Abstract: Steel ligatures are provided having coated thereon a thin film of a resin composition containing zinc particles. The resin composition comprises a mixture of an epoxy resin and a phenolic resin, and the coating may be cured, or substantially uncured, as desired.

Abstract: A process for bonding steel sheets, e.g., into metallic cans, which comprises applying first a primer comprising 0.1 to 2.5 weight parts of a bisphenol type A epoxy resin having a mean molecular weight of more than about 800, preferably 2000 to 4000, and 1 weight part of thermosetting phenolic resin, which is obtained by heating an aqueous solution comprising phenol, orthocresol and formaldehyde in the presence of a catalyst and reacting them with each other under refluxing conditions, on the surface of the steel sheets, heating the resultant steel sheets, and then bonding the steel sheets with a polyamide, and a primer composition for use in the process.

Abstract: Compounds having at least three 3-sorboyloxy-2-hydroxypropyl groups directly attached to ether oxygen atoms are polymerised by exposure to actinic radiation, preferably in the presence of a sensitiser such as Michler's ketone or benzoin. The compounds may be obtained by the reaction either of sorbic acid with a substance having at least three glycidyl ether groups or of glycidyl sorbate with a substance having at least three phenolic or alcoholic hydroxyl groups: if desired, not all of the glycidyl groups may be consumed, so that, after actinically-induced polymerisation, the epoxide-containing polymer may be cross-linked by reaction with a curing agent for epoxide resins.The compounds are useful in making printed circuits or printing plates for offset printing.

Abstract: This invention provides an adhesive composition for use in flexible printed circuits, comprising a phenol-formaldehyde resin, a polyepoxy compound, an acrylonitrile-butadiene copolymer and/or a polyvinylacetal resin, and a styrenic copolymer containing as structural units maleic anhydride and/or an alkyl maleate. Being excellent in adhesive strength, flow property, rapid curability, and heat resistance after curing, the present composition is especially suitable for the continuous bonding of insulating plastic films, particularly a polyimide film, to conductor foils by use of a roll-laminator and gives heat-resistant metal-clad laminates excellent for flexible printed circuits which can be soldered at high temperatures.

Abstract: Aqueous dispersions in which ethylene-carboxylic acid copolymers and a low molecular weight phenolic resin are combined to produce a material useful as an adhesive, insulator, primer or coating. Additives enhancing the properties of the composition are also disclosed.