Abstract: Ligand-capped inorganic particles, dispersions of the ligand-capped inorganic particles, and films composed of the ligand-capped inorganic particles are provided. Also provided are methods of patterning the films and electronic, photonic, and optoelectronic devices that incorporate the films. The ligands include bifunctional ligands and two-component ligand systems that include a photosensitive group, cation, or molecule.

Abstract: A photosensitive resin composition including an ethylenically unsaturated compound, a resin having a polarity that increases by the action of an acid, and metal atoms, in which a total content of the metal atoms is from 1 ppt to 30 ppb with respect to a total mass of the photosensitive resin composition, and a content of the ethylenically unsaturated compound is from 0.0001% by mass to 1% by mass with respect to the total mass of the photosensitive resin composition, and a method for producing the same; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each of which uses the photosensitive resin composition.

Abstract: Organic coating compositions, particularly antireflective coating compositions for use with an overcoated photoresist, are provided that in a first aspect comprise a crosslinker component that comprises a structure of the following Formula (I):

Abstract: A photoresist composition includes a conjugated resist additive, a photoactive compound, and a polymer resin. The conjugated resist additive is one or more selected from the group consisting of a polyacetylene, a polythiophene, a polyphenylenevinylene, a polyfluorene, a polypryrrole, a polyphenylene, and a polyaniline. The polyacetylene, polythiophene, polyphenylenevinylene, polyfluorene, polypryrrole, the polyphenylene, and polyaniline includes a substituent selected from the group consisting of an alkyl group, an ether group, an ester group, an alkene group, an aromatic group, an anthracene group, an alcohol group, an amine group, a carboxylic acid group, and an amide group. Another photoresist composition includes a polymer resin having a conjugated moiety and a photoactive compound. The conjugated moiety is one or more selected from the group consisting of a polyacetylene, a polythiophene, a polyphenylenevinylene, a polyfluorene, a polypryrrole, a polyphenylene, and a polyaniline.

Abstract: A sulfonium salt having formula (1) is novel. A chemically amplified resist composition comprising the sulfonium salt as a PAG has advantages including solvent solubility and improved lithography properties such as EL and LWR when processed by photolithography using high-energy radiation such as KrF or ArF excimer laser, EB or EUV.

Abstract: A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.

Abstract: The present disclosure provides a block copolymer composition for a flexographic plate comprising a block copolymer A represented by the following general formula (A) and a block copolymer B represented by the following general formula (B), wherein: a content of aromatic vinyl monomer units relative to all monomer units constituting polymer components of the block copolymer composition for the flexographic plate is 18% to 70% by mass; a type A hardness is 25 to 65; and an anisotropic index is 2.0 or less.

Abstract: There is provided a production method for a resist composition purified product, which includes a step (i) of filtering a resist composition with a filter having a porous structure in which adjacent spherical cells are connected to each other. The filter includes a porous membrane containing at least one resin selected from the group consisting of polyimide and polyamide imide. The resist composition contains a base material component (A) that exhibits changed solubility in a developing solution under action of acid, an onium salt, and an organic solvent component (S), where the content of the organic solvent component (S) is 97% by mass or more.

Abstract: A photosensitive resin composition contains polymer (A) having an acid dissociative group, photoacid generator (B), and solvent (C), the solvent (C) containing 80 to 95% by mass of propylene glycol monomethyl ether acetate (C1) and 5 to 18% by mass of 3-methoxybutyl acetate (C2), a content ratio of other solvent (C3) in the solvent (C) being 0 to 10% by mass, and a content ratio of the solvent (C) contained in the photosensitive resin composition being less than 60% by mass.

Abstract: A resist composition is provided comprising (A) a sulfurane or selenurane compound, (B) an organic solvent, and (C) a base polymer comprising repeat units having an acid labile group. By virtue of the acid diffusion inhibitory function of the compound, the resist composition forms a resist pattern having improved LWR and CDU when it is processed by lithography using high-energy radiation.

Abstract: A resist composition comprising an ammonium salt and fluorine-containing polymer comprising repeat units AU having ammonium salt structure of a carboxylic acid having an iodized or brominated aromatic ring and repeat units FU-1 having a trifluoromethylalcohol group and/or repeat units FU-2 having a fluorinated hydrocarbyl group offers a high sensitivity and is unsusceptible to nano-bridging, pattern collapse or residue formation, independent of whether it is of positive or negative tone.

Abstract: A chemically amplified negative resist composition comprising (A) a sulfurane or selenurane compound having formula (A1) wherein M is sulfur or selenium and (B) a base polymer containing a polymer comprising repeat units having formula (B1) is provided. The resist composition exhibits a high resolution during pattern formation and forms a pattern with minimal LER or LWR.

Abstract: An insulation structure includes: a first resin layer including first fillers; a second resin layer on the first resin layer and including second fillers; and a third resin layer on the second resin layer and including third fillers. A diameter of each of the first fillers may be more than about 200 nm and equal to or less than about 500 nm. A diameter of each of the second fillers may be more than about 10 nm and equal to or less than about 200 nm. A diameter of each of the third fillers may be equal to or less than about 10 nm. An arithmetic average roughness (Ra) and a ten point average roughness (Rz) of a surface of the insulation structure may be equal to or less than about 30 nm and equal to or less than about 100 nm, respectively.

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a solubility in an alkali developer that increases through decomposition by an action of an acid and (B) a compound that generates an acid upon irradiation with actinic rays or radiation and is represented by a specific structure; an actinic ray-sensitive or radiation-sensitive film using the composition; a pattern forming method; a method for manufacturing an electronic device; and a compound.

Abstract: An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes a chemical formula of MaXbLc, where M is a metal, X is a multidentate aromatic ligand that includes a pyrrole-like nitrogen and a pyridine-like nitrogen, L is an extreme ultraviolet (EUV) cleavable ligand, a is between 1 and 2, b is equal to or greater than 1, and c is equal to or greater than 1.

Abstract: Photoacid generators comprising a moiety of formula (1): wherein: Ar1 is a substituted or unsubstituted aryl group; R1 is an alkyl or aryl group, each of which may be substituted or unsubstituted, wherein Ar1 and R1 are optionally connected together by a single bond or a divalent linking group to form a ring; Y is a single bond or a divalent group; and * is the point of attachment of the moiety to another atom of the photoacid generator. The photoacid generator compounds find particular use in photoresist compositions that can be used to form lithographic patterns for the formation of electronic devices.

Abstract: Provided are a novel sulfonium salt having high photosensitivity to g-rays or h-rays; a novel photoacid generator containing a sulfonium salt that has high photosensitivity to g-rays or h-rays, has high solubility in solvents and cationically polymerizable compounds such as epoxy compounds, and has an excellent storage stability in compositions containing the cationically polymerizable compounds; and the like. The present invention relates to a sulfonium salt represented by the formula (1), a photoacid generator containing the sulfonium salt, and the like.

Abstract: An on-press development type lithographic printing plate precursor has an aluminum support and an image-recording layer on the aluminum support, in which the image-recording layer contains an infrared-absorbing polymethine colorant having HOMO of ?5.2 eV or less, a polymerization initiator, and a polymerizable compound having 7 or more polymerizable functional groups and contains or does not contain a polymer having a molecular weight 10,000 or more. In a case where the image-recording layer contains the polymer having a molecular weight of 10,000 or more, a ratio Wp/Wm of a content Wp of the polymer having a molecular weight of 10,000 or more to a content Wm of the polymerizable compound having 7 or more polymerizable functional groups is 1.00 or less.

Abstract: The present invention provides a coating-type composition for forming an organic film containing: a polymer having a structure shown by the following general formula (1) as a partial structure; and an organic solvent, where in the formula (1), ring structures Ar1 and Ar2 represent a benzene ring or a naphthalene ring optionally having a substituent, and W1 represents an aryl group having 6 to 30 carbon atoms and optionally having a substituent. This provides a coating-type composition for forming an organic film that can form an organic film having high pattern-curving resistance and high dry-etching resistance, the composition being excellent in solvent solubility and having a low generation of defects.

Abstract: A method for encapsulating an organic electronic element and an organic electronic device is provided. The method for encapsulating the organic electronic element is capable of effectively blocking moisture or oxygen introduced from the outside to an organic electronic device, is excellent in flatness of an encapsulating layer to have excellent endurance reliability, and increases efficiency of an encapsulating process.

Abstract: A resist composition containing: (A) a resin containing a repeating unit having an acid-labile group; (B) a photo-acid generator shown by a general formula (B-1); and (C) a solvent, where W1 represents a cyclic divalent hydrocarbon group having 4 to 12 carbon atoms and containing a heteroatom; W2 represents a cyclic monovalent hydrocarbon group having 4 to 14 carbon atoms and not containing a heteroatom; Rf represents a divalent organic group shown by the following general formula; and M+ represents an onium cation. This provides a resist composition and a patterning process that uses the resist composition that show a particularly favorable mask dimension dependency (mask error factor: MEF), LWR, and critical dimension uniformity (CDU) particularly in photolithography where a high-energy beam such as an ArF excimer laser beam is used as a light source.

Abstract: Although it has been difficult to stabilize a viscosity and a thixo ratio in a composition containing a (meth)acrylate compound having a polyisobutylene skeleton, the present invention can stabilize the viscosity and the thixo ratio in a photocurable composition containing a (meth)acrylate compound having a polyisobutylene skeleton. A photocurable composition including a component (A) and a component (B) such that the component (B) is contained in an amount of 0.1 to 15 parts by mass relative to 100 parts by mass of the component (A): component (A): a (meth)acrylate compound having a polyisobutylene skeleton; and component (B): a (meth)acrylamide compound.

Abstract: The present invention provides a printing plate precursor including a layer which includes a polymer and is provided on a printing surface side of an aluminum support, and a layer which includes particles and is provided on a side opposite to the printing surface side, in which a modulus of elasticity of the particles is 0.1 GPa or more, and in a case where a Bekk smoothness of an outermost layer surface on the side opposite to the printing surface side is denoted by b second, a specific expression (1) is satisfied; a printing plate precursor laminate; a method for making a printing plate; and a printing method.

Abstract: A carboxylate represented by formula (I), a quencher and a resist composition including the same: wherein R1, R2 and R3 each represent a halogen atom, an alkyl fluoride group or a hydrocarbon group which may have a substituent, —CH2— included in the hydrocarbon group may be replaced by —O—, —CO—, —S— or —SO2—, m1 represents an integer of 0 to 5, m2 represents an integer of 0 to 4, m3 represents an integer of 0 to 3, and X1 represents a single bond, —CH2—, —O—, —S—, —CO—, —SO— or —SO2—.

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition including, as a solvent, ethyl lactate in which one of an L isomer or a D isomer of optical isomers has a ratio of 1% or more higher than that of the other, an actinic ray-sensitive or radiation-sensitive film formed using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, a photo mask, and a method for producing an electronic device.

Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having an excellent pattern line width roughness (LWR). In addition, another object of the present invention is to provide: a resist film, a pattern forming method, and a method for manufacturing an electronic device, each of which uses the actinic ray-sensitive or radiation-sensitive resin composition.

Abstract: A polypeptide, a photoresist composition including the polypeptide, a photoresist including the polypeptide, and a method of forming patterns using the photoresist composition.

Abstract: A resist underlayer film-forming composition including a novolac resin having a structural group (C) formed by reaction between an aromatic ring of an aromatic compound (A) having at least two amino groups and three C6-40 aromatic rings and a vinyl group of an aromatic vinyl compound (B). The structural group (C) may be a group of the following Formula (1): [wherein R1 is a divalent group containing at least two amino groups and at least three C6-40 aromatic rings]. R1 may be a divalent organic group prepared by removal of two hydrogen atoms from aromatic rings of a compound of the following Formula (2): R1 may be a divalent organic group prepared by removal of two hydrogen atoms from aromatic rings of N,N?-diphenyl-1,4-phenylenediamine.

Abstract: Embodiments of the present disclosure generally relate to a multilayer stack used as a mask in extreme ultraviolet (EUV) lithography and methods for forming a multilayer stack. In one embodiment, the method includes forming a carbon layer over a film stack, forming a metal rich oxide layer on the carbon layer by a physical vapor deposition (PVD) process, forming a metal oxide photoresist layer on the metal rich oxide layer, and patterning the metal oxide photoresist layer. The metal oxide photoresist layer is different from the metal rich oxide layer and is formed by a process different from the PVD process. The metal rich oxide layer formed by the PVD process improves adhesion of the metal oxide photoresist layer and increases the secondary electrons during EUV lithography, which leads to decreased EUV dose energies.

Abstract: The present invention relates to novel positive tone photoresist formulations comprising using crosslinkable siloxane polymers. The siloxane polymers used in the positive tone photoresist formulations are crosslinkable and comprise a first repeating unit, which contains at least one maleimide group, and a second repeating unit, which does not contain a maleimide group. The present invention further provides a manufacturing method for a microelectronic structure using a positive tone photoresist formulation according to the present invention and to an electronic device comprising a microelectronic structure, which is obtained or obtainable by said manufacturing method.

Abstract: The present invention provides a polybenzoxazole precursor, which comprises a structure of formula (I): wherein the definitions of Y, Z, R1, i, j, and V are provided herein. By means of the polybenzoxazole precursor, the resin composition of the present invention is able to form a film with high frequency characteristics and high contrast.

Abstract: A photoresist composition includes a conjugated resist additive, a photoactive compound, and a polymer resin. The conjugated resist additive is one or more selected from the group consisting of a polyacetylene, a polythiophene, a polyphenylenevinylene, a polyfluorene, a polypryrrole, a polyphenylene, and a polyaniline. The polyacetylene, polythiophene, polyphenylenevinylene, polyfluorene, polypryrrole, the polyphenylene, and polyaniline includes a substituent selected from the group consisting of an alkyl group, an ether group, an ester group, an alkene group, an aromatic group, an anthracene group, an alcohol group, an amine group, a carboxylic acid group, and an amide group. Another photoresist composition includes a polymer resin having a conjugated moiety and a photoactive compound. The conjugated moiety is one or more selected from the group consisting of a polyacetylene, a polythiophene, a polyphenylenevinylene, a polyfluorene, a polypryrrole, a polyphenylene, and a polyaniline.

Abstract: A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin and an ultraviolet absorber.

Abstract: The sulfonium salt has high photosensitivity to i-rays and high compatibility with cationically polymerizable compounds such as epoxy compounds, and is excellent storage stability in formulations containing such compounds. The sulfonium salt is represented by general formula (1). In formula (1), R represents an alkyl group or an aryl group; substituents, R1 to R5, each independently represent an alkyl group, a hydroxy group, an alkoxy group, an aryl group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom; R6 to R9 each independently represent an alkyl group, an aryl group, or a hydrogen atom; m1 to m5 each represent the number of occurrences of each of R1 to R5, m1 and m4 represent an integer of 0 to 3, m2 and m5 represent an integer of 0 to 4, m3 represents an integer of 0 to 5, and X? represents a monovalent polyatomic anion.

Abstract: Embodiments of the present disclosure relate to a cleaning device and a method of cleaning a nozzle, and relate to the technical field of semiconductor manufacturing. The cleaning device includes: a body configured to surround the nozzle, where the body includes a body inlet and a body outlet; and at least one row of first runners configured to introduce a cleaning agent, where the first runners are arranged along an outer circumference of the body, an outlet of each of the first runners communicates with the body, and a cleaning position is formed at the outlet of the first runner.

Abstract: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.

Abstract: New Te-salt compounds, including photoactive tellurium compounds useful for Extreme Ultraviolet Lithography.

Abstract: [Object] To provide a positive type photosensitive composition capable of forming a cured film having high transparency [Means] The present invention provides a positive type photosensitive siloxane composition comprising: a polysiloxane, a diazonaphthoquinone derivative, an additive having a >N—C(?O)— or >N—C(?S)— structure and the capability of interacting with the polysiloxane, and a solvent. The polysiloxane and the additive interact with each other before exposure, but they lose the interaction after exposure.

Abstract: A single layer process is utilized to reduce swing effect interference and reflection during imaging of a photoresist. An anti-reflective additive is added to a photoresist, wherein the anti-reflective additive has a dye portion and a reactive portion. Upon dispensing the reactive portion will react with underlying structures to form an anti-reflective coating between the underlying structure and a remainder of the photoresist. During imaging, the anti-reflective coating will either absorb the energy, preventing it from being reflected, or else modify the optical path of reflection, thereby helping to reduce interference caused by the reflected energy.

Abstract: A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.

Abstract: Described are a salt and a resist composition capable of producing a resist pattern with satisfactory line edge roughness (LER). The salt is represented by formula (I): In formula (I), R1, R2, R3, R4 and R5 each independently represent a halogen atom or a perfluoroalkyl group having 1 to 6 carbon atoms, R6, R7 and R8 each independently represent a halogen atom, a hydroxy group, a fluorinated alkyl group having 1 to 6 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and —CH2— included in the alkyl group may be replaced by —O— or —CO—, m5 represents an integer of 1 to 5, m6 represents an integer of 0 to 3, m7 represents an integer of 0 to 3, m8 represents an integer of 0 to 4, and AI? represents an organic anion.

Abstract: Methods and materials for making a semiconductor device are described. The method includes forming a photoresist over a substrate. The photoresist includes an acid-labile group (ALG) connected to a polar unit. The method also includes exposing the photoresist to a radiation beam, baking the photoresist and performing a developing process to the photoresist.

Abstract: A display device includes a display panel, a cover member disposed on the display panel, and an adhesive layer disposed between the display panel and the cover member. The adhesive layer has a first surface facing the cover member and a second surface facing the display panel, and includes a first area and a second area disposed at positions different from each other in a first direction from the first surface toward the second surface. A modulus of the first area is different from a modulus of the second area.

Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.

Abstract: An ink composition is provided. The composition includes a binder material and at least one narrow band emission phosphor being uniformly dispersed throughout the composition, wherein the narrow band emission phosphor has a D50 particle size from about 0.1 ?m to about 15 ?m and is selected from the group consisting of a green-emitting U6+-containing phosphor, a green-emitting Mn2+-containing phosphor, a red-emitting phosphor based on complex fluoride materials activated by Mn4+, and a mixture thereof. A device is also provided.

Abstract: The present invention relates to the use of halogen-free sulphonic acid esters and/or sulphinic acid esters as flame retardant and/or flame retardant synergists in plastics. The invention furthermore relates to the use of said compounds as radical generators in plastics, particularly in order to increase the molecular weight of the plastics, to branch and/or cross-link the plastics, to reduce the molecular weight of the plastics, to influence the molecular weight distribution of the plastics and to graft unsaturated monomers to the plastics. The present invention furthermore relates to the use of flame-retardant plastic compositions in the electrical or electronics industry, construction industry, transport industry, preferably automobiles, aircraft, trains and ships, for medical applications, for household appliances, vehicle parts, consumer products, packaging, furniture and textiles.

Abstract: The present invention provides a printing plate precursor including a layer which includes particles and is provided at a printing surface side of an aluminum support, in which a modulus of elasticity of the particles is 0.1 GPa or more, and in a case where a Bekk smoothness of an outermost layer surface at the printing surface side is denoted by A second, a specific expression (1) is satisfied; a printing plate precursor laminate; a method for making a printing plate; and a printing method.

Abstract: A radiation-sensitive resin composition includes: a resin including a structure unit having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent. The radiation-sensitive acid generator includes at least two of compounds represented by formulae (1) to (3), provided that the compound represented by formula (1) and the compound represented by formula (3) within the scope of the compound represented by formula (2) are excluded. In the formulae (1) to (3), R1, R2 and R3 are each independently a group having a cyclic structure; X11, X12, X21, X22, X31 and X32 are each independently a hydrogen atom, a fluorine atom, or a fluorinated hydrocarbon group, provided that both X11 and X12, both X21 and X22, and both X31 and X32 are not a hydrogen atom, respectively.

Abstract: A resist composition including: a compound including an anion moiety and a cation moiety and represented by the following Formula (bd1); and an organic solvent having a hydroxyl group in which Rx1 to Rx4 each represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; Ry1 and Ry2 each independently represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; Rz1 to Rz4 each represent a hydrocarbon group or a hydrogen atom, or may be bonded to each other to form a ring structure; at least one of Rx1 to Rx4, Ry1 and Ry2 and Rz1 to Rz4 has an anionic group; and Mm+ represents an organic cation)