Abstract: A system and method for joining dissimilar metals. In one embodiment, a method comprises providing a first metal plate, a second metal plate, and an intermediate body that is positioned between the first metal plate and the second metal plate. The first metal plate is then driven into the intermediate body, which causes at least a portion of the intermediate body to collide with the second metal plate. As a result, the material of the intermediate body joins the first metal plate to the second plate. In another embodiment, a method for joining dissimilar metals comprises providing a first metal that is not amenable to welding, a second metal that is joinable to the first metal, and an intermediate body that is not joinable to at least the first metal. The intermediate body may have at least one hole such that the first metal and the second metal are positioned over and on opposite sides of the hole(s). At least a portion of the second metal may then be driven into the hole(s) to be joined to first metal.

Abstract: A method for producing a composite material by plating a band arrangement with a top side (O) and a bottom side (U), wherein the band arrangement comprises at least a first strip and a second strip, which form between them a filling channel, wherein the band arrangement comprises at least one filler strip, wherein the abovementioned band arrangement is plated, wherein a part of the filler strip, during the plating, is extruded into the filling channel; and a composite material, characterized in that it has been produced according to the method as disclosed.

Abstract: A workstation has two work surfaces that have interfaceable complementary concave and convex edges, and which are maintained in the same horizontal plane by moveable arms connecting the undersides of the two work surfaces. The moveable arms are operable to move one of the work surfaces in the horizontal plane both arcuately along the complementary edges and laterally toward and away from the other work surface. The work surface that moves relative to the other may support a keyboard or other computer input device, while the other work surface may support one or more computer monitors. The workstation is useful for any user having the need or desire for a multi-monitor configuration.

Abstract: An organic light emitting diode, including a first electrode; a second electrode facing the first electrode, the second electrode including magnesium; an emission layer between the first electrode and the second electrode; and an electron injection layer between the second electrode and the emission layer, the electron injection layer including a dipole material including a first component and a second component having different polarities, the dipole material including halide, and a content of the magnesium included in the second electrode being in a range of from 10 to 40 volume %.

Abstract: Provided is a ferritic stainless steel foil having an excellent ability to form whiskers is obtained by its composition containing, by mass, C: 0.050% or less, Si: 2.00% or less, Mn: 0.50% or less, S: 0.010% or less, P: 0.050% or less, Cr: 15.0% or more and 30.0% or less, Al: 2.5% or more and 6.5% or less, N: 0.050% or less, one or more elements selected from Ti: 0.01% or more and 0.50% or less, Nb: 0.01% or more and 0.20% or less, V: 0.01% or more and 0.20% or less, Zr: 0.005% or more and 0.200% or less, and Hf: 0.005% or more and 0.200% or less, and the balance being Fe and inevitable impurities, the proportion of a {111} crystal grain (a crystal grain such that the difference between the {111} plane of the crystal grain and a direction perpendicular to the surface of the foil falls within ±15°) on the surface of the foil being 50% by area or more, and the thickness of an oxide layer formed on the surface of the foil being 0.1 ?m or less.

Abstract: An exemplary embodiment of the present application provides a new compound and an organic electronic device using the same. The organic electronic device according to an exemplary embodiment of the present application shows excellent characteristics in terms of efficiency, driving voltage, and service life.

Abstract: A semiconductor device package that incorporates a combination of ceramic, organic, and metallic materials that are coupled using silver is provided. The silver is applied in the form of fine particles under pressure and a low temperature. After application, the silver forms a solid that has a typical melting point of silver, and therefore the finished package can withstand temperatures significantly higher than the manufacturing temperature. Further, since the silver is an interfacial material between the various combined materials, the effect of differing material properties between ceramic, organic, and metallic components, such as coefficient of thermal expansion, is reduced due to low temperature of bonding and the ductility of the silver.

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

Abstract: Methods of producing composite products formed between at least two different metal structures in a side-by-side configuration are provided. The method includes providing at least two structures made of different materials that are not compatible for welding or conventional cladding processes. A geometric profile is provided in at least one of the edges of the first structure, and a corresponding mirror image of the geometric profile is provided in a corresponding edge of the second structure. The two structures are positioned together so that the profiled edge or edges form a complimentary composite structure and are then solid-phase bonded to form a composite product. The process may be repeated with additional structure at either end of the first or second structure to achieve multiple side-by-side products. The methods and corresponding products provided herein yield edge to edge products suitable for various electrical connection type applications.

Abstract: One embodiment of the invention includes a method comprising: placing a first insert and a second insert in a casting mold and wherein the first insert and second insert comprising a plurality of connecting post extending inbetween so that the first insert and second insert are in spaced-apart relationship in the mold, each of the first insert and the second insert comprising a first material; casting a molten second material into the casting mold so that the second material flows between the first insert and the second insert and solidifying the second material to provide a product comprising a cast over body portion with the first insert and second insert and so that the second material is mechanically locked or metallurgically bonded to the first material and so that one or both of the first insert and the second insert provides working surface for the product.

Abstract: The invention provides a composite metal sheet produced by joining two metal sheets together, comprising: a projection formed by cutting the two metal sheets along a cutting line and pressing an area surrounded by the cutting line and a reference line in the two metal sheets, with the two metal sheets overlapping each other, with the reference line remaining uncut, with the cutting line extending from and communicating with both terminals of the reference line while forming a predetermined shape together with the reference line, and with the projection formed at one portion of the area in response to pressure applied to the area; hole generated by forming the projection in the two metal sheets; and a joint disposed between an outer peripheral cutting face of the projection and an inner peripheral cutting face of the hole.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the coefficient of linear thermal expansion (CLTE) of the metallic layer and the substrate are mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 ?m or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 ?m, a height of 0.6-1.8 ?m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 ?m.

Abstract: Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

Abstract: Assuming that a direction in which a first member and a second member are arranged is a first direction and a direction orthogonal to the first direction is a second direction, a welding structure includes: a pressure fit portion; a first cavity; a second cavity; a first weld bead formed between the first cavity and an end of a joining part of the first member and the second member on one side in the second direction by welding the first member and second member while the second cavity is communicated with outside; a second weld bead formed between the second cavity and an end of the joining part on the other side in the second direction; and a cutout groove communicating between the first cavity and the second cavity.

Abstract: A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x ?m represents surface roughness (Ra) at the interface between the substrate and the polymer layer, and y ?m represents surface roughness (Ra) at the interface between the polymer layer and the metal film, x>y and 5 ?m>x>0.1 ?m, and wherein, when T ?m represents a thickness of the polymer layer, T and x satisfy the relationship 2x?T.

Abstract: It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.

Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.

Abstract: A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.

Abstract: A first material with a known maximum temperature of operation is coated with a second material on at least one surface of the first material. The coating has a melting temperature that is greater than the maximum temperature of operation of the first material. The coating is heated to its melting temperature until the coating flows into any cracks in the first material's surface.

Abstract: An article has a metallic substrate. The substrate has a first surface region and a plurality of blind recesses along the first surface region. The substrate has perimeter lips at the openings of the plurality of recesses and extending partially over the respective associated recesses. A ceramic coating is along the first surface region.

Abstract: The invention provides a friction joining structure comprising steel products, a friction joining steel plate inserted there between, and a fastening device, which are mutually friction joined by a compressive force derived from the fastening device. A portion of projected streaks on the friction joining steel plate is designed to have a Vickers hardness at least 3 times greater than the surface of the steel products, which allows the projected streaks to more easily enter the steel products thereby increasing the friction coefficient between the steel products. The friction joining structure is constituted by a slip resistance mechanism which can be easily validated from a theoretical or an experimental point of view and is also small in variance of the friction coefficient. Therefore, a friction coefficient used in design can be set at a high value with high accuracy to realize a rational design.

Abstract: Superalloy components are joined by mating a recess formed in one component with a corresponding projection formed in another component along a contact surface. The components are compressed along the contact surface and resistance heat brazed to each other. Current is passed between the components at a selected flow rate and application time until brazing alloy melting occurs along the contact surface, and they are mutually affixed to each other. When repairing a damaged surface portion of a superalloy material component, the damaged portion is removed to form an excavated recess. A repair splice is formed, preferably of a same material with similar mechanical structural properties, having a mating projection with profile conforming to the corresponding recess profile. The splice and substrate are resistance heat brazed under compression pressure until brazing alloy melting occurs along the contact surface, so that they are mutually affixed.

Abstract: The invention relates to a composite material element (1), the composite material comprising a microfissured matrix (7) in the form of a three-dimensional interconnected network (4) of microfissures exposed on the surface of the ceramic matrix, an additive material (6) consisting of a flux or glass being dispersed in the matrix, the additive material (6) being a material which, when the composite material is brought to a predetermined temperature, softens and migrates by capillarity in the network (4) of microfissures (4) to said surface of the element. The quantity of additive material dispersed initially in the matrix is in a sufficient proportion compared to the matrix intended to coat a surface (5) of the composite material element left exposed so as to create a gas-tight barrier.

Abstract: A composite metal ingot having two or more lengthwise alloy layers including adjacent first and second layers respectively formed of an aluminum-manganese alloy and an aluminum alloy of a different composition wherein the interface between the first and second layers is in the form of a substantially continuous metallurgical bond characterized by the presence of particles of one or more intermetallic compositions containing manganese from the first layer dispersed within a region of the second layer adjacent the interface, the first and second layers having been formed by applying the alloy for the second layer to a self-supporting surface of the first layer while the self-supporting surface is at a temperature between the solidus and liquidus temperatures of the first layer alloy.

Abstract: A translucent conductive film-forming coating liquid that can form a translucent conductive film having excellent translucency and conductivity together with organic solvent resistance includes conductive oxide acicular powder dispersed in a solvent containing a binder resin, the glass transition point (Tg) of the binder resin being 120° C. or more.

Abstract: A Ni alloy layer is formed on a surface of a steel base on the side to be in direct contact with a molten aluminum alloy, and titanium carbide (TiC) is bonded in a particulate state to the surface of the Ni alloy layer. This makes it possible to provide a metal material having materially enhanced melting loss resistance without resorting to conventional techniques, such as the provision of a ceramic coating by PVD or CVD.

Abstract: A method of providing a weld overlay structure on a heat transfer tube or a membrane surface. A first continuous bead portion of an overlay material is applied onto the heat transfer tube or membrane surface by using a weld head to melt the overlay material. A second continuous bead portion of the overlay material is applied onto the heat transfer tube or membrane surface by using a weld head to melt the overlay material, in which the second bead portion partially overlaps with the first bead portion, forming a groove between the first bead portion and the second bead portion. A third continuous bead portion of an overlay material is applied onto the heat transfer tube or membrane surface by using a weld head to melt the overlay material into the groove between the first bead portion and the second bead portion, so as to form a relatively smooth surface.

Abstract: The present invention relates to a coating composed of a metallic coating material, for a cast-in component composed of a metallic material. It is provided, according to the invention, that the coating consists of galvanically applied nickel. The present invention furthermore relates to a cast-in component composed of a metallic material that is coated on at least part of its surface with a coating composed of a metallic coating material, wherein a coating in the form of a galvanically applied nickel layer is provided.

Abstract: A method of additive manufacturing, including resistance welding together contacting surfaces of adjacent substrate sheets, wherein weld nuggets overlap adjacent weld nuggets and collectively form a respective layer that bonds a portion of an entirety of an area of the respective contacting surfaces, thereby forming an assembled structure of at least three substrate sheets, wherein each substrate sheet includes a respective portion of a final structure.

Abstract: Various embodiments of the invention include products and parts including a frictional damping means and methods of making and using the same.

Abstract: A glass-to-metal hermetic seal assembly in a sight glass assembly or a hermetic terminal assembly is disclosed and includes a glass component, an intermediate component, and an outer ring. The intermediate component is provided around the glass component. The glass component is fused to the intermediate component. The outer ring, which has a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of the glass component, compresses the intermediate component against the glass component to create a hermetic compression seal.

Abstract: A metallic component, in particular a rolling bearing, engine or transmission component, having a component body and at least one functional surface thereof that interacts with another element. Only the functional surface (7) is formed from an amorphous metal (6).

Abstract: An object of the present invention is to provide a conductive base material for dye-sensitized solar cell and a transparent conductive base material for dye-sensitized solar cell which, when used as electrode base materials of a dye-sensitized solar cell, have high resistance to corrosion by iodide ions contained in an electrolyte layer and can prevent a reduction in the fill factor and conversion efficiency of the dye-sensitized solar cell to achieve high power generation efficiency, a dye-sensitized solar cell and a dye-sensitized solar cell module using such conductive base materials. To attain the object, provided is the conductive base material for dye-sensitized solar cell comprising: a first metal layer made of a metal having a specific resistance of 6×10?6 ?·m or less; and a second metal layer formed on the first metal layer, made of any one of metals of Ti, Cr, Ni, Mo, Ta, W, Nb, and Pt, and having a thickness of 500 nm or less.

Abstract: In a throttle body, a passive film and a corrosion-resistant film are stacked in that order on a substrate of aluminum. The passive film has a concave part on its corrosion-resistant film side. A metal layer is provided in the concave part. In shot blasting, upon collision of a blasting material against the corrosion-resistant film, a part of the blasting material is separated and adhered onto the resultant concaves to form the metal layer. For example, aluminum having a purity of not less than 98% is selected as the blasting material.

Abstract: Methods of producing composite products formed between at least two different metal structures in a side-by-side configuration are provided. The method includes providing at least two structures made of different materials that are not compatible for welding or conventional cladding processes. A geometric profile is provided in at least one of the edges of the first structure, and a corresponding mirror image of the geometric profile is provided in a corresponding edge of the second structure. The two structures are positioned together so that the profiled edge or edges form a complimentary composite structure and are then solid-phase bonded to form a composite product. The process may be repeated with additional structure at either end of the first or second structure to achieve multiple side-by-side products. The methods and corresponding products provided herein yield edge to edge products suitable for various electrical connection type applications.

Abstract: A powdered metal assembly includes a mechanical part, a powdered metal part and a fastener configured to join the mechanical part and the powdered metal part. In another aspect of the disclosure, a method for manufacturing a powdered metal assembly may include the steps of positioning the mechanical part in a forming apparatus, providing a powdered metal into the forming apparatus, compressing the powdered metal to form and bond a powdered metal part to the mechanical part to form the powdered metal assembly, and removing the powdered metal assembly from the forming apparatus.

Abstract: A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 ?m and height of the projection to be 0.3 to 10 ?m. Surface roughness of the original foil is 0.1 to 5 ?m and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

Abstract: A system for forming a surface coating on an outer surface of a foam for use with cooling system of turbine engines. The system may include removing filler from the outer surface of the foam to expose a porous structure of the foam, whereby portions of the porous structure extend outwardly from a newly formed outer surface of the filler. A surface layer may be applied to the outer surface of the filler and exposed portions of the porous structure, whereby the surface layer is attached to the porous structure at least in part due to mechanical interaction with the portions of the porous structure extending outwardly from the newly formed outer surface of the filler. The filler material may then be removed from the porous structure.

Abstract: Magnesium or magnesium alloy components having galvanic corrosion protection isolators secured in place by metallurgical bonding during casting of the magnesium or magnesium alloy component. The isolators are formed of materials that are characterized by an absolute potential difference that is between that of magnesium and a contacting metallic component.

Abstract: Steel sheet having a high {222} plane integration comprising steel sheet having an Al content of less than 6.5 mass % characterized by one or both of (1) a {222} plane integration of one or both of an ?Fe phase and ?Fe phase with respect to the steel sheet surface being 60% to 99% and (2) a {200} plane integration of one or both of an ?Fe phase and ?Fe phase with respect to the steel sheet surface being 0.01% to 15%.

Abstract: A colored acrylic polymer coated metal article includes a ferrous metal substrate, and an abraded metallic coating on the substrate, wherein the abraded metallic coating has a substantially uniform patterned appearance which simulates the surface appearance of polished stainless steel. The acrylic polymer is added as a top coating, which may be relatively thick to overlie the abraded metallic coating on an obverse side of the substrate. The metallic coating may be a Zinc Nickel alloy and a pre-treatment coating may be applied beneath the top coating.

Abstract: The invention relates to a layered filter structure, said filter element comprises—a first layer, said first layer comprising a porous metal layer;—a second layer, said second layer comprising a self-supporting layer of sintered short metal fibers. The first and the second layer are sintered together. The layered filter structure is in particular suitable as surface filtration medium, for example for the filtration of liquids or gases.

Abstract: A method of producing a clad metal ingot suitable for rolling to form a clad metal sheet, and the clad metal ingot so produced. The method involves providing a solid core ingot having an upper side with a rolling face thereon having cavities extending inwardly into the ingot from the rolling face. All or all-but-one of the cavities are blocked against molten metal entry and casting cores extending outwardly from the rolling surface are provided in alignment with the cavities. Molten cladding metal is cast on the rolling face around the casting cores to produce a composite ingot and the casting cores are removed to produce voids in the cladding layer, and the cavities are unblocked. The resulting interconnected cavities and voids are filled with a molten metal to form cast-in-place metal lugs keying or pinning the cladding layer to the core ingot.

Abstract: A cylinder liner has an outer circumferential surface around which another metal is to be cast. The cylinder liner also has a plurality of protrusions disposed on the outer circumferential surface and having respective substantially conical undercuts or necks which are progressively spread outwardly from the outer circumferential surface. The protrusions have respective flat faces on the distal ends of the undercuts.

Abstract: A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10?6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.

Abstract: A metal member to be cast-wrapped by a metal cast article, a manufacturing method thereof and a metal cast article including the metal member cast-wrapped are provided. A hollow cylindrical metal member having an outer surface with projections to be cast-wrapped by a metal cast article is manufactured in such a manner that a hollow cylindrical metal raw material 13 is inserted in a die 17 having a inner peripheral surface with longitudinal grooves of a depth H and a width W, and the hollow cylindrical metal raw material 13 is subjected to hot-extrusion.

Abstract: A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60° C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 ?m or more, while a face of the wiring pattern, which is in contact with the silicone resin layer, has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.