Radiation Sensitive Composition Or Product Or Process Of Making Patents (Class 430/270.1)
  • Patent number: 11454889
    Abstract: A stepped substrate-coating composition for forming a coating film having filling property of a pattern and flattening property including a compound (E) having a partial structure (I) and a partial structure (II) having a hydroxy group formed by a reaction of an epoxy group with a proton-generating compound, a solvent (F), and a crosslinkable compound (H), wherein the partial structure (I) is from Formulae (1-1) to (1-5) or including a partial structure of Formula (1-6) combined with a partial structure of Formula (1-7) or (1-8), and the partial structure (II) is of the following Formula (2-1) or (2-2), wherein the compound (E) contains the epoxy and hydroxy group at a molar ratio (epoxy group)/(hydroxy group) of 0 or more and 0.5 or less, and contains the partial structure (II) so the molar ratio (partial structure (II))/(partial structure (I)+partial structure (II)) is 0.01 or more and 0.8 or less.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: September 27, 2022
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Takafumi Endo, Hikaru Tokunaga
  • Patent number: 11453178
    Abstract: A display apparatus includes a window member, a display module, and a photocured adhesive layer. The window member includes a base member and a bezel layer overlapping a partial region of a rear surface of the base member, the bezel layer including a photosensitive material having a reduced transmittance with an increased amount of irradiated light. The display module is disposed on the lower side of the window module. The photocured adhesive layer is configured to bind the window member to the display module, and overlaps with the bezel layer on a plane.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: September 27, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Ju-hyun Shin
  • Patent number: 11446947
    Abstract: The present invention relates to a printing form for flexographic printing. The printing form contains microcell patterns on its relief printing surface. The presence of these microcell patterns allows for printing with a higher anilox roll volume. Also disclosed are five specific microcell patterns.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: September 20, 2022
    Inventors: Bradley K. Taylor, Scott W. Rickard
  • Patent number: 11435666
    Abstract: A novel salt having an amide bond in its anion structure is provided. A chemically amplified resist composition comprising the salt has advantages including minimal defects and improved values of sensitivity, LWR, MEF and CDU, when processed by lithography using high-energy radiation such as KrF excimer laser, ArF excimer laser, EB or EUV.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 6, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Emiko Ono, Masayoshi Sagehashi, Masahiro Fukushima, Yuki Kera
  • Patent number: 11437237
    Abstract: Provided is a silicon-containing layer forming composition for forming a silicon-containing layer which exhibits an anti-reflective function during exposure in a multilayer resist process and, during dry etching, shows a high etching rate against a plasma of fluorine-based gas and a low etching rate against a plasma of oxygen-based gas. The silicon-containing layer forming composition includes a polysiloxane compound having a structural unit of the formula and a solvent. [(R1)bR2mSiOn/2] In the formula, R1 is a group represented by the following formula: (where a is an integer of 1 to 5; and a wavy line means that a line which the wavy line intersects is a bond); R2 is each independently a hydrogen atom, a C1-C3 alkyl group, a phenyl group, a hydroxy group, a C1-C3 alkoxy group or a C1-C3 fluoroalkyl group; b is an integer of 1 to 3; m is an integer of 0 to 2; n is an integer of 1 to 3; and a relationship of b+m+n=4 is satisfied).
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: September 6, 2022
    Assignee: Central Glass Company, Limited
    Inventors: Junya Nakatsuji, Kazuhiro Yamanaka
  • Patent number: 11429025
    Abstract: A salt represented by formula (I), a quencher, and a resist composition including the same: wherein R1, R2, R3 and R4 each represent a halogen atom, an alkyl fluoride group having 1 to 6 carbon atoms or a hydrocarbon group having 1 to 18 carbon atoms, —CH2— included in the hydrocarbon group may be replaced by —O— or —CO—; and m1, m2, m3 and m4 represent an integer of 0 to 4. When m1 is 2 or more, a plurality of R1 may be the same or different from each other. When m2 is 2 or more, a plurality of R2 may be the same or different from each other. When m3 is 2 or more, a plurality of R3 may be the same or different from each other. When m4 is 2 or more, a plurality of R4 may be the same or different from each other.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: August 30, 2022
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Katsuhiro Komuro, Yuki Takahashi, Koji Ichikawa
  • Patent number: 11420927
    Abstract: The invention relates to a process for the manufacture of an alkylfluoroacrylate starting from alkylfluoroacetate and an oxalic acid ester, wherein an alkane liquid under the reaction conditions is applied as the solvent in one of the reaction steps.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: August 23, 2022
    Assignee: Patheon Austria GMBH & Co KG
    Inventors: Peter Kapitan, Alexander Sajtos
  • Patent number: 11417908
    Abstract: Provided are a solid electrolyte composition containing an inorganic solid electrolyte having a conductivity of an ion of a metal belonging to Group I or II of the periodic table and a binder having a specific constituent component, a solid electrolyte-containing sheet in which the same solid electrolyte composition is used and a manufacturing method therefor, an all-solid state secondary battery and a manufacturing method therefor, a polymer having a specific constituent component, a non-aqueous solvent dispersion thereof, and a diol compound.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: August 16, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Masaomi Makino, Tomonori Mimura, Yo Kushida
  • Patent number: 11415888
    Abstract: A negative type photosensitive resin composition containing an epoxy group-containing resin; a metal oxide; and a cationic polymerization initiator (I). The cationic polymerization initiator (I) contains one or more of a compound represented by Formula (I1) and a compound represented by Formula (I2). In Formula (I1), Rb01 to Rb04 represent an aryl group which may have a substituent or a fluorine atom. In Formula (I2), Rb05 represents a fluorinated alkyl group which may have a substituent or a fluorine atom. A plurality of Rb05's may be the same as or different from one another. q represents an integer of 1 or greater, and Qq+'s each independently represent a q-valent organic cation.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: August 16, 2022
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Ryosuke Nakamura, Tomoyuki Ando, Tokunori Yamadaya
  • Patent number: 11402753
    Abstract: Provided is a positive resist composition capable of improving the adhesion between a resist film formed through pre-baking and a workpiece and reducing changes in the molecular weight of the polymer in the resist film before and after pre-baking step over broader ranges of heating temperature and heating time (at lower heating temperatures) during pre-baking.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: August 2, 2022
    Assignee: ZEON CORPORATION
    Inventor: Manabu Hoshino
  • Patent number: 11402756
    Abstract: A photosensitive resin composition comprising a silicone structure-containing polymer having crosslinking groups or crosslinking reaction-susceptible reactive sites in the molecule is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, heat resistance, and reliability as protective film.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: August 2, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hitoshi Maruyama, Kazunori Kondo
  • Patent number: 11402758
    Abstract: There is provided a substrate processing apparatus including: a holder configured to hold a substrate having a pattern formed with a resist material for ArF immersion lithography on a surface of the substrate inside a processing container; a rotation driver configured to rotate the holder; and a light source part having a plurality of light sources configured to irradiate the surface of the substrate held by the holder which is rotated by the rotation driver wherein the light sources include irradiating vacuum ultraviolet light, wherein an amount of irradiation of an inner side of the substrate with light from the light source part is made larger than an amount of irradiation of an outer side of the substrate with light from the light source part.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: August 2, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Keiichi Tanaka
  • Patent number: 11390705
    Abstract: Provided herein are methods of making a reactive particulate material by free radically polymerizing a single-cure resin to produce a polymer, the resin comprising: a reactive blocked polyurethane prepolymer, a reactive blocked polyurea prepolymer, a reactive blocked polyurethane-polyurea copolymer, or a combination thereof, wherein said polymerizing is carried out by dispersive polymerization (e.g., an emulsion, suspension or dispersion polymerization process), to form said reactive particulate material. Methods of use of the reactive particulate material and material sets including the same are also provided.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: July 19, 2022
    Assignee: Carbon, Inc.
    Inventors: Justin Poelma, Mu San Zhang, Xinyu Gu, Jason P. Rolland, Joseph M. DeSimone
  • Patent number: 11385544
    Abstract: A composition for forming a silicon-containing resist underlayer film contains at least: one or more compounds shown by the following general formula (P-0); and a thermally crosslinkable polysiloxane (Sx), where R100 represents divalent organic group substituted with one or more fluorine atoms; R101 and R102 each independently represent a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms optionally substituted with a hetero-atom or optionally interposed by hetero-atom; R103 represents linear, branched, or cyclic divalent hydrocarbon group having 1 to 20 carbon atoms optionally substituted with a hetero-atom or optionally interposed by hetero-atom; R101 and R102, or R101 and R103, are optionally bonded to each other to form a ring with sulfur atom in the formula; and L104 represents a single bond or linear, branched, or cyclic divalent hydrocarbon group having 1 to 20 carbon atoms optionally substituted with a hetero-atom or optionally interposed by hetero-atom.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: July 12, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Ogihara, Yusuke Biyajima, Masahiro Kanayama, Tsukasa Watanabe, Masaki Ohashi
  • Patent number: 11385543
    Abstract: Environmentally stable, chemically amplified (CA) positive resist compositions are described. These resist compositions are based on a blend of at least two types of polymer platforms. The first platform is a low activation energy, acetal blocked polyhydroxystyrene (PHS) based resin; the second platform is an acrylate based resin containing a high activation energy acid labile group [such as tertiary-butyl acrylate(t-BA)]. The resist composition also contains a photo-acid generator (PAG), a base quencher, a surfactant dissolved in a suitable solvent. Also described, is the use of these resist composition in a method for forming a photoresist relief image on a substrate.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: July 12, 2022
    Assignee: Merck Patent GmbH
    Inventors: Medhat A. Toukhy, Weihong Liu, PingHung Lu
  • Patent number: 11370751
    Abstract: The sulfonium salt does not contain a toxic metal and exhibits higher cationic polymerization performance and crosslinking performance than a tetrakis(pentafluorophenyl)borate salt. The heat- or photo-acid generator contains the sulfonium salt. The sulfonium salt is formed of a sulfonium cation selected from a group represented by general formulas (1), (9), (10) and (11) described below and a gallate anion represented by formula (a). The heat- or photo-acid generator contains the sulfonium salt. The heat- or energy ray-curable composition contains the acid generator and a cationically polymerizable compound. A cured product can be obtained by curing the same.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: June 28, 2022
    Assignee: SAN APRO LTD.
    Inventors: Noriya Fukunaga, Yusaku Takashima
  • Patent number: 11372329
    Abstract: A resist composition including a polymeric compound having a structural unit in which a compound represented by formula (a0-1) has a polymerizable group within the W1 portion converted into a main chain, and a compound represented by formula (b1-1) in which W1 represents a polymerizable group-containing group; Ct represents a tertiary carbon atom, and the ?-position of Ct is a carbon atom which constitutes a carbon-carbon unsaturated bond; R11 represents an aromatic hydrocarbon group or a chain hydrocarbon group; R12 and R13 are mutually bonded to form a 5-membered aliphatic monocyclic group, or a condensed polycyclic hydrocarbon group containing a 5-membered aliphatic monocyclic ring; Rb11 represents a cyclic group; Rb10, Rb20 and Rb30 each independently represents a substituent; nb1 represents an integer of 0 to 4; nb2 represents an integer of 0 to 5; nb3 represents an integer of 0 to 5; and X? represents a counteranion.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: June 28, 2022
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Masahito Yahagi, Yoichi Hori, Tatsuya Fujii, Yuki Fukumura
  • Patent number: 11366389
    Abstract: The present invention provides a resist underlayer forming composition, which is well in heat resistance and gap filling. Further, the present invention provides methods of manufacturing a resist underlayer and semiconductor device using it. [Means for Solution] A composition comprising a allyloxy derivative having a specific group and a solvent, and methods of manufacturing a resist underlayer and semiconductor device using it.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: June 21, 2022
    Assignee: MERCK PATENT GMBH
    Inventors: Shigemasa Nakasugi, Hiroshi Yanagita, Takashi Sekito, Yusuke Hama, Yuriko Matsuura
  • Patent number: 11365325
    Abstract: The present disclosure is drawn to primer compositions, which can include a binder including polyvinyl alcohol, starch nanoparticles, and a crosslinkable polyurethane dispersion. The primer competitions can also include a cationic salt and water.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: June 21, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bor-Jiunn Niu, Tao Chen, Haigang Chen, Silke Courtenay
  • Patent number: 11366387
    Abstract: Disclosed is a salt represented by formula (I): wherein, in formula (I), Q1 and Q2 each independently represent a fluorine atom or the like, R1 and R2 each independently represent a hydrogen atom or the like, Z represents an integer of 0 to 6, X1 represents *—CO—O— or the like, where * represents a bonding site to C(R1)(R2) or C(Q1)(Q2), L1 represents a single bond or a saturated hydrocarbon group, and —CH2— included in the saturated hydrocarbon group may be replaced by —O—, —S—, —SO2— or —CO—, A1 represents a divalent alicyclic hydrocarbon group which may have a substituent, Ra represents a cyclic hydrocarbon group which may have a substituent, and Z+ represents an organic cation.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: June 21, 2022
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Tatsuro Masuyama, Takahiro Yasue, Koji Ichikawa
  • Patent number: 11347146
    Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: May 31, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Keika Hashimoto, Ryoji Okuda
  • Patent number: 11348947
    Abstract: The present disclosure discloses a manufacturing method for an array substrate and an array substrate. The method includes: forming a gate electrode, a gate insulating layer, a semiconductor layer, a source drain electrode layer and a photoresist layer on a substrate; patterning the photoresist layer to form a patterned photoresist layer; performing at least one wet etching on the source drain electrode layer and performing at least one dry etching on the semiconductor layer; performing an ashing processing between the steps of the wet etching and the dry etching. A ratio of a lateral etching rate to a longitudinal etching rate in the at least one ashing processing ranges from 1:0.9 to 1:1.5.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: May 31, 2022
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Technology Co., Ltd.
    Inventors: En-tsung Cho, Yiqun Tian
  • Patent number: 11337316
    Abstract: A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate to effect adhesion and aggregation of the ink in the pattern area, the surface of the metal nanoparticles being protected by an organic molecule layer.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: May 17, 2022
    Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Tatsuo Hasegawa, Toshikazu Yamada, Ken Matsuoka, Ayano Katou
  • Patent number: 11331900
    Abstract: Provided are a lithographic printing plate precursor having an image-recording layer on an aluminum support, in which the image-recording layer contains a polymerization initiator, an infrared absorber, a polymer particle, and a polymerizable compound, and the polymerizable compound has a) a molecular weight of 1,500 to 3,000, b) a double bond equivalent of 200 or less, and c) a CLog P of 9 or less and a method for producing a lithographic printing plate in which the lithographic printing plate precursor is used.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: May 17, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Ryo Nakamura, Kenjiro Araki, Shuji Hirano, Koji Sonokawa, Yuuya Miyagawa
  • Patent number: 11333976
    Abstract: A resin having a small linear thermal expansion coefficient and a low absorbance is provided.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: May 17, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Tomoyuki Yuba, Yuki Masuda, Jiake Jin, Ping Li
  • Patent number: 11333977
    Abstract: A curable composition includes a salt compound having a) an organic anion in which, in Hansen solubility parameter, ?d is 16 or more, ?p is 16 or more and 32 or less, and ?H is 60% or less of ?p and b) a counter cation. A lithographic printing plate precursor having an image-recording layer containing the curable composition, a method for producing a lithographic printing plate using the lithographic printing plate precursor, and a compound that is used in the image-recording layer in the lithographic printing plate precursor are also set out.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: May 17, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Yohei Ishiji, Keisuke Nogoshi, Kazuaki Enomoto, Yuuya Miyagawa
  • Patent number: 11327399
    Abstract: A photoresist composition comprising a resin which comprises a structural unit represented by the formula (I): and a salt represented by the formula (B1):
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: May 10, 2022
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Tatsuro Masuyama, Masahiko Shimada, Koji Ichikawa
  • Patent number: 11319388
    Abstract: A radiation-sensitive resin composition contains: a polymer having a first structural unit represented by formula (1), and a second structural unit represented by formula (2) and having an acid-labile group. A first acid, to be generated from the first acid generating agent, disassociates the acid labile group in the polymer upon heating under a condition involving a temperature of no less than 80° C. and no greater than 140° C. for a time period of 1 minute, and the second acid, to be generated from the second acid generating agent, does not substantially disassociate the acid-labile group under the condition. The polymer is synthesized by RAFT, ATRP, or NMP, and a RAFT agent is at least one selected from the group consisting of a mercaptocarboxylic acid ester, a disulfide, a dithioester, a xanthate, a dithiocarbamate, and a trithiocarbonate.
    Type: Grant
    Filed: September 7, 2020
    Date of Patent: May 3, 2022
    Assignee: JSR CORPORATION
    Inventors: Ken Maruyama, Yoshiki Nonoyama, Takuo Sone, Motohiro Shiratani
  • Patent number: 11322383
    Abstract: A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventors: Senichi Ryo, Yukinobu Ohura, Hiroto Yoshida, Tomoaki Endo
  • Patent number: 11320735
    Abstract: A radiation-sensitive resin composition contains: a polymer having an acid-labile group, a radiation-sensitive acid generator, a compound represented by the following formula (1), and a solvent. In the formula (1), X represents an oxygen atom or a sulfur atom; R1 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; R2 to R5 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and optionally two or more of R2 to R5 taken together represent an alicyclic structure having 3 to 20 ring atoms or an aliphatic heterocyclic structure having 3 to 20 ring atoms together with the carbon atom to which the two or more of R2 to R5 bond; Zn+ represents a cation having a valency of n; and n is an integer of 1 to 3.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: May 3, 2022
    Assignee: JSR CORPORATION
    Inventors: Katsuaki Nishikori, Satoshi Okazaki
  • Patent number: 11315798
    Abstract: Two-stage bake photoresists with releasable quenchers for fabricating back end of line (BEOL) interconnects are described. In an example, a photolyzable composition includes an acid-deprotectable photoresist material having substantial transparency at a wavelength, a photo-acid-generating (PAG) component having substantial transparency at the wavelength, and a base-generating component having substantial absorptivity at the wavelength.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: April 26, 2022
    Assignee: Intel Corporation
    Inventors: Robert L. Bristol, Marie Krysak, James M. Blackwell, Florian Gstrein, Kent N. Frasure
  • Patent number: 11315787
    Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a mandrel layer on a substrate, conformally forming a spacer layer on the mandrel layer, wherein the spacer layer is a doped silicon material, and patterning the spacer layer. In another embodiment, a method for forming features on a substrate includes conformally forming a spacer layer on a mandrel layer on a substrate, wherein the spacer layer is a doped silicon material, selectively removing a portion of the spacer layer using a first gas mixture, and selectively removing the mandrel layer using a second gas mixture different from the first gas mixture.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: April 26, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Tzu-shun Yang, Rui Cheng, Karthik Janakiraman, Zubin Huang, Diwakar Kedlaya, Meenakshi Gupta, Srinivas Guggilla, Yung-chen Lin, Hidetaka Oshio, Chao Li, Gene Lee
  • Patent number: 11314168
    Abstract: This disclosure relates generally to a patterning structure including an underlayer and an imaging layer, as well as methods and apparatuses thereof. In particular embodiments, the underlayer provides an increase in radiation absorptivity and/or patterning performance of the imaging layer.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: April 26, 2022
    Assignee: Lam Research Corporation
    Inventors: Samantha S. H. Tan, Jun Xue, Mary Anne Manumpil, Jengyi Yu, Da Li
  • Patent number: 11306392
    Abstract: In a preliminary deposition for producing an optical film in which multilayered optical thin-film is formed on a film substrate, a plurality of sputtering chambers are simultaneously energized to deposit a stacked body of thin-films made of two or more different materials on the film substrate, and the thicknesses of the plurality of thin-films are calculated from the optical properties obtained by the optical measuring unit (80) equipped in a sputtering apparatus. Measurement of the thicknesses and adjusting the deposition conditions for thin-films are repeated until the optical properties obtained by the optical measurement unit or the thickness of the respective thin-films calculated from the optical properties falls within a prescribed range.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: April 19, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shunsuke Shuto, Satoru Saki
  • Patent number: 11300877
    Abstract: A radiation-sensitive resin composition includes: a first polymer having a first structural unit that includes an acid-labile group; a radiation-sensitive acid generator; and a first compound capable of forming a salt through a structural change in a molecule thereof upon irradiation with a radioactive ray. Basicity of the first compound preferably changes upon irradiation with a radioactive ray. The first compound preferably generates an acid upon irradiation with a radioactive ray. The first compound is preferably represented by formula (1). In formula (1), Ar1 represents a substituted or unsubstituted heteroarenediyl group having 4 to 30 ring atoms and having at least one nitrogen atom as a ring-constituting atom.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: April 12, 2022
    Assignee: JSR Corporation
    Inventor: Natsuko Kinoshita
  • Patent number: 11294279
    Abstract: A lithographic printing plate precursor including an image recording layer on a hydrophilic support, in which the image recording layer includes a polymerization initiator, an infrared absorbent, a polymerizable compound, and an acid color former, and the infrared absorbent includes a compound represented by Formula 1, as well as a method of preparing a lithographic printing plate by use of the lithographic printing plate precursor.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: April 5, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Yohei Ishiji, Keisuke Nogoshi, Takeshi Inasaki
  • Patent number: 11292764
    Abstract: Novel photoacid generator compounds are provided. Compositions that include the novel photoacid generator compounds are also provided. The present disclosure further provides methods of making and using the photoacid generator compounds and compositions disclosed herein. The compounds and compositions are useful as photoactive components in chemically amplified resist compositions for various microfabrication applications.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: April 5, 2022
    Assignee: HERAEUS EPURIO LLC
    Inventors: Yongqiang Zhang, Ram B. Sharma
  • Patent number: 11286320
    Abstract: Polymerization reaction is performed using a polymerizable monomer shown by the following general formula (1) and at least one monomer selected from monomers each having a structure of a salt among a lithium salt, a sodium salt, a potassium salt, and a nitrogen compound salt of a fluorosulfonic acid or the like; then, the structure of the salt of the repeating unit of a polymer obtained by the polymerization reaction is changed to the fluorosulfonic acid or the like by ion exchange. Thus, the present invention provides a polymer compound for a conductive polymer and a method for producing the polymer compound which is suitably used as a dopant for a fuel cell and a conductive material, and which is a copolymer containing a repeating unit of styrene having a 3,3,3-trifluoro-2-hydroxy-2-trifluoromethylisobutyl ether group, and a repeating unit having any of a fluorosulfonic acid, a fluorosulfonimide group, and a n-carbonyl-fluoro-sulfonamide group.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: March 29, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Takayuki Nagasawa, Koji Hasegawa, Masayoshi Sagehashi, Masahiro Fukushima
  • Patent number: 11281104
    Abstract: A composition for forming a resist underlayer film for lithography, the resist underlayer film for lithography containing silicon and being dissolved and removed with an alkaline developer in accordance with a resist pattern together with an upper layer resist during development of the upper layer resist, the composition comprising a component, which is a silane compound containing a hydrolyzable silane, a hydrolysate of the silane, a hydrolytic condensate of the silane, or any combination of these, and an element, which is an element of causing dissolution in an alkaline developer. The element, which is an element of causing dissolution in an alkaline developer, is contained in the structure of the compound as the component. The element, which is an element of causing dissolution in an alkaline developer, is a photoacid generator.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: March 22, 2022
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Wataru Shibayama, Makoto Nakajima
  • Patent number: 11281099
    Abstract: A resist composition including a compound represented by formula (b1) in which Rb1 represents an aryl group which may have a substituent; Rb2 and Rb3 each independently represents an aryl group which may have a substituent or an alkyl group which may have a substituent; provided that at least one of the aryl group represented by Rb1 and the aryl group or the alkyl group represented by Rb2 or Rb3 has a substituent containing a halogen atom, and at least one of the aryl group represented by Rb1 and the aryl group or the alkyl group represented by Rb2 or Rb3 has a substituent containing a sulfonyl group; and X? represents a counteranion.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: March 22, 2022
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hiroto Yamazaki, Masatoshi Arai, Yoshitaka Komuro
  • Patent number: 11281101
    Abstract: A resist composition comprising a base polymer and a quencher in the form of an ammonium salt compound having an iodized aromatic ring and a tertiary ester structure offers a high sensitivity and minimal LWR or improved CDU, independent of whether it is of positive or negative tone.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: March 22, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Takayuki Fujiwara, Masaki Ohashi
  • Patent number: 11275307
    Abstract: A resist composition including a resin component which exhibits changed solubility in a developing solution under action of acid, the resin component including a structural unit represented by general formula (a0) shown below in which Vax0 represents a single bond or a divalent linking group; Wa represents a divalent aromatic hydrocarbon group which may have a substituent; Ya0 represents a carbon atom; Xa0 represents a group which forms a cyclic hydrocarbon group together with Ya0; Ra00 represents a hydrocarbon group which may have a substituent; provided that at least one of Xa0 and Ra00 has a carbon atom constituting a carbon-carbon unsaturated bond at an ?-position of Ya0.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: March 15, 2022
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Masatoshi Arai, Takaya Maehashi, Koshi Onishi
  • Patent number: 11268115
    Abstract: In a method for generating an elongated nucleic acid molecule, a nucleic acid addition of a first nucleic acid molecule attached to a first 3? or 5? protecting group to a nucleic acid immobilized on a surface produces an intermediate-length immobilized nucleic acid. The first protecting group is dissociated from the first nucleic acid molecule. A second nucleic acid molecule that is attached to a second associated a 3? or 5? associated protecting group is added to the intermediate-length nucleic acid. The second associated protecting group is dissociated from the second nucleic acid molecule. A sequentially-extended elongated immobilized nucleic acid molecule having a desired sequence and length is produced by sequentially extending the intermediate-length immobilized nucleic acid by adding additional nucleic acid molecules with associated protecting groups to the intermediate-length nucleic acid and dissociating the associated protecting group after each addition.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: March 8, 2022
    Assignee: Massachusetts Institute of Technology
    Inventors: Peter A. Carr, Brian Y. Chow, Joseph M. Jacobson, David W. Mosley, Christopher Emig
  • Patent number: 11262655
    Abstract: A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: March 1, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hitoshi Maruyama, Hideto Kato, Michihiro Sugo
  • Patent number: 11256170
    Abstract: The resist composition of the present invention contains one or more selected from compounds represented by specific formulae and resins obtained using these as monomers.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: February 22, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takumi Toida, Masatoshi Echigo, Takashi Sato, Youko Shimizu
  • Patent number: 11243467
    Abstract: The present invention employs a compound represented by the following formula (1) and/or a resin comprising the compound as a constituent: wherein R1 is a 2n-valent group of 1 to 60 carbon atoms or a single bond; R2 to R5 are each independently a linear, branched, or cyclic alkyl group of 1 to 10 carbon atoms, an aryl group of 6 to 10 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, an alkoxy group of 1 to 30 carbon atoms, a halogen atom, a thiol group, a hydroxy group, or a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group, provided that at least one selected from R2 to R5 is a group in which a hydrogen atom of a hydroxy group is replaced with an acid dissociation group; m2 and m3 are each independently an integer of 0 to 8; m4 and m5 are each independently an integer of 0 to 9, provided that m2, m3, m4, and m5 are not 0 at the same time; n is an integer of 1 to 4; and p2 to p5 are each independently an integer of 0 to 2.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 8, 2022
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takumi Toida, Youko Shimizu, Takashi Makinoshima, Takashi Sato, Masatoshi Echigo
  • Patent number: 11231650
    Abstract: A negative resist composition comprising an onium salt of arenesulfonic acid having a bridged ring-containing group and a base polymer is provided, the onium salt being capable of generating a bulky acid having an appropriate strength and controlled diffusion. When the resist composition is processed by lithography, a dot pattern of rectangular profile having high resolution and reduced LER is formed.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: January 25, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masaaki Kotake, Satoshi Watanabe, Keiichi Masunaga
  • Patent number: 11226558
    Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: January 18, 2022
    Inventors: Kahee Shin, Eun-Young Lee, Jong-Ho Na, Geun Huh
  • Patent number: 11226560
    Abstract: A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: January 18, 2022
    Assignee: HD MICROSYSTEMS, LTD.
    Inventors: Nobuyuki Saito, Yukari Koibuchi, Yutaka Namatame
  • Patent number: 11221557
    Abstract: A resist composition containing a compound represented by the general formula (bd1-1), (bd1-2) or (bd1-3); in the formula, Rx1 to Rx4 represent a hydrocarbon group or a hydrogen atom or may be mutually bonded to form a ring structure; Ry1 to Ry2 represent a hydrocarbon group or a hydrogen atom or may be mutually bonded to form a ring structure, Rz1 to Rz4 represent a hydrocarbon group or a hydrogen atom or may be mutually bonded to form a ring structure. At least one of Rx1 to Rx4, Ry1 to Ry2 and Rz1 to Rz4 has an anion group, M1m+ represents a sulfonium cation having a sulfonyl group, R001 to R003 each independently represent a monovalent organic group; provided that at least one of R001 to R003 is an organic group having an acid dissociable group; and M3m+ represents an m-valent organic cation having an electron-withdrawing group.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: January 11, 2022
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Takuya Ikeda, Masahiro Shiosaki, Masatoshi Arai, Yoshitaka Komuro