Radiation Sensitive Composition Or Product Or Process Of Making Patents (Class 430/270.1)
  • Patent number: 11124829
    Abstract: An example of a flow cell includes a substrate; a first primer set attached to a first region on the substrate, the first primer set including an un-cleavable first primer and a cleavable second primer; and a second primer set attached to a second region on the substrate, the second primer set including a cleavable first primer and an un-cleavable second primer.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: September 21, 2021
    Assignees: Illumina, Inc., Illumina Cambridge Limited
    Inventors: Jeffrey S. Fisher, Brian D. Mather, Maria Candelaria Rogert Bacigalupo, Justin Fullerton, Ludovic Vincent, Lewis J. Kraft, Sahngki Hong, Boyan Boyanov, M. Shane Bowen, Sang Park, Wayne N. George, Andrew A. Brown, Dajun Yuan
  • Patent number: 11123920
    Abstract: A 3D printing apparatus with a radiation source, a workbench, and a liquid tank, wherein a workbench for supporting a three-dimensional object being constructed, and a liquid tank for containing a polymerizable liquid for constructing a three-dimensional object. The apparatus also includes a cover plate which is located in the liquid tank or on the top of the liquid tank; the radiation source irradiates from above the cover plate. The cover plate is an element transparent to the radiation source; and the lower surface of the cover plate is a covering surface which remains in contact with the polymerizable liquid during the printing process.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: September 21, 2021
    Assignee: FUJIAN INSTITUTE OF RESEARCH ON THE STRUCTURE OF MATTER, CHINESE ACADEMY OF SCIENCE
    Inventors: Wenxiong Lin, Huagang Liu, Jianhong Huang, Zhi Zhang, Zixiong Lin, Kaiming Ruan, Yan Ge, Haizhou Huang, Hongchun Wu, Jinhui Li, Wen Weng, Jinming Chen
  • Patent number: 11127592
    Abstract: A method includes forming a photoresist layer over a substrate, where the photoresist layer includes a polymer blended with a photo-acid generator (PAG), exposing the photoresist layer to a radiation source, and developing the photoresist layer, resulting in a patterned photoresist layer. The PAG is bonded to one or more polarity-enhancing group (PEG), which is configured to increase a dipole moment of the PAG. The exposing may separate the PAG into a cation and an anion, such that a PEG bonded to the cation and a PEG bonded to the anion each increases a polarity of the cation and the anion, respectively.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: September 21, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ya-Ching Chang, Ching-Yu Chang, Chin-Hsiang Lin, Yen-Hao Chen
  • Patent number: 11126084
    Abstract: A composition for resist underlayer film formation contains a compound having a group represented by formula (1), and a solvent. R1 represents an organic group having 2 to 10 carbon atoms and having a valency of (m+n), wherein the carbon atoms include two carbon atoms that are adjacent to each other, with a hydroxy group or an alkoxy group bonding to one of the two carbon atoms, and with a hydrogen atom bonding to another of the two carbon atoms; L1 represents an ethynediyl group or a substituted or unsubstituted ethenediyl group; R2 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; n is an integer of 1 to 3; * denotes a bonding site to a moiety other than the group represented by the formula (1) in the compound; and m is an integer of 1 to 3.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: September 21, 2021
    Assignee: JSR CORPORATION
    Inventors: Naoya Nosaka, Goji Wakamatsu, Tsubasa Abe, Yuushi Matsumura, Yoshio Takimoto, Shin-ya Nakafuji, Kazunori Sakai
  • Patent number: 11112698
    Abstract: The present disclosure provides an embodiment of a method for lithography patterning. The method includes coating a photoresist layer over a substrate, wherein the photoresist layer includes a first polymer, and a first photo-acid generator (PAG), and a chemical additive mixed in a solvent; performing an exposing process to the photoresist layer; and performing a developing process to the photoresist layer to form a patterned photoresist layer. The chemical additive has a non-uniform distribution in the photoresist layer.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: September 7, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang Lilin, Ching-Yu Chang, Chin-Hsiang Lin
  • Patent number: 11114309
    Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: September 7, 2021
    Assignee: Corning Incorporated
    Inventors: Robert Alan Bellman, Shiwen Liu
  • Patent number: 11110653
    Abstract: In a three-dimensional printing method example, a polymeric or polymeric composite build material is applied. A fusing agent is applied on at least a portion of the build material. The fusing agent includes an aqueous or non-aqueous vehicle and a plasmonic resonance absorber having absorption at wavelengths ranging from 800 nm to 4000 nm and having transparency at wavelengths ranging from 400 nm to 780 nm dispersed in the aqueous or non-aqueous vehicle. The build material is exposed to electromagnetic radiation, thereby fusing the portion of the build material in contact with the fusing agent to form a layer.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: September 7, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephen G. Rudisill, Alexey S. Kabalnov, Keshava A. Prasad, Sivapackia Ganapathiappan, Jake Wright, Vladek Kasperchik
  • Patent number: 11106137
    Abstract: New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that comprise one or more base reactive groups and (i) one or more polar groups distinct from the base reactive groups, and/or (ii) at least one of the base reactive groups is a non-perfluorinated base reactive group. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: August 31, 2021
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Deyan Wang, Cong Liu, Mingqi Li, Joon Seok Oh, Cheng-Bai Xu, Doris H. Kang, Clark H. Cummins, Matthias S. Ober
  • Patent number: 11097211
    Abstract: A resist coating apparatus including a resist supplying system; a resist filtering system having a first filter, a second filter, and a pump between the first filter and the second filter; and a resist dispensing system, wherein the first filter includes a plurality of first unit filters connected in parallel.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taehoi Park, Sangjin Kim, Nakhee Seong, Woojeong Shin, Taehwan Oh, Kwangsub Yoon
  • Patent number: 11079680
    Abstract: [Problem] To provide a high heat resistance resist composition and a pattern formation method using the composition. [Solution] The present invention provides a chemically amplified negative-type resist composition comprising a particular polymer and a particular crosslinking agent, and this composition makes it possible to form a resist pattern of high sensitivity, of excellent resolution and of strong heat-resistance.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: August 3, 2021
    Assignee: Merck Patent GmbH
    Inventors: Masato Suzuki, Hiroshi Hitokawa, Tomohide Katayama
  • Patent number: 11079677
    Abstract: An object of the present invention is to provide a chemical liquid which makes it difficult for a defect to occur on a substrate after development. Another object of the present invention is to provide a chemical liquid storage body and a pattern forming method. The chemical liquid of the according to an embodiment of the present invention contains a main agent which is formed of one kind of organic solvent or formed of a mixture of two or more kinds of organic solvents, an impurity metal, and a surfactant, in which a vapor pressure of the main agent is 60 to 1,340 Pa at 25° C., the impurity metal contains particles containing one kind of metal selected from the group consisting of Fe, Cr, Ni, and Pb, in a case where the chemical liquid contains one kind of particles, a content of the particles in the chemical liquid is 0.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: August 3, 2021
    Assignee: FUJIFILM Corporation
    Inventor: Tetsuya Kamimura
  • Patent number: 11079676
    Abstract: A radiation-sensitive composition is to be used in exposure with an extreme ultraviolet ray or an electron beam, and includes a first polymer and a solvent, wherein the first polymer includes a first structural unit including: at least one metal atom; and at least one carbon atom that each bonds to the metal atom by a chemical bond and does not constitute an unsaturated bond, and at least one chemical bond is a covalent bond. Every chemical bond is preferably a covalent bond. The metal atom is preferably tin, germanium, lead or a combination thereof.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: August 3, 2021
    Assignee: JSR CORPORATION
    Inventors: Yusuke Asano, Hisashi Nakagawa, Shinya Minegishi
  • Patent number: 11073762
    Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) a photoacid generator that generates an acid having a pKa of ?1.40 or more upon irradiation with actinic rays or radiation, and (B) a resin having a repeating unit containing an acid-decomposable group, in which an Eth sensitivity of the repeating unit containing an acid-decomposable group is 5.64 or less, and which can provide very excellent roughness performance, exposure latitude, and depth of focus, particularly, in the formation of an ultrafine pattern; a photoacid generator; and an actinic ray-sensitive or radiation-sensitive film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: July 27, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Daisuke Asakawa, Akiyoshi Goto, Masafumi Kojima, Keita Kato, Keiyu Ou, Kyohei Sakita
  • Patent number: 11067722
    Abstract: The present invention relates to an optical element including a base material, a light-shielding film, and a cured film in which an alkyd resin and a melamine resin having two or more iminomethylol groups in a molecule are condensed or in which an alkyd resin and a benzoguanamine resin having two or more iminomethylol groups in a molecule are condensed. The light-shielding film is disposed in at least a part of the periphery of the base material. The cured film is disposed on the surface of the light-shielding film.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: July 20, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Keiko Abe, Tomonari Nakayama
  • Patent number: 11067888
    Abstract: A resist composition containing a polymer compound which has a constitutional unit (a0) represented by Formula (a0-1); and an acid generator which is formed of a compound represented by Formula (b1) (in the formulae, Ra00 represents an acid dissociable group represented by Formula (a0-r1-1); Ra01, Ra02, Ra031, Ra032, and Ra033 represent a hydrocarbon group; Ya0 represents a quaternary carbon atom; Rb1 represents a hydrocarbon group which has a steroid skeleton containing at least one hydroxyl group; Yb1 represents a divalent linking group having a single bond or a hetero atom; Vb1 represents a single bond, an alkylene group, or a fluorinated alkylene group; and Rf1 represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group).
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: July 20, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Takashi Nagamine, Emi Uchida, Tsuyoshi Nakamura
  • Patent number: 11061294
    Abstract: A black matrix composition, a liquid crystal display panel and a manufacturing method thereof are provided. The black matrix composition is used to form a black matrix layer, and components and percentages by weight of the black matrix composition are: an inorganic filler, and 5% to 10%; an alkali-soluble oligomer, and 5% to 10%; a crosslinking agent, and 5% to 10%; a photopolymerization initiator, and 1%; a thermochromic agent, and 1% to 10%; and a solvent, and 60% to 85%. When the temperature of the black matrix layer is less than 50° C., the black matrix layer is black. When the temperature of the black matrix layer is higher than or equal to 60° C., the black matrix layer is completely transparent.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: July 13, 2021
    Assignee: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Bai Bai
  • Patent number: 11059740
    Abstract: A glass article comprising a glass substrate and a coating on a surface of the glass substrate is disclosed. The coating comprises a glass frit and a binder comprising an interpenetrating polymer network. The interpenetrating polymer network comprises a crosslinked polyol resin, a second crosslinked resin, and a third resin. A method of forming the glass article containing the coating is also disclosed.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: July 13, 2021
    Assignee: GUARDIAN GLASS, LLC
    Inventors: Liang Liang, Suresh Devisetti
  • Patent number: 11061329
    Abstract: A resist composition including a resin component having a structural unit derived form a compound represented by formula (a0-1) (in the formula, W represents a polymerizable group-containing group; Ra01 is a group which is bonded to Ra03 to form an aliphatic cyclic group, or bonded to Ra04 to form an aliphatic cyclic group; Ra02 represents a hydrocarbon group which may have a substituent; Ra03 is a hydrogen atom or a monovalent organic group in the case where Ra01 is not bonded thereto; Ra04 is a hydrogen atom or a monovalent organic group in the case where Ra01 is not bonded thereto; and Ra05 to Ra07 each independently represents a hydrogen atom or a monovalent organic group).
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: July 13, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Takuya Ikeda, Masatoshi Arai
  • Patent number: 11059994
    Abstract: A silicone resin is disclosed. The silicone resin is free from carbon atoms. A method of preparing the resin is additionally disclosed. This method comprises reacting a silane compound and a precursor compound, thereby preparing the silicone resin. A composition including the silicon resin and a vehicle is further disclosed. A method of preparing a film with the composition is also disclosed. This method comprises applying the composition including the silicone resin and the vehicle to a substrate to form a layer. This method also includes heating the layer to give the film.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: July 13, 2021
    Assignee: Dow Silicones Corporation
    Inventors: Randall G. Schmidt, Yanhu Wei, Shengqing Xu
  • Patent number: 11061326
    Abstract: A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of “footing” in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than the top (the side proximal to the surface of a resist layer) in the nonresist portion when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate having a metal surface using the composition. A mercapto compound having the formula (C) shown below is added to the composition and includes an acid generator which generates acid upon exposure to an irradiated active ray or radiation and a resin the solubility of which in alkali increases under the action of acid: wherein n1, n2, Rc1, and Rc are defined in claim 1.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 13, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akiya Kawaue, Yasushi Kuroiwa, Shota Katayama, Kazuaki Ebisawa
  • Patent number: 11052599
    Abstract: Stereolithography using solid thermoplastic photopolymer plates/sheets/films provides a new technique to make 3D printed objects. In this new additive manufacturing process, objects are built layer-wise using thermoplastic photopolymers and actinic radiation. The thermoplastic photopolymer compositions consist of a thermoplastic photopolymer layer sandwiched between a transparent flexible base without an anchoring layer and a release film. Un-crosslinked portions of the 3D printed object are removed by heat.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: July 6, 2021
    Inventor: Manilal J. Savla
  • Patent number: 11054742
    Abstract: A photoresist layer is formed over a wafer. The photoresist layer includes a metallic photoresist material and one or more additives. An extreme ultraviolet (EUV) lithography process is performed using the photoresist layer. The one or more additives include: a solvent having a boiling point greater than about 150 degrees Celsius, a photo acid generator, a photo base generator, a quencher, a photo de-composed base, a thermal acid generator, or a photo sensitivity cross-linker.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: July 6, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: An-Ren Zi, Joy Cheng, Ching-Yu Chang
  • Patent number: 11040368
    Abstract: At the time of forming a paste layer on a substrate sheet by use of three rolls placed at right angles, in order to offset a variation amount of a first gap due to thermal expansion of the rolls, a variation amount in a given detection period is calculated by use of outputs of a first sensor configured to detect a coating film surface of a second-roll coating film of a second roll and a second sensor configured to detect a second-roll surface, and the first roll is moved by use of a first-roll moving mechanism.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: June 22, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Katsushi Enokihara, Takenori Ikeda
  • Patent number: 11042089
    Abstract: The present invention relates to a chemically amplified photoresist composition including an alkali-soluble resin and a polymeric photo-acid generator having a predetermined structure, a photoresist pattern produced from the chemically amplified photoresist composition, and a method for preparing the chemically amplified photoresist pattern.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 22, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Min Young Lim, Ji Hye Kim, Yongmi Kim
  • Patent number: 11034856
    Abstract: The present disclosure is drawn to primer compositions, which can include a binder including polyvinyl alcohol, starch nanoparticles, and a polyurethane dispersion. The primer competitions can also include a cationic salt and water.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: June 15, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bor-Jiunn Niu, Tao Chen, Haigang Chen, Silke Courtenay
  • Patent number: 11036137
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming an assist layer over a material layer. The assist layer includes a first polymer with a first polymer backbone, a floating group bonded to the first polymer backbone, and the floating group includes carbon fluoride (CxFy), and a second polymer. The method includes forming a resist layer over the assist layer, and the first polymer is closer to an interface between the assist layer and the resist layer than the second polymer. The method also includes patterning the resist layer.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: June 15, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: An-Ren Zi, Ching-Yu Chang, Chin-Hsiang Lin
  • Patent number: 11036133
    Abstract: An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E).
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: June 15, 2021
    Assignee: JSR CORPORATION
    Inventors: Hiroki Nakagawa, Hiromitsu Nakashima, Gouji Wakamatsu, Kentarou Gotou, Yukio Nishimura, Takeo Shioya
  • Patent number: 11037789
    Abstract: The present disclosure relates to a method of performing a semiconductor fabrication process. The method may be performed by forming a spacer material over an underlying layer. The spacer material has sidewalls defining a first trench. A cut material is formed over the spacer material and within the first trench. The cut material separates the trench into a pair of trench segments having ends separated by the cut material. The underlying layer is patterned according to the spacer material and the cut material.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: June 15, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuan-Wei Huang, Chia-Ying Lee, Ming-Chung Liang
  • Patent number: 11036131
    Abstract: A resist composition containing a compound (B1) represented by Formula (b1) in which Rb1 represents a monovalent hydrocarbon group which has a steroid skeleton and 17 to 50 carbon atoms, Yb1 and Yb2 each independently represent a divalent linking group having a hetero atom, Vb1 represents a divalent linking group containing a cyclic aliphatic hydrocarbon group, Vb2 represents an alkylene group, a fluorinated alkylene group, or a single bond, Rf1 represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group having 1 to 5 carbon atoms, m represents an integer of 1 or greater, and Mm+ represents an m-valent organic cation
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 15, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Takashi Nagamine, Tsuyoshi Nakamura, Kazuishi Tanno
  • Patent number: 11028251
    Abstract: Provided is a resin composition including: an infrared absorbing pigment; and a resin having an infrared absorbing group. In addition, provided are a film that is formed using the resin composition, an infrared cut filter, a method of manufacturing an infrared cut filter, a solid image pickup element, an infrared sensor, and a camera module.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: June 8, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Suguru Samejima, Kyohei Arayama, Kazutaka Takahashi
  • Patent number: 11022881
    Abstract: A photoacid generator having formula (1a) is provided. A chemically amplified resist composition comprising the PAG forms a pattern of rectangular profile with a good balance of sensitivity and LWR when processed by photolithography using ArF excimer laser, EB or EUV.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: June 1, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazuya Honda, Takayuki Fujiwara, Masaki Ohashi, Kazuhiro Katayama
  • Patent number: 11020730
    Abstract: The present disclosure provides compounds, compositions, and methods for preparing alkenyl halides and/or haloalkyl-substituted olefins with Z-selectivity. The methods are particularly useful for preparing alkenyl fluorides such as CF3-substituted olefins by means of cross-metathesis reactions using halogen-containing molybdenum and tungsten complexes.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: June 1, 2021
    Assignees: Massachusetts Institute of Technology, Trustees of Boston College
    Inventors: Amir H. Hoveyda, Ming Joo Koh, Thach T. Nguyen, Richard R. Schrock, Jakub Hyvl
  • Patent number: 11022885
    Abstract: A method includes providing a substrate; forming a bottom layer over the substrate; forming a middle layer over the bottom layer, a top surface of which including a photosensitive moiety having a first end anchored in the middle layer and a second end extending away from the top surface of the middle layer; forming a photoresist layer over the middle layer; exposing the photoresist layer to a radiation source; and developing the photoresist layer to form a pattern. The photosensitive moiety, which includes one of a photo-acid generator (PAG), a photo-base generator (PBG), photo-decomposable base (PDB), or photo-decomposable quencher (PDQ), may be anchored to a polymer backbone forming the middle layer via one or more linker groups. A distance by which the photosensitive moiety extends into the photoresist layer may be determined by a length of the linker group.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 1, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chih Ho, Kuan-Hsin Lo, Ching-Yu Chang, Chin-Hsiang Lin
  • Patent number: 11016387
    Abstract: A chemically amplified positive-type photosensitive resin composition containing a predetermined amount of organic solvent (S1) having a boiling point of 120 to 180° C., and satisfying the following requirements: a solvent residual rate measured by the following steps (1) and (2) is 3.5% by mass or less: (1) forming a coated film of 40 ?m by applying the photosensitive resin composition to a substrate; and (2) baking the coated film at a temperature that is higher by 10° C. than the boiling point of the organic solvent (S1) for 30 seconds, and calculating the rate of the organic solvent (S1) in a total mass of the coated film after baking by gas chromatography.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: May 25, 2021
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Shota Katayama, Kazuaki Ebisawa
  • Patent number: 11009790
    Abstract: A photoacid generator (PAG) and a photoresist composition, the PAG being represented by the following Chemical Formula (I): wherein, in Chemical Formula (I), L is sulfur (S) or iodine (I), R3 being omitted when L is I; R1, R2, and R3 are each independently a C1 to C10 alkyl, alkenyl, alkynyl, or alkoxy group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and L, or a C6 to C18 aryl, arylalkyl, or alkylaryl group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and L; AL is an acid-labile group; m is 1 to 4; and M is a C1 to C30 hydrocarbon group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and a sulfur atom.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: May 18, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Suk-koo Hong, Kyoung-yong Cho, Hyo-sung Lee, Gum-hye Jeon, Mi-yeong Kang, Gun-woo Park
  • Patent number: 11003074
    Abstract: A pattern formation method, comprising: (a) providing a semiconductor substrate; (b) forming a photoresist pattern over the semiconductor substrate, wherein the photoresist pattern is formed from a photoresist composition comprising: a first polymer comprising acid labile groups; and a photoacid generator; (c) coating a pattern overcoat composition over the photoresist pattern, wherein the pattern overcoat composition comprises a second polymer and an organic solvent, wherein the organic solvent comprises one or more ester solvents, wherein the ester solvent is of the formula R1—C(O)O—R2, wherein R1 is a C3-C6 alkyl group and R2 is a C5-C10 alkyl group; (d) baking the coated photoresist pattern; and (e) rinsing the coated photoresist pattern with a rinsing agent to remove the second polymer. The methods find particular applicability in the manufacture of semiconductor devices.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: May 11, 2021
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Xisen Hou, Cong Liu, Irvinder Kaur
  • Patent number: 11003084
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a material layer over a substrate and forming a resist layer over the material layer. The method includes exposing a portion of the resist layer by performing an exposure process. The resist layer includes a compound, and the compound has a carbon backbone, and a photoacid generator (PAG) group and/or a quencher group are bonded to the carbon backbone. The method also includes performing a baking process on the resist layer and etching a portion of the resist layer to form a patterned resist layer. The method includes patterning the material layer by using the patterned resist layer as a mask and removing the patterned resist layer.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Yen Lin, Ching-Yu Chang, Chin-Hsiang Lin
  • Patent number: 10996378
    Abstract: The present invention is an antireflective film, including: a support base, and a pattern composed of a photoresist material formed on the support base, the index at a point closer to the support base. The present invention provides an antireflective film that is able to give antireflection effect to decrease the reflection of light, a method of producing the same, and an eyeglass type display.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: May 4, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Jun Hatakeyama
  • Patent number: 10996563
    Abstract: The present application provides a method for detecting coagula on a coater head. The method includes: detecting a thickness value of a coating material (2) on a substrate along a coating direction thereof; acquiring a first thickness value and a second thickness value, and calculating a difference value; and comparing an absolute value of the difference value with a preset value, and outputting a feedback signal if the absolute value of the difference value exceeds the preset value.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: May 4, 2021
    Assignees: CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventor: Ronglong Chen
  • Patent number: 10983433
    Abstract: A photosensitive composition including a quantum dot dispersion, a reactive compound having at least two thiol groups, a photopolymerizable monomer having a carbon-carbon double bond, and a photoinitiator, wherein the quantum dot dispersion includes a carboxylic acid group-containing polymer and a quantum dot dispersed in the carboxylic acid group containing polymer, and wherein the carboxylic acid group-containing polymer includes a copolymer of a monomer combination including a first monomer having a carboxylic acid group and a carbon-carbon double bond and a second monomer having a carbon-carbon double bond and a hydrophobic moiety and not having a carboxylic acid group.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: April 20, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Shang Hyeun Park, Hojeong Paek, Eun Joo Jang, Shin Ae Jun
  • Patent number: 10976844
    Abstract: Provided herein is a touch sensor including: a substrate having a transmittance of 5% or less at a wavelength of 380 nm; a touch sensor layer configured to be opposite the substrate and having a thickness of 2 ?m to 10 ?m; and an adhesive layer disposed between the substrate and the touch sensor layer, wherein the adhesive layer includes a cured product of an adhesive composition including at least one selected from the group consisting of an initiator and a sensitizer having an absorption wavelength in the range of 380 nm to 450 nm and has an adhesion strength of 5 N/25 trim or more. There is an advantageous effect in that the provided film-type touch sensor represents excellent adhesion and folding characteristics even when the substrate has a relative low transmittance.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: April 13, 2021
    Assignee: DONGWOO FINE-CHEM. CO, LTD.
    Inventors: Myung Young An, Dong Jin Son
  • Patent number: 10961381
    Abstract: Provided is a composition with which a film having excellent temporal stability and excellent adhesiveness with a support or the like can be formed. In addition, provided are a film, a near infrared cut filter, a solid image pickup element, an image display device, and an infrared sensor. The composition includes: a near infrared absorbing compound that includes a ?-conjugated plane having a monocyclic or fused aromatic ring; and a compound A having a weight-average molecular weight of 3000 or higher that has a radically polymerizable ethylenically unsaturated group, in which the compound A includes a repeating unit having a graft chain.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: March 30, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Masahiro Mori, Akio Mizuno, Kazuya Oota
  • Patent number: 10960656
    Abstract: A negative-working infrared radiation-sensitive lithographic printing plate precursor can be imaged and developed on-press to provide a lithographic printing plate. Such precursor has an initiator composition that contains compound A of Structure (I) and one or more compounds collectively as compound B of Structure (II) or Structure (III): wherein R1, R2, R3, R4, R5 and R6 are independently alkyl groups each having 3 to 6 carbon atoms; at least one of R3 and R4 is different from R1 or R2; the difference of total number of carbon atoms in R1 and R2 and the total number of carbon atoms in R3 and R4 is 0, 1, or 2; the difference of total number of carbon atoms in R1 and R2 and the total number of carbon atoms in R5 and R6 is 0, 1, or 2; and X1, X2 and X3 are the same or different anions.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: March 30, 2021
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Koji Hayashi, James Russell Matz, Satoshi Ishii, Yoshiaki Sekiguchi, Masamichi Kamiya
  • Patent number: 10934455
    Abstract: The present invention relates to a polysilsesquioxane resin composition for a flexible substrate. More specifically, the present invention relates to a polysilsesquioxane resin composition for a flexible substrate, having excellent heat resistance and transparency, the resin composition being usable for a flexible display substrate. More specifically, a transparent thin film can be formed, excellent transmittance is exhibited in the visible range even after curing, heat resistance is excellent, and flexibility and crack resistance can be controlled. Compared to a conventional polyimide-based substrate material, the present invention has excellent insulation characteristics and passivation characteristics, which can be satisfied simultaneously, and is advantageous for productivity since release characteristics are ensured during a delamination process from a glass substrate.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: March 2, 2021
    Inventors: Jun Young Kim, Hwa Young Kim, Ho Sung Choi
  • Patent number: 10933661
    Abstract: An aqueous treatment composition for ITM (Intermediate transfer member) of a printing system and a method of printing comprising the step of applying said treatment composition to the surface of an ITM, wherein said treatment composition comprising: at least 3% wt quaternary ammonium salt, at least 1% wt water soluble polymer, and at least 65% wt water. Also disclosed, a printing system comprising a an ITM and treatment station for forming a thin layer of liquid treatment formulation on the ITM surface.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: March 2, 2021
    Assignee: LANDA CORPORATION LTD.
    Inventors: Benzion Landa, Sagi Abramovich, Moshe Levanon, Galia Golodetz, Helena Chechik, On Mero, Tatiana Kurtser, Ayal Galili, Uriel Pomerantz, Dan Avital, Jose Kuperwasser, Omer Ashkenazi
  • Patent number: 10928727
    Abstract: According to the present invention, an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a hydrophobic resin (B), and a resin (C) having an aromatic ring, as well as a film, a mask blank, a pattern forming method, and a method for manufacturing an electronic device, each using the composition, are provided.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: February 23, 2021
    Assignee: FUJIFILM Corporation
    Inventor: Shuji Hirano
  • Patent number: 10927075
    Abstract: Described herein are methods and compositions relating to the treatment of e.g., cancer, autoimmune disease, immune deficiency, and/or neurodegenerative disease. In some embodiments, the methods of treatment relate to administering a compound as described herein. In some embodiments, the subject treated according to the methods described herein is a subject determined to have an increased level of DNA damage.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: February 23, 2021
    Assignee: THE JACKSON LABORATORY
    Inventors: Kevin David Mills, Muneer Gulamhusein Hasham
  • Patent number: 10921712
    Abstract: A color developing composition containing a compound represented by the Formula (1) as defined herein, a lithographic printing plate precursor including a support and an image-recording layer containing the color developing composition, a method for producing a lithographic printing plate including: exposing the lithographic printing plate precursor in an image pattern; and removing a non-exposed portion in the image-recording layer using at least one of printing ink or dampening water on a printer, and a color developing compound represented by the Formula (1) as defined herein.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: February 16, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Inasaki, Keisuke Nogoshi, Hiroaki Idei, Akio Mizuno
  • Patent number: 10921711
    Abstract: A resist composition which generates an acid when exposed and whose solubility in a developer is changed by an action of an acid, the resist composition including: a base material component (A) whose solubility in a developer is changed by an action of an acid, in which the base material component (A) comprises a polymer compound (A1) having a constitutional unit (a01) represented by Formula (a0-1), a constitutional unit (a02) represented by Formula (a0-2), and a constitutional unit (a03) which is represented by Formula (a0-3) and has a structure different from the constitutional unit (a02).
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: February 16, 2021
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Masafumi Fujisaki, Junichi Tsuchiya, Kotaro Endo
  • Patent number: 10894390
    Abstract: A film touch sensor includes a separation layer, a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer formed by curing an insulation layer forming composition comprising a polymer having a repeating unit represented by Formula 1 or 2, such that it is possible to suppress thermal damage which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: January 19, 2021
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Sang Kook Kim, Seong Hwan Park, Seung June Park, Sung Hoon Cho