Accessory Means For Holding, Shielding Or Supporting Work Within Furnace Patents (Class 432/253)
  • Patent number: 10523361
    Abstract: An embodiment of the present invention suggests a method in which an access point (AP) obtains channel quality information in a wireless LAN system. The AP transmits, to at least one station (STA), a null data packet announcement (NDP-A) frame including information on transmission of a subsequent null data packet (NDP) frame, and transmits an NDP frame to the at least one station on the basis of information on the NDP-A frame. Further, the AP receives, from the at least one STA, a feedback frame including downlink channel quality information. At this time, the NDP frame includes an L-part for a legacy STA and a high efficiency (HE)-part for a HE STA, wherein the HE-part consists of a HE-signaling A (HE-SIG A) field, a HE-short training field (HE-STF), and a HE-long training field (HE-LTF).
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: December 31, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Jinyoung Chun, Jinsoo Choi, Kiseon Ryu, Jeongki Kim, Hangyu Cho, Dongguk Lim
  • Patent number: 10094618
    Abstract: A method and apparatus for annealing semiconductor substrates is disclosed. The apparatus has an annealing energy source and a substrate support, with a shield member disposed between the annealing energy source and the substrate support. The shield member is a substantially flat member having a dimension larger than a substrate processed on the substrate support, with a window covering a central opening in the substantially flat member. The central opening has a gas inlet portal and a gas outlet portal, each in fluid communication with a gas inlet plenum and gas outlet plenum, respectively. A connection member is disposed around the central opening and holds the window over the central opening. Connection openings in the connection member are in fluid communication with the gas inlet plenum and gas outlet plenum, respectively, through a gas inlet conduit and a gas outlet conduit formed through the connection member.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: October 9, 2018
    Inventors: Stephen Moffatt, Aaron Muir Hunter
  • Patent number: 9691616
    Abstract: A method of manufacturing a silicon carbide semiconductor device includes a step of preparing a silicon carbide substrate having a first main surface and a second main surface located opposite to the first main surface, a step of forming a doped region in the silicon carbide substrate by doping the first main surface with an impurity, a step of forming a first protecting film on the first main surface, and a step of forming a second protecting film on the second main surface, the step of forming a first protecting film being performed after the step of forming a doped region, the method further including a step of activating the impurity included in the doped region by annealing with at least a portion of the first main surface covered with the first protecting film and at least a portion of the second main surface covered with the second protecting film.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: June 27, 2017
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Taku Horii
  • Patent number: 9530675
    Abstract: A wafer handling station includes a housing defining a chamber, and a wafer cassette assembly positionable in the chamber. The wafer cassette assembly includes a vertical support, and cassette members carried by the vertical support in spaced relation. Each cassette member includes a base coupled to the vertical support, wafer contact pads on an upper surface of the base and configured to support a wafer thereon, and a pair of wafer brackets carried by the base and configured to engage respective edges of the wafer to laterally confine the wafer.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: December 27, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Romolo Recorba Bactasa
  • Patent number: 9403251
    Abstract: Embodiments of edge rings for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, an edge ring for a semiconductor process chamber may include an annular body having a central opening, an inner edge, an outer edge, an upper surface, and a lower surface, an inner lip disposed proximate the inner edge and extending downward from the upper surface, and a plurality of protrusions extending upward from the inner lip and disposed along the inner edge of the annular body, wherein the plurality of protrusions are arranged to support a substrate above the inner lip and over the central opening, wherein the inner lip is configured to substantially prevent light radiation from travelling between a first volume disposed above the edge ring and a second volume disposed below the edge ring when a substrate is disposed on the plurality of protrusions.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: August 2, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sairaju Tallavarjula, Kevin Joseph Bautista, Jeffrey Tobin
  • Patent number: 9099514
    Abstract: An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer holder including a first portion and a second portion. The first and second portions are formed of the same continuous material. The first portion includes a first upper surface and a first lower surface, and the second portion including a second upper surface and a second lower surface. The apparatus further includes an interface between the first and second portions. The interface provides for a transition such that the first upper surface of the first portion tends toward the second upper surface of the second portion. The apparatus further includes a tapered region formed in the first portion. The tapered region starts at a radial distance from a center line of the wafer holder and terminates at the interface. The tapered region has an initial thickness that gradually decreases to a final thickness.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: August 4, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Hung Lin, Li-Ting Wang, Tze-Liang Lee
  • Patent number: 9064915
    Abstract: A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: June 23, 2015
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Atsushi Kubo, Hirofumi Imai, Koki Tamura, Takahiro Yoshioka
  • Patent number: 9027504
    Abstract: A heating apparatus including: a first heating part and a second heating part between which a substrate having a coating film is disposed at a substrate position in the film thickness direction; and a distance control part which controls at least one of a first distance between the substrate position and the first heating part and a second distance between the substrate position and the second heating part.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: May 12, 2015
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hidenori Miyamoto, Tsutomu Sahoda
  • Publication number: 20150093712
    Abstract: A retaining bar to be used in combination with a heat furnace supporting assembly for supporting at least one receptacle. The retaining bar comprises at least one single piece elongated body having a finite length and at least one receptacle receiving cavity defined therein and extending along a section of the length of the body. Each one of the at least one receptacle receiving cavity is configured to receive therein one of a bottom section and an upper section of one of the at least one receptacle. A heat furnace receptacle supporting assembly comprising such a retaining bar and a heat furnace provided with the heat furnace receptacle supporting assembly are further provided.
    Type: Application
    Filed: March 11, 2013
    Publication date: April 2, 2015
    Inventor: Steve Forest
  • Patent number: 8936462
    Abstract: A multi-operation wafer baking system includes a chassis; a wafer loading device mounted on the chassis for laterally moving a wafer; a cruciform transportation device mounted on the chassis for receiving a wafer from the wafer loading device and including a base, an elevation platform, and a rotation platform mounted on the elevation platform and having four carrier arms for carrying wafers; an annular baking device mounted on the chassis to oppose the cruciform transportation device and including a central turn table, a plurality of wafer racks, and a plurality of baking tray assemblies functioning to receive wafers from corresponding wafer racks for performing a baking operation on the wafer; and an unloading device mounted on the chassis for receiving baked wafers. This system allows for baking wafers in a multi-operation manner to thereby improve throughput.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: January 20, 2015
    Assignee: Chen Long Technology Corp. Ltd.
    Inventors: Walong Sheu, Chin-Chuang Chang
  • Patent number: 8937483
    Abstract: A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: January 20, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeck-Jin Jeong, Yong-Ki Park, Yong-Jin Jung, Heul-Seog Kim
  • Patent number: 8920162
    Abstract: Methods and apparatuses that decouple wafer temperature from pre-heat station residence time, thereby improving wafer-to-wafer temperature uniformity, are provided. The methods involve maintaining a desired temperature by varying the distance between the wafer and a heater. In certain embodiments, the methods involve rapidly approaching a predetermined initial distance and then obtaining and maintaining a desired final temperature using closed loop temperature control. In certain embodiments, a heated pedestal supplies the heat. The wafer-pedestal gap may be modulated may be varied by moving the heated pedestal and/or moving the wafer, e.g., via a movable wafer support. Also in certain embodiments, the closed loop control system includes a real time wafer temperature sensor and a servo controlled linear motor for moving the pedestal or wafer support.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: December 30, 2014
    Assignee: Novellus Systems, Inc.
    Inventors: Michael Nordin, Chris Gage, Shawn Hamilton, Sheldon Templeton
  • Patent number: 8900384
    Abstract: In a method for heat treating a metal tube or pipe for a nuclear power plant, the tube or pipe being accommodated in a batch-type vacuum heat treatment furnace, when the tube or pipe is laid down on and is subjected to heat treatment on a plurality of metal cross beams arranged along a longitudinal direction of the tube or pipe, it is possible to suppress scratches to be formed on the outer surface of the tube or pipe and attributable to heat treatment, and to reduce the discoloration on the outer surface of the tube or pipe by holding the tube or pipe and the metal cross beams in indirect contact with each other by virtue of a heat resistant fabric having a thickness of 0.1 to 1.2 mm interposed in between.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: December 2, 2014
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Shoji Kinomura, Shinichi Takenaka
  • Publication number: 20140335271
    Abstract: A boat according to this disclosure includes side walls and a base that are arranged to define a container with an interior. A bottom of the boat may have a convex configuration. In a specific embodiment, the base may have a convex configuration, such as the shape of a portion of the curved surface of a cylinder, with end walls located at opposite ends of the base. Such a boat may have a crescent configuration. Each boat may be configured to be positioned against another boat, enabling the assembly of groups of boats. Multi-celled structures that receive and effectively increase the surface area of precursor material are also disclosed. A multi-celled structure may be configured for use within the interior of a boat, or individually, without a separate boat.
    Type: Application
    Filed: July 29, 2014
    Publication date: November 13, 2014
    Inventors: James Dempster, Jason Maynard
  • Publication number: 20140329191
    Abstract: An enhanced bead rack has a pair of supports. Each support has a front face, a back face, a top edge and a base. The front faces and back faces have a plurality of ports extending therethrough, and each port can receive therein one end of a wire. Beads, pendants, and other works can be threaded onto one or more wires and the wires can then be placed so that each end of each wire is supported by a port in each support. The plurality of ports can be arranged in various patterns or randomly and the number of ports can vary. Different sizes, shapes and styles of ports can be employed including: a grid of round ports, a series of long slots with notches, a series of long shelf spaces with notches, etc.
    Type: Application
    Filed: May 1, 2013
    Publication date: November 6, 2014
    Inventor: Lindsey Elizabeth McNamara
  • Publication number: 20140318317
    Abstract: A system for ashing carbon includes a vertically oriented burner column having a first end and an opposing end with an interior chamber therebetween. The burner column has an aperture at the first end and a suction port proximal to the second end, the aperture and the suction port in communication with the interior chamber. The system also comprises a porous media screen located in the interior chamber and positioned between the first end and the second end of the burner column. The media screen is adapted to hold ignited carbon containing a precious metal therein. The system also contains a pump that is coupled to the suction port. The pump is configured to apply a negative pressure to the interior chamber of the burner column to draw air into the interior chamber via the aperture. The drawn air passes through the ignited carbon at a desired flow rate to achieve a temperature of the carbon suitable for ashing the carbon.
    Type: Application
    Filed: March 17, 2014
    Publication date: October 30, 2014
    Applicant: The Vault Corporation
    Inventors: Hank Chapman, JR., Rick Allen
  • Patent number: 8874254
    Abstract: An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: October 28, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Shuji Iwanaga, Nobuyuki Sata
  • Publication number: 20140308621
    Abstract: A sintering apparatus comprising a furnace core tube having an opening in a top end through which the soot deposition body is inserted, and having atmospheric gas introduced therein from below and expelled upward; a shaft from which the soot deposition body hangs; a lid that has the shaft inserted therethrough and can cover the opening; a heating furnace that heats the soot deposition body; an internal lid in a top portion of the furnace core tube that divides the top portion of the furnace core tube into an upper region and a lower region; and a gas flow path that connects the two regions to each other and has the atmospheric gas flow therethrough. Total cross-sectional area, relative to movement direction of the atmospheric gas, of the gas flow path is less than cross-sectional area, relative to movement direction of the atmospheric gas, of the furnace core tube.
    Type: Application
    Filed: April 8, 2014
    Publication date: October 16, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Dai INOUE, Kazuya UCHIDA
  • Patent number: 8858740
    Abstract: In a method for heat treating a metal tube or pipe for a nuclear power plant, the tube or pipe being accommodated in a batch-type vacuum heat treatment furnace, when the tube or pipe is laid down on and is subjected to heat treatment on a plurality of metal cross beams arranged along a longitudinal direction of the tube or pipe, it is possible to suppress scratches to be formed on the outer surface of the tube or pipe and attributable to heat treatment, and to reduce the discoloration on the outer surface of the tube or pipe by holding the tube or pipe and the metal cross beams in indirect contact with each other by virtue of a heat resistant fabric having a thickness of 0.1 to 1.2 mm interposed in between.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: October 14, 2014
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Shoji Kinomura, Shinichi Takenaka
  • Publication number: 20140205959
    Abstract: A medium heating device includes a heater that heats a medium, and a medium support member that supports a target heating portion, which is a portion that is heated by the heater in the medium, in which the medium support member has a first component portion that is formed so that a space is provided between the medium and the first component portion when the medium is supported, and a second component portion that is in contact with the medium when the medium is supported.
    Type: Application
    Filed: January 21, 2014
    Publication date: July 24, 2014
    Applicant: Seiko Epson Corporation
    Inventors: Yasuo NARAMATSU, Masahiro AKAMINE
  • Patent number: 8748780
    Abstract: A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: June 10, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Shouken Moro, Yasuhiro Takaki, Masatoshi Kaneda
  • Publication number: 20140147800
    Abstract: A method of supporting a plurality of planar substrates in a tube shaped furnace for conducting a thermal treatment process is disclosed. The method uses a boat fixture having a base frame including two length portions and a first width portion, a second width portion, and one or more middle members connected between the two length portions. Additionally, the method includes mounting a removable first grooved rod respectively on the first width portion, the second width portion, and each of the one or more middle members, each first grooved rod having a first plurality of grooves characterized by a first spatial configuration. The method further includes inserting one or two substrates of a plurality of planar substrates into each groove in the boat fixture separated by a distance.
    Type: Application
    Filed: May 8, 2013
    Publication date: May 29, 2014
    Applicant: Stion Corporation
    Inventor: Stion Corporation
  • Publication number: 20140131347
    Abstract: An apparatus and method for small scale heating of an asphalt material suitable for repair and/or resurfacing of paved surfaces, most preferably where the material is placed in a small microwavable container.
    Type: Application
    Filed: May 21, 2013
    Publication date: May 15, 2014
    Applicant: CRIUS TECH LLC
    Inventor: Mark ELIOT
  • Publication number: 20140134557
    Abstract: A heating storage structure includes a plurality of mounting parts each including a mounting face on which articles to be heated are mounted, which is a part of the surface of the mounting part; and a fixing part to which the plurality of mounting parts are detachably fixed so that the plurality of mounting parts are stacked while each of spaces S1 to S4 is left between the mounting face of one of the mounting parts and the mounting part disposed adjacent to the one mounting part, and the plurality of mounting parts include a mounting part provided with the mounting face having a thermal emissivity which is different from that of the mounting face of another mounting part.
    Type: Application
    Filed: January 22, 2014
    Publication date: May 15, 2014
    Applicant: NGK INSULATORS, LTD.
    Inventors: Shigeru HANZAWA, Hiroyoshi SUZUMURA, Tsutomu YAMAMOTO
  • Patent number: 8708295
    Abstract: Improved workpiece-carrier in the form of a high-temperature-grating 10 assembled from mutually engaging elements consisting of carbon-fiber-reinforced carbon-composite-board-strips comprising comb-shaped elements, having a frame surrounding a horizontal grating as well as at least one workpiece-support (40) which is inert in relation to the supported workpiece and provides a workpiece-support-area (50) at a distance above the grating (3O)7 said work-piece-support (40) being arranged within at least one enclosing cut-out-section of at least one element wherein furthermore said elements comprise at least one element having interlocking cut-out-sections in alternating arrangement, at least one auxiliary element, said workpiece-support (40) is a single-piece part of high temperature ceramic of rod-shaped elongation being arranged parallel to the plane of said grating (30) and being an integral part of the grating by being enclosed beneath the workpiece-support-area (50) by cut-out-sections of a multitude of cros
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: April 29, 2014
    Assignee: GTD Graphit Technologie GmbH
    Inventors: Martin Barthelmie, Arno Cloos, Michael Riedl
  • Patent number: 8696351
    Abstract: A heat-collecting kiln device includes a housing assembly including a single housing or a plurality of housings having a same height or different heights, with the housings stackable one upon another. A top lid is mounted on a top of the housing assembly to seal the housing assembly and includes an observation hole. A base is mounted to a bottom of the housing assembly to seal the housing assembly. A cover is mounted to the top lid to seal the observation hole. The cover is removable to reveal the observation hole. The heat-collecting kiln device further includes a net and at least one leg. Each housing is comprised of four modular elements each having a mortise engaged with a tenon of another modular element. One of the modular elements includes a temperature detection hole.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: April 15, 2014
    Inventors: Kang-Ming Huang, Tsung-Wei Huang
  • Patent number: 8672675
    Abstract: A firing tray for a furnace for dental ceramics having a plate for the placement on it of the firing material, wherein the plate is made as a base for the improvement of the application possibilities and the firing tray has additional wall elements which are designed for the placement on them of a further firing tray for the forming of a stack.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: March 18, 2014
    Assignee: DEKEMA Dental-Keramiköfen GmbH
    Inventor: Stephan Miller
  • Publication number: 20130337394
    Abstract: According to one aspect of the present disclosure, provided is a heat treatment apparatus configured to heat treat a plurality of objects to be treated which are held and supported by a holding and supporting unit while an inert gas is allowed to flow in a vertical type processing chamber from a bottom to a top thereof, wherein the processing chamber has a heating unit installed therearound. The heat treatment apparatus includes a gas supply system configured to supply the inert gas, wherein the gas supply system includes a gas supply header portion located in a lower end of the processing chamber to allow the inert gas to flow along a circumferential direction of the lower end; and a gas introduction portion in communication with the gas supply header portion to introduce the inert gas into the processing chamber.
    Type: Application
    Filed: June 14, 2013
    Publication date: December 19, 2013
    Inventors: Shinji ASARI, Hidekazu SATO, Hideki TAKAHASHI
  • Patent number: 8608885
    Abstract: A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: December 17, 2013
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Shigehiro Goto, Keiji Matsuchika, Akihiko Morita
  • Publication number: 20130309623
    Abstract: A sintering chamber structure adapted to store multiple articles to be sintered in a sintering furnace, includes a first wall, a second wall, two side walls interconnecting the first and second walls, at least two supporting walls, and holding boards for holding the multiple articles. The two side walls and the first and second walls together define a storage space communicating outside. The two supporting walls correspondingly form a plurality of guiding grooves, wherein the first and second walls correspondingly form a pair of positioning slots communicating with the storage space, the at least two supporting walls are detachably inserted in the pairs of positioning slots, respectively, and the holding boards are inserted in corresponding guiding grooves. In this manner, the at least two supporting walls can adjust the inner space according to the sizes of the articles, whereby achieving the best yield of sintering.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Applicant: Cheng Uei Precision Industry Co., LTD.
    Inventors: CHENG-YU CHOU, CHIH-WEI CHENG
  • Publication number: 20130295513
    Abstract: A susceptor supports a crucible in a furnace and includes a first wall having a vertical edge and a second wall having a vertical edge. A first interlocking member is on the vertical edge of the first wall and a second interlocking member is on the vertical edge of the second wall. The first interlocking member is interlocked with the second interlocking member when the first wall and second wall are in an assembled configuration. Openings are disposed through the first interlocking member and the second interlocking member. Each of the openings through the first interlocking member is coaxial with each of the openings through the second interlocking member.
    Type: Application
    Filed: May 4, 2012
    Publication date: November 7, 2013
    Applicant: MEMC SINGAPORE PTE. LTD. (UEN200614794D)
    Inventor: Lee William Ferry
  • Publication number: 20130280666
    Abstract: A self-contained heated wax treatment apparatus includes an outer shell and a rack disposed inside the outer shell. The rack includes a receptacle holder and at least one heater holder. At least a first receptacle is mounted to the receptacle holder of the rack. The first receptacle contains a heat activated substance. A heater is mounted to the heater holder of the rack in thermal conductive contact with the first receptacle. Activation of the heater causes heat to flow to the first receptacle and activate the heat activated substance inside the receptacle.
    Type: Application
    Filed: August 13, 2010
    Publication date: October 24, 2013
    Inventor: Daniel L. Young
  • Publication number: 20130280667
    Abstract: Firing containers for firing an electrode active material include one or more through openings, and protrusions protruding from an outer surface of sidewalls of each of the firing containers. The protrusions allow adjacent firing containers to be spaced apart from each other and guide the adjacent firing containers during alignment.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 24, 2013
    Inventors: Young-Hoon DO, Myung-Hun BAE, Suk-Chul JUNG
  • Publication number: 20130273487
    Abstract: In a sample heating method which uses a microchip, using the microchip which includes a vessel portion (70e) in which at least a portion is configured of an elastic member and a flow channel (61b) which leads a liquid sample to the vessel portion (70e), after a liquid sample is put in the vessel portion (70e), the liquid sample is heated while pressure is applied with respect to an inner portion of the vessel portion (70e).
    Type: Application
    Filed: December 19, 2011
    Publication date: October 17, 2013
    Applicant: NEC CORPORATION
    Inventors: Minoru Asogawa, Hisashi Hagiwara
  • Patent number: 8544305
    Abstract: Provided are a conveying jig, a method of manufacturing the conveying jig, and a method of heat-treating metal rings using the conveying jig. The conveying jig is provided with a base and ten holding shafts raised from the base. Ridges and grooves are alternatively provided in the side wall of each holding shaft. The metal rings are held in position by being engaged in the grooves in the holding shafts. The space enclosed within the holding shafts is communicated with the atmosphere, and this allows, when the metal rings held by the conveying jig are subjected to heat treatment in a heat treatment furnace, an atmospheric gas to circulate in the space enclosed within the holding shafts.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: October 1, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yoshiharu Watabe, Seiichi Minegishi, Tetsuo Suzuki, Masaomi Saruyama, Masashi Takagaki
  • Publication number: 20130252189
    Abstract: An apparatus, a system and a method are disclosed. An exemplary apparatus includes a first portion configured to hold an overlying wafer. The first portion includes a central region and an edge region circumscribing the central region. The first portion further including an upper surface and a lower surface. The apparatus further includes a second portion extending beyond an outer radius of the wafer. The second portion including an upper surface and a lower surface. The lower surface of the first portion in the central region has a first reflective characteristic. The lower surface of the first portion in the edge region and the second portion have a second reflective characteristic.
    Type: Application
    Filed: March 23, 2012
    Publication date: September 26, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Hung Lin, Li-Ting Wang, Tze-Liang Lee
  • Publication number: 20130252191
    Abstract: A support tooling for supporting at least one metal part that is to be subjected to heat treatment or shaped while hot, the tooling including: a stationary support structure presenting a determined shape that corresponds to the general shape of each metal part that is to be supported; first holder elements arranged on one side of each part; second holder elements arranged on the other side of each part; and at least one spring type resilient element placed between the support structure and each first or second holder element so as to hold the part throughout the duration of heat treatment. The support structure, the first and second holder elements and the resilient element(s) are made of thermostructural composite material.
    Type: Application
    Filed: March 22, 2013
    Publication date: September 26, 2013
    Applicant: HERAKLES
    Inventors: Frédéric GUICHARD, Jean-Pierre MAUMUS
  • Publication number: 20130236844
    Abstract: A substrate carrier is used for carrying a plurality of back electrode substrates into a furnace. Each back electrode substrate has a precursor layer formed thereon. The furnace is used for providing a process gas to react with the precursor layer, so as to form a photoelectric transducing layer on each back electrode substrate. The substrate carrier includes a heat-resistant metal frame and a first protective layer. The heat-resistant metal frame has a plurality of slots for supporting the plurality of back electrode substrates. The first protective layer is formed on the heat-resistant metal frame for preventing a chemical reaction of the heat-resistant metal frame with the process gas.
    Type: Application
    Filed: May 7, 2012
    Publication date: September 12, 2013
    Applicant: AXUNTEK SOLAR ENERGY
    Inventors: Shih-Wei Lee, Ching-Ju Lin, Chin-Yuan Chung, Ming-Hung Lin, Wei-Min Huang, Chen-Hai Chiu
  • Publication number: 20130230814
    Abstract: A substrate supporting assembly in a reaction space includes a heater, a substrate support member, and a shim positioned between the heater and the substrate support member. The shim may be removably secured between the heater and the substrate support member. The shim may further include an inner surface defining a perimeter of a gap. The gap may be further defined by a bottom surface of the substrate support member and a top surface of the heater. The substrate support member may further include a shoulder positioned radially outside of a substrate support position and wherein the shim inner surface is radially aligned with the substrate support member shoulder.
    Type: Application
    Filed: March 2, 2012
    Publication date: September 5, 2013
    Applicant: ASM IP HOLDING B.V.
    Inventors: Todd Dunn, Carl White, Michael Halpin, Eric Shero, Jerry Winkler
  • Publication number: 20130224675
    Abstract: An electrostatic chuck device includes a surface to support a substrate, an electrode to generate electrostatic force for the substrate, and a plurality of heaters to heat different regions of the surface. The plurality of heaters include a first heater to heat a first region to a first temperature, a second heater to heat a second region to a second temperature, and a third heater to heat a third region to a third temperature between the first and second temperatures. The second region is closer to a peripheral area of the surface than the first region, and the third region between the first and second regions.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 29, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Samsung Electronics Co., Ltd.
  • Publication number: 20130209950
    Abstract: The invention relates to an oven for heat treatment of a multiplicity of objects. The oven comprises a support stand, which is realized as a three-dimensional frame, an elongate heating chamber, which is arranged vertically or horizontally in a central region of the support stand, and a plurality of elongate combustion chambers, which are arranged vertically or horizontally inside the support stand. The oven additionally comprises a heating element, which is assigned to the heating chamber, and at least one fan for generating an air stream from the heating chamber to the combustion chambers. The combustion chambers are provided to receive the objects to be treated. The support stand is provided to support the heating chamber and the combustion chambers. The invention additionally relates to an oven installation having a multiplicity of such ovens.
    Type: Application
    Filed: March 25, 2011
    Publication date: August 15, 2013
    Inventor: Stefan Mohr
  • Patent number: 8506712
    Abstract: The present invention provides a wafer support jig having at least a support surface on which a treatment target wafer is mounted and supported when performing a heat treatment, wherein skewness Rsk on the support surface that supports the treatment target wafer is 0<Rsk<10, and 100 to 105 protruding objects each having a height of 2 ?m or above and less than 30 ?m are present within arbitrary 1 mm2 without protruding objects each having a height of 30 ?m or above on the entire support surface.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: August 13, 2013
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventor: Takeshi Kobayashi
  • Patent number: 8469703
    Abstract: A vertical boat for heat treatment includes a plurality of supporting columns, a pair of plate members coupled to both ends of each supporting column. In each of the supporting columns a plurality of supporting parts for horizontally supporting substrates to be treated are formed and an auxiliary supporting member to place each of the substrates to be treated is removably attached to each of the plurality of supporting parts. The auxiliary supporting member is adjusted for each supporting part with respect to the inclination of a surface for placing the substrates to be treated depending on the shape of each supporting part by processing a surface for attaching to the supporting part, or by interposing a spacer between the supporting part and the auxiliary supporting member is provided.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: June 25, 2013
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventor: Takeshi Kobayashi
  • Patent number: 8461061
    Abstract: A method of supporting a plurality of planar substrates in a tube shaped furnace for conducting a thermal treatment process is disclosed. The method uses a boat fixture having a base frame including two length portions and a first width portion, a second width portion, and one or more middle members connected between the two length portions. Additionally, the method includes mounting a removable first grooved rod respectively on the first width portion, the second width portion, and each of the one or more middle members, each first grooved rod having a first plurality of grooves characterized by a first spatial configuration. The method further includes inserting one or two substrates of a plurality of planar substrates into each groove in the boat fixture separated by a distance.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: June 11, 2013
    Assignee: Stion Corporation
    Inventors: Paul Alexander, Jurg Schmitzberger, Ashish Tandon, Robert D. Wieting
  • Patent number: 8454356
    Abstract: An apparatus for supporting a workpiece during heat-treating includes a support plate having a non-planar upper surface, and a support system. The support system is configured to support the workpiece above the support plate during heat-treating of the workpiece, such that a lower surface of an initial shape of the workpiece is supported at a non-uniform spacing above the non-planar upper surface of the support plate, said non-uniform spacing including an edge gap beneath an outer perimeter of the workpiece, and a central gap at a central axis of the workpiece.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: June 4, 2013
    Assignee: Mattson Technology, Inc.
    Inventors: David Malcolm Camm, Joseph Cibere, Mladen Bumbulovic
  • Patent number: 8454357
    Abstract: The hotplate for a workpiece comprises a heatable plate which on a first side comprises a support surface for the workpiece, several lifting elements for the lifting of the workpiece relative to the support surface, wherein each lifting element is moveably arranged in such a manner that the respective lifting element can be retracted with respect to the support surface and/or extended with respect to the support surface and means for heating the plate. The means for heating comprise at least one heating channel which extends on a second side of the plate located opposite the support surface and is filled with a heating fluid. The heating fluid is in contact with the plate. The lifting elements are loaded with the heating fluid in such a manner that the lifting elements are extendable through a predetermined change of the hydrostatic pressure of the heating fluid.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: June 4, 2013
    Assignee: Komax Holding AG
    Inventors: Bruno Reichmuth, Claudio Meisser
  • Patent number: 8424485
    Abstract: The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder 26 for holding substrates 12 in a multistage manner and a substrate transfer unit 34 for transferring the substrates 12 into the substrate holder 26, wherein a substrate holding condition of the substrate holder 26 is sensed by a sensing section 60. The sensing section 60 has photo-sensors 64a, 64b, and sensing waveforms sensed by the photo-sensors 64a, 64b are compared with a normal waveform. A control section 66 is provided, which controls a substrate transfer unit 34 such that substrates 12 other than at least a substrate 12 that was determined to be abnormal are transferred by the unit.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: April 23, 2013
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Makoto Hirano, Akihiro Yoshida
  • Publication number: 20130017505
    Abstract: The invention relates to an oven for heat treatment of a multiplicity of objects. The oven comprises a support stand, which is realized as a three-dimensional frame, an elongate heating chamber, which is arranged vertically or horizontally in a central region of the support stand, and a plurality of elongate combustion chambers, which are arranged vertically or horizontally inside the support stand. The oven additionally comprises a heating element, which is assigned to the heating chamber, and at least one fan for generating an air stream from the heating chamber to the combustion chambers. The combustion chambers are provided to receive the objects to be treated. The support stand is provided to support the heating chamber and the combustion chambers. The invention additionally relates to an oven installation having a multiplicity of such ovens.
    Type: Application
    Filed: March 25, 2011
    Publication date: January 17, 2013
    Inventor: Stefan Mohr
  • Publication number: 20130011807
    Abstract: A rotary furnace for conditioning performs includes a heating wheel, a plurality of heating modules disposed on the heating wheel and a control device. Each heating module includes a heating chamber including at least one heating radiator adapted for irradiating the preform with infrared radiation, a holding and lifting device configured to lift or lower at least one of the preform and heating chamber so as to introduce the preform into the heating chamber and/or withdraw the preform from the heating chamber, and a temperature measurement device configured to measure a temperature of at least one of the preform and the heating chamber. The control device is configured to actuate the heating modules based on the measured temperature.
    Type: Application
    Filed: October 20, 2010
    Publication date: January 10, 2013
    Applicant: KRONES AG
    Inventors: Frank Winzinger, Christian Holzer, Wolfgang Schoenberger, Konrad Senn, Andreas Wutz
  • Publication number: 20130004908
    Abstract: The present invention provides a method for producing silicon by at least heating any one of raw materials for silicon production selected from a silica raw material and a carbon material; a silica raw material and silicon carbide; and silicon raw material, in a heating furnace, wherein the method comprises operating at least one of the raw materials for silicon production and a heated product in the heating furnace using a jig, and the jig comprises a non-metallic material portion having a bending strength of 100 MPa or more and a melting point higher than a melting point of silicon, and at least a portion thereof coming into contact with the raw materials for silicon production or the heated product, having a temperature of 1,000° C. or higher, is constituted of the non-metallic material portion.
    Type: Application
    Filed: September 11, 2012
    Publication date: January 3, 2013
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Toshiaki KATAYAMA, Keiji YAMAHARA