Abstract: A method of forming low-k material is provided. The method includes providing a plurality of core-shell particles. The core of the core-shell particles has a first ceramic with a low melting point. The shell of the core-shell particles has a second ceramic with a low melting point and a low dielectric constant. The core-shell particles are sintered and molded to form a low-k material. The shell of the core-shell particles is connected to form a network structure of a microcrystal phase.

Abstract: An active element for an electrochemical apparatus or an electrical energy generating apparatus may include a plane or curved, generally plate-type, sheet-type or mesh-type support body. A surface of the support body is at least partly (preferably entirely) coated with amorphous nickel boron or nickel thallium boron or a similar amorphous, columnar growth boron containing coating having a nodular topography.

Abstract: A cobalt electroplating composition may include (a) cobalt ions; and (b) an ammonium compound of formula (NR1R2R3H+)nXn?, wherein R1, R2, R3 are independently H or linear or branched C1 to C6 alkyl, X is one or more n valent inorganic or organic counter ion(s), and n is an integer from 1, 2, or 3.

Abstract: The present invention discloses methods for producing synthetic surfaces that mimic collagen coated surfaces for cell culture comprising: providing a monomer source comprising one or more organic compounds which are capable of polymerization, wherein at least one organic compound is prolinol; creating a plasma of said monomer source; and contacting at least a portion of a surface with the plasma to provide a plasma polymer coated surface. Advantageously, such methods provide an animal-free, synthetic, chemically defined surface that mimics a collagen coated surface for cell culture. Advantageously, such methods not only reduce the cost and/or issues associated with animal-derived collagen but are also amenable to large scale manufacturing.

Abstract: Disclosed is a combination effect coat that simultaneously provides at least one function selected from the group consisting of color, effect, or the combination thereof as well as at least one function selected from the group consisting of corrosion protection, adhesion promotion, absorption of mechanical energy, or the combination of two or more of the foregoing. The combination effect coat is produced by the application and curing of a pigmented powder slurry wherein the pigmented powder slurry is curable thermally, or curable thermally and with actinic radiation. The pigmented powder slurry consists of finely divided dimensionally stable constituents having an average particle size of from 0.8 to 40 ?m, has a residual volatile solvent content of less than 1% by weight, and comprises a (meth)acrylate copolymer having an epoxide equivalent weight of 400 to 2500; and a color pigment, an effect pigment, or a combination thereof.

Abstract: A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.

Abstract: Lead-free chemically produced nickel alloy containing nickel, phosphorus, bismuth and antimony, process for the production of such a nickel alloy by externally electroless metal deposition in an aqueous electrolyte and articles plated therewith.

Abstract: Disclosed herein is a fuel pump for an inter-cylinder direct fuel injection apparatus, in which occurrence of corrosion and attrition caused by cavitation or erosion can be suppressed, their resistance against the environment can be improved, and an excellent lifetime can be achieved in the case of the use of an aluminum material even if the temperature reaches as high as 100° C. or higher and the pressure reaches as high as 7 to 12 MPa. In the fuel pump for an inter-cylinder direct fuel injection apparatus, made of aluminum or an aluminum alloy, a coating film plated with Ni—P or a Ni—P based material is formed by electroless plating.

Abstract: A process is provided for coating metallic workpieces with a bearing material, wherein the workpiece first receives a hard chromium plating having a pearl or columnar structure type surface. A predominantly silver layer is then galvanically deposited, which fills in and smooths the pearl or columnar structure type surface of the hard chromium plating. Optionally, additional hard chromium platings and predominantly silver-containing layers may be applied, preferably galvanically. The predominantly silver layer may advantageously contain a graphite component.

Abstract: Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals, alkaline earth metals, or a combination thereof other than sodium and potassium, to in major part balance the hydroxyl ions. A preferred alkali metal is rubidium.

Abstract: The invention provides a hydrogen permeable structure, which can effectively prevent peeling-off of a hydrogen permeable film and hence has higher durability, and a method of manufacturing the structure. The hydrogen permeable structure has a hydrogen permeable film formed on the surface of or inside a porous support, having a thickness of not more than 2 &mgr;m, and containing palladium (Pd). The hydrogen permeable film is formed on the surface of or inside the porous support by supplying a Pd-containing solution and a reducing feed material from opposite sides of the porous support.

Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.

Abstract: A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.

Abstract: There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexing agent for nickel ions, a reducing agent for nickel ions, and ammonums (NH4+). The electroless Ni—B plating liquid can lower the boron content of the resulting plated film without increasing the plating rate and form a Ni—B alloy film having an FCC crystalline structure.

Abstract: An electroless brass plating method for applying an uniform and thick metallic layer on metallic, ceramic or plastic pieces, which does not depend on the piece geometry nor on its electric characteristics and by which global costs are reduced approximately 50% thanks to the use of a zinc compound as source of zinc atoms, which is less expensive than zinc cyanide.

Abstract: The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices.

Abstract: A metallic component exposed to high temperature steam is provided with a coating comprising a thin primer layer deposited on the surface of the metallic component and a thicker overlay layer on top of the primer layer. The primer layer consists of highly ductile, oxidation resistant material such that it remains free of any defects over a long period of exposure. The overlay layer consists of an oxidation resistant, less ductile, and low-cost material. It protects the thin primer layer from mechanical damage and chemical degradation. The primer layer protects the base material of the metallic component from oxidizing steam that may penetrate through cracks of the overlay layer. Due to suitable choice of coating materials and thicknesses of the layers the coating is low-cost.

Abstract: Materials and methods are described for electroless deposition of cobalt phosphorus and cobalt tungsten phosphorus, employing tungsten trioxide or tungsten phosphoric acid as a source of tungsten.

Abstract: A method for forming an electrochromic material includes the steps of (a) forming a transparent conductive film on a transparent substrate, (b) forming a metal film on the transparent conductive film by electroless plating, and (c) oxidizing the metal film to form a metal oxide film, which exhibits electrochromic characteristics on the transparent conductive film.

Abstract: The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to palladium, and subsequently nickel is electroless deposited over the mass. The invention also includes a method of electroless deposition of nickel over aluminum-containing materials and copper-containing materials. The aluminum-containing materials and copper-containing materials are both exposed to palladium-containing solutions prior to electroless deposition of nickel over the aluminum-containing materials and copper-containing materials. Additionally, the invention includes a method of forming a solder bump over an aluminum-containing material.

Abstract: The surface to be plated of a composite made of a metallic and a non-metallic material is degreased and otherwise cleaned and immersed in a palladium activator fluid conditioned with a hydrogencarbonate to a pH of 2˜5. After this pretreating process, the composite is plated with a metal and becomes most suitable for use as a material for heat sink on hybrid ICs since it can be efficiently soldered and has better corrosion resistance.

Abstract: A crystalline Ni alloy particle for an anisotropic conductive film comprising Ni and a metalloid element such as P, B, etc. and having a structure in which a Ni intermetallic compound phase is precipitated can be produced by preparing substantially amorphous Ni alloy particle by an electroless reduction method, and heat-treating the substantially amorphous Ni alloy particle. The Ni alloy particle is preferably heat-treated after disintegration, and preferably coated with Au.

Abstract: A system and method for producing a corrosion-resistant article includes a metal substrate and a multi-layer resistant coating disposed over the metal substrate. The coating is operable to resist corrosion and hydrogen embrittlement of the metal substrate. The coating includes a first layer comprising a material galvanically similar to the metal substrate. The coating also includes a second layer disposed over the first layer. The second layer comprises a metal anodic to the metal substrate. The corrosion resistant article may also include a corrosion resistant interface layer at the boundary of the first and second layers. The interface layer may be formed by diffusing a portion of the second layer into the first layer.

Abstract: Disclosed is a method of manufacturing an aluminium or aluminium alloy joined product, such as a shaped and hollow member, comprising the sequential steps of: (a) providing two parts made of aluminium or aluminium alloy, each part having a peripheral flange; (b) positioning the two parts such that the peripheral flange of one part faces the peripheral flange of the other part to form an assembly, and joining the facing flanges of the two parts by heating.

Abstract: Disclosed is an aluminium brazing product, such as a brazing sheet product, having a substrate (1) of an aluminium alloy comprising silicon in an amount in the of 2 to 18% by weight, and on at least one outer surface a layer (2) comprising nickel, wherein a separately deposited layer (3) is applied on one side of the layer (2) comprising nickel and the layer (3) comprising a metal such that taken together the aluminium base substrate (1) and all layers exterior thereto form a metal filler having a liquidus temperature in the range of 490 to 570° C., and preferably in the range of 510 to 550° C. The invention also relates to a method of manufacturing such a brazing product and to a brazed assembly comprising at least one component made of the brazing sheet product.

Abstract: A sliding member for a compressor, comprising a base body formed of a material which contains aluminum as a major component, and an electroless nickel plating layer formed on a surface of the base body and containing phosphorous (P) and boron (B), wherein the improvement comprises: the electroless nickel plating layer being a non heat-treated layer containing the phosphorous in an amount of 0.5-5.0 wt. % and the boron in an amount of 0.05-0.2 wt. %.

Abstract: Techniques are provided for electrolessly depositing and electrodepositing a CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming gold layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames, and metal buttons.

Abstract: The invention relates to an aluminium alloy, in particular for a layer of a friction bearing, for example, which, apart from aluminium and smelt-related impurities, additionally contains soft-phase formers, e.g. Sn, Pb, Bi, Sb or similar. The alloy contains added quantities of at least one element from the group of elements consisting of Sc, Y, Hf, Nb, Ta, La, lanthanides and actinides in a maximum of 10% by weight, preferably 4% by weight, in particular between 0.015% by weight and 3.25% by weight, relative to 100% by weight of alloy, the remainder being aluminium with smelt-related impurities.

Abstract: The invention relates to an intermediate layer, in particular a bonding layer, made from an alloy with an aluminium base, for multi-layered materials with layers of differing composition, in particular friction bearings. The alloy contains added quantities of at least one element from a group of elements consisting of Sc, Y, Hf, Nb, Ta, La, lanthanides and actinides in a maximum of 10% by weight, preferably 4% by weight, in particular between 0.015% by weight and 3.25% by weight, relative to 100% by weight of alloy, the remainder being aluminium with smelt-related impurities.

Abstract: An electrical conductor for use in an electronic structure is disclosed which includes a conductor body that is formed of an alloy including between about 0.001 atomic % and about 2 atomic % of an element selected from the group consisting of Ti, Zr, In, Sn and Hf; and a liner abutting the conductor body which is formed of an alloy that includes Ta, W, Ti, Nb and V. The invention further discloses a liner for use in a semiconductor interconnect that is formed of a material selected from the group consisting of Ti, Hf, In, Sn, Zr and alloys thereof, TiCu3, Ta1−XTix, Ta1−X, Hfx, Ta1−X, Inxy, Ta1−XSnx, Ta1−XZrx.

Abstract: A method of producing high quality optical surfaces is disclosed. The invention allows for the production of optical surfaces with complex geometry while retaining the high quality of the optical surface. A top layer is provided on a substrate. In order to adhere the top layer to the substrate, an adhesion layer is applied first. In the preferred embodiment, the substrate is an aluminum substrate, the adhesion layer includes a layer of zinc and a layer of nickel and the top layer is gold. The substrate is generally stress free in order to provide a flat surface with no undulations. This allows a relatively thin layer of gold to be applied which then can be diamond turned in order to achieve a reflective layer.

Abstract: A device, and its production method, the device has a substrate and a coating composition, the coating composition being formed by the gas phase or plasma polymerization of a gas comprising at least one organic compound or monomer. The polymerization is carried out using a pulsed discharge having a duty cycle of less than about ⅕, in which the pulse-on time is less than about 100 msec and the pulse-off time is less than about 2000 msec. The duty cycle can also be varied, thus the coating composition can be gradient layered accordingly. The device has a coating composition which is uniform in thickness, pin-hole free, optically transparent in the visible region of the magnetic spectrum, permeable to oxygen, abrasive resistant, wettable and biologically non-fouling.

Abstract: Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal and a radioisotope, which may be soluble or insoluble, and may further comprise a reducing agent. The radioactive sol-gel comprises at least one metal alkoxide and a radioisotope, which may be soluble or insoluble. Methods of making a substrate radioactive by coating with radioactive coating solutions or sol-gels are also disclosed, including electrodeposition, electroless deposition, spin coating and dip coating. In a particular embodiment, the radioactive coating formed by the method is a composite coating. Radioactive substrates are also disclosed, comprising a substrate and one or more radioactive coatings, which coatings may be the same or different.

Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoWP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames and metal buttons.

Abstract: Techniques are provided for electrolessly depositing and electrodepositing CoMoP barrier coating onto copper or copper alloys to prevent copper diffusion when forming layers on articles such as watch bracelets, watch cases, imitation jewellery, spectacle frames and metal buttons.

Abstract: Provided are methods of preparing an electrically conductive polymeric foam. The methods include the following steps: (a) contacting a polymeric foam with a surfactant solution; (b) contacting the polymeric foam with a sensitizing solution; (c) contacting the polymeric foam with an activation solution; and (d) forming at least one metallic layer on the polymeric foam with an electroless plating process. Also provided are electrically conductive polymeric foams formed by such methods. The present methods and foams have particular applicability to the manufacture of EMI (electromagnetic interference) shielding devices.

Abstract: A Cu plated ceramic substrate is used in a semiconductor. On a ceramic substrate layer, a thin-film Cr layer is put, and a thin-firm Au layer is put on the Cr layer. The Au layer is plated with Cu. By providing the Au and Cr layers between the ceramic plate and Cu layer, adhesibility is increased. A Pertier element which includes the Cu plated ceramic layer is employed in a semiconductor to absorb and generate heat efficiently.

Abstract: A brazing sheet product having a core sheet (1) made of an aluminium alloy, having one or both of the surfaces of the core sheet clad with an aluminium clad layer (2), and a layer (3) comprising nickel on the outersurface of one or both the aluminium clad layer or layers (2). There is a layer (4) comprising zinc or tin as a bonding layer between the outersurface of the aluminium clad layer or layers (2) and the layer (3) comprising nickel. The aluminium clad alloy layer comprises, in weight percent: Si 2 to 18, Mg up to 8.0, Zn up to 5.0, Cu up to 5.0, Mn up to 0.30, In up to 0.30, Fe up to 0.80, Sr up to 0.20, at least one element selected from the group consisting of: Bi 0.01 to 1.0, Pb 0.01 to 1.0, Li 0.01 to 1.0, Sb 0.01 to 1.0, impurities each up to 0.05, total up to 0.20; and balance aluminium.

Abstract: A semiconductor wafer having copper bondpads (17) that are free of voids (13) and a method for coating the copper bondpads (17) with solderable or wirebondable metals such that the copper bondpads (17) are free of the voids (13). The void free metal coatings are achieved using a dual activation process. In a first activation step (27), the copper bondpads (17) are activated by placing them in a palladium bath. In a second activation step (28), the bondpads are placed in a nickel—boron bath. After the dual activation, the copper bondpads (17) are coated with a layer of nickel—phosphorous or palladium. The nickel—phosphorous or palladium layer may be coated with a layer of gold for subsequent formation of solder balls or wirebonds thereon.

Abstract: A high-strength lightweight steel and its use for car parts and facade linings is a purely ferritic steel having, in mass %, more than 5 to 9% Al, less than 0.2% Si, and 0.03 to 0.2% Mn.

Abstract: The invention relates to a method of manufacturing an Al or Al alloy workpiece, including the steps of (a) providing an Al or Al alloy workpiece, (b) pre-treating of the outersurface of the Al or Al alloy workpiece, and (c) plating a metal layer including nickel onto the outersurface of the pre-treated Al or Al alloy workpiece. During step (c) the metal layer including nickel is deposited by electroplating both nickel and bismuth using an aqueous bath comprising a nickel-ion concentration in a range of 10 to 100 g/l and a bismuth-ion concentration in the range of 0.01 to 10 g/l. The invention further relates to an aqueous plating bath for use in the method of this invention.

Abstract: A method for preparing a copper pad surface for electrical connection that has superior diffusion barrier and adhesion properties is provided. In the method, a copper pad surface is first provided that has been cleaned by an acid solution, a protection layer of a phosphorus or boron-containing metal alloy is then deposited on the copper pad surface, and then an adhesion layer of a noble metal is deposited on top of the protection layer. The protection layer may be a single layer, or two or more layers intimately joined together formed of a phosphorus or boron-containing metal alloy such as Ni-P, Co-P, Co-W-P, Co-Sn-P, Ni-W-P, Co-B, Ni-B, Co-Sn-B, Co-W-B and Ni-W-B to a thickness between about 1,000 Å and about 10,000 Å. The adhesion layer can be formed of a noble metal such as Au, Pt, Pd and Ag to a thickness between about 500 Å and about 4,000 Å.

Abstract: According to the present invention, Ni-B is electrolessly deposited on an object and then Ni-P is electrolessly deposited on the surface of the Ni-B layer formed on the object. In this process, if any dry area is present on the Ni-B layer where moisture has been evaporated after the Ni-B depositing step and before the Ni-P depositing step, it is difficult to form a uniform Ni-P layer on the Ni-B layer in such area. Accordingly, an additional step is provided for preventing the Ni-B layer formed on the object from drying after the Ni-B plating step and before the Ni-P plating step. In this way, a uniform Ni-P layer can be electrolessly deposited on the electrolessly deposited Ni-B layer.

Abstract: To provide a substrate enclosed in a uniform nucleation layer, a substrate is nucleated with a noble metal salt where the noble metal salt is chemically bound to the substrate, and a method is described for binding a noble metal salt chemically to a substrate. To provide a metal plated powder, a powder is nucleated with a noble metal salt and the nucleation is coated with a metal layer. A method is also provided for nucleating the powder surface with a noble metal salt in such a manner that it is chemically bound to the substrate and then metal plated by a conventional electroless method.

Abstract: A method for selective electroless metal deposition on a substrate. The method comprises applying a patterned coating comprising a silyl hydride functional resin onto a substrate. An electroless plating solution comprising a metal ion is then applied onto the silyl hydride functional resin coating to deposit a patterned metal film on the substrate. The process of the invention is especially useful in the electronics industry.

Abstract: An industrial material such as metal, ceramics or plastics whose surface has a film passivated by fluoridation and a process of manufacturing the above industrial material. The industrial material comprises a substrate, a nickel alloy film formed on the substrate and containing nickel, semimetal and/or other metal whose fluoride becomes a volatile compound, and a fluorine passivated film formed at least on a surface of the nickel alloy film in such a manner that the fluorine passivated film contains nickel and does not contain said other metal or the semimetal, and satisfies stoichiometric ratio. The process of manufacturing an industrial material comprises the steps of performing grounding treatment of a surface of a substrate, forming a nickel alloy film, on the surface of the substrate, containing nickel, semimetal and/or other metal, and forming a fluorine passivated film on the nickel alloy film.

Abstract: The invention relates to a method for gloss coating articles or a portion of an article's surface and articles produced from this method. A corrosion-inhibiting polishing base coat is applied in a known fashion, after which a high-gloss layer produced by atomization, preferably magnetron atomization, is applied. Then, a transparent, wear-resistant top coat layer is applied in a known fashion. The articles can also be pretreated, if desired, and given a protective or other layers. By using this method, parts for vehicles, especially vehicle wheels, can be produced in a great variety of colors and with improved qualities.

Abstract: An aluminum or aluminum alloy surface which during use is exposed to sliding friction is coated to provide a chemical conversion coating of tin comprising 0.2-10.0 wt. % cobalt. For example, a swash plate type compressor has a cylinder block with cylinder bores disposed parallel to the axis of the cylinder block. A rotary shaft rotatably mounted within the cylinder block carries an aluminum swash plate. The swash plate has a coating preferably between 0.8 to 2.5 microns. The coating on the swash plate permits the use of low silicon alloy aluminum without the need of metal plating or high finish polishing.

Abstract: An aluminum or aluminum alloy surface which during use is exposed to sliding friction has a chemical conversion coating of mostly tin with 0.2-10.0 wt. % cobalt and 0.1 to 12 wt. % bismuth. For example, a swashplate of a swashplate type compressor may be conversion coated on at least part thereof, that is the part that during use contact the shoes. Preferably, the coating is between 0.8 to 2.5 microns thick. The coating on the swash plate permits the use of low silicon alloy aluminum without the need of metal plating or high finish polishing.

Abstract: A substrate wherein a layer comprising a principal component of nickel and a layer comprising a principal component of palladium are deposited on a glass substrate and wherein an electroconductive layer is deposited on the palladium layer.