Abstract: It is disclosed a method of forming fine patterns comprising: covering a substrate having photoresist patterns thereon made of a photoresist composition which is sensitive to high energy light rays with wavelength of 200 nm or shorter or electron beam radiation, with an over-coating agent for forming fine patterns, applying heat treatment to cause thermal shrinkage of the over-coating agent so that the spacing between adjacent photoresist patterns is lessened by the resulting thermal shrinking action, and removing the over-coating agent substantially completely. The present invention provides a method of forming fine patterns whereby fine patterns having pattern width or diameter of 100 nm or shorter and being excellent in uniformity (in-plane uniformity), etc. can be formed by ultrafine processing using high energy light rays with wavelength of 200 nm or shorter or electron beams.

Abstract: In the field of semiconductor production using shaped charged particle beam lithography, a method and system for fracturing or mask data preparation or proximity effect correction is disclosed, wherein a series of curvilinear character projection shots are determined for a charged particle beam writer system, such that the set of shots can form a continuous track, possibly of varying width, on a surface. A method for forming a continuous track on a surface using a series of curvilinear character projection shots is also disclosed. Methods for manufacturing a reticle and for manufacturing a substrate such as a silicon wafer by forming a continuous track on a surface using a series of curvilinear character projection shots is also disclosed.

Abstract: A semiconductor lithography process. A photoresist film is coated on a substrate. The photoresist film is subjected to a flood exposure to blanket expose the photoresist film across the substrate to a first radiation with a relatively lower dosage. The photoresist film is then subjected to a main exposure using a photomask to expose the photoresist film in a step and scan manner to a second radiation with a relatively higher dosage. After baking, the photoresist film is developed.

Abstract: A fluorinated monomer has formula (1) wherein R1 is H, F, methyl or trifluoromethyl, R2 and R3 are H or a monovalent hydrocarbon group, R4 to R6 each are a monovalent fluorinated hydrocarbon group, A is a divalent hydrocarbon group, and k1 is 0, 1 or 2. A polymer derived from the fluorinated monomer may be endowed with appropriate water repellency, water slip, acid lability and hydrolysis and is useful as an additive polymer in formulating a resist composition.

Abstract: An average write speed M is calculated by averaging write speeds for blocks of a tentative block size La, and write speed variation ? of the blocks with respect to the average write speed M is calculated (Step S12). A maximum speed Vmax is calculated by accelerating and then decelerating (or decelerating and then accelerating) a stage when moving the stage by the width of one of the blocks of the tentative block size La (Step S13). When the relationship “Vmax?M??” does not hold, the tentative block size La is increased (Step S15). When the relationship “Vmax?M??” holds, the tentative block size La is set as an optimal block size Lb (Step S16).

Abstract: When performing writing on a substrate applied with a resist by rapidly vibrating electron beam in a direction orthogonal to a radial direction of the substrate and X-Y deflecting the electron beam while rotating the substrate in one direction, a long element is written by scanning the electron beam with the middle position of a 2-bit signal length as the center position of the electron beam so as to completely fill the area of the writing length reduced by a predetermined ratio and an unwritten portion of predetermined width remaining on each side of the long element with respect to a final 2-bit signal length on a magnetic disk medium.

Abstract: The present invention relates to a structured monolayer that is composed of low-molecular aromatics and fully cross-linked in the lateral direction, the monolayer having a pattern of functional groups on one of the two surfaces, and to a method for preparing such a structured monolayer, as well as to the use thereof.

Abstract: A method is disclosed in which a plurality of variable shaped beam (VSB) shots is used to form a desired pattern on a surface. In this method some shots within the plurality of shots overlap each other. Additionally, the union of any subset of the plurality of shots differ from the desired pattern. In some embodiments, dosages of the shots vary with respect to each other. In other embodiments, an optimization technique may be used to minimize shot count. In yet other embodiments, the plurality of shots may be optionally selected from one or more pre-computed VSB shots or groups of VSB shots. The method of the present disclosure may be used, for example, in the process of manufacturing an integrated circuit by optical lithography using a reticle, or in the process of manufacturing an integrated circuit using direct write.

Abstract: In the field of semiconductor device production, a method for manufacturing a surface using two-dimensional dosage maps is disclosed. A set of charged particle beam shots for creating an image on the surface is determined by combining dosage maps for a plurality of shots into the dosage map for the surface. A similar method is disclosed for fracturing or mask data preparation of a reticle image. A method for creating glyphs is also disclosed, in which a two-dimensional dosage map of one or more shots is calculated, and the list of shots and the calculated dosage map are stored for later reference.

Abstract: A charged-particle beam instrument (such as a transmission electron microscope) which facilitates modifying the diameters of aperture stops installed above and below (on the beam entrance and exit sides) the specimen chamber and exchanging the aperture stops. The instrument has bottom polepieces forming the specimen chamber, aperture stops each having plural holes, pushing mechanisms for pushing the aperture stops against the polepieces and supporting the stops, and stop drive mechanisms for sliding the aperture stops in a direction perpendicular to the path of the beam in response to a manipulation performed outside the electron optical column. The aperture stops are made of a metal foil or sheet and provide a cover over the opening of at least one beam passage hole in the polepieces that faces into the specimen chamber.

Abstract: A method for manufacturing a semiconductor device using a photomask and optical lithography is disclosed, wherein circular patterns on the semiconductor wafer are formed by using circular patterns on the photomask, which is manufactured using a charged particle beam writer. In one embodiment, circular patterns of varying sizes have been formed on the photomask using a single character projection (CP) character, by varying the charged particle beam dosage. A method for fracturing circular patterns is also disclosed, either using circular CP characters or using VSB shots wherein the union of the plurality of VSB shots is different than the set of desired patterns.

Abstract: The invention relates to an elastomeric device (105), wherein the elastomeric device contains a relief structure with indentations with respect to the base (110), (102) and wherein selected ones of said indentations comprise at least two indentation depths (112), (108) and indentation widths (101), (107). It also relates to a method of making a master for construction of said elastomeric device comprising a procedure to provide a pattern on a substrate of a suitable material. One step in. the construction of said elastomeric device comprises a molding procedure of an elastomer. Methods of using the elastomeric device in printing, fluidic control, sorting, lab-on-a-chip devices are also disclosed.

Abstract: A novel approach to dry development of exposed photo resist is described in which a photo resist layer is exposed to a visible light source in order to remove the resist in the areas of exposure. The class of compounds used as the resist material, under the influence of the light source, undergoes a chemical/structural change such that the modified material becomes volatile and is thus removed from the resist surface. The exposure process is carried out for a time sufficient to ablate the exposed resist layer down to the layer below. A group of compounds found to be useful in this process includes aromatic calixarenes.

Abstract: A specified time is determined which is a worst-case (or the longest) time period assumed as a time interval required between the instant at which an interface block receives an exposed substrate from an exposure unit and the instant at which a post-exposure bake process of the substrate starts in a heating part. A waiting time is calculated by subtracting a transport time from the specified time. The transport time is a time interval actually required between the instant at which the interference block receives the substrate from the exposure unit and the instant at which the substrate reaches the heating part. The post-exposure bake process of the substrate starts in the heating part after a lapse of the above-mentioned calculated waiting time since the arrival of the substrate at the heating part.

Abstract: The invention relates to a method for enabling transmission of substantially equal amounts of energy from at least one light source (LS) comprising intensity variations in time to at least two light sensitive points (LSP), said transmission being controlled by means of at least one illumination arrangement (1), and said method comprising establishment of a correlation between said intensity variations and at least one feature of said illumination arrangement. The invention furthermore relates to an illumination arrangement (1) for controlling transmission of energy to at least two light sensitive points (LSP), wherein said controlling transmission enables transmission of substantially equal amounts of energy to each of said at least two light sensitive points (LSP).

Abstract: A chemically amplified negative resist composition is provided comprising (A) an alkali-soluble base polymer, (B) an acid generator, and (C) a nitrogen-containing compound, the base polymer (A) turning alkali insoluble under the catalysis of acid. A polymer having a fluorinated carboxylic acid onium salt on a side chain is included as the base polymer. Processing the negative resist composition by a lithography process may form a resist pattern with advantages including uniform low diffusion of acid, improved LER, and reduced substrate poisoning.

Abstract: An exposure method includes generating a reticle exposure pattern based on a target pattern, performing a lithography simulation based on the reticle exposure pattern to generate a simulation pattern that simulates a resist pattern formed by reticle exposure, generating differential data between the target pattern and the simulation pattern, generating a first electron-beam exposure pattern based on the differential data, generating a reticle based on the reticle exposure pattern, performing an optical exposure process with respect to a resist by use of the reticle, and performing an electron-beam exposure process with respect to the resist based on the first electron-beam exposure pattern.

Abstract: A chemically amplified positive resist composition is provided comprising a polymer PB having an amine structure bound thereto and a polymer PA comprising recurring units having an acidic side chain protected with an acid labile protective group and recurring units having an acid generating moiety on a side chain.

Abstract: A first resist film is formed on a substrate, and first pattern exposure is performed such that the first resist film is irradiated with exposure light through a first mask. Then, the first resist film is developed, thereby forming a first resist pattern out of the first resist film. Subsequently, a nano-carbon material is attached to the surface of the first resist pattern, and then a second resist film is formed on the substrate including the first resist pattern. Thereafter, second pattern exposure is performed such that the second resist film is irradiated with exposure light through a second mask. Then, the second resist film is developed, thereby forming a second resist pattern out of the second resist film.

Abstract: Apparatus and methods are disclosed herein for fabricating semiconductor device features with a half-pitch node of 22 nm and beyond using single exposure and single etch (1P1E) photolithography techniques. The method includes exposing in a single exposure a photoresist layer to the exposure source through a photolithography mask where the photolithography mask has on it an island pattern of a material having high percentage transmission. The photoresist layer is developed using a negative tone developer to form a hole pattern in the photoresist layer. The 1P1E does not require the second photo exposure of the double patterning method. Furthermore, the method circumvents the island pattern collapsing issues and the need for strong illumination associated with exiting single 1P1E processes.

Abstract: A lithography method is disclosed. An exemplary lithography method includes providing an energy sensitive resist material on a substrate; providing a desired pattern; performing a lithography process on the substrate, wherein the lithography process includes exposing the energy sensitive resist material to a charged particle beam, such that the desired pattern is transferred to the energy sensitive resist material; and directing the charged particle beam from an off state to a defocus state, wherein the defocus state compensates for the backscattered energy, thereby reducing proximity effects.

Abstract: A manufacturing process technology creates a pattern on a first layer using a focused ion beam process. The pattern is transferred to a second layer, which may act as a traditional etch stop layer. The pattern can be formed on the second layer without irradiation by light through a reticle and without wet chemical developing, thereby enabling conformal coverage and very fine critical feature control. Both dark field patterns and light field patterns are disclosed, which may enable reduced or minimal exposure by the focused ion beam.

Abstract: There is disclosed a sulfonium salt represented by the following general formula (1). In the formula, X and Y each represents a group having a polymerizable functional group; Z represents a divalent hydrocarbon group having 1 to 33 carbon atoms optionally containing a hetero atom; R1 represents a divalent hydrocarbon group having 1 to 36 carbon atoms optionally containing a hetero atom; and R2 and R3 each represents a monovalent hydrocarbon group having 1 to 30 carbon atoms optionally containing a hetero atom or R2 and R3 may be bonded with each other to form a ring together with a sulfur atom in the formula. There can be provided a sulfonium salt usable as a resist composition providing high resolution and excellent in LER in photolithography using a high energy beam such as an ArF excimer laser, an EUV light and an electron beam as a light source, a polymer obtained from the sulfonium salt, a resist composition containing the polymer and a patterning process using the resist composition.

Abstract: Concentrator and locator device (1) of a solute comprising a substrate (2) and a plurality of prismatic lithographic micro-structures (4) orthogonally emerging from the substrate (2). The microstructures (4) are spaced from one another in a periodical manner so as to make such a substrate (2) super-hydrophobic.

Abstract: A semiconductor hollow-core waveguide using high-contrast gratings or photonic crystal claddings and a method of manufacturing the same includes providing a layered semiconductor structure; creating an etching mask pattern over the layered semiconductor structure; performing a combined cycled directional etching process on the layered semiconductor structure in one sequence and in one lithography level to create a 3-dimensional waveguide structure; and creating a hollow air core in the layered semiconductor structure by removing to define a shape of the waveguide. The etching process comprises vertically etching a series of deep trenches on the layered semiconductor structure with precise control and varying the width of the trench. Furthermore, the hollow air core is created by removing a portion of the sacrificial material located in the center of the waveguide and under the waveguide.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes an arylsulfonium salt that when exposed to actinic rays or radiation, generates an acid, the arylsulfonium salt containing at least one aryl ring on which there are a total of one or more electron donating groups, the acid generated upon exposure to actinic rays or radiation having a volume of 240 ?3 or greater.

Abstract: A scanning electron microscope having a charged particle beam that when in a state being irradiated toward a sample, a voltage is applied to the sample so that the charged particle beam does not reach the sample. The scanning electron microscope also detects information on a potential of a sample using a signal obtained, and a device for automatically adjusting conditions based on the result of measuring.

Abstract: Exemplary embodiments provide materials and methods for polymer-based fixing members that have a textured surface with reduced surface energy and increased surface hydrophobicity.

Abstract: A positive resist composition is provided comprising an acid generator, a resin component which generates resin-solubilizing groups under the action of acid so that the resin component becomes soluble in an alkaline developer, at least some resin-solubilizing groups being carboxyl groups, and a compound for activating or condensing a carboxyl group. When processed by the lithography, the resist composition forms a resist pattern having a very high resolution and good mask fidelity.

Abstract: In the field of semiconductor production using shaped charged particle beam lithography, a method and system for fracturing or mask data preparation or proximity effect correction is disclosed, wherein a shot determined for a shaped charged particle beam writer system comprises dragging the charged particle beam across a surface during the shot, so as to form a complex pattern in a single, extended shot. The dragging may be done with either variable shaped beam (VSB) or character projection (CP) shots. Methods for specifying in the shot data the path for the dragged shot are also disclosed. Other embodiments include using dragged shots with partial projection, varying the dragging velocity during a shot, and combining dragged shots with conventional shots. A method and system for creating glyphs which contain dragged shots is also disclosed.

Abstract: A polymer comprising recurring units of formula (1) and having a solubility in alkaline developer which increases under the action of an alkaline developer is provided. The polymer has transparency to radiation of up to 200 nm and improved water repellency, water slip, acid lability and hydrolysis and is useful as an additive polymer to formulate a resist composition. R1 is H, F, methyl, or trifluoromethyl, R2 is a monovalent fluorinated hydrocarbon group, An is a (n+1)-valent hydrocarbon or fluorinated hydrocarbon group, and n is 1, 2 or 3.

Abstract: First, a resist film is formed on a substrate from a resist material including cyclic oligomer which does not contain any acid-labile group, is soluble in alkali, and is a trimer or a higher multimer; a molecular compound containing an acid-labile group; a photoacid generator; and no polymer. Then, pattern exposure is performed by selectively irradiating the formed resist film with exposure light of extreme ultraviolet. The resist film after the pattern exposure is heated, and then, the heated resist film is developed to form a resist pattern from the resist film.

Abstract: A method for optical proximity correction (OPC) of a desired pattern for a substrate is disclosed in which a plurality of variable shaped beam (VSB) shots are determined which can form on a surface an OPC-corrected version of the desired substrate pattern. Shots within the plurality of VSB shots are allowed to overlap each other. Dosages of the shots may also be allowed to vary with respect to each other. The union of the plurality of shots may deviate from the OPC-corrected version of the desired pattern for the substrate. In some embodiments, optimization may be used to minimize shot count. In other embodiments, the plurality of shots may be optionally selected from one or more pre-computed VSB shots or groups of VSB shots, that is, glyphs. A method for creating glyphs is also disclosed, in which patterns that would result on a surface from one or a group of VSB shots are pre-calculated.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes any of the compounds of general formula (I) below; wherein: Ar represents an aromatic ring that may have a substituent other than the -(A-B) groups; n is an integer of 1 or greater; A represents any one, or a combination of two or more members selected from a single bond, an alkylene group, —O—, —S—, —C(?O)—, —S(?O)—, —S(?O)2— and —OS(?O)2—, provided that —C(?O)O— is excluded; B represents a group containing a hydrocarbon group having 4 or more carbon atoms wherein either a tertiary or a quaternary carbon atom is contained, when n is 2 or greater, the two or more -(A-B) groups may be identical to or different from each other; and M+ represents an organic onium ion.

Abstract: In the exposure data preparation method for charged particle beam exposure in which an exposure object is exposed while dose is adjusted for each pattern, the method including the steps of: classifying a pattern in terms of a target linewidth; setting a standard characteristic showing the relationship between a standard dose and a resultant linewidth of a resist pattern for a group of patterns having the target linewidth; and preparing exposure data by correcting a shape and dose so that a characteristic showing the relationship between dose of each pattern having the target linewidth and a resultant linewidth of a resist pattern follows the standard characteristic.

Abstract: The invention relates to an extreme ultraviolet photolithography mask, operating in reflection, the mask comprising a substrate, a mirror structure deposited uniformly on the substrate, and an absorbent layer which is absorbent at the operating wavelength of the mask and is deposited on top of the mirror structure and etched in a desired masking pattern. The absorbent layer contains indium among its principal constituents.

Abstract: When writing elements of a fine pattern on a substrate applied with a resist by scanning an electron beam on the substrate, the electron beam is scan controlled so as to completely fill the shape of each of the elements by vibrating the electron beam rapidly in a radius direction of the rotation stage and at the same time deflecting in a direction orthogonal to the radius direction of the rotation stage faster than a rotational speed thereof, thereby sequentially writing the elements.

Abstract: Provided are radiation-sensitive polymers and compositions which may be used in photolithographic processes. The polymers and compositions provide enhanced sensitivity to activating radiation.

Abstract: In the field of semiconductor production using charged particle beam lithography, a method and system for fracturing or mask data preparation or proximity effect correction is disclosed, wherein base dosages for a plurality of exposure passes are different from each other. Methods for manufacturing a reticle and manufacturing an integrated circuit are also disclosed, wherein a plurality of charged particle beam exposure passes are used, with base dosage levels being different for different exposure passes.

Abstract: In the field of semiconductor production using charged particle beam lithography, a method and system for fracturing or mask data preparation or proximity effect correction is disclosed, wherein a plurality of exposure passes are used, and where the sum of the base dosage levels for all of the exposure passes does not equal a normal dosage. Methods for manufacturing a reticle and manufacturing an integrated circuit are also disclosed, wherein a plurality of charged particle beam exposure passes are used, and where the sum of the base dosage levels for all of the exposure passes is different than a normal dosage.

Abstract: In the field of semiconductor production using charged particle beam lithography, a method and system for fracturing or mask data preparation or proximity effect correction is disclosed, in which the union of shots from one of a plurality of exposure passes is different than the union of shots from a different exposure pass. Methods for manufacturing a reticle and for manufacturing an integrated circuit are also disclosed, in which the union of shots from one of a plurality of charged particle beam exposure passes is different than the union of shots from a different exposure pass.

Abstract: Method and apparatus capable of observing a liquid sample. An optical image of the sample and an image using a primary beam, such as an electron beam or charged-particle beam, can be obtained at the same time. The apparatus has a film including a first surface on which the liquid sample is held. The primary beam irradiation column and optical image acquisition viewer are located on opposite sides of the film that acts to block light.

Abstract: In a multi-project-chip semiconductor device, semiconductor elements fabricated on a wafer have a layout that corresponds to an exposure order of a pattern of the semiconductor elements and that is based on information indicating manufacture conditions and the number of shots and are arranged such that the semiconductor elements having the same manufacture condition are adjacent to each other in ascending or descending order of the number of shots.

Abstract: A fluorinated monomer has formula (1) wherein R1 is H, F, methyl or trifluoromethyl, R2 is a monovalent hydrocarbon group which may have halogen or oxygen, A is a divalent hydrocarbon group, and k1 is 0, 1 or 2. A polymer derived from the fluorinated monomer may be endowed with appropriate water repellency, water slip, acid lability and hydrolysis and is useful as an additive polymer in formulating a resist composition.

Abstract: A method and apparatus for manufacturing a semiconductor device is disclosed. In particular, the application discloses a method that performs a lithography process using a material capable of increasing a depth of focus so as to prevent efficiency of the lithography process from being degraded due to high integration of a semiconductor device, and a pressure-type bake oven as an apparatus for forming a high refractive material on a semiconductor substrate, having advantages of reducing manufacturing costs of a semiconductor manufacturing process and increasing efficiency of the lithography process.

Abstract: To provide a new recording method and recording apparatus with respect to an optical recording medium, the recording method and recording apparatus being able to deal with a high density of an optical recording medium of recent years. Recording of a recording track and a prepit is carried out by sequentially deflecting a single beam.

Abstract: It is an object of the present invention to improve sensitivity of a resist made from hydrosilsesquioxane when a pattern is formed in the resist by irradiation with a charged particle beam. The method for improving sensitivity of a resist of the present invention is a method to improve sensitivity of a resist formed from hydrosilsesquioxane to a charged particle beam when a pattern is formed in the resist by irradiation with a charged particle beam, and is characterized by including prebaking a resist formed from hydrosilsesquioxane and applied onto a substrate at t° C. (20?t?300), applying a composition containing a water-soluble conductive polymer compound to a charged particle beam irradiation surface of the prebaked resist, baking the thus applied composition at T° C. (0?T<t+40) and then irradiating the resist with a charged particle beam.

Abstract: According to one embodiment, an electroforming master comprises a patterns of protrusions and recesses formed on one major surface of an Si substrate having two major surfaces, corresponding to information for positioning of a read/write head (a preamble, address, and burst), recording tracks or recording bits. Impurity ions are doped in the surface of this patterns of protrusions and recesses. The impurity ion concentration distribution in the film thickness direction of the Si substrate has a peak in a portion from the patterns of protrusions and recesses surface to a depth of 40 nm in the film thickness direction. The impurity concentration of this peak is 1×1020 to 2×1021 ions/cm3.

Abstract: According to one embodiment, patterns of protrusions and recesses includes a substrate including a conductive region on at least one major surface, and a projecting pattern layer formed on the conductive region on the major surface, and made of a microcrystalline material, a polycrystalline material, an amorphous material, or an oxide of the microcrystalline, polycrystalline, or amorphous material.

Abstract: Nanosubstrates as biosensors, methods of making such nanosubstrates, and methods of using such nanosubstrates to detect biomarkers are described.