrylate, or cycloalkylenedimethacrylate, wherein the at least one of an alkylene diacrylate, alkylene dimethacrylate, cycloalkylene diacrylate, or cycloalkylenedimethacrylate provides at least 80 percent by weight of the monomer; and a stabilizer against ultraviolet light. An article including a coating on a surface of a substrate and a method of making the article are also disclosed. The coating on the surface of the substrate is obtained by curing the disclosed coating composition.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 11, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Susannah C. Clear, Raghunath Padiyath, Garry W. Lachmansingh, Mark A. Strobel, Sonja S. Mackey, Naiyong Jing