Abstract: A composition, method, and article of manufacture are disclosed. The composition is a microcapsule that includes a transparent shell encapsulating a mixture comprising light upconversion molecules. The method is a method of forming a microcapsule, which includes obtaining light upconversion molecules, forming an emulsion of the light upconversion molecules and a shell formation solution, and encapsulating the light upconversion molecules in a transparent shell. The article of manufacture comprises the microcapsule.

Abstract: Methods and apparatus comprising a dewetting phase and a polymerization liquid that are immiscible, and can be used for the formation of three-dimensional objects, wherein the method does not require a dead zone. Additionally, methods and apparatus that employ an optically transparent cooling apparatus to mitigate heat generated during the fabrication process, and the use of a mobile phase to provide a shearing interface to reduce interfacial adhesive forces.

Abstract: A method for forming a photomask includes the following steps. A first target pattern is provided, wherein the first target pattern includes a first pattern area and a second pattern area. The first pattern area includes a block pattern. The second pattern area includes multiple stripe patterns. A first sidewall reset area is defined in the second pattern area. A retarget procedure is executed on the first target pattern to obtain a second target pattern. The photomask is formed based on the second target pattern.

Abstract: A reflective mask includes a substrate, a lower reflective multilayer disposed over the substrate, an intermediate layer disposed over the lower reflective multilayer, an upper reflective multilayer disposed over the intermediate layer, a capping layer disposed over the upper reflective multilayer, and an absorber layer disposed in a trench formed in the upper reflective layers and over the intermediate layer. The intermediate layer includes a metal other than Cr, Ru, Si, Si compound and carbon.

Abstract: A semiconductor device includes a plurality of wirings each having a damascene structure on a semiconductor layer, wherein the plurality of wirings includes a first wiring and a second wiring adjacent to each other, wherein the first wiring includes, along a direction in which the first wiring extends, a first portion, a second portion, and a third portion located between the first portion and the second portion, and wherein a width of the third portion is larger than each of a width of the first portion and a width of the second portion.

Abstract: A method of forming an inorganic film on a surface can include depositing a polymer at a layer on a surface, swelling the polymer with a solvent to produce a swollen polymer on the surface, infiltrating the swollen polymer with a precursor, removing the swollen polymer after infiltrating the swollen polymer with the precursor, and forming a porous inorganic film on the surface based on removing the swollen polymer.

Abstract: A patterning method includes forming a multilayer photoresist stack on a substrate. The multilayer photoresist stack includes a first layer of a wet photoresist, deposited by spin-on deposition, over a second layer of a dry photoresist, deposited by vapor deposition. The multilayer photoresist stack is exposed to a first pattern of actinic radiation including relative, spatially-varying doses of actinic radiation and including high-dose regions, mid-dose regions and low-dose regions. The multilayer photoresist stack and the first pattern of actinic radiation are configured such that after the exposing the multilayer photoresist stack to the first pattern of actinic radiation, in the high-dose regions, developability of both the first layer and the second layer is changed; in the mid-dose regions, developability of the first layer is changed while developability of the second layer is unchanged; in the low-dose regions, developability of both the first layer and the second layer is unchanged.

Abstract: A method of forming a part includes 3D printing a photopolymerizable resin and forming a preformed part and subsequently post-curing the preformed part with electron beams. The preformed part may be cured via UV curing. A section of the preformed part post-cured with electron beams may have a thickness of at least 1.0 centimeter, for example, at least 2.0 centimeters or at least 3.0 centimeters. An electron beam dosage to post-cure the preformed part may be between 10 kilogray (kGy) and 100 kGy. The preformed part may be 3D printed using stereolithography (SLA), digital light processing (DLP) or material jetting (MJ) and the photopolymerizable resin may include at least one of an acrylate functional polymer and a methacrylate functional polymer. In the alternative, or in addition to, the photopolymerizable resin may include at least one of a urethane, a polyester, and a polyether.

Abstract: Methods of fabricating an object via direct laser lithography are provided. In embodiments, such a method comprises illuminating, via an optical fiber having an end facet and a metalens directly on the end facet, a location within a photosensitive composition from which an object is to be fabricated with light, thereby inducing a multiphoton process within the photosensitive composition to generate a region of the object; and repeating the illuminating step one or more additional times at one or more additional locations to generate one or more additional regions of the object.

Abstract: This application describes kits, methods, and systems of three dimensional printing. In some examples, described herein are three-dimensional object printing kits comprising a metallic or a ceramic build material, a polymeric binder dispersed in an aqueous liquid vehicle, and a boundary fluid comprising thermally expandable particles.

Abstract: An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units through a conductive pad. Each of the resilient conductive pillars is a conductive photoresist.

Abstract: An apparatus for manufacturing semiconductors includes a power amplifier to power a laser, a catalyst disposed in the power amplifier, an inlet port, and an exhaust port. The inlet port introduces a mixing gas to an interior of the power amplifier during a cleaning operation so that the mixing gas contacts a surface of the catalyst having a build-up thereon. The mixing gas reacts with and removes the build-up by generating gaseous by-products. The exhaust port removes the gaseous by-products from the power amplifier.

Abstract: An electrically operated smoking device configured to receive a smoking article is provided, including: a housing defining a cavity configured to at least partially receive the smoking article; and an image sensor configured to detect indicia on the smoking article, the image sensor being disposed on a periphery of the cavity and including a light source, an image detector, and a plurality of microlenses held in a support structure, the plurality of microlenses being configured to provide a mosaic of inverted images on the image detector. A smoking system is also provided.

Abstract: A method of forming a three-dimensional object includes: providing a carrier and an optically transparent member having a build surface, the carrier and the build surface defining a build region therebetween; filling the build region with a polymerizable liquid, irradiating the build region with light through the optically transparent member to form a solid polymer from the polymerizable liquid, and advancing said carrier away from said build surface to form said three-dimensional object from said solid polymer. The irradiating step includes projecting focused light at the build region, and the advancing step is carried out at a rate that is dependent on an average light intensity of the focused light.

Abstract: A method of imprinting a pattern on a substrate is provided. The method includes forming a first pattern on a plurality of masters using a method other than imprinting, the first pattern including a plurality of patterned features of varying sizes; measuring the patterned features at a plurality of locations on each of the masters; selecting a first master of the plurality of masters based on the measurements of the patterned features on each of the masters; using the first master to form a second pattern on an imprint template; and imprinting the first pattern on a first device with the imprint template.

Abstract: The present invention relates to an information storage medium and a method for long-term storage of information comprising the steps of: providing a ceramic substrate; coating the ceramic substrate with a layer of a second material different from the material of the ceramic substrate, the layer having a thickness no greater than 10 ?m; tempering the coated ceramic substrate to form a writable plate or disc; encoding information on the writable plate or disc by using a laser and/or a focused particle beam to manipulate localized areas of the writable plate or disc.

Abstract: An apparatus dispenses a raw material in liquid form into a manufacturing zone. The raw material is, by computer-controlled, point-by-point targeted light irradiation, heated and solidified by the region of incidence of a light beam relative to the manufacturing zone being altered in a continuous and/or in a step-by-step manner. The light beam is emitted from the light beam source, or from an optical unit influencing the light of the light beam source, with a substantially ring-shaped light intensity profile. The ring-shaped light intensity profile is formed by a ring-shaped region in which the light intensity initially increases in the direction toward the center of the ring from the outer diameter and then drops off again toward the inner diameter of the ring, with the light intensity being equal to zero in the interior region of the ring.

Abstract: A method for correcting a semiconductor mask pattern includes steps as follows: A pattern to be corrected in the semiconductor mask pattern is divided into a plurality of sub-blocks that are symmetrical to and coincide with each other. Then, an optical proximity correction (OPC) step is performed on one of the plurality of sub-blocks to obtain a modified template. At least one copy template is generated according to the modified template corresponding to the other ones of the plurality of sub-blocks. The modified template and the at least one copy template are spliced to form a correcting pattern to replace the original pattern to be corrected.

Abstract: A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.

Abstract: The present invention relates to a method for additive manufacturing of a 3D-structured form and to a device for additive manufacturing of a 3D-structured form.

Abstract: A mask material is deposited on a substrate or growth template. The substrate or growth template is compatible with crystalline growth of a crystalline optical material. Patterned portions of the mask material are removed to expose one or more regions of the substrate or growth template. The one or more regions have target shapes of one or more optical components. The crystalline optical material is selectively grown in the one or more regions to form the one or more optical components.

Abstract: A reflective mask blank for EUV lithography includes a substrate and, formed on or above the substrate in the following order, a reflective layer for reflecting EUV light, a protective layer for the reflective layer, an absorption layer for absorbing EUV light, and a hard mask layer. The protective layer contains ruthenium (Ru), the absorption layer contains tantalum (Ta), the hard mask layer contains chromium (Cr) and at least one of nitrogen (N) and oxygen (O), and the hard mask layer has a film density of from 3.00 g/cm3 to 5.40 g/cm3.

Abstract: Embodiments relate to an electronic circuit implemented using a first integrated circuit die, a second integrated circuit die, and an interposer connecting the first integrated circuit die to the second integrated circuit die. The first integrated circuit die implements a first electronic circuit. The first integrated circuit die includes a first set of contacts on a bottom surface, a buried power rail (BPR), and a plurality of through-silicon vias (TSV) for connecting the BPR to the first set of contacts. The interposer includes a second set of contacts and a power delivery network (PDN). Each contact of the second set of contact corresponds to a contact of the first set of contacts of the first integrated circuit die. The PDN is configured to route a power supply voltage to the second set of contacts.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The method includes: providing a substrate; forming, on the substrate, a first mask layer having a plurality of strip-shaped first patterns arranged in parallel; forming, on the first mask layer, a second mask layer having a plurality of strip-shaped second patterns arranged in parallel; forming, on the second mask layer, a third mask layer having a plurality of strip-shaped third patterns arranged in parallel, the second patterns overlap with the third patterns, and the second patterns and the third patterns are configured to sever the first patterns at predetermined positions; and performing layer-by-layer etching, using the first mask layer, the second mask layer, and the third mask layer as masks to transfer the first patterns, the second patterns, and the third patterns to the substrate to form an array of discrete active areas.

Abstract: An integrated circuit includes a plurality of transistors and an interlevel dielectric layer formed over the transistors. The interlevel dielectric layer includes a first region and a second region with a higher dielectric constant than the first region. The difference in dielectric constant is produced by curing the first region shielding the second region from the curing. Metal signal lines are formed in the first region. Metal-on-metal capacitors are formed in the second region.

Abstract: A mask includes a body unit through which a deposition opening is defined, and a protrusion unit through which a pattern opening is defined and which protrudes from a corner of the body unit, where a thickness of the body unit is greater than a thickness of the protrusion unit.

Abstract: A blankmask for EUV lithography includes a substrate, a reflective layer, a capping layer, and a phase shift layer. The phase shift layer is made of a material containing ruthenium (Ru) and chromium (Cr), and a total content of ruthenium (Ru) and chromium (Cr) is 50 to 100 at %. The phase shift layer may further contain boron (B) or nitrogen (N). The phase shift layer of the present invention has a high relative reflectance (relative reflectance with respect to a reflectance of the reflective layer under the phase shift layer) with respect to a tantalum (Ta)-based phase shift layer and has a phase shift amount of 170 to 230°. It is possible to obtain excellent resolution when finally manufacturing a pattern of 7 nm or less by using a photomask manufactured using such a blankmask.

Abstract: A touch sensor includes a sensing part in which a plurality of sensing cells is arranged and connected and a wiring part connected to the sensing part and formed outside the sensing part. The wiring part includes a first divisional wiring part having a plurality of first divisional wires having a connecting protrusion with a width larger than that of the wiring at one end thereof and a second divisional wiring part having a plurality of second divisional wires having one end thereof with a width smaller than that of the connecting protrusion and coupled to and overlapped with the connecting protrusion. The first divisional wiring part and the second divisional wiring part are formed by divisional exposure.

Abstract: A method of managing a critical dimension error includes (i) defining, in a photomask, N openings having a width, where N is a natural number, (ii) using graphs for each of the N openings, each of the graphs being obtained by setting locations through an opening of the N openings as a first axis and an intensity of transmitting light as a second axis, obtaining ILSi proportional to an inclination of a tangent to a graph of the graphs at a location corresponding to an edge of an opening and Ii which is an intensity of transmitting light at the location, where i is a natural number from 1 to N, (iii) obtaining, with respect to each of the N openings, a real width CDi of the openings, and (iv) when I a ? v ? e = 1 N ? ? i = 1 N ? I i , CD a ? v ? e = 1 N ? ? i = 1 N ? CD i ? ? and ? ? ILS a ? v ? e = 1 N ? ? i = 1 N ? ILS i , obtaining AIMEEFi which is an aerial image mask error enhancement factor with respect to each of the N openings accordi

Abstract: A display device may include a display panel, an input sensing unit, and an alignment structure. The display panel may include a sealing member. The input sensing unit may be disposed on the display panel. The input sensing unit may include first-type sensor electrodes directly contacting a face of a first insulator of the display device, a first-type connector electrically connecting the first-type sensor electrodes, second-type sensor electrodes directly contacting the face of the first insulator of the display device, and a second-type connector electrically connecting the second-type sensor electrodes. The alignment structure may overlap the sealing member and may include a transparent member that directly contacts the face of the first insulator of the display device.

Abstract: A mask for use in a semiconductor lithography process includes a substrate, a mask pattern disposed on the substrate, and a light absorbing border surrounding the mask pattern. The light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the light absorbing border. In some designs, a first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate, and a second peripheral region that extends from the outer perimeter of the light absorbing border to a second edge of the substrate, where the first edge of the substrate and the second edge of the substrate are on opposite sides of the mask pattern.

Abstract: The invention pertains to a photosensitive element, particularly a photopolymerizable printing form precursor; a method of preparing the photosensitive element to form a printing form for use in relief printing; and, a process of making the photosensitive element. The printing form precursor includes a layer of a photosensitive composition, a digital layer that is adjacent to a side of the photosensitive layer, and a cell pattern layer that is disposed between the photosensitive layer and the digital layer. The cell pattern layer includes a plurality of features in which each feature an area between 5 to 750 square microns and is composed of an ink that is opaque to actinic radiation and transparent to infrared radiation. Since the cell pattern layer is integral with the printing form precursor, digital imaging can occur rapidly with relatively low resolution optics to form a mask without needing to also form a microcell pattern of the digital layer.

Abstract: Methods and apparatus for an assembly having directly bonded first and second wafers where the assembly includes a backside surface and a front side surface. The first wafer includes IO signal connections vertically routed to the direct bonding interface by a first one of the bonding posts on the first wafer bonded to a first one of the bonding posts on the second wafer. The second wafer includes vertical routing of the IO signal connections from first one though the bonding posts on the second wafer to IO pads on a backside surface of the assembly.

Abstract: A grating structure, a manufacturing method thereof and a display device are provided. The method of manufacturing the grating structure includes: forming a photosensitive material layer on a substrate; patterning the photosensitive material layer to form a grating transition pattern, where the grating transition pattern includes multiple grating units, the multiple grating units each include a first portion and a second portion which are symmetric, and at least one of the first portion and the second portion includes multiple subunits to have a stepped structure; and curing the grating transition pattern to form the grating structure.

Abstract: Aspects of the present disclosure are directed to fabrication of large-footprint chips having integrated photonic components comprising low-loss optical waveguides. The large footprint chips require the use of multiple reticles during fabrication. Stitching adjacent reticle fields seamlessly is accomplished by overlaying into adjacent reticle fields, tapering waveguide ends, and using strategically placed alignment marks in the die.

Abstract: Described herein are methods, systems and apparatus (including associated control methods, systems and apparatus), for the production of a three-dimensional object by “bottom up” additive manufacturing, in which a carrier is vertically reciprocated with respect to a build surface, to enhance or speed the refilling of the build region with a solidifiable liquid. In preferred (but not necessarily limiting) embodiments, the three-dimensional object is produced from a liquid interface by continuous liquid interface production (i.e., “CLIP”).

Abstract: A light sheet imaging system, such as a light sheet microscope, comprises an illumination arrangement for generating a light sheet for three-photon excitation of a fluorescent sample, and a fluorescence collection arrangement for collecting fluorescence generated in the sample as a result of three-photon excitation by the light sheet. The light sheet may be a non-diffractive, propagation-invariant light sheet. The light sheet may be formed from and/or comprise a Bessel beam. A method of light sheet imaging comprises using a light sheet for three-photon excitation of a fluorescent sample, and collecting fluorescence generated in the sample as a result of three-photon excitation of the sample by the light sheet. Such a method may be used for light sheet microscopy.

Abstract: A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.

Abstract: Systems and processes for making a flexo plate, and plates made thereby. Non-printing indicia defined by areas of presence and absence of polymer in the plate floor created using microdots imaged during a LAMS layer imaging step are readable downstream of the washing or other non-cured-polymer-removal step but not to print in the printing step. The non-printing indicia may define a repeating pattern of alphanumeric characters, non-text graphics, or a combination thereof. A difference in growth of plate structures corresponding to different types of microdots may be used for characterizing processing conditions.

Abstract: A method of imprinting a pattern on a substrate is provided. The method includes forming a first pattern on a plurality of masters using a method other than imprinting, the first pattern including a plurality of patterned features of varying sizes; measuring the patterned features at a plurality of locations on each of the masters; selecting a first master of the plurality of masters based on the measurements of the patterned features on each of the masters; using the first master to form a second pattern on an imprint template; and imprinting the first pattern on a first device with the imprint template.

Abstract: An apparatus is configured to receive input image data corresponding to output image data of a first radiology scanner device, translate the input image data into a format corresponding to output image data of a second radiology scanner device and generate an output image corresponding to the translated input image data on a post processing imaging device associated with the first radiology scanner device. Medical images from a new scanner can be translate to look as if they came from a scanner of another vendor.

Abstract: In a method of optimizing a lithography model in a lithography simulation, a mask is formed in accordance with a given layout, a wafer is printed using the mask, a pattern formed on the printed wafer is measured, a wafer pattern is simulated using a wafer edge bias table and the given mask layout, a difference between the simulated wafer pattern and the measured pattern is obtained, and the wafer edge table is adjusted according to the difference.

Abstract: Disclosed are a photomask, an exposure apparatus, and a method of fabricating a three-dimensional semiconductor memory device using the same. The photomask may include a mask substrate, a first mask pattern on the mask substrate, and an optical path modulation substrate. The optical path modulation substrate may include a first region on a portion of the first mask pattern, and a second region on another portion of the first mask pattern. The second region has a thickness that is less than a thickness of the first region.

Abstract: A layer-by layer method for additive manufacturing that includes: photocuring a first volume of resin to form a layer of a build at an upper surface of a separation membrane laminated over a build window; injecting a fluid into an interstitial region between the separation membrane and the build window; retracting the build from the build window; evacuating the fluid from the interstitial region; and photocuring a second volume of liquid resin to form a subsequent layer of the build between an upper surface of a separation membrane and the previous layer of the build.

Abstract: A system and method for providing three-dimensional printing is disclosed. The three-dimensional printing technology includes enhanced functionality to provide better resolution printing, filtration of forming materials stored within a reservoir tank, and a simple and efficient cleaning process to remove debris from the reservoir subsequent to a printing cycle.

Abstract: A system and method for continuous additive manufacturing of objects is provided. The system includes a container configured to receive a photopolymer and a print bed disposed within the container. An first end effector is movably disposed within the container. A light source is operably coupled to the first end effector, the light source being configured to emit and electromagnetic radiation. Wherein at least one of the print bed or first end effector is movable relative to the other to perform continuous separation curing of the photopolymer on the print bed with the electromagnetic radiation.

Abstract: A waveguide display includes a waveguide and a grating coupler configured to couple display light into or out of the waveguide. The grating coupler includes at least a first grating layer and a second grating layer arranged in a stack. The first grating layer is characterized by a first thickness and includes a first transmission VBG configured to diffract display light of a first wavelength from a first field of view. The second grating layer is characterized by a second thickness greater than the first thickness and includes a second transmission VBG configured to diffract display light of the first wavelength from a second field of view greater than the first field of view.

Abstract: A method of manufacturing a display device in a chamber in which a material including yttrium is coated on an inner surface includes: forming a first layer pattern by dry etching on a substrate; depositing a second layer material on the first layer pattern; forming a photoresist pattern on the second layer material; completing a second layer pattern by using the photoresist pattern as an etch mask; and performing an additional acid etching process by using an etching solution including at least one of hydrochloric acid, sulfuric acid, or nitric acid before the forming of the photoresist pattern on the second layer material after the dry etching to form the first layer pattern.

Abstract: A method for forming openings in an underlayer includes: forming a photoresist layer on an underlayer formed on a substrate; exposing the photoresist layer; forming photoresist patterns by developing the exposed photoresist layer, the photoresist patterns covering regions of the underlayer in which the openings are to be formed; forming a liquid layer over the photoresist patterns; after forming the liquid layer, performing a baking process so as to convert the liquid layer to an organic layer in a solid form; performing an etching back process to remove a portion of the organic layer on a level above the photoresist patterns; removing the photoresist patterns, so as to expose portions of the underlayer by the remaining portion of the organic layer; forming the openings in the underlayer by using the remaining portion of the organic layer as an etching mask; and removing the remaining portion of the organic layer.

Abstract: A build plate for a three-dimensional printer includes: a rigid, optically transparent, gas-impermeable planar base having an upper surface and a lower surface; and a flexible, optically transparent, gas-permeable sheet having an upper and lower surface, the sheet upper surface comprising a build surface for forming a three-dimensional object, the sheet lower surface positioned on the base upper surface. The build plate includes a gas flow enhancing feature configured to increase gas flow to the build surface.