Abstract: A refractory article having a support structure including a first plurality of posts coupled by a first member; and a second plurality of posts substantially parallel with the first plurality of posts, the second plurality of posts coupled by a second member, wherein the support structure has a height, H, and wherein the first and second members are positioned between 0.3H and 0.7H. In another aspect, the support structure has a height to width ratio of at least 1.5, a stiffness factor of no greater than 100 mm, and a solid to open volume ratio of no greater than 5%. In another aspect, the support structure has a weight of no greater than 1200 kg, a stiffness factor of no greater than 100 mm, and a solid to open volume ratio of no greater than 5%.

Abstract: Contamination of a bottom surface of a substrate caused by a processing liquid used for cleaning a top surface of the substrate can be suppressed. After performing a liquid processing on the top surface of the substrate and a liquid processing on the bottom surface of the substrate in parallel while rotating the substrate by a substrate holding/rotating unit, when stopping the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, a control unit 18 stops a supply of the processing liquid onto the top surface of the substrate by a first processing liquid supply device 73, and then, stops a supply of the processing liquid onto the bottom surface of the substrate by a second processing liquid supply device 71.

Abstract: In one embodiment, a fixture for supporting a body in an oven includes a plurality of support ribs to support the body, and a support element to support and connect the plurality of support ribs. Each support rib has a length, a width, a thickness, and a first end. The length extends from the support element to the first end, and the width extends perpendicular to the length. The length varies across the width of at least one support rib. In another embodiment, a fixture for supporting a body in an oven includes a plurality of connected support ribs to support the body. Each support rib is spaced from at least one other support rib. The length differs for at least a first support rib of the plurality of support ribs with respect to at least a second support rib of the plurality of support ribs.

Abstract: A support ring for semiconductor processing is provided. The support ring includes a ring shaped body defined by an inner edge and an outer edge. The inner edge and outer edge are concentric about a central axis. The ring shaped body further includes a first side, a second side, and a raised annular shoulder extending from the first side of the ring shaped body at the inner edge. The support ring also includes a coating on the first side. The coating has an inner region of reduced thickness region abutting the raised annular shoulder.

Abstract: In a dental furnace having a firing chamber (12) with a base and at least one receiving portion for dental restoration parts (40). The receiving portion has a plurality of support elements (26) that are arranged adjacent to one another and in particular have the same thickness, wherein said support elements (26) support the dental restoration part (40) during the firing process.

Abstract: An assembly for providing a saggar for use in high temperature applications, may include a rectangular base element and first and second sets of two rectangular wall elements, wherein the rectangular base element includes connectors on two opposite sides for connecting with the two rectangular wall elements of the first set of the rectangular wall elements at the two opposite sides. The two rectangular wall elements of the first set may each include a connector at a first edge for connecting with the rectangular base element at the two opposite sides, and the two rectangular wall elements of the first set each may include two recesses in a second edge opposite to the first edge and in the vicinity of each end of the second edge of the rectangular wall elements of the first set. The two rectangular wall elements may each include two ears for connecting with the recesses.

Abstract: A refractory article having a support structure including a first plurality of posts coupled by a first member; and a second plurality of posts substantially parallel with the first plurality of posts, the second plurality of posts coupled by a second member, wherein the support structure has a height, H, and wherein the first and second members are positioned between 0.3H and 0.7H. In another aspect, the support structure has a height to width ratio of at least 1.5, a stiffness factor of no greater than 100 mm, and a solid to open volume ratio of no greater than 5%. In another aspect, the support structure has a weight of no greater than 1200 kg, a stiffness factor of no greater than 100 mm, and a solid to open volume ratio of no greater than 5%.

Abstract: An assembly for providing a saggar for use in high temperature applications, may include a first substantially rectangular base element and two sets of two substantially rectangular side elements, wherein the side elements of each set of side elements have at least one dimension corresponding to dimensions of first and second opposite edges of the base element. The assembly may also include four corner elements and fasteners, wherein the base element and the side elements are configured to be assembled into a box-shaped saggar and secured to one another using the corner elements and the fasteners, and wherein the first base element is made of a corrosion resistant material.

Abstract: The present disclosure relates to a substrate storage rack, including a hollow rack body with a first, a second, a third, and a fourth lateral surfaces, wherein at least one substrate laying layer is arranged in the rack body along a vertical direction. The substrate laying layer includes: a first support connected with the rack body and arranged at the second lateral surface; first supporting bars transversely arranged on the first support and extending to the interior of the rack body; a second support connected with the rack body and arranged at the fourth lateral surface; and second supporting bars transversely arranged on the second support and extending to the interior of the rack body. Since the first and the second supporting bars are arranged on the second and the fourth lateral surfaces of the rack body respectively, storing substrates in the rack body can be ensured.

Abstract: An elastic retention wheel and a wafer adapter containing this wheel are disclosed. The elastic retention wheel comprises: a rim; a retention main body positioned within the rim; and a plurality of spokes. Each spoke is positioned in a space between the rim and the retention main body. One end of each spoke is coupled to the retention main body, and the other end is coupled to the rim. A sliding rail can be provided on an inner side of the rim, and the spoke's other end can slide with the sliding rail. When the elastic retention wheel is stressed by a non-uniform or excessive external force, these spokes provide enhanced support from the rim's inner side, or at least partially disperse the non-uniform external force applied to the elastic retention wheel. Thereby, the elastic retention wheel is largely kept from over-deformation or cracking.

Abstract: A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and contracts due to heating and cooling. By increasing the contact area to the substrate and by using quartz on items that contact the substrate, it is possible to prevent scratches occurring on a substrate, even after an etching process of the substrate, thereby improving quality of the slimmer final product.

Abstract: Disclosed herein are a ceramic substrate, a firing setter, and a manufacturing method of a ceramic substrate using the same. According to the present invention, there is provided a ceramic substrate including: a first substrate concave-convex part formed on a lower surface thereof and having a first substrate roughness; and a second substrate concave-convex part formed on an upper surface thereof and having a second substrate roughness.

Abstract: A system and method for maintain a desired degree of platen flatness is disclosed. A laser system is used to measure the flatness of a platen. The temperature of the platen is then varied to achieve the desired level of flatness. In some embodiments, this laser system is only used during a set up period and the resulting desired temperature is then used during normal operation. In other embodiments, a laser system is used to measure the flatness of the platen, even while the workpiece is being processed.

Abstract: A refractory article having a support structure including a first plurality of posts coupled by a first member; and a second plurality of posts substantially parallel with the first plurality of posts, the second plurality of posts coupled by a second member, wherein the support structure has a height, H, and wherein the first and second members are positioned between 0.3H and 0.7H. In another aspect, the support structure has a height to width ratio of at least 1.5, a stiffness factor of no greater than 100 mm, and a solid to open volume ratio of no greater than 5%. In another aspect, the support structure has a weight of no greater than 1200 kg, a stiffness factor of no greater than 100 mm, and a solid to open volume ratio of no greater than 5%.

Abstract: An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.

Abstract: A method of manufacturing a honeycomb structure including a honeycomb unit includes forming a honeycomb molded body having a plurality of cells extending from a first end face to a second end face of the honeycomb molded body along a longitudinal direction of the honeycomb molded body and separated by a plurality of cell walls, placing the honeycomb molded body in a degreasing apparatus so that the first end face faces downward and the second end face faces upward, feeding introduced gas into the degreasing apparatus, degreasing the honeycomb molded body at a temperature of approximately 200° C. to approximately 400° C., and firing the degreased honeycomb molded body at a temperature of approximately 500° C. to approximately 900° C. to obtain the honeycomb unit.

Abstract: A shelf assembly for firing including plural struts for supporting shelf boards arranged upright in two or more rows in a cross direction and in three or more rows in a longitudinal direction on a longitudinally-long car with tie-beams connecting the struts. A thermal stress relief structure is provided in which the struts arranged upright in the adjacent rows in the longitudinal direction are connected only with tie-beams slanted in a cross direction between the struts, with the thermal stress relief structure preventing warpage or damage of the struts resulting from a bending stress generated in the longitudinal direction at the fixing parts of the struts.

Abstract: A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.

Abstract: The invention relates to a dental firing or press furnace (10) that enables the production of at least one dental restoration part (62). The dental firing or press furnace is provided with a firing space (12) that is heatable with the aid of a heating device (22), preferably, a resistance heating device. A heat-conducting element (50) having a specific thermal conductivity of at least 100 W/mK is arranged on the floor of the firing space (12).

Abstract: A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.

Abstract: A method for adjusting the warpage of a wafer, includes providing a wafer having a center portion and edge portions and providing a holding table having a holding area thereon for holding the wafer. The wafer is placed onto the holding table with the center portion higher than the edge portions and thereafter pressed onto the holding area such that the wafer is attracted to and held onto the holding table by self-suction force. The wafer is heated at a predetermined temperature and for a predetermined time in accordance with an amount of warpage of the wafer in order to achieve a substantially flat wafer or a predetermined wafer level.

Abstract: A seal hardening furnace is presented in which seal lines in a liquid crystal display panel are hardened. The seal hardening furnace includes a cassette having a rack bar structure. The rack bar structure has rack bars for supporting the substrate along one direction and rack bar supports at ends of the rack bars that support the rack bars. The rack bars have air discharge openings therein. An air injecting passage is connected to the rack bar supports. An air supply unit supplies air through the air injecting passage and through the discharge openings to support the substrate thereon.

Abstract: A vertical boat for heat treatment includes a plurality of supporting columns, a pair of plate members coupled to both ends of each supporting column. In each of the supporting columns a plurality of supporting parts for horizontally supporting substrates to be treated are formed and an auxiliary supporting member to place each of the substrates to be treated is removably attached to each of the plurality of supporting parts. The auxiliary supporting member is adjusted for each supporting part with respect to the inclination of a surface for placing the substrates to be treated depending on the shape of each supporting part by processing a surface for attaching to the supporting part, or by interposing a spacer between the supporting part and the auxiliary supporting member is provided.

Abstract: Tray assemblies and methods for manufacturing ceramic articles are provided. In one embodiment, a tray assembly includes a tray body having a supporting surface operable to support a ceramic article for passage through a microwave drying apparatus during a microwave drying process and a microwave coupling cover associated with the tray body. The microwave coupling cover envelopes at least a portion of the ceramic article during the microwave drying process. The microwave coupling cover has a dielectric property such that a greater percentage of microwave energy is coupled into the ceramic article with the microwave coupling cover present during the microwave drying process than with the microwave coupling cover not present. Methods may include rotating the ceramic article when the ceramic article is about 40%-60 dry.

Abstract: Contact lens curing systems and methods are described. A contact lens curing system includes an oven that has a plurality of curing zones, a mold advancement system for moving contact lens mold assemblies between the plurality of zones, and a controlled atmosphere in the curing zones that provides a substantially chemically inert environment in which contact lens precursor materials can be polymerized in contact mold assemblies located in the curing zones. Methods of producing contact lenses include curing contact lens precursor materials in contact lens mold assemblies in the lens curing system.

Abstract: Provided is a heat treatment furnace, which includes a processing vessel configured to accommodate at least one object to be processed, a heat insulating member configured to cover a periphery of the processing vessel, and a heating unit configured to be arranged along an inner peripheral surface of the heat insulating member. The heat insulating member includes an inner heat insulating member and an outer heat insulating member formed independently of the inner heat insulating member. The outer heat insulating member contains a finely-powdered compressed silica material, and at least an outer surface thereof is covered with an anti-scattering member configured to prevent the finely-powdered compressed silica material from being scattered.

Abstract: A roller hearth calcining furnace that uses a movable fluid bed that is transported through plural heating modules, each heating module independently heated using an indirect heating system. The indirect heating system includes an oxidizer, an all-ceramic, indirect, air-to-air heat exchanger, and one or more metal heat exchangers. The oxidizer can be fired with oil, coal, natural gas or other means, is impervious to attack from dirty fuels, and produces clean hot air for productive use. The movable fluid bed includes a permeable silicon carbide ceramic plate that resides within, and is supported by, a sagger or tray. The sagger is transported on rollers through the plural heating modules, and thus different temperature zones within a furnace as required by the temperature profile of the material being calcined.

Abstract: In a loading area below a vertical furnace of a thermal treatment apparatus, a gas stream flows along a first direction from one side to the other side of the loading area into a first evacuation opening provided in the other side of the loading area. A thermal evacuation part is located, along the first direction, between a first evacuation opening and an upstream end of a substrate holding member located at an unload position that is located between the one side and the other side of the loading area. The thermal evacuation part includes a second evacuation opening that is arranged to oppose at least an upper part of the substrate holding member located at the unload position and evacuates an environment around the substrate holding member located at the unload position.

Abstract: The present invention is a vertical boat for heat treatment having an auxiliary supporting member removably attached to each of supporting parts of a boat body, the auxiliary supporting member on which a substrate to be treated is to be placed, in which the auxiliary supporting member has a guiding member attached to the supporting part and a substrate supporting plate on which the substrate to be treated is to be placed, a hole is formed on an upper surface of the guiding member, the substrate supporting plate is inserted and fitted into the hole of the guiding member so as to be fixed, a height position of a placing surface for the substrate to be treated is higher than a height position of the upper surface of the guiding member, the substrate supporting plate is composed of silicon carbide and the guiding member is composed of quartz.

Abstract: A substrate support instrument includes a first support instrument portion and a second support instrument portion detachably combined with each other. Each of the first support instrument portion and second support instrument portion includes: a ceiling plate and a bottom plate facing each other upward and downward; a support pillar disposed in plurality along a peripheral edge portion of each of the ceiling plate and bottom plate, and configured to connect the ceiling plate and the bottom plate; and a support part disposed at a position corresponding to each of the support pillars, and configured to support a bottom of each substrate. In the support part, a height position is set such that a substrate supported in the first support instrument portion and a substrate supported in the second support instrument portion are alternately arranged, when the first support instrument portion is combined with the second support instrument portion.

Abstract: A variable modular support system for use in a kiln, as well as a method of constructing such a support system in a kiln, comprises plurality of refractory blocks each having an upper surface and a lower surface and at least one transverse recess in either the upper or lower surface, the plurality of refractory blocks comprising a first base refractory block and a second base refractory block spaced from the first refractory block by a variable and selectable distance. Connecting rods extend from the recess of the first base refractory block or a refractory block stacked thereon to the recess of the second base refractory block or a refractory block stacked thereon, the connecting rods forming a rack or shelf located between the first base refractory block and the second base refractory block.

Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.

Abstract: The present invention relates to a device for supporting, stacking, and transporting kiln run, in particular for firing ceramic products, comprising an assembly of supports and support beams, like carrier beams and cross beams, on which, in particular one or several supports for placing the kiln run are provided. Thus, for supporting at least one support beam, at least one loose bearing is provided, comprising a support body, moveably disposed, substantially in the direction of the support beam.

Abstract: An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.

Abstract: A heat treatment jig includes a holding concave portion to hold an object and a void part formed near the holding concave portion and a thermal history variation of the object in a heat treatment process is reduced thereby.

Abstract: Cellular ceramic green bodies are debindered in a heated circulating oxygen-containing atmosphere while being supported on a plurality of flow-restricting support members for selectively restricting circulation of the atmosphere through cellular core sections of the bodies, and while allowing for a free circulation of the atmosphere past the support members and green bodies.

Abstract: A kiln tool plate 1 for firing a ceramic material used during the firing of an article to be fired, wherein at least uneven conformations 3 are imparted to a front surface side A on which the article to be fired is mounted and a back surface side B, and opening areas 7 are formed. In the ceramic material firing kiln tool plate 1, the decrease of heat capacity and the reduction of costs can be achieved, a contact area with the article to be fired is decreased to improve outgassing, and the atmosphere can be made uniform to uniformly manufacture the fired article. Above all, the kiln tool plate for firing the ceramic material has excellent thermal shock resistance, creep resistance, high strength at high temperature and oxidation resistance, and enables weight saving.

Abstract: The invention relates to a combustion table for an oven for dental ceramics made of solid, highly temperature-resistant material, having a base, a top side, and a wall, wherein the combustion table is formed of at least two parts in order to improve the temperature resistance of the combustion table.

Abstract: The present invention is a vertical boat for heat treatment having an auxiliary supporting member removably attached to each of supporting parts of a boat body, the auxiliary supporting member on which a substrate to be treated is to be placed, in which the auxiliary supporting member has a guiding member attached to the supporting part and a substrate supporting plate on which the substrate to be treated is to be placed, a hole is formed on an upper surface of the guiding member, the substrate supporting plate is inserted and fitted into the hole of the guiding member so as to be fixed, a height position of a placing surface for the substrate to be treated is higher than a height position of the upper surface of the guiding member, the substrate supporting plate is composed of silicon carbide and the guiding member is composed of quartz.

Abstract: A drying jig of the present invention is a drying jig for a pillar-shaped honeycomb molded body having a large number of cells longitudinally placed in parallel with one another with a cell wall therebetween, comprising: a fixing member for preventing separation or opening of the drying jig; and a piling member which enables the drying jig to be piled up in multi stage at the time of drying.

Abstract: Disclosed herein is a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment.

Abstract: Disclosed are devices and methods for supporting glass sheets during a thermal treatment process, such as heat treating, to maintain the physical geometry of the glass sheets. The device can comprise means for separating adjacent glass sheets to prevent them from touching. The separating means can comprise a separation comb having projections and channels configured for receiving the glass sheets, separating rods configured to be positioned between the glass sheets, or a combination of separation combs and separating rods.

Abstract: Pottery wares are fired in a saggar in an electric kiln, whereby effects such as reduction firing and soda firing may be obtained.

Abstract: A support for structural components that are subjected to a thermal treatment process. The support includes a frame having limbs and extending therefrom a grid of intersecting strands. In order to prevent the support from warping even when subjected to strong thermal loads or variations in temperature, the frame is produced from a temperature-resistant material and the strands are produced from carbon fibers or ceramic fibers that form the grid, extending from the limbs of the frame.

Abstract: An edge ring for use in batch thermal processing of wafers supported on a vertical tower within a furnace. The edge rings are have a width approximately overlapping the periphery of the wafers and are detachably supported on the towers equally spaced between the wafer to reduce thermal edge effects. The edge rings have may have internal or external recesses to interlock with structures on or adjacent the fingers of the tower legs supporting the wafers or one or more steps formed on the lateral sides of the edge ring may slide over and then fall below a locking ledge associated with the support fingers. Preferably, the tower and edge ring and other parts of the furnace adjacent the hot zone are composed of silicon.

Abstract: The present invention relates to a device for supporting, stacking and transporting kiln run, in particular, when firing ceramic products, comprising an assembly from supports and support beams, in particular carrier beams, cross beams, large plates or similar, on which, in particular, one or several supports for placing kiln run are provided. The device comprises at least one substantially rectangular sleeve, in particular disposed on a kiln cart. In this sleeve a substantially rectangular support of the support assembly is disposed, wherein the sleeve has at least one adjustment means, which is supported in the sleeve, and which can be pressed against the support, wherein the sleeve additionally comprises at least one pressure means, formed from at least one elastic element, which is preloaded through the impact of the adjustment devices, so that it builds up reversal forces against the support.

Abstract: The long-term use of a conventional jig for calcining an electronic component arises a problem such as peel-off of a zirconia surface layer. Even if the performance is not deteriorated in the short-term use, the zirconia surface layer reacts with the electronic component to shorten the life of the jig for calcining the electronic component when the use is prolonged for a longer period of time. A jig for calcining an electronic component is provided which is stable after use of a longer period of time by suitably setting the composition of a zirconia surface layer. For example, in the zirconia surface layer containing zirconia particles and a partially fused-bonding agent, an amount of calcia is made to be 4 to 15% in weight.

Abstract: A material supply device for diffusion furnaces includes a main body, a fixing pedestal mechanism, a transmission mechanism and a cover mechanism for a furnace door. The main body includes a base portion and a main rod. The base portion is mounted on the main rod and the main rod extends through the base portion. The fixing pedestal mechanism is mounted on the main rod and is pivotedly mounted on a fixing pedestal. The transmission mechanism is mounted on the base portion and has a transmission rod slidably mounted on the base portion. The cover mechanism for a furnace door is fixed on an end of the transmission rod which is far away from the main body and is turnablely mounted on a cover of the furnace door. Based on the above assemblies, the present invention runs smoothly and improves production quality.

Abstract: The present invention is a quartz-product baking method for baking a first quartz product and a second quartz product to remove a metal contained therein, the first and second quartz products being to be loaded into a heat-processing apparatus for heat-processing a semiconductor substrate so that at least a part of each quartz product is brought into contact with a heat-processing atmosphere of the heat-processing apparatus, the quartz-product baking method comprising the steps of: with the use of a jig including a first jig element and a second jig element that are disengageably stacked in a tier-like manner, placing the first quartz product on the first jig element, stacking the second jig element on the first jig element, and placing the second quartz product on the second jig member; placing on a lid member the jig in which the quartz products are placed in a tier-like manner, elevating the lid member to load the jig into a baking vertical vessel through a lower opening thereof, and hermetically sealing t

Abstract: A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 ?m and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size may be formed by CVD. Larger particles may be milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.