Deposited Metal Coating On Image Patents (Class 430/16)
  • Patent number: 9709889
    Abstract: A precursor article has a substrate and a polymeric layer having a reactive composition that contains a non-crosslinked thiosulfate copolymer comprising: (a) recurring units comprising pendant thiosulfate groups, and (b) recurring units comprising pendant carboxy, carboxylate, phospho, phosphonate, phosphate, sulfo, sulfonate, or sulfite groups. The (a) recurring units are present in an amount of 1 to 30 mol %, and the (b) recurring units are present in an amount of 70 to 99 mol %. This precursor article can be used to provide a product article comprising a substrate in which the polymeric layer has both exposed regions and non-exposed regions. The exposed regions contain a pattern of electrolessly plated metal within or deposited on the surface of an at least partially crosslinked polymer that has been derived from the non-crosslinked thiosulfate copolymer. The non-exposed regions have none of the electrolessly plated metal or the non-crosslinked thiosulfate polymer.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: July 18, 2017
    Inventors: Mark Edward Irving, Thomas B. Brust, Grace Ann Bennett
  • Patent number: 8046722
    Abstract: A computer implemented method for correcting a mask pattern includes: predicting a displacement of a device pattern by using a mask pattern to form the device pattern and a variation of a process condition; determinating an optical proximity correction value so that the displacement falls within a displacement tolerance of the device pattern; and correcting the mask pattern using the optical proximity correction value.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: October 25, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toshiya Kotani, Satoshi Tanaka, Soichi Inoue
  • Patent number: 7435515
    Abstract: A primary object of the present invention is to provide a process for the production of a pattern-forming body, the process enabling the formation of a highly precise pattern, requiring no post-exposure treatment and being free from a fear as to the deterioration of the pattern-forming body itself because no photocatalyst is contained in the produced pattern-forming body.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: October 14, 2008
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hironori Kobayashi, Masato Okabe, Manabu Yamamoto
  • Patent number: 7354733
    Abstract: We disclose methods of sorting or separating mixtures of living cells (e.g., eukaryotic, prokaryotic, mammalian, pathogenic, bacterial, viral, etc.). We perform our methods by activating cell-selective photophoric labels, which photosensitize and chemically reduce a photosensitive metal compound to form metal grains, particles or crystals. The metal adheres to the cells and forms the basis for sorting or separating different cell types. Photophoric labels may include chemiluminescent agents such as peroxidase enzymes activated with peroxidase substrates capable of luminescence. Photosensitive metal compounds may be present in a light-sensitive matrix or emulsion containing photosensitizable metal compounds, which form metal grains, particles or crystals upon exposure to a developer solution. Developer solutions are formulated to substantially allow living cells to remain viable after exposure to the developing solution.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: April 8, 2008
    Assignee: Cellect Technologies Corp.
    Inventors: Shmuel Bukshpan, Gleb Zilberstein
  • Patent number: 7305761
    Abstract: A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the ground layer precursor to thereby form a ground layer charged in cathode; (c) patterning a cationic surface-active agent of anode to be left on the first area of the substrate with the ground layer as a ground; (d) providing a catalyst at the surface-active agent; and (e) forming a wiring along the first area of the substrate by precipitating a metal layer to the catalyst.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: December 11, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Satoshi Kimura, Hidemichi Furihata
  • Patent number: 7291427
    Abstract: A surface graft material including a substrate and a surface graft polymer chain, wherein the surface graft polymer chain includes a photocleavable moiety at one of its terminals, and the surface graft polymer chain is directly bonded to a surface of the substrate by a covalent bond between the photocleavable moiety and the substrate. A graft pattern formation method comprising exposing the graft material to cleave the photocleavable moiety in the exposed area, and removing the graft polymer chain from the exposed are to form a surface graft polymer chain pattern. A conductive pattern material and a metal particle pattern material using the graft pattern.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: November 6, 2007
    Assignee: Fujifilm Corporation
    Inventors: Koichi Kawamura, Takeyoshi Kano
  • Patent number: 7290328
    Abstract: Major surface of a substrate having an optical waveguide and a modulation electrode is pasted to a base substrate through a thermosetting resin, and then the rear surface of the substrate is machined thus making thin the entirety. Subsequently, the rear surface of the substrate thus rendered thin is subjected to machining or laser machining to form a thin part, which is further subjected to machining or laser machining to form a first thin part at a part, including the optical waveguide, of the thin part and a second thin part thinner than the first thin part contiguously thereto. Thereafter, the rear surface of the substrate is pasted to the major surface of a supporting substrate through a thermosetting resin and the base substrate is stripped thus obtaining an optical modulator.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: November 6, 2007
    Assignee: NGK Insulators, Ltd.
    Inventors: Jungo Kondo, Yukio Mizuno, Minoru Imaeda, Atsuo Kondo
  • Patent number: 7285315
    Abstract: The present invention relates to a closure which is made of synthetic material with characteristics similar to or even better than those of cork and which can therefore be used in all applications in which a cork closure is normally used. In particular, the closure according to the present invention is a stopper for containers for wine or liquors. In particular, the present invention relates to a container closure made of an expanded elastomer by means of a thermal moulding method, characterized in that the expanded elastomer can be produced by means of a step of expansion by a supercritical fluid.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: October 23, 2007
    Assignee: Guala Dispensing, S.p.A.
    Inventor: Felice Fragola
  • Patent number: 6833224
    Abstract: The present invention is to provide a method for forming various patterns such as a metal or metal compound pattern, in which the amounts of the materials constituting the pattern which are removed during the formation step can be suppressed to the minimum. The method comprises a resin pattern forming step of forming on the surface of a substrate a resin pattern capable of absorbing a solution containing metal components, an absorbing step of dipping the resin pattern in the solution containing metal components to make the resin pattern absorb the solution containing metal components, a washing step of washing the substrate having formed thereon the resin pattern that has absorbed the solution containing metal components, and a burning step of burning the resin pattern after washing.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: December 21, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tsuyoshi Furuse, Masahiro Terada, Shosei Mori
  • Patent number: 6815126
    Abstract: A PWB or multilayer board with circuit traces is treated by a process that serves to reduce the incident of failure of the board. The process includes the steps of applying a thin commoning layer of copper onto a catalyzed surface of the board substrate and the circuit lines. A photoresist is then applied over the commoning layer after which the photoresist is removed only from the commoning material over the circuit lines. A thin layer of a more noble metal, such as nickel, is electrodeposited over the exposed conductive layer. This is followed by a gold layer electrodeposited over the nickel in close registry therewith. The process provides the traces with a conforming nickel/gold layer that extends down the side of the traces. This reduces the tendency of a subsequent copper etch step from undercutting the nickel/gold, thereby causing slivers that could cause short circuiting between adjacent circuit patterns.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: November 9, 2004
    Assignee: International Business Machines Corporation
    Inventors: Edmond Otto Fey, Raymond Thomas Galasco, Thomas Richard Miller, Anita Sargent
  • Publication number: 20040137376
    Abstract: A method and system for recording or replicating data in a film media to a metal substrate, such as a nickel substrate. An ultraviolet light source is directed to a sheet of microfiche. The resulting microfiche image is collimated and reduced with an optics system. The reduced image is directed to a wafer of silicon. The silicon wafer is developed, resulting in a mask representative of the documents or data in the film media. A metal seed or base layer is developed on the mask. One or more metal layers are deposited onto the seed layer to form a metal substrate having the film media data or documents formed therein.
    Type: Application
    Filed: January 15, 2003
    Publication date: July 15, 2004
    Inventors: John L. Bishop, Michael A. Wheeler, Kenneth M. Harrington
  • Patent number: 6656665
    Abstract: The invention concerns a method for producing a pattern on a transparent substrate, particularly a glass or glass-ceramic substrate. According to the invention, there is deposited on at least one area of one face of the substrate, a first layer of a photosensitive resin comprising at least one sensitizing agent and at least one photosensitive compound essentially composed of a polymer with an average degree of cross-linking d° such that it is able to absorb solid particles. Certain areas of said first layer are exposed to light, particularly in order to increase, in a controlled manner, the average degree of cross-linking do of said polymer so as to modulate its absorption capacity. On the first layer is deposited at least one second layer of a mineral-particle-based composition. The substrate is subjected to at least one treatment cycle, particularly in order to fix said mineral particles. The invention also concerns the substrate produced by this method and its applications.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: December 2, 2003
    Assignee: Saint-Gobain Vitrage
    Inventors: Yves Demars, Jean-Christophe Elluin, Gilles Longchampt
  • Publication number: 20030129536
    Abstract: A method for fabricating circuitized substrates which reduces the formation of shorts, and which does not require a bake step to drive off solvent before photoimaging, is provided. The method employs an essentially solventless photoimageable dielectric film, having a solvent content typically less than about 5%, preferably less than about 2% and a glass transition temperature, when cured, which is greater than about 110° C. The method for fabricating circuitized structures comprises the following steps: providing a photoimagable dielectric film, which film comprises: from about 95% to about 100% solids, comprising: from 0% to about 30% by weight of the solids, of a particulate rheology modifier; from about 70% to about 100% by weight of the solids of an epoxy resin system comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts by weight of the total resin weight, a cationic photo-initiator; from 0 to about 0.
    Type: Application
    Filed: January 16, 2003
    Publication date: July 10, 2003
    Applicant: International Business Machines Corporation
    Inventors: Elizabeth Foster, Gary A. Johansson, Heike Marcello, David J. Russell
  • Patent number: 6555209
    Abstract: A method of manufacturing a multilayer wiring board comprising a step of forming an upper wiring layer (27), a part thereof being electrically connected to a pillar-shaped metallic body (24a), after he pillar-shaped metal body (24a) is formed on a lower wiring layer (22) is characterized in that the step of forming the metallic body includes a sub-step of forming a plating layer (24) constituting the metallic body, a sub-step of forming a mask layer (25) on the surface where the metal body is formed, of the plating layer, and a sub-step of etching the plating layer. The manufacture can be carried out with simple equipment combination of conventional steps and the wiring layer can be made fine.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: April 29, 2003
    Assignee: Daiwa Co., Ltd.
    Inventors: Eiji Yoshimura, Toshiro Higuchi
  • Patent number: 6531257
    Abstract: Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 &mgr;m from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: March 11, 2003
    Assignee: Murata Manufacturing Co. Ltd
    Inventor: Masahiro Kubota
  • Patent number: 6528218
    Abstract: A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0 to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: March 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Elizabeth Foster, Gary A. Johansson, Heike Marcello, David J. Russell
  • Patent number: 6524758
    Abstract: The present invention relates to the fabrication process for the printed wiring boards and flex circuits. An electrostatic printing plate includes a substrate with an image receiving layer applied thereto. The image receiving layer is a toner with a metallic toner and subsequently fixed in place or is transferred to a layer. The metal toner is then fixed on this receiving surface.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: February 25, 2003
    Assignee: Electrox Corporation
    Inventors: Dietmar C. Eberlein, Robert H. Detig
  • Patent number: 6521328
    Abstract: The present invention is a persulfate etchant composition especially useful for dissolving copper during fabrication of microelectronic packages. The etchant is characterized by its ability to selectively etch copper in the presence of nickel, nickel-phosphorous and noble metal alloys therefrom. Furthermore, no deleterious galvanic etching occurs in this etchant-substrate system so that substantially no undercutting of the copper occurs. The combination of high selectivity and no undercutting allows for a simplification of the microelectronic fabrication process and significant improvements in the design features of the microelectronic package, in particular higher density circuits. The persulfate etchant composition is stabilized with acid and phosphate salts to provide a process that is stable, fast acting, environmentally acceptable, has high capacity, and can be performed at room temperature. A preferred etchant composition is 230 gm/liter sodium persulfate, 3 volume % phosphoric acid and 0.
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: February 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: John M. Lauffer, Kathleen L. Covert, Peter A. Moschak
  • Publication number: 20020098331
    Abstract: A laminate circuit structure assembly is provided that comprises at least two modularized circuitized plane subassemblies; a joining layer located between each of the subassemblies and wherein the subassemblies and joining layer are bonded together with a cured dielectric from a bondable, curable dielectric. The subassemblies and joining layer are electrically interconnected with bondable electrically conductive material. The joining layer comprises dielectric layers disposed about an internal electrically conductive layer. The electrically conductive layer has a via and the dielectric layers each have a via of smaller diameter than the vias in the electrically conductive layer and are aligned with the vias in the electrically conductive layer. The vias are filled with electrically bondable electrically conductive material for providing electrical contact between the subassemblies.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 25, 2002
    Applicant: International Business Machines Corporation
    Inventors: John M. Lauffer, Voya R. Markovich, Thomas R. Miller, Konstantinos I. Papathomas, William E. Wilson
  • Patent number: 6306594
    Abstract: An efficient method for the microfabrication of electronic devices which have been adapted for the analyses of biologically significant analyte species is described. The techniques of the present invention allow for close control over the dimensional features of the various components and layers established on a suitable substrate. Such control extends to those parts of the devices which incorporate the biological components which enable these devices to function as biological sensors. The materials and methods disclosed herein thus provide an effective means for the mass production of uniform wholly microfabricated biosensors. Various embodiments of the devices themselves are described herein which are especially suited for real time analyses of biological samples in a clinical setting. In particular, the present invention describes assays which can be performed using certain ligand/ligand receptor-based biosensor embodiments.
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: October 23, 2001
    Assignee: i-STAT Corporation
    Inventors: Stephen N. Cozzette, Graham Davis, Imants R. Lauks, Randall M. Mier, Sylvia Piznik, Nicolaas Smit, Paul Van der Werf, Henry J. Wieck
  • Patent number: 6025057
    Abstract: A method of fabricating an electronic package having an organic substrate. The substrate is formed of fiberglass and epoxy. In order to additively circuitize the electronic package substrate, an organic polyelectrolyte is deposited onto the organic substrate. A colloidal palladium-tin seed layer is deposited atop the organic polyelectrolyte. This is followed by depositing a photoimageable polymer atop the seed layer, and photolithographically patterning the photoimageable polymer to uncover portions of the seed. layer. The uncovered portions of the seed layer are catalytic to the electroless deposition of copper. In this way a conductive layer of copper is deposited atop the uncovered seed layer. The organic polyelectrolyte is deposited from an aqueous solution at the pH appropriate for the desired seed catalyst coating, depending on the ionizable character of the particular polyelectrolyte employed.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: February 15, 2000
    Assignee: International Business Machines Corporation
    Inventors: Anastasios Peter Angelopoulos, Gerald Walter Jones, Richard William Malek, Heike Marcello, Jeffrey McKeveny
  • Patent number: 6020049
    Abstract: A reinforced laminate that is consists of conventional glass mesh, TEFLON mesh, etc. with copper clad to one or both sides and a positive or negative acting photoimageable dielectric material impregnated in the mesh. This photoimageable dielectric material is a substitute for conventional dielectrics like epoxy, polyimides, etc. This laminate construction will allow for via formation using established manufacturing methods for producing vias in printed circuits with minor process variations. This product will eliminate major process steps such as mechanical drilling, laser drilling and plasma etching. It will allow most printed circuit producers the capability of producing complex multilayer circuits that currently produced by relatively few circuit manufacturers. It eliminates processes such as plasma etching and laser processing and other capital-intensive methods that are currently in development or use. A further development as a result of this product allows for producing vias of any shape e.g.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: February 1, 2000
    Inventor: Anthony J Cucinotta
  • Patent number: 5981114
    Abstract: A photoresist check pattern structure in a semiconductor integrated circuit device has a pattern test region and a photoresist check pattern. The pattern test region has a plurality of step regions corresponding to surface steps developed during respective process steps for fabricating the semiconductor device. The surface steps are formed in a one-side concave shape in a plane view. The photoresist check pattern extends continuously across at least one of the surface steps in the pattern test region and which has substantially flat resist surfaces. The photo resist check patterns include a pattern formed in a dimension more severe than that according to design rules for semiconductor circuit elements on the substrate. With this, it is possible to check easily as to whether the exposure/development of photoresist films corresponding to respective interconnect layers has been carried out with the desired accuracy being maintained.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: November 9, 1999
    Assignee: NEC Corporation
    Inventor: Natsuki Sato
  • Patent number: 5981113
    Abstract: Radiation curable ink compositions and coating compositions contain an aliphatic (meth)acrylate functional macromonomer, a reactive acrylate monomer, and a photoinitiator. Ink compositions also contain an effective amount of a colorant or pigment. These inks, when cured by exposure to actinic radiation, have excellent durability, weatherability, and adhesion to acrylate substrates such as polymethylmethacrylate.
    Type: Grant
    Filed: December 17, 1996
    Date of Patent: November 9, 1999
    Assignee: 3M Innovative Properties Company
    Inventor: Paul D. Christian
  • Patent number: 5958600
    Abstract: Disclosed are a highly reliable circuit board and a method of stably manufacturing the circuit board, wherein an insulator made from a specific organic insulating material is provided under a highly stressed conductor for preventing occurrence of cracks in the insulator. In addition, a method of correcting a wiring of a ceramic board is additionally adopted. The circuit board includes a thick film wiring board 1 having a first conductor pattern 2 and a thin film layer laminated on the first conductor pattern 2.
    Type: Grant
    Filed: January 9, 1998
    Date of Patent: September 28, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Sotokawa, Akira Yabushita, Takashi Inoue, Hidetaka Shigi, Mamoru Ogihara, Haruhiko Matsuyama, Minoru Tanaka, Yasunori Narizuka
  • Patent number: 5869175
    Abstract: A structure formed during processing of an integrated circuit. Two layers of photoresist are formed over a conductive layer to be patterned. The lower layer is thinner than the upper layer, and is dyed to have a lower transmittance. Both layers are used as a masking pattern for the underlying conductive layer.
    Type: Grant
    Filed: May 16, 1995
    Date of Patent: February 9, 1999
    Assignee: STMicroelectronics, Inc.
    Inventor: John C. Sardella
  • Patent number: 5841568
    Abstract: An optical modulator includes a substrate having an electrooptic effect, an optical waveguide formed on a surface of the substrate, and a control electrode formed on the substrate, and a control electrode formed on the substrate to oppose the optical waveguide. In this optical modulator, the control electrode is formed by stacking a plurality of layers in a direction perpendicular to the substrate surface.
    Type: Grant
    Filed: March 28, 1996
    Date of Patent: November 24, 1998
    Assignee: NEC Corporation
    Inventor: Tosiya Miyakawa
  • Patent number: 5714247
    Abstract: A non-specular reflecting surface for use in a Liquid Crystal Display is obtained by randomly embedding particles in a layer of a resin solution and then baking to hardness. The particles' sizes are approximately the same as the layer's thickness, so a randomly uneven surface is the result. The particles are most commonly, but not necessarily, commercially available plastic microspheres. If a photosensitive resin is selected, it may be shaped into a desired pattern without the need for a separate photoresist and etch step. When a high reflectance metal is deposited onto the resin surface it becomes an effective non-specular reflector.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: February 3, 1998
    Assignee: Industrial Technology Research Institute
    Inventors: Chen-Lung Kuo, Dong-Yuan Goang, Chun-hsia Chen
  • Patent number: 5650248
    Abstract: A method of identifying an object by a machine readable image applied to it in which the image is produced by a plurality of fine particles embossed with a machine readable pattern produced by replicating contact with a diffraction grating having from about 5,000 to about 11,000 grooves per cm.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 22, 1997
    Assignee: Avery Dennison Corporation
    Inventors: Richard G. Miekka, Dennis R. Benoit, Richard M. Thomas, James P. Rettker, Karl Josephy
  • Patent number: 5510216
    Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
    Type: Grant
    Filed: August 29, 1995
    Date of Patent: April 23, 1996
    Assignee: Shipley Company Inc.
    Inventors: Gary S. Calabrese, Jeffrey M. Calvert, Mu-San Chen, Walter J. Dressick, Charles S. Dulcey, Jacque H. Georger, Jr., John F. Bohland, Jr.
  • Patent number: 5503902
    Abstract: A light control material for displaying black-and-white and color images by forming light traps in a layer of photopolymer at selected locations. The photopolymer layer constitutes a master from which embossments can be produced. An embossment which displays the image can be produced from the master by a soft embossing procedure. The light traps are formed in the master by reactively ion etching a layer of cured photopolymer at selected locations to create fields of tapered structures. An embossment generated from the master contains fields of tapered structures which correspond to those created in the master. The surface of the embossment which includes the fields of tapered structures is coated with a reflective material such as metal. Light which enters the fields is reflected within the fields of tapered structures until substantially all of the light has been absorbed. Light which does not enter the fields is reflected.
    Type: Grant
    Filed: March 2, 1994
    Date of Patent: April 2, 1996
    Assignee: Applied Physics Research, L.P.
    Inventors: Richard A. Steenblik, Mark J. Hurt
  • Patent number: 5500315
    Abstract: Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.
    Type: Grant
    Filed: October 4, 1994
    Date of Patent: March 19, 1996
    Assignee: Rohm & Haas Company
    Inventors: Jeffrey M. Calvert, Walter J. Dressick, Gary S. Calabrese, Michael Gulla
  • Patent number: 5487964
    Abstract: New spray powder formulations are described which, after application in the form of a thin layer to substrate surfaces with the aid of processes basset on electrostatic attraction and storing of this layer by heat or high-energy radiation, allow the deposition of firmly adhering layers of metal by currentless, wet-chemical metallization. The essential constituents of such a formulation are a pulverulent, non-conductive material and (semi-) noble metal compounds.
    Type: Grant
    Filed: June 8, 1994
    Date of Patent: January 30, 1996
    Assignee: Bayer Aktiengesellschaft
    Inventors: Gunther Reichert, Hans Lietz, Jurgen-Rolf Hassdenteufel, Gunter Sackmann, Frank Kobelka
  • Patent number: 5318910
    Abstract: A standard whole blood composition is disclosed, which is useful as a pooled human hemostasis reference standard in blood coagulation assays including Activated Clotting Time (ACT), Whole Blood Prothrombin Time (WBPT), Whole Blood Activated Partial Thromboplastin Time (WBAPTT) and Whole Blood Thrombin time (WBTT). Also disclosed are methods for determining the human standardized potency of heparin and protamine.
    Type: Grant
    Filed: January 14, 1993
    Date of Patent: June 7, 1994
    Assignee: International Technidyne Corp.
    Inventor: Frank M. LaDuca
  • Patent number: 5213917
    Abstract: This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaining photoresist coating unprotected by the metal mask.
    Type: Grant
    Filed: January 31, 1991
    Date of Patent: May 25, 1993
    Assignee: Shipley Company Inc.
    Inventors: Michael Gulla, Prasit Sricharoenchaikit
  • Patent number: 5166014
    Abstract: A method for the manufacture of an optically readable disc, notably for providing and fixing the recording of a coded information in a sensitive resin layer applied on a transparent substrate made of an inorganic material, such as notably glass, the resin layer being preferably coated outside by a thin protective layer.According to the invention, this method is characterized in that it consists in recording in a manner known per se the signal corresponding to the coded information by localized activation of the sensitive layer through the substrate, then to remove the protective layer, to perform the engraving of the substrate through the activated zones of the sensitive layer playing the role of an engraving mask, to remove the remaining of this sensitive layer, to coat the engraved substrate with a thin reflecting metallic layer and finally to deposit on the metallic layer a final protective external layer. The invention relates also to the disc obtained by the method.
    Type: Grant
    Filed: November 20, 1990
    Date of Patent: November 24, 1992
    Assignee: Digipress
    Inventor: Jean Ledieu
  • Patent number: 5089362
    Abstract: A metallic toner fluid composition that contains (A) electrostatically charged, colloidal elemental metal particles dispersed in an electrically nonconductive organic carrier liquid having a dielectric constant less than about 3.5 and a volume resistivity greater than about 10.sup.12 ohm-cm, (B) a soluble surfactant in an amount sufficient to charge and stabilize the colloidal metal dispersion, and (C) an effective amount of organosol particles and/or a soluble polymer that is not a soluble surfactant (B). Also disclosed is a substrate coated with elemental metallic toner fluid particles. The coated substrate can act as a donor substrate for thermal mass transfer of images to a secondary receiving substrate by performing either or both of the following steps, in any order:(a) transferring the elemental metal coating from the primary substrate to the secondary receiving substrate;(b) contacting the elemental metal coated primary or secondary substrate with an electroless metal plating solution.
    Type: Grant
    Filed: February 1, 1991
    Date of Patent: February 18, 1992
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Hsin H. Chou, Wu-Shyong Li, Robin E. Wright
  • Patent number: 5077156
    Abstract: Substrates which have been coated with a mixture of a radiation-sensitive organic material, an unsubstituted or substituted tetrathio-, tetraseleno- or tetratelluro-naththalene and/or -tetracene and a substance containing active Cl, Br and/or I atoms, form radiation-sensitive layers with electrically conductive charge transfer complexes under the action of thermal energy. Irradiation under an image mask and subsequent development give antistatic or electrically conductive relief images which can be used, for example, as electrodes or conductive connections for electronic components.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: December 31, 1991
    Assignee: Ciba-Geigy Corporation
    Inventors: Jurgen Finter, Bruno Hilti, Carl W. Mayer, Ernst Minder
  • Patent number: 4956215
    Abstract: This optical recording card includes optical recording medium which is formed with optical information patterns each of which has an optical reflective layer and information stored in the optical recording card can be read out in dependency on the difference in optical reflectivity of the optical information pattern. It is not economical that the optical reflective layer of the optical recording card is formed on a base sheet by etching or the like, wherein the base sheet is prepared in the form of a sheet. The optical recording card is produced by way of the steps of forming an optical reflective layer on a continuous base film having large area and then die cutting the assembly of optical reflective layer and base film into a large number of optical recording cards having required dimensions in such a state that the optical recording medium is held between a card base and a protective sheet.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: September 11, 1990
    Assignee: Kyodo Printing Co., Ltd.
    Inventors: Minoru Fujita, Yoichi Fukushima
  • Patent number: 4888260
    Abstract: A hologram is fabricated by opening a volume phase reflection hologram formed in a recording medium such as a positive photoresist. The opening occurs by forming a second hologram, such as an off-axis hologram, in the same recording medium. The opened hologram can be replicated in metal and the metal can be used to emboss the fringe pattern of the opened hologram into plastic. A full range of colors in the visible spectrum may be obtained by metallizing the embossed plastic structure and then by overcoating it with appropriate clear dielectric layers.
    Type: Grant
    Filed: August 10, 1987
    Date of Patent: December 19, 1989
    Assignee: Polaroid Corporation
    Inventor: James J. Cowan
  • Patent number: 4845000
    Abstract: A radiation-sensitive carrier body directly utilized as a stamper has a glass substrate, a first highly adhesive layer securely adhered to the substrate, a radiation-sensitive layer which discharges a gas component upon being irradiated with a laser beam and which locally forms a protuberance due to the absorbed energy, a second highly adhesive layer securely adhered to the specific material of the radiation-sensitive layer and which deforms in accordance with deformation of the layer, and a metal layer which has a high releasability to allow easy separation from a optical disk substrate material such as an acrylic material when the carrier body is used as a stamper substrate for manufacturing optical disks. A protuberance formed on the carrier body such as a continuous spiral protuberance allows formation of a corresponding spiral groove in the acrylic material, serving as a pre-track into which desired information will be digitally written by a user.
    Type: Grant
    Filed: December 4, 1986
    Date of Patent: July 4, 1989
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Yoshikatsu Takeoka, Nobuaki Yasuda, Akio Hori, Norio Ozawa
  • Patent number: 4818649
    Abstract: Method and apparatus for intensification and reflective read-out of underexposed films, radiographs, and the like are shown which include means for converting a metallic silver particle image to a highly reflective image. The film containing the highly reflective image is placed in a black-walled cavity which may contain a particle-free liquid, such as water. The image is raster scanned by a laser beam, and light reflected from the image is detected by a photomultiplier. The photomultiplier output is digitized and the digitized signal is stored for subsequent computer enhancement and display.
    Type: Grant
    Filed: April 1, 1987
    Date of Patent: April 4, 1989
    Assignee: SRI International
    Inventors: Ivor Brodie, Malcolm Thackray
  • Patent number: 4816362
    Abstract: An optical recording material comprising (I) a substrate, (II) a recording layer provided on said substrate, the recording layer consisting of light transmissive portions and light screening portions, and (III) a reflective metallic thin film layer provided on the recording layer; as well as a process therefor. The invention also includes an optical card comprising the optical recording material provided on a card substrate. In the cases of the optical recording material and the optical card, it is possible to readily carry out high density recording, the alternation of written information is difficult, and the written information can be read out on a basis of the difference in light reflectivity.
    Type: Grant
    Filed: March 31, 1987
    Date of Patent: March 28, 1989
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Mitsuru Takeda, Wataru Kuramochi
  • Patent number: 4735878
    Abstract: An information recording medium includes a substrate having first and second sides. A layer of photoresist is deposited on the first side of the substrate. This layer of photoresist has a selected thickness and defines an area of openings therein such that the first side of the substrate is exposed at the openings, the openings being distributed in a pattern indicative of selected stored information. A reflecting layer is deposited on the photoresist layer and on the first side of the substrate at the openings. Both the substrate and the layer of photoresist are adapted to transmit the reading beam such that a portion of the reading beam incident on the second side of the substrate is reflected out of the substrate by the reflecting layer, both in a first region comprising the openings and in a second region between the openings.
    Type: Grant
    Filed: August 28, 1986
    Date of Patent: April 5, 1988
    Assignee: Quixote Corporation
    Inventors: Alan B. Hamersley, Michael W. Goff, Vinai K. Thummalapally, Thomas M. Whitworth, Ramchandra R. Nomula
  • Patent number: 4724026
    Abstract: The present invention is directed to a method for selectively transferring metallic foil and xerographic images on a receiving substrate such as paper. The method generally comprises providing a transfer sheet (including a metallic film) and a receiving substrate (including xerographic images disposed thereon.) The receiving substrate is placed in face-to-face contact with the transfer sheet to form a sandwich with the xerographic images on the inside. the sandwich is then fed through an apparatus, where heat and pressure are applied, causing the xerographic images to tackify and causing the metal film from the transfer sheet to selectively adhere to the xerographic images.
    Type: Grant
    Filed: October 14, 1986
    Date of Patent: February 9, 1988
    Assignee: Omnicrom Systems Corporation
    Inventor: Marshall A. Nelson
  • Patent number: 4673626
    Abstract: An optical recording material comprising (I) a substrate, (II) a recording layer provided on said substrate, the recording layer consisting of light transmissive portions and light screening portions, and (III) a reflective metallic thin film layer provided on the recording layer; as well as a process therefor. The invention also includes an optical card comprising the optical recording material provided on a card substrate. In the cases of the optical recording material and the optical card, it is possible to readily carry out high density recording, the alternation of written information is difficult, and the written information can be read out on a basis of the difference in light reflectivity.
    Type: Grant
    Filed: March 27, 1985
    Date of Patent: June 16, 1987
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Mitsuru Takeda, Wataru Kuramochi
  • Patent number: 4650735
    Abstract: A method of manufacturing a metal matrix in which a supporting plate bearing a photo-resist layer is irradiated patternwise, the irradiated parts are developed and thereby removed, the obtained master disc is provided with a metal peel, which subsequently is removed, whereby after removal of the patternwise irradiated parts of the photoresist layer, the remaining parts are irradiated. The invention also relates to a new intermediate product which comprises a supporting layer, a photoresist layer having an information track and an electrically conductive layer on the photoresist layer, the photoresist layer being a fully irradiated layer.
    Type: Grant
    Filed: January 10, 1983
    Date of Patent: March 17, 1987
    Assignee: U.S. Philips Corporation
    Inventor: Antonius W. M. De Laat
  • Patent number: 4524116
    Abstract: The invention provides a master for use in image transfer by contact printing onto a transparent electrophotographic (TEP) film, which comprises an electrically insulating substrate having a planar surface which carries image elements deposited thereon; and a thin transparent insulating layer covering said planar surface and said image elements. The surface of the thin transparent insulating material is preferably profiled so that it comprises a base level and raised portions extending above said base level, the area of the raised portions being small compared to the total surface area of the transparent insulating layer. A thin transparent electrode may be incorporated between the substrate and the thin transparent insulating layer.Methods of forming such a master and of contact printing with it are also disclosed.
    Type: Grant
    Filed: May 17, 1983
    Date of Patent: June 18, 1985
    Assignee: Comtech Research Unit Limited
    Inventor: Victor C. Humberstone
  • Patent number: 4504529
    Abstract: Disclosed is a method for the xerographic, pattern-wise deposition of a dielectric powder that is sensitized with a metal compound to enable the electroless plating of a pattern formed by said powder.
    Type: Grant
    Filed: June 18, 1982
    Date of Patent: March 12, 1985
    Assignee: A/S Neselco
    Inventors: Gunnar Sorensen, Leo G. Svendsen
  • Patent number: 4488864
    Abstract: There is disclosed an improved integral optical device of the type produced by creating optical patterns in porous glass bodies, especially patterns involving gradient refractive index distributions. The optical strength of an element, such as a lens, in such an optical pattern is increased by treatment with a polymerizable, organo functional silicone fluid while the matrix glass is sealed.
    Type: Grant
    Filed: August 4, 1983
    Date of Patent: December 18, 1984
    Assignee: Corning Glass Works
    Inventors: Nicholas F. Borrelli, Thomas H. Elmer, David L. Morse, Paul A. Sachenik