For Severing Perpendicular To Longitudinal Dimension Patents (Class 428/572)
  • Patent number: 11614375
    Abstract: An electromechanical sensor includes: an elastic carrier arranged to extend when subjected to an external mechanical load; a sensing sheath arranged at least partially around and along the elastic carrier; wherein the sensing sheath includes an electrically resistive element having a first electrical resistance operable to change upon a change of a dimension of the elastic carrier.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: March 28, 2023
    Assignee: City University of Hong Kong
    Inventors: King Wai Chiu Lai, Xiaoting Li
  • Patent number: 11370020
    Abstract: The invention relates to a method for producing casting bodies in a levitation melting method in which a batch of an electrically conductive material is brought into the sphere of influence of at least one alternating electromagnetic field by means of a starting material having a plurality of pre-separated batches separated by regions of reduced cross-section so that the batch is kept in a state of levitation. The regions are designed in such a way that separation of the pre-separated batches takes place only during melting in an alternating electromagnetic field. The melt is then cast into casting moulds.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: June 28, 2022
    Assignee: ALD Vacuum Technologies GMBH
    Inventors: Sergejs Spitans, Henrik Franz, Bjoern Sehring, Markus Holz
  • Patent number: 7951465
    Abstract: To provide a steel-aluminum welded material and a spot welding method therefor having high weld strength. The steel-aluminum welded material 3 includes a steel material 1 and an aluminum material 2 having predetermined widths. The area of a nugget 5 of a spot-welded part is determined as a function of the thickness of the aluminum material 2, and the area of a part of the nugget 5 corresponding to a part having a thickness in a range between 0.5 and 10 ?m of an interface reaction layer 6 is defined as a function of the thickness of the aluminum material 2.
    Type: Grant
    Filed: April 20, 2005
    Date of Patent: May 31, 2011
    Assignee: Kobe Steel, Ltd.
    Inventors: Wataru Urushihara, Mikako Takeda, Katsushi Matsumoto, Jun Katoh, Yasuaki Sugizaki, Hidekazu Ido
  • Patent number: 7914901
    Abstract: Structures and methods for hindering molded part deformation during densification are discussed. Such devices and techniques can help alleviate stresses that tend to result in part deformation during firing, sintering, or other densification processes, and thus reduce the need for secondary straightening operations post-densification. In some instances, a support structure is utilized to orient a molded greenbody in a preferred direction to reduce deformation during firing (e.g., orienting a thin tail section is a plane parallel to the direction of gravity). The support structure can also be part of, or the entirety of, a thermal mass to help alleviate stresses that lead to part deformation. Though such structures and methods can be used for any molded piece, it can be particularly used to create a portion, or an entirety of, a medical device such as a jaw of an surgical instrument.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: March 29, 2011
    Assignee: Ethicon Endo-Surgery, Inc.
    Inventors: Nabeel Mark Jadeed, Charles Frank Benjey, Donald F. Heaney
  • Publication number: 20020058116
    Abstract: A method for molding a molded substance to a substrate is provided. A substrate connected to a fixing portion by a connecting portion is prepared. The substrate is placed in a mold, wherein a portion of the fixing portion is protruding from the mold. The fixing portion is fixed by a fixing device outside the mold. Then, the molded substance covering the substrate is formed within the mold.
    Type: Application
    Filed: January 11, 2002
    Publication date: May 16, 2002
    Inventor: Chien-Hung Chen
  • Patent number: 6345425
    Abstract: An apparatus includes a scoring device for making transverse score lines on a roll of sheet material, a dimpler device or dimpler roller for making dimples adjacent the score lines at predetermined width locations, and a rollformer adapted to continuously form the sheet material into a tubular shape with channels. A welder is positioned in line with the rollformer and is adapted to weld the tubular shape into a permanent tube. A break off device positioned in line with the rollformer is adapted to break off sections of the tube at the score lines as the permanent tube exits the rollformer. The dimpler device is adapted to form an “in” dimple and an “out” dimple at locations coordinated with the score lines and with a width of the sheet material so that the “out” dimple forms a stop configured to slip into a channel formed in the sheet material by the rollformer but that abuts the “in” dimple which is formed at an end of the channel.
    Type: Grant
    Filed: December 9, 1999
    Date of Patent: February 12, 2002
    Assignee: Shape Corporation
    Inventors: James J. Rosasco, Douglas L. Witte, Peter Sturrus
  • Patent number: 6177203
    Abstract: Diffusion bonding techniques are extended to the simultaneous bonding of an array of multilevel piece parts. The problems of uneven expansion and contraction of different levels of different piece parts in the array are obviated by positioning each level of the array within a frame. The stack of frames is pinned in one corner. The opposite corner of the array has a slot at a 45° angle with respect to the x and y axes of the array. The slot engages a pin and allows the entire array to expand and contract along the slot in a manner to maintain the registration of features between respective levels of each piece part.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: January 23, 2001
    Assignee: Opto Power Corporation
    Inventor: Juan Alfonso Garcia
  • Patent number: 6112405
    Abstract: A component assembly, or fan, comprises a hub having secured thereto a plurality of radially extending components. The hub, which is generally of semi-circular configuration, includes planar raised portions constructed and arranged to be vacuum gripped by a rotary indexing support, or turret, and holes which accommodate guide rods of a hopper for storing a supply of the fans. The components are connected to the hub at angularly spaced intervals by severable linkage portions.
    Type: Grant
    Filed: January 8, 1997
    Date of Patent: September 5, 2000
    Assignee: Unilever Patent Holdings BV
    Inventor: John C Inkster
  • Patent number: 6051613
    Abstract: A pharmaceutical composition containing an extract from inflammatory tissue inoculated with vaccinia virus may be used to suppress the death of cells caused by endotoxin, and suppress excessive production of nitrogen monoxide induced by endotoxin. The extract may also be used to relieve hypotension induced by endotoxin. In sepsis and other serious bacterial infectious diseases, endotoxin (an intracellular toxin) is produced and a shock symptom is induced by its action. The extract, having an excellent inhibitory action toward endotoxin-induced toxicity, is quite useful for the treatment or the prevention of endotoxin-induced shock symptoms, sepsis and various symptoms accompanied thereby. In addition, the extract has an inhibitory action towards abnormal nitrogen monoxide production during the diseased state and, therefore, it is also useful as a therapeutic and preventive agent for diseases wherein an excessive nitrogen monoxide production occurs, such as acute hypotension.
    Type: Grant
    Filed: January 5, 1998
    Date of Patent: April 18, 2000
    Assignee: Nippon Zoki Pharmaceutical Co., Ltd.
    Inventors: Kousaku Ohno, Jin-emon Konishi, Seishi Suehiro
  • Patent number: 5725930
    Abstract: A supply feedstock intended for use in a workpiece finishing machine wherein individual workpieces are successively separated and presented in a predetermined fashion to an automated loading means. The feedstock includes a plurality of individual workpieces arranged in side-by-side order in the form of a continuous belt, or bandolier, of workpieces, each of the workpieces being interconnected at head and tail portions of the workpieces by integral webs, successive workpieces being trimmed from the bandolier and presented to a loading means, while the separated webs are discharged to waste.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: March 10, 1998
    Assignee: Bi-Link Metal Specialties
    Inventor: Frank Ziberna
  • Patent number: 5503895
    Abstract: A supply feedstock intended for use in a workpiece finishing machine wherein individual workpieces are successively separated and presented in a predetermined fashion to an automated loading means. The feedstock includes a plurality of individual workpieces arranged in side-by-side order in the form of a continuous belt, or bandolier, of workpieces, each of the workpieces being interconnected at head and tail portions of the workpieces by integral webs, successive workpieces being trimmed from the bandolier and presented to a loading means, while the separated webs are discharged to waste.
    Type: Grant
    Filed: September 20, 1993
    Date of Patent: April 2, 1996
    Assignee: Bi-Link Metal Specialties
    Inventor: Frank Ziberna
  • Patent number: 5207524
    Abstract: An adapter device is provided for varying the length of a ball point pen refill cartridge to enable the cartridge to be used in a variety of ball point pen housings. The adapter consists of a barrel which slips over the distal end of a refill cartridge and is securely connected to the cartridge by a channel formed in the barrel. The barrel comprises detachable sections which are removed as necessary so that the cartridge with the adapter attached barrel sections is substantially equal in length to the exhausted refill cartridge. The channel permits air to flow to the ink cartridge, enabling ink to be flow easily from the cartridge.
    Type: Grant
    Filed: October 19, 1989
    Date of Patent: May 4, 1993
    Assignee: Arnold Pen Company
    Inventor: Remmie L. Arnold III
  • Patent number: 4904539
    Abstract: A continuous strip (200) of electrical component assemblies (22) is disclosed, together with method of manufacturing thereof. The components are made by stamping a metal strip to form an intermediate article having a plurality of first and second members (28, 38) integrally extending therefrom and joined thereto at spaced locations therealong. Each first member (28) has at least one second member (38) associated with and adjacent to it. The second members (38) include locating means (42) for enabling at least third members (56) to be assembled to the first members (28) in a precisely located relationship. The first members (28) may also include further locating means (37) for fourth members (46) to be included in the assembly. The strip thus provides its own fixturing means for precisely locating the various members of electronic component assemblies.
    Type: Grant
    Filed: January 17, 1989
    Date of Patent: February 27, 1990
    Assignee: AMP Incorporated
    Inventors: John P. Kling, Richard F. Stone, Jr.
  • Patent number: 4869969
    Abstract: A metallic wall having coined knockouts. The wall includes a first surface and a second surface spaced from the first surface. A plurality of spaced knockout portions are positioned in incipient apertures in the wall and are disposed substantially between the surfaces. Each knockout portion is defined by a first indentation encompassing the knockout portion and extending from the first surface, and by a second indentation encompassing the knockout portion and extending form the second surface. These indentations are in alignment with a web of material of substantially uniform thickness throughout its length spacing the indentations. The outside surface defining the first indentation is inclined inwardly. A coating is applied to the second surface after formation of the indentations. A sharp blow to the knockout portion from the second surface fractures the web to allow removal of the knockout portion without any material of the wall extending substantially beyond the first surface.
    Type: Grant
    Filed: May 3, 1988
    Date of Patent: September 26, 1989
    Assignee: Allied Tube & Conduit Corporation
    Inventors: Zorica Pavlov, Vijay B. Patel
  • Patent number: 4715118
    Abstract: The connecting strip for the manufacture of electric components intended to be used with flow soldering; this connecting strip acts during the entire manufacturing cycle as a support for the base elements of the components and as a joining plane for the molding of the coating resin, the notches punched out in the strip thus limiting the output electrodes of the components as well as the electric connections inside the coating.
    Type: Grant
    Filed: May 2, 1986
    Date of Patent: December 29, 1987
    Assignee: Compagnie Europeene de Composants Electroniques
    Inventors: Gilles Bernard, Francois Delalande
  • Patent number: 4547985
    Abstract: This invention relates to the protection of metallic surfaces susceptible to abrasion by rock-like material. According to the invention, a metallic surface susceptible to abrasion by rock-like material is protected by stud welding studs of abrasion resistant metallic material to the metallic surface in closely spaced relationship to cause the majority of the rock-like material to contact the abrasion resistant studs instead of the metallic surface. Typical of such metallic surfaces are a ground engaging tool, earth-working equipment, or chutes for conveying the rock-like material. The abrasion resistant metallic material comprising the stud can be formed of cast material of compacted metallic powder.
    Type: Grant
    Filed: July 23, 1982
    Date of Patent: October 22, 1985
    Assignee: Sherritt Gordon Mines Limited
    Inventors: Vilnis Silins, Jerome H. Tameling
  • Patent number: 4451973
    Abstract: A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips whic
    Type: Grant
    Filed: April 13, 1982
    Date of Patent: June 5, 1984
    Assignee: Matsushita Electronics Corporation
    Inventors: Kenichi Tateno, Masami Yokozawa, Hiroyuki Fujii, Mikio Nishikawa, Michio Katoh, Fujio Wada
  • Patent number: 4424976
    Abstract: A channel-shaped trim having a longitudinally extending opening for embracing and clamping an edge flange of a support member comprising a core member having a large number of disconnected channel-shaped core pieces constructed with at least two strip-shaped elements and connecting portions which are positioned symmetrically with respect to both side end portions of the elements so as to define and surround all sides of at least one slot between the elements and the connecting portions. In addition, the trim includes a covering member enclosing the core member and charged between the adjacent core pieces and in slots which are formed in the core pieces.
    Type: Grant
    Filed: May 10, 1982
    Date of Patent: January 10, 1984
    Assignee: Toyoda Gosei Co., Ltd.
    Inventor: Keizo Hayashi
  • Patent number: 4362787
    Abstract: This print hammer assembly method utilizes an elongated thin metal strip punched to form repetitive flag panels each having a flag region non-symmetrically linked to a surrounding frame, and a connector arm extending obliquely between the frame and flag. All assembly steps are performed while maintaining the panels connected in the strip. A flat coil, centered by a boss on the flag region, is sandwiched between and adhesively bonded to the strip and a second flag panel severed from another like strip. Spring wires are attached to the connector arms of both panels before sandwiching, and the coil leads are subsequently attached to the connector arms. Simultaneous soldering of the coil leads and spring wires to the connector arms is carried out from one side of the assembly strip, advantageously using solder paste and focused infrared heating. After discarding the excess frame portions, the hammers are embedded in a molding compound while still linked together in a strip.
    Type: Grant
    Filed: November 3, 1980
    Date of Patent: December 7, 1982
    Assignee: Dataproducts Corporation
    Inventor: Val K. Jezbera
  • Patent number: 4348464
    Abstract: A scoring tool combination wherein the score anvil is provided with a pair of transversely spaced generally rounded material compressing ribs disposed on opposite sides of the scoring rib of the score tool. The material compressing ribs compress the material of the sheet being scored on opposite sides of the score so as to strengthen the sheet and thus permit deeper scoring and lesser score residuals without failure due to cracking. The material compressing ribs also control coating damage and exposed metal areas.
    Type: Grant
    Filed: November 29, 1978
    Date of Patent: September 7, 1982
    Assignee: The Continental Group, Inc.
    Inventor: Nick S. Khoury
  • Patent number: 4331740
    Abstract: A continuous tape is employed in the automatic assembly of semiconductor devices. The tape contains a sequential series of patterns, each one comprising a plurality of metal fingers. Each pattern includes fingers having an inward extension that terminates in a configuration that mates with the contact pattern of the semiconductor device. Desirably these fingers are thermocompression gang bonded to the semiconductor contact pads. This attaches the semiconductor device to the tape for further processing. In one assembly method the fingers have an outward extending portion that is designed for bonding to a secondary structure such as a lead frame destined to become part of the final housing. The fingers in the pattern are joined together by means of a ring located at or near the point at which they are bonded to the lead frame. After the lead frame bonds are achieved, preferably by thermocompression gang bonding, the ring is severed at locations between the fingers.
    Type: Grant
    Filed: April 14, 1980
    Date of Patent: May 25, 1982
    Assignee: National Semiconductor Corporation
    Inventor: Carmen D. Burns
  • Patent number: 4318964
    Abstract: An apparatus and supply strip is disclosed for inserting terminal pins into an apertured workpiece. The apparatus includes reciprocating feeding means for sequentially advancing a supply strip of integrally connected preformed terminal pins toward the workpiece; shearing means for severing the leading one of said pins from the remainder of the supply strip; and driving means for inserting the severed lead one of said pins into the workpiece. The feeding means comprises grasping means operable only when the feeding means is moving in a first direction toward the workpiece to grasp the supply strip at the juncture of adjacent integrally connected preformed terminal pins.
    Type: Grant
    Filed: March 28, 1979
    Date of Patent: March 9, 1982
    Assignee: General Staple Company, Inc.
    Inventors: Irwin Zahn, Heinrich F. Meyer
  • Patent number: 4189523
    Abstract: A flexible string of interconnected sheet metal clips of the type which are adapted to hold the end bars of a sinuous or zigzag cushion-supporting springs on the wooden frame of an article of furniture. The clips are disposed in side-by-side relationship and adjacent clips in the string are connected together by a thin flexible web, the thickness of which is reduced by a swaging operation, and which serves to maintain such clips slightly spaced apart.
    Type: Grant
    Filed: May 11, 1978
    Date of Patent: February 19, 1980
    Assignee: Hartco Company
    Inventor: Kenneth C. Pearson
  • Patent number: 4188424
    Abstract: A metal carrier is embedded into trim, for providing proper rigidness in the transverse direction as well as in the longitudinal direction to the strip-like trim formed with rubber or plastics and the like. Transverse slots are formed in the strip-like sheet metal at given intervals in the longitudinal direction and a thin link portion and/or narrow width portion (sectional area in the transverse direction is small) is alternately formed at the top and bottom portions of the transverse slot. When an external force is applied to the metal carrier covered with rubber or plastics, the formed connecting links of the thin link portion and/or narrow width portion at top and bottom are broken, and the metal carrier becomes a continuous zigzag strip.
    Type: Grant
    Filed: December 20, 1977
    Date of Patent: February 12, 1980
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Tsuneo Ohno, Kunio Maeno, Takahiko Kasuya, Takao Nakajima
  • Patent number: 4170691
    Abstract: The disclosure includes method and apparatus for handling elongated webs of sheet metal, and a sheet metal construct formed as an intermediate product and comprising a parent coil pre-divided into a plurality of daughter coils. In one method sequence, separation can be completed by the end user of the coil just before it is fed into a press or the like. In another method sequence, separation is completed during wrapping of the parent coil. In still other sequences, completion of separation can be accomplished at stages intermediate these two. Slitting may be done directly off a mill. Edge trim strip may be wound as part of the parent coil to simplify scrap handling, and may be used to protect the coil in transit.
    Type: Grant
    Filed: August 12, 1976
    Date of Patent: October 9, 1979
    Inventor: John W. Rogers
  • Patent number: 4129682
    Abstract: A high density interdigitated symmetrical separable lead frame for use in fabricating light-emitting diodes. A plurality of protection bars protects the unseparated lead frame from damage during initial handling and plating processes. The frame is separable into two unitary segments for attachment of light-emitting diode assemblies. Substantial savings are realized in material costs.
    Type: Grant
    Filed: November 16, 1977
    Date of Patent: December 12, 1978
    Assignee: Monsanto Company
    Inventors: Walter P. Stewart, Lawrence F. Punte