Abstract: Cuprous oxide films are directly deposited by chemical reduction from an aqueous solution of a copper salt, a complexing agent and a reducing agent maintained at a pH of at least about 12.9.

Abstract: A process, article produced therefrom, and compositions are described for the reception of electroless plating onto a substrate of a non-catalytic metal or non-catalytic alloy. The process comprises contacting the surface of the non-catalytic substrate with a promotor composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with an electroless plating bath comprising hypophosphite for metallic build-up.

Abstract: A method of metallizing materials by coating a substrate material with a hydrophilic composite material; electrolessly metal plating the hydrophilic composite material with a metal to render the surface conductive; followed by electroplating a metal onto the conductive surface. The method can, for example, be utilized to produce metallized foams, embossing plates for reproduction of grains and textures, and decorative coatings for substrate materials.

Abstract: A friction member is a clutch facing, a brake pad, or a brake lining which comprises a phenolic fiber, a plated organic fiber, and/or mixed fiber thereof, which may or may not comprise the other fibers such as nonorganic fibers, as based material of the aforementioned friction member, wherein various difficulties of asbestos are improved.

Abstract: A method is provided for forming an extrusion die of the type used to form a ceramic monolith having thin walls defining a multiplicity of parallel tubular passageways with at least about 100 passageways per square inch, the die having a feed face and a discharge face, the feed face having a plurality of feed holes extending partially through said die and interconnecting with a network of grid slots in the discharge portion of said die formed by a plurality of grid pins which define the slot width and the wall thickness, shape and size of said passageways. The method involves the steps of forming the width of the slots larger than the desired wall thickness of the passageways, and metal plating the slot defining surfaces of the grid pins to obtain the slot width corresponding to the desired wall thickness. Plating is accomplished by the electroless plating technique using a metal selected from the group consisting of nickel, chromium, cobalt and cobalt-nickel.

Abstract: An adherent bright metallic coating which may be any metal or alloy capable of being deposited electrolessly, is applied to the surface of a plastic or other dielectric part (or to a metal part) by an electroless process comprising suitable pretreatment of said surface, deposition of a primary electroless copper to produce an underlayer, then depositing a bright secondary electroless coating of the desired metal (the overlayer) with complete elimination of any subsequent electroplating process [usually required to achieve this brightness]. The required overlayer may also be limited to selected surface areas of a coated part by mechanically removing portions of the primary electroless copper prior to immersion of the part in the secondary electroless bath to produce the desired overlayer metal.

Abstract: A process for making thin film resistor terminals is described. Terminal fabrication is accomplished by the steps of chemical plating onto the terminal forming surfaces of the resistor and thereafter heat treating between 300.degree. and 800.degree. C in the vacuum, non-oxidation gas or non-oxidation atmosphere or in the air, oxidation gas or oxidation atmosphere. The chemical plating is of nickel, cobalt or nickel-cobalt alloy.

Abstract: Copper foil is subjected to a two-step electrochemical copper treatment to improve its bond strength, the first step of said treatment involving the use of a copper and arsenic-containing electrolyte. A treatment involving the use of the aforementioned two-step electrochemical copper pretreatment prior to the application of an electrochemical copper treatment. Treated copper foil and printed circuit boards resulting therefrom.