Shaped Configuration For Melting (e.g., Package, Etc.) Patents (Class 428/576)
  • Patent number: 11171103
    Abstract: A solder ball assembly can include a first spring element having a first shape and formed from a first elastic electrically conductive material. The solder ball assembly can also include a second spring element having a second shape and formed from a second elastic electrically conductive material. The second spring element is mechanically attached to the first spring element to form a spring assembly. The solder ball can be configured to enclose the spring assembly.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: November 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Jason J. Bjorgaard, Layne A. Berge, John R. Dangler, Matthew Doyle, Thomas W. Liang, Kyle Schoneck, Matthew A. Walther
  • Patent number: 10702953
    Abstract: The present invention is a composite welding wire for fusion welding of components manufactured of superalloys. The composite weld wire includes a surface layer applied to the core wire in a green condition and bonded to the core wire. The surface layer includes alloying elements selected from among B and Si, the total bulk content of B and Si representing 0.5 to 4.0 wt. % of the composite welding wire. The boron and silicon alloying elements reduce the melting temperature and increase the solidification range of the weld pool, minimizing the incidence of weld cracking compared to welding without the coating. The green condition surface layer is comprised of more than 80 wt. % of the bulk content of the composite welding wire selected from the combination of B and Si.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: July 7, 2020
    Assignee: Liburdi Engineering Limited
    Inventors: Alexander B Goncharov, Joseph Liburdi, Paul Lowden, Scott Hastie
  • Patent number: 10668695
    Abstract: Billets and methods for manufacturing them are disclosed. The billets include a cladding member including an alloy selected from the group including stainless steel, nickel-chrome, nickel-copper, and copper-nickel alloys, and a steel body that is positioned so that it has an interface with the cladding member, the steel body having a formation in which the scavenging metal is located and elements being provided for separating the scavenging metal from the cladding member at the interface.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: June 2, 2020
    Assignee: CLADINOX INTERNATIONAL LIMITED
    Inventor: Antonio Giorgio Cacace
  • Publication number: 20150004428
    Abstract: An aluminum alloy brazing sheet having high corrosion resistance is provided, which develops the sacrificial anticorrosion effect in both surfaces of the sheet, which has the brazing function in one of both the surfaces, and which prevents the occurrence of preferential corrosion. A channel forming component for a vehicular heat exchanger is also provided by utilizing the aluminum alloy brazing sheet. An aluminum alloy brazing sheet having high corrosion resistance includes an aluminum alloy core, a filler material clad on one surface of the core, and a sacrificial anode material clad on the other surface of the core, wherein the filler material, the sacrificial anode material, and the core have respective predetermined alloy compositions. A channel forming component for a vehicular heat exchanger is manufactured using the aluminum alloy brazing sheet having high corrosion resistance.
    Type: Application
    Filed: January 28, 2013
    Publication date: January 1, 2015
    Applicants: DENSO CORPORATION, UACJ CORPORATION
    Inventors: Sadayuki Kamiya, Shota Terachi, Kenji Negura, Makoto Ando, Atsushi Fukumoto, Yoshiyuki Oya, Akio Niikura
  • Publication number: 20140329106
    Abstract: It is an object of the present invention to provide a bonding wire capable of maintaining a structure and a configuration thereof at the time of performing wire bonding; and a manufacturing method thereof. Provided is a bonding wire having a core member mainly composed of copper; and a palladium coating layer. Particularly, formed in a center of the core member is a fibrous structure with copper crystals extending in an axial direction.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Applicant: NIPPON MICROMETAL CORPORATION
    Inventor: Ryo TOGASHI
  • Publication number: 20140287258
    Abstract: An assembly comprises a carbon structure (10), a metal sheet (40), a brazing layer (20) disposed on a surface of the carbon structure (10). The brazing layer (20) is formed by brazing a brazing material on the surface of the carbon structure (10), and a solder layer (30) disposed on a surface of the brazing layer (20) and binding the metal sheet (40) to the brazing layer (20). A method for affixing a metal sheet (40) to a carbon structure (10) and a method for metalizing a surface of a carbon structure (10) are also provided.
    Type: Application
    Filed: March 20, 2014
    Publication date: September 25, 2014
    Applicants: Johnson Electric S.A., Shenzhen Joint Welding Material Co., Ltd.
    Inventors: Jianjun GUO, Zhiping ZOU, Zonghui ZHENG, Chihang TO
  • Publication number: 20140284374
    Abstract: A carrier plate has test areas for the assessment of a selective soldering process. The carrier plate has different zones, which are provided with peripheral borders. The zones are not wettable with solder, while the peripheral borders are wettable. if a selective soldering head is brought up to the reference areas, then, as long as there is no deficiency in quality, the respective peripheral border must be just wetted with solder, whereby an assessment of the selective soldering process is possible. The test plate advantageously makes a simple optical evaluation possible, for example by visual inspection.
    Type: Application
    Filed: June 22, 2012
    Publication date: September 25, 2014
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Bernd Müller, Ulrich Wittreich
  • Publication number: 20140248505
    Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melti
    Type: Application
    Filed: September 21, 2012
    Publication date: September 4, 2014
    Inventors: Thomas Kalich, Christiane Frueh, Franz Wetzl, Bernd Hohenberger, Rainer Holz, Andreas Fix, Michael Guyenot, Andrea Feiock, Michael Guenther, Martin Rittner
  • Patent number: 8815019
    Abstract: It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: August 26, 2014
    Assignees: Nippon Steel & Sumikin Materials., Ltd., Nippon Micrometal Corporation
    Inventors: Tomohiro Uno, Shinichi Terashima, Takashi Yamada, Ryo Oishi, Daizo Oda
  • Patent number: 8803001
    Abstract: Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°- 180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: August 12, 2014
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Sang Won Yoon, Satoshi Yasuda, Koji Shiozaki
  • Publication number: 20140193658
    Abstract: Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 10, 2014
    Applicant: Indium Corporation
    Inventors: Jordan Peter Ross, Amanda Hartnett, Robert Norman Jarrett
  • Publication number: 20140141273
    Abstract: By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.
    Type: Application
    Filed: March 23, 2012
    Publication date: May 22, 2014
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Masato Shimamura, Tsukasa Ohnishi, Mitsuhiro Kosai, Kazuyori Takagi, Tomoko Nonaka, Masayuki Suzuki, Toru Hayashida, Seiko Ishibashi, Shunsaku Yoshikawa, Yoshie Yamanaka
  • Patent number: 8663817
    Abstract: A brazing sheet made up of a core sheet made of aluminum alloy covered on at least one side with a layer of cladding forming a sacrificial anode. The layer of cladding is formed of an aluminum alloy of chemical composition, in % by weight: Si: >2.0-7.0; Fe<0.5; Cu<1.0; Mn: 1.0-2.0; Mg<0.5; Zn: 1.0-3.0; Cr<0.25; Ni<1.5; Ti<0.25; Co<1.5; V, In, Sn, Zr, Sc<0.25 each; other elements <0.05 each and 0.15 in total. A heat exchanger tube may be produced by folding and brazing from the brazing sheet, where the layer of cladding forms a sacrificial anode constituting the lining of the tube or “inner-liner.
    Type: Grant
    Filed: May 28, 2009
    Date of Patent: March 4, 2014
    Assignee: Constellium France
    Inventors: Sylvain Henry, Elodie Perrin
  • Publication number: 20140057125
    Abstract: A light weight alloy part is molded in a mold containing at least one weldable metal insert, so that portions of portions of the alloy part lap portions of the insert to securely lock the weldable insert to the light weight alloy part. The resulting hybrid part is thus both light weight and weldable to other assemblies and sub-assemblies.
    Type: Application
    Filed: September 13, 2013
    Publication date: February 27, 2014
    Inventors: Wojciech Krzewinski, Ben Reginella, Matthew M. McNutt, Anca Matache
  • Publication number: 20140048587
    Abstract: Disclosed is a brazing alloy composition. The composition comprises, by weight, about 94% copper, about 4% zinc, and about 2% iron. Further disclosed is a brazing process utilizing the brazing alloy, a method for the brazing alloy's preparation and a work piece having members joined by the brazing alloy providing stronger bonding as demonstrated by braze joints having increased shear strength.
    Type: Application
    Filed: February 7, 2013
    Publication date: February 20, 2014
    Inventors: Paul Rivest, Robert Biersteker, Joseph Sarazin
  • Publication number: 20140042131
    Abstract: A system and method for heating a filler wire (consumable) using a laser in brazing, cladding, building up, filling, overlaying, welding, and joining applications. The filler wire includes a first surface that absorbs energy from a laser beam and a second surface separated from said first surface by a thickness t that is in a range of 0.010 inch to 0.045 inch. A cross-sectional shape of the filler wire includes at least one bend toward the laser beam along a length of the cross-sectional shape. The cross-sectional shape has a projected width w that is in a range of 0.030 inch to 0.095 inch.
    Type: Application
    Filed: March 12, 2013
    Publication date: February 13, 2014
    Applicant: LINCOLN GLOBAL, INC.
    Inventor: Elliott ASH
  • Publication number: 20130313309
    Abstract: A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal.
    Type: Application
    Filed: March 28, 2013
    Publication date: November 28, 2013
    Inventors: Masayuki KITAJIMA, Takatoyo YAMAKAMI, Takashi KUBOTA, Kuniko ISHIKAWA
  • Publication number: 20130306714
    Abstract: A brazing sheet material including a core alloy layer bonded on at least one side with an aluminium brazing clad layer or layers forming a filler material of a 4000-series aluminium alloy. The core layer is made from an aluminium alloy having (in wt. %): Mg 1.0 to 3.0, Mn 0 to 1.8, Cu 0 to 0.8, Si 0 to 0.7, Fe 0 to 0.7, optionally one or more elements selected from the group (Zr, Cr, Hf, T), Zn 0 to 0.5, impurities and aluminium. The filler material forms a 4000-series aluminium alloy further including one or more wetting elements selected from Bi 0.03-0.5, Pb 0.03-0.5, Sb 0.03- 0.5, Li 0.03-0.5, Se 0.03-0.5, Y 0.03-0.05, Th 0.03-0.05, wherein the sum of these elements being 0.5% or less.
    Type: Application
    Filed: January 19, 2012
    Publication date: November 21, 2013
    Applicant: ALERIS ROLLED PRODUCTS GERMANY GMBH
    Inventor: Adrianus Jacobus Wittebrood
  • Publication number: 20130244051
    Abstract: There are provided an aluminum-alloy clad sheet and a clad sheet subjected to heating equivalent to brazing, which each have a high strength and an excellent erosion resistance and thus allow a reduction in thickness of a clad sheet subjected to heating equivalent to brazing such as an aluminum alloy radiator tube, and/or of a clad sheet such as an aluminum-alloy brazing sheet. An aluminum-alloy clad sheet or a clad sheet subjected to heating equivalent to brazing includes at least a core aluminum alloy sheet and an aluminum-alloy sacrificial anti-corrosive material cladded with each other, and is to be formed into a heat exchanger by brazing. The core aluminum alloy sheet includes a specified 3000 series composition.
    Type: Application
    Filed: February 21, 2013
    Publication date: September 19, 2013
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventor: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
  • Publication number: 20130224510
    Abstract: A system for heat transfer along with the method of preparation of the same is described. System includes a first surface, a second surface, and an interface material. The interface material is disposed between the first and second surfaces such that it is solid at an assembling temperature and liquid at an operating temperature. The first surface of the system is configured to adhere to the solid and liquid thermal interface material, and the second surface is configured to adhere to the liquid thermal interface material and be detachable from the solid interface material. The method of preparation of the system includes disposing the first surface, an interface material, and a second surface, heating the interface material to above its melting point and then cooling to a temperature below melting point to detach and remove the second surface from the interface material.
    Type: Application
    Filed: February 29, 2012
    Publication date: August 29, 2013
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Tao Deng, Yogen Vishwas Utturkar, Binoy Milan Shah, Charles Franklin Wolfe, JR., Pramod Chamarthy
  • Publication number: 20130193194
    Abstract: A superior braze material, along with a method of producing the braze material and a method of sealing, joining or bonding materials through brazing is disclosed. The braze material is based on a metal oxide-noble metal mixture, typically Ag—CuO, with the addition of a small amount of metal oxide and/or metal such as TiO2, Al2O3, YSZ, Al, and Pd that will further improve wettability and joint strength. Braze filer materials, typically either in the form of paste or thin foil, may be prepared by a high-energy cryogenic ball milling process. This process allows the braze material to form at a finer size, thereby allowing more evenly dispersed braze particles in the resultant braze layer between on the surface of the ceramic substrate and metallic parts.
    Type: Application
    Filed: April 19, 2010
    Publication date: August 1, 2013
    Applicant: Aegis Technology Inc.
    Inventors: Quan Yang, Chunhu Tan, Zhigang Lin
  • Publication number: 20130189536
    Abstract: A steel for electron-beam welding according to the present invention includes at least C: 0.02% to 0.10%, Si: 0.03% to 0.30%, Mn: 1.5% to 2.5%, Ti: 0.005% to 0.015%, N: 0.0020% to 0.0060%, and O: 0.0010% to 0.0035%, further includes S: limited to 0.010% or less, P: limited to 0.015% or less, and Al: limited to 0.004% or less, with a balance including iron and inevitable impurities. An index value CeEBB obtained by substituting composition of the steel into following Formula 1 falls in the range of 0.42 to 0.65%, the number of oxide having an equivalent circle diameter of 1.0 ?m or more is 20 pieces/mm2 or less at a thickness center portion in cross section along the thickness direction of the steel, and the number of oxide containing Ti of 10% or more and having an equivalent circle diameter of not less than 0.05 ?m or more and less than 0.5 ?m falls in the range of 1×103 to 1×105 pieces/mm2 at the thickness center portion.
    Type: Application
    Filed: October 27, 2011
    Publication date: July 25, 2013
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Ryuichi Honma, Ryuji Uemori, Tadashi Ishikawa, Akihiko Kojima, Manabu Hoshino
  • Publication number: 20130094900
    Abstract: Disclosed is a hardfacing alloy deriving its usefulness from carbides and borides of molybdenum and niobium. The alloy does not rely on chromium as an alloying agent. The hardfacing alloy is capable of being applied to a number of industrial substrates in a crack-free manner, and once applied convert the substrate to a wear- and abrasion-resistant material having an extended service life, even when subjected to harsh wear conditions.
    Type: Application
    Filed: October 17, 2011
    Publication date: April 18, 2013
    Applicant: DEVASCO INTERNATIONAL INC.
    Inventors: Grant R. FOLKMANN, Keith E. MOLINE
  • Publication number: 20120325539
    Abstract: Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°-180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.
    Type: Application
    Filed: June 21, 2011
    Publication date: December 27, 2012
    Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Sang Won Yoon, Satoshi Yasuda, Koji Shiozaki
  • Patent number: 8329311
    Abstract: The invention concerns a nanoprinted device comprising point shaped metallic patterns, in which each metallic pattern has a bilayer structure controlled in hardness and in chemical properties comprising a lower layer (30) constituting the base of the point and an upper layer (31) constituting the point itself.
    Type: Grant
    Filed: September 25, 2005
    Date of Patent: December 11, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: François Marion, Cécile Davoine
  • Publication number: 20120267420
    Abstract: A class of nickel based alloys having a fine grain structure resistant to stress corrosion cracking, and methods of alloy design to produce further alloys within the class are presented. The alloys act as suitable welding materials in similar applications to that of Alloy 622. The fine-grained structure of these novel alloys may also be advantageous for other reasons as well such as wear, impact, abrasion, corrosion, etc. These alloys have similar phases to Alloy 622 in that they are composed primarily of austenitic nickel, however the phase morphology is a much finer grained structure opposed to the long dendritic grains common to Alloy 622 when it is subject to cooling rates from a liquid state inherent to the welding process.
    Type: Application
    Filed: March 23, 2012
    Publication date: October 25, 2012
    Inventor: Justin Lee Cheney
  • Publication number: 20120205346
    Abstract: A welding wire is provided with a hollow section for accommodating flux. The flux has a composition including: Mn:5-20%, Si:1-5%, TiO2:5-25%, SiO2:0.1-10%, Mo:0.1-5% by weight, the balance being iron. When welding low alloy high strength steel by using the welding wire, the slag on the welding bead can be easily cleaned and a smooth surface can be formed on the welding bead which makes it easier to galvanize a zinc layer over the surface of the welding bead. The welding wire provides better welding operation performance and generates less welding spatters.
    Type: Application
    Filed: October 20, 2010
    Publication date: August 16, 2012
    Applicant: ILLINOIS TOOL WORKS INC.
    Inventors: Jie Yan, Xiangui Cao, Fuhu Chen, Mingqian Yang
  • Publication number: 20120202088
    Abstract: A billet includes a solid steel body and an alloy cladding. The cladding may include a square tube in which the body is inserted with an interface at which the cladding becomes bonded to the body when the billet is heated and rolled or otherwise worked into a ferrous product. At least one element composed of a mass of finely divided scavenging aluminium, titanium or magnesium, is placed in the tube adjacent the body and separate from the interface. The elements are advantageously compressed into briquettes which scavenge oxygen from residual air at the interface to prevent oxidation of the cladding at the interface. The tube may be closed to prevent gases outside the billet from penetrating to the interface. Alternatively, reliance may be placed on the briquettes to scavenge oxygen from the residual air and also from atmospheric air and furnace gases before they can penetrate to the interface.
    Type: Application
    Filed: October 19, 2010
    Publication date: August 9, 2012
    Applicant: CLADINOX INTERNATIONAL LIMITED
    Inventor: Antonino Giorgio Cacace
  • Patent number: 8216693
    Abstract: A brazing sheet of aluminum alloy composed of a core material and a first brazing filler metal covering one surface of the core material. The core material contains as an essential component 0.2-1.0 mass % of Cu and as optional components at least one species of no more than 1.5 mass % of Si, no more than 1.8 mass % of Mn, no more than 0.35 mass % of Ti, and no more than 0.5 mass % of Mg, with the remainder being Al and inevitable impurities. The first brazing filler metal has a liquid phase ratio (X %) at 600° C. and a thickness (Y ?m) such that X and Y satisfy the following relationship: (1) 30?X?80, (2) Y?25, and (3) 1000?X×Y?24000. The brazing sheet provides good brazeability and maintains high corrosion resistance after brazing on the surface cladded with the brazing filler metal.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: July 10, 2012
    Assignee: Kobe Steel, Ltd.
    Inventors: Katsuhiro Matsukado, Akihiro Tsuruno, Yoshinori Kato
  • Publication number: 20120111928
    Abstract: Systems and methods are provided for improved brazing. A system includes a gap filling compound (GFC). The GFC includes a brazing alloy. The system also includes a GFC retention screen. The GFC retention screen configured to be disposed over the GFC to retain the GFC within the gap during brazing. The GFC retention screen is also configured to enable gas to escape from the GFC during brazing.
    Type: Application
    Filed: November 8, 2010
    Publication date: May 10, 2012
    Applicant: General Electric Company
    Inventors: Junyoung Park, Jason Robert Parolini
  • Publication number: 20120067498
    Abstract: A method for a thermal joining of two thermoplastic components includes arranging at least one reactive sheet entity in a mating zone between the two thermoplastic components. A multiply perforated metallic sheet entity configured as a bonding agent is disposed on each side of the at least one reactive sheet entity, at least in some regions of the mating zone. The at least one reactive sheet entity is activated so as thermally join the two thermoplastic components in the regions of the mating zone.
    Type: Application
    Filed: September 16, 2011
    Publication date: March 22, 2012
    Applicant: AIRBUS OPERATIONS GMBH
    Inventor: Freerk Syassen
  • Publication number: 20120063911
    Abstract: A dual brazing alloy element for a materially integral connection of a ceramic surface to a metallic surface includes a first layer having a Ni-based brazing alloy with a Ni content of at least 50% by weight and having at least one component configured to lower a melting point of the Ni-based brazing alloy selected from the group consisting of Si, B, Mn, Sn and Ge. A second layer includes an active brazing alloy material having a total content of 1-15% by weight of at least one active element selected from the group consisting of Ti, Hf, Zr and V.
    Type: Application
    Filed: September 29, 2011
    Publication date: March 15, 2012
    Applicant: ALSTOM TECHNOLOGY LTD
    Inventors: Hans-Peter Bossmann, Alexander Schnell
  • Publication number: 20110290458
    Abstract: An aluminum strip for a component, in particular a brazing component, in particular a tube or a disk, includes a profile having a brazing connection, wherein in at least one area, in particular in the area of the brazing connection: a first part of the strip thickness is taken up by a core layer of a first aluminum alloy; at least a second part of the strip thickness is taken up by at least one plating layer of a second aluminum alloy, wherein the first and the second aluminum alloy are configured to form a “brown band” layer during a brazing process; and at least a third part of the strip thickness is taken up by at least one “brown band” layer that is formed out of the first and the second aluminum alloy during the brazing process, and wherein a strip thickness of the aluminum strip is less than 500 ?m and a thickness of the core layer and/or a thickness of the plating layer is configured such that after the brazing process at least 5% of the strip thickness that is taken up by the first aluminum alloy of t
    Type: Application
    Filed: May 27, 2011
    Publication date: December 1, 2011
    Inventors: Bernd Gruenenwald, Alexander Wald, Alan Gray
  • Publication number: 20110272454
    Abstract: Provided is a wire solder with high tensile strength and pull cut resistance. An apparatus for feeding the wire solder is also provided. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The core wire is made of thermosetting resin or Joulean heat generating material. The wire solder has a single or multiple strands bound together. The wire solder is supplied from upstream of a location of soldering while the core wire is rewound under tension at a location downstream of the location of soldering. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member.
    Type: Application
    Filed: January 14, 2010
    Publication date: November 10, 2011
    Applicant: NIHON SUPERIOR CO., LTD.
    Inventor: Tetsuro Nishimura
  • Publication number: 20110244262
    Abstract: Provided are a metal bonding member having both a high adhesion strength and an excellent heat cycle reliability and a fabrication method of the same. A metal bonding member has a solder layer formed on at least a part of the surface of a metal substrate. The metal bonding member has an adhesion layer formed of metal particles having an excellent wettability with the solder layer in the interface between the solder layer and the metal substrate. The adhesion layer is partially buried in the metal substrate to form an anchor layer.
    Type: Application
    Filed: November 23, 2010
    Publication date: October 6, 2011
    Applicant: Hitachi, Ltd.
    Inventors: Keishi SATO, Shosaku ISHIHARA, Kazuaki NAOE
  • Publication number: 20110240279
    Abstract: The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.
    Type: Application
    Filed: March 30, 2010
    Publication date: October 6, 2011
    Applicant: International Business Machines Corporation
    Inventors: BRUCE K. Furman, Paul A. Lauro, Yves C. Martin, Robert L. Sandstrom, Da-Yuan Shih, Theodore G. Van Kessel
  • Publication number: 20110171485
    Abstract: A flux-cored nickel-based alloy wire contains, based on the total mass of the wire, 3 to 11 percent by mass of TiO2, 0.2 to 1.3 percent by mass of SiO2, 1 to 3 percent by mass of ZrO2, and 0.3 to 1.0 percent by mass of manganese oxides in terms of MnO2, contains of a total of 0.2 to 1.0 percent by mass in terms of Na, K and Li of sodium compounds, potassium compounds, and lithium compounds. The flux has a ratio (([TiO2]+[ZrO2])/[SiO2]) of the total of the TiO2 and ZrO2 contents to the SiO2 content of 5.0 to 14.5, in which [TiO2], [SiO2] and [ZrO2] represent TiO2, SiO2 and ZrO2 contents. The wire shows excellent weldability in welding of all positions typically on 9% nickel steels and nickel-based alloy steels and gives a weld metal having good pitting resistance, bead appearance, and resistance to hot cracking.
    Type: Application
    Filed: December 13, 2010
    Publication date: July 14, 2011
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Hiroaki KAWAMOTO, Tetsunao Ikeda, Hirohisa Watanabe
  • Publication number: 20110159310
    Abstract: Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
    Type: Application
    Filed: December 30, 2009
    Publication date: June 30, 2011
    Inventors: Deepak V. Kulkarni, Carl L. Deppisch, Leonel R. Arana, Gregory S. Constable, Sriram Srinivasan
  • Publication number: 20110147438
    Abstract: A clad solder thermal interface material is described. In one example the material has a first layer of solder, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature lower than the melting temperature of the first layer, and a third layer of solder clad to the first layer of solder opposite the second layer, the third layer having a melting temperature lower than the melting temperature of the first layer.
    Type: Application
    Filed: December 23, 2009
    Publication date: June 23, 2011
    Inventors: Carl Ludwig Deppisch, Rajasekaran Swaminathan
  • Publication number: 20110147440
    Abstract: An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.
    Type: Application
    Filed: December 21, 2009
    Publication date: June 23, 2011
    Inventor: Chuan Hu
  • Publication number: 20110146338
    Abstract: A heat exchanger includes a shell communicating with a first fluid inlet pipe and a first fluid outlet pipe, end caps coupled to ends of the shell to communicate with a second fluid inlet pipe and a second fluid outlet pipe, a plurality of tubes disposed in the shell to constitute a channel through which a second fluid flows, an end baffle located at ends of the tubes to prevent mixing of a first fluid and the second fluid, and a first plate to fill gaps between the tubes and the end baffle.
    Type: Application
    Filed: November 19, 2010
    Publication date: June 23, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Yong Sam Kwon
  • Publication number: 20110104510
    Abstract: The invention is aimed at providing a bonding structure of a copper-based bonding wire, realizing low material cost, high productivity in a continuous bonding in reverse bonding for wedge bonding on bumps, as well as excellent reliability in high-temperature heating, thermal cycle test, reflow test, HAST test or the like. The bonding structure is for connecting the bonding wire onto a ball bump formed on an electrode of a semiconductor device, the bonding wire and the ball bump respectively containing copper as a major component thereof.
    Type: Application
    Filed: July 10, 2009
    Publication date: May 5, 2011
    Applicants: NIPPON STEEL MATERIALS CO., LTD., NIPPON MICROMETAL CORPORATION
    Inventors: Tomohiro Uno, Takashi Yamada, Atsuo Ikeda
  • Publication number: 20110100615
    Abstract: A brazing sheet made up of a core sheet made of aluminum alloy covered on at least one side with a layer of cladding forming a sacrificial anode. The layer of cladding is formed of an aluminum alloy of chemical composition, in % by weight: Si: >2.0-7.0; Fe<0.5; Cu<1.0; Mn: 1.0-2.0; Mg<0.5; Zn: 1.0-3.0; Cr<0.25; Ni<1.5; Ti<0.25; Co<1.5; V, In, Sn, Zr, Sc<0.25 each; other elements <0.05 each and 0.15 in total. A heat exchanger tube may be produced by folding and brazing from the brazing sheet, where the layer of cladding forms a sacrificial anode constituting the lining of the tube or “inner-liner.
    Type: Application
    Filed: May 28, 2009
    Publication date: May 5, 2011
    Applicant: ALCAN INTERNATIONAL LIMITED
    Inventors: Sylvain Henry, Elodie Perrin
  • Publication number: 20110064963
    Abstract: The present invention provides a method for coating an article comprising applying a thermal spray coating to the article; applying a brazing material to the article; and heating the brazing material to at least a brazing temperature of the brazing material to form a resultant coating on the article, wherein the resultant coating is characterized by at least partial metallurgical bonding or at least partial alloying between the thermal spray coating and the brazing material.
    Type: Application
    Filed: September 29, 2009
    Publication date: March 17, 2011
    Inventors: Justin Lee Cheney, John Hamilton Madok
  • Publication number: 20110042053
    Abstract: The invention relates to a sandwich material for brazing comprising a core layer of a first aluminum alloy and a barrier layer of a second aluminum alloy characterized by that: the first alloy, constituting the core layer contains (in weight %): 0.8-2% Mn, ?1.0% Mg, 0.3-1.5% Si, ?0.3% Ti, ?0.3% Cr, ?0.3% Zr, ?1.3% Cu, ?0.5% Zn, ?0.2% In, ?0.1% Sn and ?0.7% (Fe+Ni), the balance consisting of Al and ?0.05% of each of the unavoidable impurities, and that the second alloy, constituting the barrier layer contains (in weight %): ?0.2% Mn+Cr, ?1.0% Mg, ?1.5% Si, ?0.3% Ti, ?0.2% Zr, ?0.3% Cu, ?0.5% Zn, ?0.2% In, ?0.1% Sn and ?1.5% (Fe+Ni), the balance consisting of Al and ?0.05% of each of the unavoidable impurities, The invention also concerns a method for the manufacture of the sandwich material, a brazed product, such as a heat exchanger comprising the sandwich material and the use of the brazed product at high and low temperatures.
    Type: Application
    Filed: February 10, 2009
    Publication date: February 24, 2011
    Inventor: Hans-Erik Ekström
  • Publication number: 20110031596
    Abstract: Semiconductor devices containing nickel-titanium (NiTi or TiNi) compounds or alloys and methods for making such devices are described. The devices contain a silicon substrate with an integrated circuit, a contact layer contacting the substrate, a TiNi-containing soldering layer on the contact layer, an oxidation prevention layer on the soldering layer, a solder bump on the soldering layer, and a lead frame or PCB attached to the solder bump. The combination of the Ti and Ni materials in the soldering layer exhibits many features not found in the Ti and Ni materials alone, such as reduced wafer warpage, increased ductility for improved elasticity, decreased consumption of the Ni in the soldering layer, and decreased manufacturing costs. Other embodiments are described.
    Type: Application
    Filed: August 5, 2009
    Publication date: February 10, 2011
    Inventors: Mike D. Gruenhagen, James J. Murphy, Suku Kim, Jim Pierce, William S. Beggs, Thomas P. Welch
  • Publication number: 20110020664
    Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.
    Type: Application
    Filed: September 29, 2010
    Publication date: January 27, 2011
    Inventors: Kengo MITOSE, Shuichi Kitagawa, Yoshiaki Ogiwara
  • Publication number: 20110008642
    Abstract: A method and apparatus are described for the casting of a composite metal ingot having two or more separately formed layers of one or more alloys. An open ended annular mould is provided having a divider wall dividing a feed end of the mould into at least two separate feed chambers. For each pair of adjacent feed chambers, a first alloy stream is fed through one of the pair of feed chambers into the mould and a second alloy stream is fed through another of the feed chambers. A self-supporting surface is generated on the surface of the first alloy stream and the second alloy stream is contacted with the first stream. By carefully selecting conditions and positions where the alloy streams meet, a composite metal ingot is formed in which the alloy layers are mutually attached with a substantially continuous metallurgical bond.
    Type: Application
    Filed: September 13, 2010
    Publication date: January 13, 2011
    Inventors: Mark Douglas Anderson, Kenneth Takeo Kubo, Todd F. Bischoff, Wayne J. Fenton, Eric W. Reeves, Brent Spendlove, Robert Bruce Wagstaff
  • Publication number: 20110006491
    Abstract: The invention relates to a process for making a hot stamped coated steel sheet product, comprising the steps of pre-coating a steel strip or sheet with aluminium—or aluminium alloy, cutting said pre-coated steel strip or sheet to obtain a pre-coated steel blank, heating the blank in a furnace preheated to a temperature and during a time defined by diagram according to thickness, at a heating rate VC between 20 and 700° C. comprised between 4 and 12° C./s and at a heating rate VC? between 500 and 700° C. comprised between 1.5 and 6° C./s, to obtain a heated blank; then transferring said heated blank to a die, hot stamping the heated blank in the die obtain a hot stamped steel sheet product, cooling at a mean rate Vr between the exit of the heated blank from the furnace, down to 400° C., of at least 30° C./s.
    Type: Application
    Filed: July 12, 2010
    Publication date: January 13, 2011
    Applicant: ArcelorMittal France
    Inventors: Dominique SPEHNER, Ronald KEFFERSTEIN, Pascal DRILLET
  • Patent number: 7858204
    Abstract: A wire (10) for use in a brazing or soldering operation has an elongated body (12) of a metallic material. The elongated body (12) has an outer surface (18). A channel (14) is formed along a length of the body. The channel (14) has an opening (A1). A flux solution (22) is deposited within the channel (14) and along the length of the body. The flux solution (22) covers a portion of the outer surface (18). A portion of the flux solution (22) is exposed through the opening (A1) in the channel (14).
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: December 28, 2010
    Assignee: Bellman-Melcor Development, LLC
    Inventors: Steven Campbell, John Scott