Abstract: A substrate processing method includes a preprocessing forming step of forming a preprocessing film on a surface of a substrate having the surface on which a first region and a second region in which different substances are exposed are present, a preprocessing film separating step of separating the preprocessing film from the surface of the substrate with a stripping liquid, a processing film forming step of forming a processing film on the surface of the substrate after the preprocessing film separating step, and a processing film separating step of separating the processing film from the surface of the substrate with the stripping liquid.

Abstract: A cleaning solution includes a first solvent having Hansen solubility parameters 25>?d>13, 25>?p>3, and 30>?h>4; an acid having an acid dissociation constant, pKa, of ?11<pKa<4, or a base having a pKa of 40 > pKa>9.5; and a surfactant. The surfactant is one or more of an ionic surfactant, a polyethylene oxide and a polypropylene oxide, a non-ionic surfactant, and combinations thereof.

Abstract: Provided is a composition for forming release layers which comprises (A) a polyurea including a repeating unit represented by formula (1), (B) an acid compound or a salt thereof, (C) a crosslinking agent selected from among compounds having a nitrogen atom substituted by a hydroxyalkyl group and/or an alkoxymethyl group, (D) a polymeric additive including a repeating unit represented by formula (a1), a repeating unit represented by formula (b), and a repeating unit represented by formula (c), and (E) a solvent, wherein the polymeric additive (D) is contained in an amount of 5-100 parts by mass per 100 parts by mass of the polyurea (A). (In the formulae, the RA moieties each are independently a hydrogen atom or a methyl group; RB1 is a branched C3-4 alkyl group in which at least one hydrogen atom has been replaced with a fluorine atom; RC is a C1-10 hydroxyalkyl group; and RD is a C6-20 polycycloalkyl group or C6-12 aryl group.

Abstract: An apparatus for material deposition on an acceptor surface includes a transparent donor substrate having opposing first and second surfaces, and a donor film on the second surface. The apparatus additionally includes an optical assembly, which is configured to direct a beam of radiation to pass through the first surface of the donor substrate and impinge on the donor film at a location on the second surface so as to induce ejection of droplets of molten material from the donor film at an angle that is not normal to the second surface at the location onto the acceptor surface.

Abstract: A solder resist includes a lower layer including a first resin and particles, and an upper layer including a second resin and formed on the lower layer. The particles are one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles.

Abstract: The invention provides a fiber containing (A) a polymer compound containing a structural unit having, in a side chain, at least one kind of organic group selected from a hydroxy group, a hydroxymethyl group and an alkoxymethyl group having 1-5 carbon atoms, and (B) a photoacid generator.

Abstract: Resist stripping agents useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits and/or liquid crystals with reduced metal and metal alloy etch rates (particularly copper etch rates and TiW etch rates), are provided with methods for their use. The preferred stripping agents contain low concentrations of resorcinol or a resorcinol derivative, with or without an added copper salt, and with or without an added amine to improve solubility of the copper salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: According to one embodiment, a pattern forming method is disclosed. The method can include selectively providing a curing agent to a pattern in a template, contacting the template provided the curing agent to a substrate, irradiating the curing agent with light where the template and the substrate are contacted each other to harden the curing agent, demolding the template from the substrate to form a curing agent pattern on the substrate, and etching the substrate on a basis of the curing agent pattern.

Abstract: A method of forming a master from smaller originals is provided for use in replicating molecular transfer lithography (M×L) templates, cured polymer films for imprinting molds or cured polymer films for photonic applications. A coating layer on a base substrate is successively patterned in two or more areas using dissoluble conformal templates created from original master patterns, wherein areas not being patterned with a template at any given stage of the process are protected with photoresist and templates applied to open areas also partially overlap the resist-protected areas. Overlapping minimizes seam formation in the overall pattern. Templates have etch-resistant functional material that adheres to the coating layer on the base substrate. After dissolving the template to leave only the functional material in the pattern of the original master, etching of the coating layer transfers the pattern to the etched coating layer of the base substrate.

Abstract: A method of forming a polarizing material is provided including exposing a layer of dichroic material to activating light illumination to provide an ordered structure with a distinguished absorption axis and thus photo-induce polarization, and fixing the induced polarization by polymerization of the dichroic layer. Novel polarizing materials formed thereby are also provided. By selectively exposing regions of the dichroic material to differing activating radiation, different regions with different polarization axes can be created. The polarizing material can also be provided with a coating or coatings to alter the spectral responses, and a stack formed of a plurality if dichroic layers can be provided.

Abstract: Resist stripping agents useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits and/or liquid crystals with reduced metal and metal alloy etch rates (particularly copper etch rates and TiW etch rates), are provided with methods for their use. The preferred stripping agents contain low concentrations of resorcinol or a resorcinol derivative, with or without an added copper salt, and with or without an added amine to improve solubility of the copper salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: In one example embodiment, a method fabricates microbeads, which can supply a bead set containing a various types of microbeads and having distinct populations of the respective types of microbeads. In one example embodiment, the method includes forming a hydrophilic layer made of a hydrophilic organic material on a substrate. In one example embodiment, the method includes laminating on the hydrophilic layer a thin film capable of being peeled off in the form of microbeads. In one example embodiment, the method includes forming the thin film in a given configuration by photolithography. In one example embodiment, the method includes solid-phasing a given substance on the post-formed thin films. In one example embodiment, the method includes peeling off the post-formed thin films, which have been solid-phased with the substance, from the substrate along with at least a part of the hydrophilic layer to obtain microbeads.

Abstract: A method for forming an image at least comprising steps of forming an electrostatic latent image by exposing an electrophotographic photoreceptor, forming a foil transferring face by supplying a toner onto the electrophotographic photoreceptor having the electrostatic latent image, transferring the foil transferring face formed on the electrophotographic photoreceptor to a base substance, fixing the foil transferring face transferred on the base substance, supplying a transfer foil to the base substance fixed with the foil transferring face, adhering the transfer foil onto the foil transferring face by heating under a condition of contacting the transfer foil with the foil transferring face; and removing the transfer foil from the base substance while leaving the foil adhered onto the foil transferring face, wherein the toner comprises a binder resin having a softening temperature in the range of from not less than 105° C. to not more than 140° C.

Abstract: Disclosed is a method for stripping a photoresist comprising: (I) providing a photoresist pattern on a substrate where the substrate has at least a copper (Cu) wiring and a low-dielectric layer thereon, and selectively etching the low-dielectric layer by using the photoresist pattern as a mask; (II) contacting the substrate after the step (I), with ozone water and/or aqueous hydrogen peroxide; and (III) contacting the substrate after the step (II), with a photoresist stripping solution that contains at least a quaternary ammonium hydroxide.

Abstract: Examples of novel semiconductor processing pedestals, and apparatuses including such pedestals, are described. These pedestals are specifically configured to provide uniform heat transfer to semiconductor substrates and to reduce maintenance complexity and/or frequency. Specifically, a pedestal may include a removable cover positioned over a metal platen of the pedestal. The removable cover is configured to maintain a consistent and uniform temperature profile of its substrate-facing surface even though the platen's upper-surface, which supports the cover and is in thermal communication with the cover, may have a much less uniform temperature profile. The cover may be made from certain ceramic materials and shaped as a thin plate. These materials are resistant to the processing environments and maintain their thermal characteristics over many processing cycles. The cover can be easily removed from the platen and replaced with a new one without a need for major disassembly of the entire apparatus.

Abstract: A manufacturing method for a plasma display member wherein generation of defects such as interruption and short-circuit of a pattern obtained after exposure and development is suppressed and yield is improved, even when a foreign material is adhered on a photo mask or photo mask is scratched. An exposing method for a display member wherein a display member having a photosensitive layer formed on a base substrate is exposed through a photo mask having a desired pattern. The exposing method for the display member is characterized in that the photo mask and the base substrate are relatively shifted during exposure operation.

Abstract: Methods for removing a photoresist from a metal-comprising material are provided. In accordance with an exemplary embodiment of the present invention, the method comprises applying to the photoresist a substantially non-aqueous-based solvent having a pH no less than about 9 or no pH and subsequently applying to the metal-comprising material an aqueous-based fluid having a pH no less than about 9.

Abstract: A method of manufacturing microstructures is disclosed, the method comprising a applying a mask to substrate; forming a pattern in the mask; processing the substrate according to the pattern; and mechanically removing the mask from the substrate. A polymer mask is disclosed for manufacturing micro scale structure, the polymer mask comprising a thin, preferably ultra thin flexible film. A method of manufacturing an integrated circuit is disclosed, the method comprising forming a plurality of isolated semiconductor devices on a common substrate; and connecting some of the devices. Apparatus for manufacturing microstructures is disclosed comprising: a mechanism for coating a mass substrate to create a structure; a mechanism for removing a mask from the substrate; and processing apparatus.

Abstract: An exemplary method for making a plurality of light blocking plates is provided. Firstly, a photoresist layer is formed on a substrate. Secondly, the photoresist layer is exposed using a gray scale photomask. Thirdly, the photoresist layer is developed to form a plurality of conical frustums on the substrate, and each of the conical frustums tapers in a direction away from the substrate. Fourthly, an opaque to-be-solidified film is formed on the substrate, and each of the conical frustums extends through the to-be-solidified film. Fifthly, the to-be-solidified film is solidified. Sixthly, the solidified film is separated from the substrate and the conical frustums, thus obtaining a light blocking plate module including a plurality of light blocking plates. Lastly, the light blocking plate module is cut into a plurality of individual light blocking plates.

Abstract: A method of making a relief image on a flexographic print plate including imagewise exposing a mask including an imageable material disposed on a mask substrate to form an imaged mask having a mask image in the imageable material disposed on the mask substrate, the mask image including mask image areas each having a highlight value. The method further includes laminating the imaged mask to a front surface of a flexographic printing plate precursor, and exposing selected areas of the flexographic printing plate precursor to an imagewise addressable curing radiation via a back surface of the flexographic printing plate precursor based on the highlight values of corresponding mask image areas of the mask image.

Abstract: A method of fabricating a flexible display device, the method including applying a transparent adhesive layer on a carrier substrate, laminating a flexible substrate comprising a barrier layer on the transparent adhesive layer, forming a thin film transistor array on the flexible substrate, and separating the carrier substrate from the flexible substrate by irradiating a laser beam onto the barrier layer.

Abstract: A method of fabricating a flexible display device, the method including applying an adhesive layer including polyimide on a carrier substrate, laminating a flexible substrate on the adhesive layer, and separating the carrier substrate from the flexible substrate by irradiating a laser beam or light onto the adhesive layer.

Abstract: A template comprising pitch multiplied and non-pitch multiplied features is configured for use in imprint lithography. On a first substrate, a first pattern is formed using pitch multiplication and a second pattern is formed using photolithography without pitch multiplication. The first pattern and the second pattern are transferred to a template. The template is brought into contact with a transfer layer overlying a series of mask layers overlying a second substrate. The pitch multiplied and non-pitch multiplied patterns on the template are transferred to the transfer layer, forming an imprinted pattern. The imprinted pattern is transferred to the second substrate to form pitch multiplied and non-pitch multiplied features.

Abstract: A method of making a microstructure includes selectively activating a portion of a surface of a silicon-containing elastomer, contacting the activated portion with a substance, and bonding the activated portion and the substance, such that the activated portion of the surface and the substance in contact with the activated portion are irreversibly attached. The selective activation may be accomplished by positioning a mask on the surface of the silicon-containing elastomer, and irradiating the exposed portion with UV radiation.

Abstract: A method is provided for automated converting of a web of a thin patterned catalyst-coated membrane to separate membrane sheets for fuel cell assembly. The membrane typically has a thickness of about one thousandth of an inch. Automated web converting involves transporting, with use of a movable vacuum, an end portion of the membrane web from a first location to a second location. With use of respective first and second vacuums at the first and second locations, and after removal of the movable vacuum, the end portion of the membrane web is releasably secured at the first and second locations. The membrane web is cut within a gap defined between a single catalyst pattern of the membrane web end portion and an adjacent catalyst pattern to produce a membrane sheet. The membrane sheet is precisely positioned to a desired orientation to facilitate subsequent processing of the membrane sheet.

Abstract: An apparatus for direct engraving comprises: a plurality of laser diode emitting at different wavelengths; a multiplexer (11) for collecting the plurality of laser sources into a single laser beam; a rare earth doped fiber amplifier (12) to amplify the single laser beam to form an amplified single laser beam; a demultiplexer to split the single laser beam into a plurality of amplified laser sources; and an imaging means to apply the plurality of amplified laser sources for imaging a printing plate (55).

Abstract: A method for removing dry film resist (DFR) from a fine pitch solder bump array on a semiconductor wafer provides for pre-soaking the wafer in a chemical bath then turbulently exposing the wafer to a chemical solution, both steps taking place in batch processing with the wafers processed in a vertical position. The wafers are then individually processed through a chemical spinning operation in which a chemical solution is dispensed from a spray nozzle while motion such as spinning is imparted the horizontally disposed wafer. The spin speed of the chemical spraying process may then be increased to accelerate physical removal of residue. Deionized water rinsing and spin-drying provide a solder bump array void of any DFR or other residuals.

Abstract: A two-step process is disclosed for stripping photoresist material from a substrate, wherein the substrate includes a low k dielectric material underlying the photoresist material and a polymer film overlying both the photoresist material and the low k dielectric material. The first step of the two-step process uses an oxygen plasma to remove the polymer film. The second step of the two-step process uses an ammonia plasma to remove the photoresist material, wherein the second step commences after completion of the first step. Each step of the two-step photoresist stripping process is respectively defined by particular values for process parameters including chemistry, temperature, pressure, gas flow rate, radio frequency power and frequency, and duration.

Abstract: The invention is directed to methods of making an article bearing a relief image using a removable film. First, an imageable film that contains at least a mask substrate and an imageable material is imagewise exposed to imaging radiation to form an imaged film. The imaged film is then transferred to an imageable article, such as a flexographic printing plate precursor. The resulting assembly is exposed to curing radiation resulting in exposed and unexposed areas of photosensitive material on the imageable article. Following exposure to curing radiation, the imaged film is then removed from the imageable article. The imageable article is then developed with a suitable developer to form a relief image. The imaged film may then be reused to make additional articles bearing the relief image.

Abstract: A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical drive mechanism couples the platen to the chamber housing. In operation, the mechanical drive mechanism separates the platen from the chamber housing for loading of the semiconductor substrate. In further operation, the mechanical drive mechanism causes the second sealing surface of the platen and the first sealing surface of the chamber housing to form a high pressure processing chamber around the semiconductor substrate.

Abstract: Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be applied to a work piece to mark it and removed from the work piece by peeling.

Abstract: There are disclosed a releasing sheet comprising a substrate and a releasing agent layer which is installed by coating the substrate with a releasing agent liquid containing 1,4-polybutadiene and an antioxidant, and irradiating the coated layer with ultraviolet ray so that the layer is cured; and also a releasing sheet comprising in turn a substrate, an undercoat layer which is formed thereon and is composed of an elastic body, and a releasing agent layer which is installed on the undercoat layer by coating the same with a releasing agent liquid containing 1,4-polybutadiene and an antioxidant, and irradiating the layers with ultraviolet ray so that the layers are cured. Being of non-silicone base, the releasing sheets are excellent in releasability from a tacky adhesive agent layer and adhesiveness to the substrate.

Abstract: Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be applied to a work piece to mark it and removed from the work piece by peeling.

Abstract: A method for removing a resist pattern having a resist pattern forming step of forming a resist pattern on a substrate using a chemically amplified positive resist composition and a removing step of removing the resist pattern from the substrate using a solvent, a composition prepared by dissolving (A) an alkali soluble resin having a hydroxyl group in the side chain, (B) a photo acid generator and (C) a compound represented by the following general formula (I): H2C?CH—O—R1—O—CH?CH2??(I) ?wherein R1 represents an alkylene group having 1 to 10 carbon atoms or the like, in an organic solvent being used as the chemically amplified positive resist composition, the method further having a heat treatment step of heat-treating the substrate on which the resist pattern is formed at a temperature of 150 to 400° C. between the resist pattern forming step and the removing step.

Abstract: An image transfer sheet is provided which comprises a support, a barrier layer, a dye sublimation ink layer and a polyester layer; wherein the image transfer sheet exhibits cold peel, warm peel and hot peel properties when transferred. A method for transferring an image to a receptor element using the image transfer sheet is also provided. More specifically, the invention relates to an image transfer sheet which can be applied to a receptor element, such as cotton or cotton/polyester blend fabrics or the like.

Abstract: The present invention relates to a thinner composition for removing resist used in TFT-LCD manufacturing processes, and more particularly to a thinner composition for removing resist that comprises: a) 0.1 to 5 wt % of an inorganic alkali compound; b) 0.1 to 5 wt % of an organic amine; c) 0.1 to 30 wt % of an organic solvent; d) 0.01 to 5 wt % of a surfactant comprising an ionic surfactant and a non-ionic surfactant in the weight ration of 1:5 to 1:25; and e) 60 to 99 wt % of water. The thinner composition for removing resist of the present invention has good efficiency of removing unwanted resist film constituents formed on the edge of the resist film or at the back of the substrate in TFT-LCD device and semiconductor device manufacturing processes. Also, it does not have the problem of equipment corrosion.

Abstract: There is disclosed a method of fabricating electrodes of plasma display panel using photo-peeling method, which can make the electrode highly precise in correspondence to high resolution. A method of fabricating an electrode of a plasma display panel using a photo peeling method according to an embodiment of the present invention includes the steps of forming a photo material layer on a substrate, the adhesive strength of the photo material layer decreases when exposed to light; exposing the photo material layer to light in correspondence to a desired pattern; forming an electrode material layer on the exposed photo material layer; forming a peeling material layer on the electrode material layer, the peeling material layer has higher adhesive strength than an exposure area of the photo material layer; and taking off the peeling material layer to pattern the electrode material layer.

Abstract: There are provided a thermal transfer film which can yield an image formed object possessing excellent fastness or resistance properties such as excellent abrasion resistance and lightfastness, has good sensitivity in transfer, and is free from blocking during storage in a roll form, a thermal transfer recording medium, and a method for image formation using them. The thermal transfer film comprises: a substrate; and one or a plurality of layers provided on one side of the substrate, the one or plurality of layers including at least a thermal transfer layer, the thermal transfer layer being located on the uppermost surface of the thermal transfer film, the thermal transfer layer comprising at least two polyester resins different from each other in number average molecular weigh.

Abstract: The present invention relates to a method of reading an image, which comprises exposing a color photosensitive material having at least three photosensitive layers containing blue-, green- and red-photosensitive silver halide emulsions, respectively, on a transparent support, processing the exposed color photosensitive material at a processing temperature of 50° C. or more to form a silver image, and substantially reading the silver image.

Abstract: A method for applying an image to a receptor element, which comprises the steps of (i) providing a transfer sheet comprising a support having a first surface and a second surface, and a coating capable of receiving an image on the first surface of the support, (ii) imaging the coating, (iii) dry peeling the coating from the support in the absence of wet release prior to hand ironing, (iv) positioning the dry peeled coating on a receptor element having valleys or pores, (v) positioning a non-stick sheet on the dry peeled coating which is positioned on the receptor element having valleys or pores, and (vi) heating the non-stick sheet to drive the dry peeled coating into the receptor element having valleys or pores.

Abstract: A multicolor image forming material comprising: an image receiving sheet comprising an image receiving layer; and at least five heat transfer sheets different in color each comprising a substrate, a light-heat conversion layer and an image forming layer, each of the heat transfer sheets being adapted to be superposed on the image receiving sheet with the image forming layer facing the image receiving layer and irradiated with laser light to transfer the irradiated area of the image forming layer to the image receiving layer to record an image on the image receiving sheet, wherein the area of the recording has a size of 515 mm by 728 mm or larger, and at least one of the heat transfer sheets comprises titanium oxide as a colorant in the image forming layer thereof.

Abstract: In a method of forming a patterned thin film, a first film to be patterned and a peelable film are sequentially formed on a base layer, and an undercut mask is then formed thereon. Then, using of the mask, the peelable film and the first film to be patterned are etched selectively to form a first patterned thin film. During the etching, a substance that forms the first film to be patterned deposits to form a deposition film on the peelable film. Then, a film to be patterned is formed over the entire surface. During the formation, a substance that forms the film to be patterned deposits to form another deposition film on the peelable film. The mask and the peelable film are then peeled off to remove the deposition films together.

Abstract: A transfer sheet comprises a support, and a transfer layer for receiving an ink, wherein the transfer layer is formed in the support by heating at a predetermined temperature and is separable from the support. The hot-melt adhesive particle comprises a first particle having a melting point more than the predetermined temperature and a second particle having a melting point not more than the predetermined temperature. The transfer layer may further comprise a film-forming resin component and a dye fixing agent. The hot-melt adhesive particle may comprise a polyamide-series particle. In particular, the average particle size of the first particle may be 3 to 100 mm. The transfer sheet is excellent in stability on delivery of a paper as well as can prevent the inside of the printer from staining.

Abstract: Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.

Abstract: There is disclosed a method of processing a light-sensitive material which comprises exposing a light-sensitive material having at least one light-sensitive layer on a support, and subjecting to development by a dipping system or a coating system, and then, peeling at least the light-sensitive layer off by bringing a peeling material into close contact with the light-sensitive material, wherein the peeling material is a material having a liquid-absorbing rate in which a liquid-absorption amount within 0.1 second after getting in contact with a liquid is 60% or more based on a liquid-absorption amount within 0.2 second after the same.

Abstract: The present invention relates to a method for image formation using an intermediate transfer recording medium. An object of the present invention is to provide an intermediate transfer recording medium and a method for image formation which can yield a thermally transferred image possessing excellent various fastness properties even under severe service conditions, can transfer a protective layer onto an image on the object without transfer failure in an accurate and simple manner, and, in addition, can yield a highly lightfast image which is not deteriorated upon exposure to ultraviolet light. The intermediate transfer recording medium comprises: a sheet substrate provided with a resin layer; and a transparent sheet provided with a receptive layer, the sheet substrate provided with the resin layer having been put on top of the transparent sheet provided with the receptive layer so that the transfer sheet faces the resin layer.

Abstract: The present invention provides a heat-developable photosensitive material having a substrate, an undercoat layer and photosensitive layer containing silver behenate in this order, wherein an adhesive roll having an adhesive force of at least 35 hPa is brought into contact with one face or both faces of the photosensitive material before the photosensitive layer is formed, and a method of producing the same.

Abstract: The invention relates to an article comprising ethoxylated alcohol wax intercalated in smectite clay. Embodiments of the invention comprise a sheet or an imaging member comprising an image layer and at least one layer comprising ethoxylated alcohol wax intercalated in smectite clay. The invention comprises a method of forming intercalated clay by providing smectite clay and combining the clay with ethoxylated alcohol wax and heating the mixture to above the softening point of the wax. The method further includes combining the intercalated clay with a polymer.