Abstract: The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist.

Abstract: The present disclosure provides a method for lithography patterning in accordance with some embodiments. The method includes forming a photoresist layer over a substrate, wherein the photoresist layer includes a metal-containing chemical; performing an exposing process to the photoresist layer; and performing a first developing process to the photoresist layer using a first developer, thereby forming a patterned resist layer, wherein the first developer includes a first solvent and a chemical additive to remove metal residuals generated from the metal-containing chemical.

Abstract: Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.

Abstract: A siloxane polymer comprising polysiloxane, silphenylene, isocyanuric acid, and polyether skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the siloxane polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency and light resistance.

Abstract: The present invention provides an imprint method of performing a forming process which includes supplying an imprint material on a substrate and then forming a pattern of the imprint material on the substrate by using a mold, the method comprising: dispensing, on the substrate, an adhesion material to bring the substrate and the imprint material into tight contact with each other; performing a first annealing process of heating and cooling the substrate on which the adhesion material has been dispensed; conveying the substrate to which the first annealing process has been performed; performing a second annealing process of heating and cooling the substrate which has been conveyed in the conveying; and performing the forming process on the substrate to which the second annealing process has been performed.

Abstract: The present disclosure illustrates a signal transmission device and a display device using the same. The signal transmission device includes a first flexible printed circuit board comprising a first circuit layer and a connection member, wherein the first circuit layer is electrically connected to a display module and a system; a second flexible printed circuit board disposed on the first flexible printed circuit board, and comprising a second circuit layer; a third flexible printed circuit board disposed on the first flexible printed circuit board, and comprising a third circuit layer; insulating layers disposed between the first, second and third flexible printed circuit boards, and comprising a plurality of through holes formed thereon in a vertical direction; and conductive pillars disposed in the through holes, respectively, wherein the second and third circuit layer are electrically connected to the system through the first circuit layer and the conductive pillars.

Abstract: A photosensitive epoxy resin composition for formation of an optical waveguide is provided, which contains an epoxy resin component and a photo-cationic polymerization initiator, wherein the epoxy resin component includes: (a) a solid bisphenol-A epoxy resin having a softening point of not higher than 105° C.; (b) a solid polyfunctional aliphatic epoxy resin having a softening point of not higher than 105° C.; and (c) a liquid long-chain bifunctional semi-aliphatic epoxy resin, wherein the epoxy resin (a) is present in a proportion of 60 to 70 wt. % based on the weight of the epoxy resin component, wherein the epoxy resin (b) is present in a proportion of 20 to 35 wt. % based on the weight of the epoxy resin component, wherein the epoxy resin (c) is present in a proportion of 5 to 10 wt. % based on the weight of the epoxy resin component.

Abstract: An image forming method is provided. The method includes the steps of (a) applying an ink to a recording medium to form an image and (b) applying a pressure to the recording medium to which the ink has been applied. The ink comprises water, an organic solvent, and a colorant. When the ink is formed into an ink film, a maximum value of logarithmic damping ratio of the ink film is 1.50 or less and a time elapsed until the logarithmic damping ratio reaches the maximum value is 3,800 seconds or less, when measured by a rigid-body pendulum test at 60° C.

Abstract: The present invention provides a modified repair solution, a preparation method thereof, and a method for repairing color resist. Through adding additives to a photoresist solvent, a ketone compound in the modified repair solution is adsorbed on a surface of a source/drain metal layer to chemically react with a molecular linker to form a transparent colloid. The colloid is colorless and transparent, insoluble in water and organic solvent, and has strong adsorption with aluminum. After the transparent colloid is formed, further formation of the colloid is prevented, and aluminum is prevented from contacting with alkaline modified repair chemical solution, thereby preventing aluminum from being corroded; moreover, the chemical solution can be prevented from remaining in a damaged portion of a protective layer, and reaction with aluminum at high temperatures in post processing can be prevented, thereby preventing a vertical disconnection.

Abstract: A radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

Abstract: An antimicrobial polymer coating composition comprising a polyhedral oligomeric silsesquioxane having a cage structure and having one or more reactive functional groups substituted on silicon atoms; a thermal initiator; and a photosensitizer, an antimicrobial polymer film comprising a cured product of the antimicrobial polymer coating composition, and an antimicrobial polymer film comprising: a substrate layer containing a polyhedral oligomeric silsesquioxane having a cage structure, in which one or more reactive functional groups are substituted; and a photosensitizes dispersed in the substrate layer, wherein the polymer film has oxygen permeability of 10 to 80 cc/m2 day.

Abstract: Provided is a photosensitive element including a support film, and a photosensitive layer provided on the support film and formed from a photosensitive resin composition, in which the surface roughness of the surface of the support film that is in contact with the photosensitive layer is 200 to 4,000 nm.

Abstract: A photosensitive resin composition contains (i) modified partially-saponified polyvinyl acetate having a functional group introduced into a side chain thereof, (ii) tertiary nitrogen atom-containing polyamide, (iii) a photopolymerizable unsaturated compound and (iv) a photopolymerization initiator, characterized in that the above (ii) tertiary nitrogen atom-containing polyamide contains 20 to 50% by mol of a structural unit obtained from cyclohexane-dicarboxylic acid and 50 to 95% by mol of an alicyclic structural unit in total, in relation to a total of an amount of an aminocarboxylic acid unit (including a case wherein lactam is a raw material), an amount of a dicarboxylic acid unit and an amount of a diamine unit in the polyamide molecule. There is also provided a relief printing original plate which is characterized in having, on a support, a photosensitive resin layer formed by using this photosensitive resin composition.

Abstract: There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposer 10 is provided with: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, and each of the wires 13 and each of the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a each having each of the wires 13 disposed therein; and a second organic insulating layer 22 laminated to the first organic insulating layer 21 in such a way as to embed the wires 13.

Abstract: A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R1-R4 may be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), R5 represents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of R5s in the same molecule may be the same or different.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.

Abstract: Provided is a substrate for semiconductor devices comprising: an insulating substrate; and a first metal board having a plurality of sides and formed on a first surface of the insulating substrate; wherein the first metal board includes: a corner portion positioned closer to a corner of a first side of the first metal board, for which a creepage distance between an edge of the first metal board and an edge of the insulating substrate reaches a smallest value for the first side; and a center portion positioned closer to a center of the first side than the corner portion, for which a creepage distance between the edge of the first metal board and the edge of the insulating substrate exceeds the smallest value; wherein a range of the center portion is larger than a range of the corner portion.

Abstract: A photosensitive resin printing plate precursor includes at least a substrate and a photosensitive resin layer, the photosensitive resin layer containing: (A) a partially saponified polyvinyl acetate, (B) a polyamide having basic nitrogen, (C) a compound having an ethylenic double bond, and (D) a photopolymerization initiator; the photosensitive resin layer including at least an underlayer and a printing surface layer; the substrate, the underlayer, and the printing surface layer being included in this order; and the photosensitive resin layer containing, as the partially saponified polyvinyl acetate (A), those (A1) having an average polymerization degree of 1,200 to 2,600 in the printing surface layer and those (A2) having an average polymerization degree of 400 to 800 in the underlayer.

Abstract: A photosensitive composition having excellent sensitivity, an insulating film formed using the composition, a color filter formed using the composition, a display device provided with the insulating film or color filter, and a compound suitable for incorporation as a photopolymerization initiator into the composition. This photosensitive composition includes a photopolymerizable compound and a photopolymerization initiator. The photopolymerization initiator contains a compound represented by formula (1) below in which R1 is a hydrogen atom, a nitro group, or a monovalent organic group; R2 and R3 are each an optionally substituted linear alkyl group, an optionally substituted cyclic organic group, or a hydrogen atom, and R2 and R3 may be bonded to one another to form a ring; R4 is a monovalent organic group; R5 is a hydrogen atom, an optionally substituted C1-11 alkyl group, or an optionally substituted aryl group; n is an integer from 0 to 4; and m is 0 or 1.

Abstract: A curable resin obtained by reacting a polybasic anhydride with a reaction product of an epoxy resin with a phenol compound having an alcoholic hydroxyl group and an unsaturated monobasic acid, wherein an epoxy resin having a softening point of 93° C. or higher is used as the epoxy resin.

Abstract: In one example, a battery includes a negative terminal, a positive terminal, an electrolyte contained between the negative terminal and the positive terminal, and a hydrogel layer positioned between and physically separating the negative terminal and the positive terminal.

Abstract: Using a curable resin composition including the following (A) to (E) configurations, which is excellent in adhesiveness to nails and curing reactivity, and a cured product of which has a certain flexibility, makes it possible to form a coating aiming for protection, decoration, and the like of nails with favorable followability to the nails: (A) 100 parts by mass of a polymer having a urethane structure in molecule and containing acrylic functional groups at both terminals of a molecular chain, (B) 1 to 35 parts by mass of a trifunctional acrylic functional compound of a specific structure, (C) 15 to 75 parts by mass of a compound containing an acrylic functional group having an aliphatic ring structure, (D) 1 to 35 parts by mass of a compound containing an acrylic functional group having an aliphatic chain structure, and (E) 0.5 to 13.5 parts by mass of a photopolymerization initiator.

Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

Abstract: An electrically-conductive composition essentially has (a) an electrically-conductive material consisting essentially of silver nanoparticles that have a d50 of less than or equal to 60 ?m and a d90 of less than or equal to 500 ?m; (b) particles having a Young's modulus that is different from the Young's modulus of the (a) electrically-conductive material by at least 10%, which (b) particles have a d50 of 500 nm to 300 ?m and a polydispersity coefficient of less than or equal to 3; (c) a binder material that is non-electrically-conductive; and (d) a solvent medium in an amount of less than or equal to 90 weight %, based on the total composition weight, which solvent medium is at least 50 weight % water. The weight ratio of the (b) particles to the (a) electrically-conductive material is at least 0.01:1 and up to and including 7:1.

Abstract: An electrically-conductive composition can be used with piezoelectric materials to enhance the piezoelectric effects. This composition essentially has (a) an electrically-conductive material; (b) particles having a Young's modulus that is different from the Young's modulus of the (a) electrically-conductive material by at least 10%, and which (b) particles have a d50 of at least 500 nm and up to and including 500 ?m and a polydispersity coefficient that is less than or equal to 3; and (c) a non-electrically-conductive binder material. The weight ratio of the (b) particles to the (a) electrically-conductive material is at least 0.01:1 and up to and including 10:1. When the composition is coated and dried on an insulating substrate, a resulting dried composition exhibits a resistivity of less than 10,000 ohm-cm.

Abstract: A radiation-sensitive resin composition comprising a binder resin (A), quinone diazide-based photoacid generator (B), (meth)acrylate compound (C), and photopolymerization initiator (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition which can give a resin film which exhibits a high adhesion to a substrate and is excellent in transparency, photosensitivity, and chemical resistance.

Abstract: The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.

Abstract: An optical fiber includes an optical transmission medium having a core and a cladding, a primary resin layer disposed in contact with the optical transmission medium to coat the optical transmission medium, and a secondary resin layer coating the primary resin layer, wherein a Young's modulus of the primary resin layer is 0.5 MPa or less at 23° C., and the primary resin layer comprises a cured product of an ultraviolet light curable resin composition containing a urethane (meth)acrylate oligomer, a monomer, a photopolymerization initiator and a ?-diketone compound, and tin.

Abstract: A chemical amplification resist composition according to the present invention includes (A) a compound including a triarylsulfonium cation having one or more fluorine atoms and capable of generating an acid with a volume of 240 ?3 or higher by irradiation of active rays or radiation; and (B) a compound including a phenolic hydroxyl group.

Abstract: The present invention relates to a polarizing plate including: a polarizer; a first protective layer formed on at least one surface of the polarizer; and a second protective layer formed on a surface opposite to a surface adjacent to a polarizer of the first protective layer, in which the first protective layer is a cured product of a radical curable composition, and the second protective layer is a cured product of a cationic curable composition, a manufacturing method thereof, and an image display device including the same.

Abstract: A chemically amplified resist material comprises: a polymer component that is capable of being made soluble or insoluble in a developer solution by an action of an acid; and a generative component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure. The polymer component comprises: a first polymer comprising a first structural unit that comprises a fluorine atom and does not comprise a salt structure; or a second polymer comprising a second structural unit that comprises a fluorine atom and a salt structure. The generative component comprises: a radiation-sensitive acid-and-sensitizer generating agent; any two of the radiation-sensitive acid-and-sensitizer generating agent, a radiation-sensitive sensitizer generating agent and a radiation-sensitive acid generating agent; or the radiation-sensitive acid-and-sensitizer generating agent, the radiation-sensitive sensitizer generating agent and the radiation-sensitive acid generating agent.

Abstract: A process of producing electrically conductive pathways within additively manufactured parts and similar parts made by plastic extrusion nozzles. The process allows for a three-dimensional part having both conductive and non-conductive portions and allows for such parts to be manufactured in a single production step.

Abstract: A coil component includes a body in which a coil portion is embedded. The coil portion includes a support member; first insulators formed on first and second main surfaces of the support member, respectively, and having an opening having a planar coil shape; coils filling the openings; and second insulators covering the coils.

Abstract: A resin composition for forming an insulating film including a polymer having a structural unit of the following formula (1a) and a structural unit of the following formula (1b); and an organic solvent; wherein T0 is a divalent organic group containing at least one arylene group in which at least one hydrogen atom is substituted with an amino group; and T1 is a divalent organic group containing at least one arylene group having at least one substituent, wherein the substituent is a substituent of the following formula (2); and wherein Z is a divalent, aliphatic, aromatic, or alicyclic group optionally having a substituent.

Abstract: A polyalkylether photoinitiator of the general formula I, R1(A1)r-(R2(A2)m-O)o—(R3(A3)n-O)p—R4(A4)s I, wherein R1, R2, R3, R4 and m, n, o, p, r and s are as defined herein and A1, A2, A3 and A4 are identical or different photoinitiator moieties.

Abstract: An optical film is provided containing cellulose acylate and at least one type of a compound denoted by the following Formula (I). R1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, a heterocyclic group, an acyl group, an alkoxy carbonyl group, a carbamoyl group, an alkyl sulfonyl group, or an aryl sulfonyl group, R2 represents an alkyl group or an aryl group, L represents a single bond or a bivalent or more connecting group, and n represents 1 when L is a single bond and n represents an integer of the valence of L?1 when L is a bivalent or more connecting group. s and t each independently represent 1 to 3, and X represents —O— or —N(Ra)-. Ra represents a hydrogen atom or an alkyl group.

Abstract: Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B.

Abstract: A pattern is formed by coating a resist composition comprising (A) a PPD inhibitor, (B) a polymer adapted to change its solubility in an organic solvent under the action of acid, (C) a photoacid generator, and (D) an organic solvent onto a substrate, baking, exposing the resist film, PEB, and developing in an organic solvent developer. The resist composition ensures to form a pattern in a consistent manner while inhibiting any CD shrinkage and pattern profile change due to a delay from PEB to development.

Abstract: A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.

Abstract: The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (—COOH) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator.

Abstract: A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.

Abstract: A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s?1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.

Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.

Abstract: A polyalkylene carbonate resin composition with interpenetrating network structure includes an aliphatic polycarbonate obtained through a reaction of carbon dioxide with at least one epoxide compound selected from the group consisting of (C2-C10)alkylene oxide substituted or unsubstituted with halogen or alkoxy, (C4-C20)cycloalkylene oxide substituted or unsubstituted with halogen or alkoxy, and (C8-C20)styrene oxide substituted or unsubstituted with halogen, alkoxy, alkyl or aryl, at least one compound selected from a polyol compound, an epoxy compound and an acryl compound, and a curing agent for polymerization or networking.

Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

Abstract: Provided are a rubber composition having a good balance of improved fuel efficiency, abrasion resistance, and wet grip performance while providing good processability, and a pneumatic tire having a tread manufactured from the rubber composition. A rubber composition comprising: a copolymer synthesized by copolymerization of a conjugated diene monomer and an unsaturated acyclic monoester represented by the formula (1) below; and carbon black and/or silica, wherein R1 represents hydrogen or a C1-C30 hydrocarbon group, and R2 represents hydrogen or a C1-C30 hydrocarbon group.

Abstract: Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.

Abstract: A method for manufacturing an artificial elastic implant for restorative and reconstructive surgery includes two casting steps performed in a casting mold. The mold has at least a cover that is optically and UV transparent. In a first step, a first layer of a first photo-curable material or of a second photo-curable material is cast while forming a meniscus. Using one of two photo masks, the mold is irradiated with UV light to cure the first layer. In a second step, a second layer of either the first or the second photo-curable material is cast onto the cured first layer while forming a meniscus. After irradiating the mold again with ultraviolet light, unhardened photo-curable material is removed from the product by dissolving in a suitable solvent. After additionally irradiating the product with UV light, the product is soaked, separated from the mold, placed in isopropyl alcohol and then vacuum dried.

Abstract: Provided are an aliphatic polycarbonate-polyurethane composition and an aliphatic polycarbonate-polyurethane polymer using the same.

Abstract: A negative pattern is formed by coating a resist composition comprising a polymer comprising recurring units having a carboxyl and/or hydroxyl group optionally substituted with an acid labile group, an oxirane or oxetane compound having a hydrophilic group, and an acid generator onto a substrate, prebaking, exposing, baking, and developing in an organic solvent so that the unexposed region of resist film is dissolved away and the exposed region of resist film is not dissolved. The resist composition exhibits a high sensitivity and high dissolution contrast during organic solvent development and forms a fine hole or trench pattern via positive/negative reversal.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for integrated circuit package assemblies including a glass solder mask layer and/or bridge. In one embodiment, an apparatus includes one or more build-up layers having electrical routing features and a solder mask layer composed of a glass material, the solder mask layer being coupled with the one or more build-up layers and having openings disposed in the solder mask layer to allow coupling of package-level interconnect structures with the electrical routing features through the one or more openings. Other embodiments may be described and/or claimed.