Abstract: A composite amine absorbent to absorb at least one of CO2 and H2S in a gas includes: a chain monoamine; a diamine; a cyclic compound represented by the following chemical formula: where R1: any one of hydrogen, a hydrocarbon group having a carbon number of 1 to 4, and a hydroxyalkyl group, R2: oxygen or N—R3, and R3: any one of hydrogen, a hydrocarbon group having a carbon number of 1 to 4, and a hydroxyalkyl group; and water.

Abstract: A method of manufacturing an optical element including, a first step of, after affixing a hologram forming material to a glass substrate having a marking portion, performing interference exposure on the hologram forming material, thereby forming a hologram layer at the glass substrate, and a second step of affixing the hologram layer peeled off from the glass substrate to a plastic substrate having a first alignment mark, wherein in the second step, the first alignment mark on the plastic substrate, and a second alignment mark formed at a position corresponding to the marking portion in the hologram layer during the interference exposure are used to implement positioning of the plastic substrate and the hologram layer.

Abstract: A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

Abstract: Rapid and specific detection of biological cells and biomolecules is important to biological assays across diverse fields including genomics, proteomics, diagnoses, and pathological studies. Microarrays and microfluidics increasingly dominate such detection techniques due to the ability to perform significant numbers of tests with limited sample volumes. A snap chip assembly is provided for the transfer of a microarray of reagents within semi-spherical liquid droplets on a transfer chip to a target assay microarray on an assay chip following assembly of the two chips and physical contact of the droplets with the target array. Reagents in nanoliter quantities are spotted on both chips and selectively transferred as liquid droplets between transfer chip and assay chip within the contact areas. Using the snap chip structure the inventors performed immunoassays with colocalization of capture and detection antibodies with 10 targets and bead-in-gel droplet microarrays with 9 targets in the low pg/ml regime.

Abstract: A method of making a relief image printing element from a photosensitive printing blank is provided. The method comprising the steps of: 1) providing a photosensitive printing blank comprising a backing layer, at least one layer of photoresin on top of the backing layer and a removable coversheet on top of the at least one layer of photoresin; 2) imaging the photosensitive printing blank through the removable coversheet using a laser to create a relief image therein; and 3) removing the removable coversheet.

Abstract: A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength.

Abstract: A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

Abstract: A manufacturing method for a plasma display member wherein generation of defects such as interruption and short-circuit of a pattern obtained after exposure and development is suppressed and yield is improved, even when a foreign material is adhered on a photo mask or photo mask is scratched. An exposing method for a display member wherein a display member having a photosensitive layer formed on a base substrate is exposed through a photo mask having a desired pattern. The exposing method for the display member is characterized in that the photo mask and the base substrate are relatively shifted during exposure operation.

Abstract: A method of manufacturing a multi-layer circuit layer is provided. One example method includes the steps of: preparing an upper substrate and a lower substrate, wherein each of the upper and lower substrates includes a carrier layer and a seed layer, which are detachably connected to each other; forming circuits including first circuit patterns on the upper substrate and second circuit patterns on the lower substrate by plating on the seed layer; preparing a core substrate, wherein circuit patterns comprising a conductive material are formed on the core substrate; coupling the upper substrate, the core substrate, and the lower substrate by interposing adhesive members; detaching the carrier layer from the seed layer; etching the seed layer, wherein the seed layer is removed; and electrically connecting the first circuit patterns and the second circuit patterns to the third circuit patterns, respectively.

Abstract: A photoresist stripping solution which comprises (a) a salt of hydrofluoric acid with a base free from metal ions, (b) a water-soluble organic solvent, (c) a mercapto group containing corrosion inhibitor, and (d) water, and a method of stripping photoresists with the use of the same are disclosed. In case of using ammonium fluoride as component (a), the photoresist stripping solution may further contain (e) a salt of hydrofluoric acid with a quaternary ammonium hydroxide, such as tetramethylammonium hydroxide, tetrapropylammonium hydroxide, etc., and/or an alkanolamine. The photoresist stripping solution of the present invention has an excellent effect of protecting both Al- and Cu-based metal wiring conductors from corrosion, of efficiently stripping photoresist films and post-ashing residues, and is free from the precipitation of the corrosion inhibitor.

Abstract: A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

Abstract: A method for removing dry film resist (DFR) from a fine pitch solder bump array on a semiconductor wafer provides for pre-soaking the wafer in a chemical bath then turbulently exposing the wafer to a chemical solution, both steps taking place in batch processing with the wafers processed in a vertical position. The wafers are then individually processed through a chemical spinning operation in which a chemical solution is dispensed from a spray nozzle while motion such as spinning is imparted the horizontally disposed wafer. The spin speed of the chemical spraying process may then be increased to accelerate physical removal of residue. Deionized water rinsing and spin-drying provide a solder bump array void of any DFR or other residuals.

Abstract: A method of making a microstructure includes selectively activating a portion of a surface of a silicon-containing elastomer, contacting the activated portion with a substance, and bonding the activated portion and the substance, such that the activated portion of the surface and the substance in contact with the activated portion are irreversibly attached. The selective activation may be accomplished by positioning a mask on the surface of the silicon-containing elastomer, and irradiating the exposed portion with UV radiation.

Abstract: A method is provided for automated converting of a web of a thin patterned catalyst-coated membrane to separate membrane sheets for fuel cell assembly. The membrane typically has a thickness of about one thousandth of an inch. Automated web converting involves transporting, with use of a movable vacuum, an end portion of the membrane web from a first location to a second location. With use of respective first and second vacuums at the first and second locations, and after removal of the movable vacuum, the end portion of the membrane web is releasably secured at the first and second locations. The membrane web is cut within a gap defined between a single catalyst pattern of the membrane web end portion and an adjacent catalyst pattern to produce a membrane sheet. The membrane sheet is precisely positioned to a desired orientation to facilitate subsequent processing of the membrane sheet.

Abstract: A method of manufacturing a multi-layer circuit layer is provided. One example method includes the steps of: preparing an upper substrate and a lower substrate, wherein each of the upper and lower substrates includes a carrier layer and a seed layer, which are detachably connected to each other; forming circuits including first circuit patterns on the upper substrate and second circuit patterns on the lower substrate by plating on the seed layer; preparing a core substrate, wherein circuit patterns comprising a conductive material are formed on the core substrate; coupling the upper substrate, the core substrate, and the lower substrate by interposing adhesive members; detaching the carrier layer from the seed layer; etching the seed layer, wherein the seed layer is removed; and electrically connecting the first circuit patterns and the second circuit patterns to the third circuit patterns, respectively.

Abstract: A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

Abstract: A photosensitive resin laminate for a sign board is provided, which laminate has a support and a photosensitive resin layer having a thickness of not less than 500 ?m formed at least on the support via an adhesive layer, wherein the photosensitive resin layer has an absorbance at 400 nm of not more than 0.4 and the support is a modified polyethylene terephthalate layer on which a UV quality change preventive layer is formed. A sign board obtained using a photosensitive resin laminate of the present invention has a transparent and colorless support having superior design and superior light resistance with a smaller coloring level due to UV. In other words, the photosensitive resin laminate of the present invention can provide a suitable sign board and greatly contributes to the industry.

Abstract: The present invention provides a halogen-free dry film photosensitive resin composition, which comprises (a) 10˜60 wt % of at least two kinds of acrylic resins having unsaturated carboxylic acid monomers as polymerized units; (b) 5˜20 wt % of a photosensitive resin having at least two (meth)acrylate groups; (c) 0.1˜15 wt % of a photoinitiator; and (d) 0.5˜20 wt % of a thermo-curing agent. The resin composition of the invention is suitable for use as a photoresist in the process of producing printed circuit boards. The resin composition of the invention is particularly suitable for use in the surface of printed circuit boards or semiconductor packages as a protective dry film solder mask.

Abstract: A patterning method includes coating a photosensitive surface active agent on a base film, forming an organic layer on the surface active agent, decreasing adhesion between the surface active agent and the organic layer by exposing light through a mask having a predetermined opening on the organic layer, adhering the base film to an insulating substrate with the organic layer facing the insulating substrate, and transferring the organic layer which is corresponded to the exposed surface active agent to the insulating substrate by separating the base film from the insulating substrate. The method provides a simplified patterning process, and a manufacturing method of a display device using the same.

Abstract: Processes for effecting thermal transfer of electroactive organic material are disclosed wherein unwanted portions of a layer of electroactive organic material supported by a donor element are removed or transferred from the layer by thermal transfer, particularly laser-induced thermal transfer, leaving a desired pattern of the electroactive organic material on the donor element. The electroactive organic material may be an organic material exhibiting electroluminescence, charge transport, charge injection, electrical conductivity, semiconductivity and/or exciton blocking. The layer of electroactive organic material may comprise more than one layer of different types of electroactive organic material. The exposure pattern is a negative image of the desired pattern. The electroactive organic material of the desired pattern is not, therefore, exposed to the heat which can cause decomposition.

Abstract: A masking film has a unique polymeric binder in the imageable layer that enables the imaged film to be readily solubilized in non-chlorinated developers when it is used to form a relief image in a radiation-sensitive element, such as a UV-sensitive flexographic printing plate precursor. The polymeric binders in the imageable layer are resins that can be dissolved or dispersed in cyclohexane at 10% solids at 23° C. within 24 hours.

Abstract: Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be applied to a work piece to mark it and removed from the work piece by peeling.

Abstract: This method forms a patterned film. The method prepares a transfer member having a transfer surface on which asperities are formed in accordance with a film pattern to be formed, performs stripping treatment on surfaces of at least ridges formed on the transfer surface of the transfer member, thereafter forms a thin film formed by a technology of vacuum film formation on the surfaces of the at least ridges formed on the transfer surface of the transfer member and transfers the thin film formed on the surfaces of at least ridges of the transfer member onto a substrate, thereby forming the patterned film on the substrate.

Abstract: The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 ?m and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist; whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20–90 wt % of an alkaline soluble binder oligomer or polymer; (b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a); (c) from 0.01 to 20% by weight of one or more photoinitiators; (d) from 0 to 20% by weight of additives and/or assistants; and (e) from 0.

Abstract: The present subject matter relates to a method of stripping a photoresist after the photoresist film has been subjected to a high dose and high energy ion implant process. The method involves soaking the photoresist film in DI water, dry etching with oxygen plasma, and immersing in Caro's acid solution to improve the throughput of removing the film from the underlying substrate. The method can also be used to strip photoresist that has been hardened or altered by other types of processes such as dry etch transfer steps and chemical treatments. In some applications, the dry etching step may be omitted from the stripping process or the dry etching step may be combined with the water soak in an integrated process.

Abstract: Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be applied to a work piece to mark it and removed from the work piece by peeling.

Abstract: A method for the fabrication of patterned devices, in which a latent image is initially formed in a photosensitive material on a carrier, and the exposed material containing the latent image is physically transferred to a substrate before processing. Physical transfer is enhanced by the appropriate selection of coating surface properties and additional coating layers, and by processing steps, such as heating and UV exposure, to promote adhesion to the substrate and detachment from the carrier.

Abstract: The photosensitive film for circuit formation of the present invention has: on a first film (base film), a photosensitive layer having a thickness of 0.1 to 10 ?m; or a photosensitive layer having a thickness of 0.1 to 14 ?m and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.

Abstract: The present invention relates to a thinner composition for removing resist used in TFT-LCD manufacturing processes, and more particularly to a thinner composition for removing resist that comprises: a) 0.1 to 5 wt % of an inorganic alkali compound; b) 0.1 to 5 wt % of an organic amine; c) 0.1 to 30 wt % of an organic solvent; d) 0.01 to 5 wt % of a surfactant comprising an ionic surfactant and a non-ionic surfactant in the weight ration of 1:5 to 1:25; and e) 60 to 99 wt % of water. The thinner composition for removing resist of the present invention has good efficiency of removing unwanted resist film constituents formed on the edge of the resist film or at the back of the substrate in TFT-LCD device and semiconductor device manufacturing processes. Also, it does not have the problem of equipment corrosion.

Abstract: A photosensitive transfer material including a temporary support, a thermoplastic resin layer, an intermediate layer, and a photosensitive recording layer. The thermoplastic resin layer, the intermediate layer and the photosensitive recording layer are provided in this order on the temporary support. The thermoplastic resin layer includes a thermoplastic resin and a polyester resin, and the polyester resin is contained in the thermoplastic resin layer in an amount of at least 20% by weight and no more than 90% by weight based on a total solid content of the thermoplastic resin layer.

Abstract: The present invention provides a negative photosensitive resin composition comprising (A) a photocurable resin having a photosensitive group or groups crosslinkable by light irradiation, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more, a negative photosensitive dry film prepared by applying the photosensitive resin composition to a surface of support film, followed by drying, to form a photosensitive resin layer, and a method of forming a pattern using the resin composition or the dry film.

Abstract: A positive photoresist transfer material, wherein an alkali-soluble thermoplastic resin layer, an intermediate layer and a positive photoresist layer are successively applied on an adhesive surface of a temporary support, and adhesion between the positive photoresist layer and the intermediate layer is less than adhesion between other layers or surfaces.

Abstract: Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.

Abstract: The present invention provides a positive photosensitive resin composition comprising (A) a positive photosensitive resin, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more; a positive photosensitive dry film prepared by applying the photosensitive resin composition to a surface of support film, followed by drying, to form a photosensitive resin layer; and a method of forming a pattern using the resin composition or the dry film.

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

Abstract: In a EUV reflection mask, the distance from the surface of the mask to an idealized plane is locally measured at a first position. The measured value indicates the mechanical stress caused by the alternating layer sequence of a EUV reflection layer. A local value for a radiation dose of an ion beam, which is used to dope the back surface, is calculated for a counter stress that will be produced on the back surface of the substrate. The lattice structure of the substrate is locally influenced by the doping at the position on the back surface corresponding to the first position on the front surface, and the desired counter stress is thereby generated to compensate for bending caused by the stress. It is advantageously possible to compensate for particular local features in the stress distribution on the substrate, in particular, bending and unevenness of relatively high orders.

Abstract: A method for forming resist patterns, and an overlying layer material and a semiconductor device used in the method for forming resist patterns, which can improve the dimensional uniformity of resist patterns by inhibiting the multiple interference of light beams within a resist film; improve the environmental resistance in a clean room or the like; and obtain resist patterns having rectangular sectional shapes by preventing the acid in the overlying layer material from diffusing into the resist. By using an overlying layer material containing a water-soluble low-molecular-weight acidic substance and a water-soluble photo base generator preventing the diffusion of the acidic substance into the resist, the base formed after exposure neutralizes the acids contained in the overlying layer material in nature, and the diffusion of the acid into the resist can be inhibited.

Abstract: A photosensitive transfer material including a temporary support having disposed thereon an alkali-soluble photosensitive resin layer containing a colorant, wherein when the temporary support is peeled from an adjacent layer provided between the temporary support and the photosensitive resin layer at a peeling rate of 1 m/min in an atmosphere of 25° C. and 30% RH, each of the temporary support and the adjacent layer has a surface potential whose absolute value is 5 kV or less after being peeled.

Abstract: A photosensitive transfer material including a temporary support having disposed thereon an alkali-soluble photosensitive resin layer containing a colorant, wherein when the temporary support is peeled from an adjacent layer provided between the temporary support and the photosensitive resin layer at a peeling rate of 1 m/min in an atmosphere of 25° C. and 30% RH, each of the temporary support and the adjacent layer has a surface potential whose absolute value is 5 kV or less after being peeled.

Abstract: A photosensitive laminate structure including a carrier layer and a photosensitive layer is described. The photosensitive layer includes a polymeric photosensitive resin composition containing at least one cross-linkable unit represented by the formula: wherein X is an organic moity and Y is selected from the following group: wherein Z is selected from at least one of lithium, sodium, potassium, ammonium, monoalkylammonium, dialkylammonium, and tetraalkylammonium.

Abstract: A manufacturing technique for making grating features utilizes the etching characteristics for photoresist to provide desirable geometric shapes in close proximity to each other. This results in a grating for optocoupling, which is manufacturable and provides efficient coupling. A silicon waveguide is conveniently achieved using a SOI substrate so that the insulator underlying the silicon provides one material adjoining the silicon with a lower index of refraction than silicon. The top surface of the silicon has the desirable geometric shapes that result also in a lower index of refraction than silicon above the main body of the silicon substrate.

Abstract: A dry film photoresist having a glass transition temperature (Tg) above room temperature. The dry film photoresist is tack free. An artwork may be placed directly on the photoresist without concern that the artwork may stick to the dry film photoresist or become contaminated with photoresist. The dry film photoresist may be laminated on a support sheet and wound into a roll without concern that the photoresist will stick to the backside of the support sheet. The dry film photoresist also has reduced cold flow problems.

Abstract: A method of manufacturing a panel assembly used to assemble a display panel intends to achieve an alignment-free between barrier ribs and a fluorescent layer and minimize the waste of a barrier rib material for cost reduction. On a support body 51 which is not a substrate, formed are a plurality of walls 281 through 283 made of a fluorescent material that are belt-shaped in plan view arranged in stripes, an electrode material layer a1, and a barrier rib material filling spaces between the walls. The support body 51 and a substrate 21 are coupled so that the barrier rib material faces the substrate. The walls 281 through 283, the electrode material layer a1 and the barrier rib material 291 are transferred in one step to the substrate 21, and thus a panel assembly 20 having barrier ribs 29, electrodes A and fluorescent layers 28R, 28G and 28B is obtained.

Abstract: A positive photoresist transfer material, wherein an alkali-soluble thermoplastic resin layer, an intermediate layer and a positive photoresist layer are successively applied on an adhesive surface of a temporary support, and adhesion between the positive photoresist layer and the intermediate layer is less than adhesion between other layers or surfaces.

Abstract: Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 &mgr;m from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight.

Abstract: The invention provides a photopolymer package for use in making a hand stamp plate, the package consisting of a sachet containing a photocurable liquid polymer, the walls of the sachet being formed of material capable of being released from the cured photopolymer. Methods for the formation of the package and the hand stamp plate are also provided. The invention eliminates the requirement for the use of a backing layer in the package and thereby offers significant advantages over the prior art in terms of cost and efficiency.

Abstract: A method for imaging a product with a pattern commences by forming a film of a wet or tacking marking material on a cliché. A negative of the pattern is ablatively imaged into the film on the cliché. The negative image then is pressure transferred from the cliché onto a marking pad. Finally, the negative image is pressure transferred from the marking pad onto the product. Preferably, the cliché where the film is formed contains recesses. The apparatus, which images the product, has a moveable cliché having a recessed pocket. An ink reservoir transfers ink into the recessed pocket. A laser imaging system images a pattern into ink contained in the recessed pocket. A stamp pad is moveable from a home position to contact the imaged pattern for pressure transferring the pattern onto the stamp pad, and moveable to a printing station to pressure transfer the pattern onto a product.

Abstract: To provide a thermosensitive transfer film in which a color filter layer and a phosphor layer can be easily formed by a small number of processes and a method of using the film. A thermosensitive transfer film 10 comprising at least a photosensitive phosphor layer 5 of a predetermined color, a color filter layer 4 of the same color, and a photosensitive adhesive layer 3 which are provided on a base film 6.

Abstract: Method for marking hot glass article having a surface uses a flexible carrier ribbon bearing a laser ablatable, high temperature, diffusely reflective coating, preferably white in color. A pattern is imaged in said coating on carrier ribbon by laser ablation. The patterned carrier ribbon is pressed against the surface only for a time adequate for transferring the patterned coating to the surface. The carrier ribbon then is released from pressing against the surface. The transferred image thickness may be limited by solid particles within the coating.

Abstract: A device is described for accurately transferring multiple individual fluids from multiple source containers into a single receiving container. Fluid flows from the multiple source containers through individual fluid conduits to a chamber having a single fluid outlet conduit. The fluid outlet conduit is in fluid communication with a single receiving container. A pressure conduit is in communication with the chamber for alternately creating positive and negative pressures in the chamber to cause fluid to flow from the individual source containers into the chamber, and to cause fluid to flow from the chamber into the receiving container in response to commands from a control means in the device.

Abstract: A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.