Treating An Article, Container, Batch Or Body As A Unit Patents (Class 432/9)
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Patent number: 11602804Abstract: The present invention discloses that a multi-laser cutting method and system, which is applied to a substrate to form a primary substrate having a pattern of rounded corners and a line, the throughput could be improved because CO2 laser cannot cut the round corner at the high speed, but the substrate strength could be kept due to the high cutting quality of the lines by CO2 laser. The poor quality of the cutting edges of the round corners will not affect on the substrate strength but the round corner cutting by the second laser unit will speed up the cutting process. The present invention applies the method by the 2 different laser machines to balance the throughput. Because at the same speed, for example 150 mm/sec, the cycle time per 1 substrate will be different due to the different length of the cutting lines.Type: GrantFiled: April 29, 2020Date of Patent: March 14, 2023Assignee: TOPAPEX ENVIRONMENT PROTECTION ENERGY CO., LTDInventors: Hung-Tu Lu, Alexander Naumov, Vladimir Kondratenko
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Patent number: 11439137Abstract: A device for applying, for a predetermined interval, heated air, which is heated to a pest extermination temperature to a to-be-treated automobile, which is housed in a freely accessible manner in a treatment chamber to exterminate pests inside the automobile includes a circulation fan device arranged in the treatment chamber, a suction part of which is oriented toward the inside of the treatment chamber, a heating member mounted in a discharge part of the circulation fan device, and a rectification member for adjusting the flow direction of the heated air delivered into the chamber via the heating member.Type: GrantFiled: March 15, 2019Date of Patent: September 13, 2022Assignee: KABUSHIKI KAISHA NIHON YUSHUTSU JIDOUSHA KENSA CENTERInventor: Damon Scott Jackson
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Patent number: 10722939Abstract: A method of fabricating a casting is provided. The method includes creating a mixture of ceramic powder and a binder, pouring the mixture around sacrificial patterns, executing a first thermal treatment to set the mixture into a solid mold without damaging the sacrificial patterns, executing a second thermal treatment to remove the sacrificial patterns without removing any of the binder from the solid mold, executing at least one of a third thermal treatment and a chemical treatment to remove a quantity of the binder to transform the solid mold into a solid breakaway mold and pouring molten metallic material into the solid breakaway mold.Type: GrantFiled: June 29, 2018Date of Patent: July 28, 2020Assignee: RAYTHEON TECHNOLOGIES CORPORATIONInventors: John Joseph Marcin, Steven J. Bullied, Santosh Ranganath
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Patent number: 10160194Abstract: A system and method are provided for implementing a comparatively higher speed process for surface curing of finished three-dimensional (3D) printed parts, objects and/or components, formed and/or otherwise manufactured in 3D printing systems and/or in additive material manufacturing processes. A vacuum finish curing chamber is provided within, or associated with one or more 3D printers to provide a locally-generated substantially oxygen depleted curing environment to support effective and efficient surface curing of one or more formed 3D printed parts. The vacuum finish curing system includes at least one device for emitting curing radiation and at least one object transport system for transporting formed 3D objects to the vacuum finish curing chamber without requiring user handling that would be hazardous to handling individuals.Type: GrantFiled: March 3, 2015Date of Patent: December 25, 2018Assignee: Xerox CorporationInventors: Christopher Atwood, Elizabeth Crossen
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Patent number: 9958154Abstract: A charge electrode configured to impart a time-varying charge to a flame and a shape electrode located outside the flame may be driven synchronously by a voltage source through time varying voltage(s). The flame may be flattened or compressed responsive to an electric field produced by the shape electrode acting on the charges imparted to the flame.Type: GrantFiled: October 23, 2012Date of Patent: May 1, 2018Assignee: CLEARSIGN COMBUSTION CORPORATIONInventors: Joseph Colannino, Thomas S. Hartwick, David B. Goodson, Tracy A. Prevo, Christopher A. Wiklof
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Publication number: 20150140217Abstract: Provided is a vertical annealing furnace, in which a heating zone and a soaking zone are communicated with each other in the upper part of the furnace, in which a part of the furnace other than the communicated parts is separated by a dividing wall, in which part of the furnace gas is suctioned into a refiner having a deoxidation device and a dehumidification device which is placed outside the furnace to decrease the dew point of the gas by removing oxygen and moisture from the gas and such that the resultant gas having a decreased dew point is returned into the furnace, in which a gas suction port into the refiner is located in the lower part of the connection part between the soaking zone and the cooling zone and in which one or more gas suction ports are located in the parts of the heating zone and/or the soaking zone outside of an area within 6 m in the vertical direction and 3 m in the longitudinal direction of the furnace from the steel strip entrance in the lower part of the heating zone.Type: ApplicationFiled: May 20, 2013Publication date: May 21, 2015Applicant: JFE STEEL CORPORATIONInventors: Hideyuki Takahashi, Nobuyuki Sato, Kazuki Nakazato, Motoki Takada
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Publication number: 20150139401Abstract: A method for treating a surface layer (3) of a device (1) consisting of alumina and a corresponding device (1) are proposed. The method comprises providing the device (1) with the surface layer (3) to be treated being exposed and heating the surface layer (3) of the device (1) in an oxygen-depleted atmosphere comprising e.g. one of an inert gas, nitrogen, hydrogen, argon and a combination thereof to a temperature higher than 1000° C., preferably higher than 1700° C. for a duration of preferably more than 2 hours. Due to such treatment, a superficial layer region (7) comprised in the surface layer (3) may obtain a significantly reduced electrical resistivity which is assumed to be the result of chemically reducing this superficial layer region (7). Such reduced superficial electrical resistivity may advantageously serve for example in components of electron beam devices such as x-ray tube components for preventing any charge build-up.Type: ApplicationFiled: July 1, 2013Publication date: May 21, 2015Inventors: Carolina Ribbing, Christoph Martiny
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Publication number: 20150129490Abstract: Processes for manufacturing low soluble iron diatomite filter aids and such filter aids are disclosed. Aluminum oxide and/or aluminum hydroxide are used as additives when preparing the flux-calcined diatomite filter aids. As compared to either straight-calcined or soda ash flux-calcined diatomite filter aids of similar permeabilities made from the same ore, the disclosed filter aids have lower soluble iron levels. For instance, disclosed filter aids of about 0.5 to about 2.0 Darcy were made using either an aluminum oxide or aluminum hydroxide additive with soda ash. The disclosed filter aids may have an EBC soluble iron content of less than 80 ppm versus 130 ppm for similar filter aids that were made from the same ore and flux-calcined with just soda ash.Type: ApplicationFiled: November 11, 2013Publication date: May 14, 2015Applicant: EP MINERALS, LLCInventors: Qun Wang, David Scott Keselica, Kimberly Walsh, Peter Edward Lenz, Chongjun Jiang, Bradley Scott Humphreys
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Patent number: 9005563Abstract: Silicon wafers having an oxygen concentration of 5·1017 to 7.5·1017 cm?3 have the following BMD densities after the following thermal processes, carried out alternatively: a BMD density of at most 1·108 cm?3 after a treatment for three hours at 780° C. and subsequently for 16 hours at 1000° C., and a BMD density of at least 1·109 cm?3 after heating of the silicon wafer at a heating rate of 1 K/min from a start temperature of 500° C. to a target temperature of 1000° C. and subsequent holding at 1000° C. for 16 hours. The wafers are prepared by a method of irradiation of a heated wafer with flashlamp which delivers energy which is from 50 to 100% of the energy density necessary for melting the wafer surface.Type: GrantFiled: July 27, 2011Date of Patent: April 14, 2015Assignee: Siltronic AGInventors: Wilfried von Ammon, Gudrun Kissinger, Dawid Kot
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Publication number: 20150050609Abstract: An apparatus and method for debindering a cellular ceramic green body. The apparatus includes a flow modulation member to selectively restrict circulation of a heated oxygen-containing atmosphere through a top of a cellular core section of the green body. The method includes heating the green body in a circulating oxygen-containing atmosphere while selectively restricting circulation of the atmosphere through the top of the cellular core section of the green body.Type: ApplicationFiled: July 22, 2014Publication date: February 19, 2015Inventors: Douglas Munroe Beall, Dana Craig Bookbinder, David John Thompson, Jianguo Wang
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Publication number: 20150044619Abstract: A substrate carrier, including: a baffle having a continuous perimeter sidewall surrounding an enclosed region; and one or more standoffs attached to an inside surface of the perimeter sidewall, the one or more standoffs extending into the enclosed region and below a bottom edge of the perimeter sidewall, the one or more standoffs each having a lip located between an upper edge of the baffle and the lower edge of the baffle. Also, a method of annealing substrates using the substrate carrier.Type: ApplicationFiled: August 7, 2013Publication date: February 12, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John C. Hall, Jeffrey C. Maling, Charles F. Musante
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Patent number: 8944810Abstract: A method and apparatus for treating a selected region of a metal layer, used to form a metal card, by annealing the selected metal region so the selected region becomes soft and ductile, while the rest of the metal layer remains stiff. The softened, ductile, selected metal region can be embossed with reduced power and with reduced wear and tear on the embossing equipment. Alternatively, the annealed metal layer can undergo additional processing steps to form an assembly which can then be embossed. The method may include the use of a fixture for holding the metal layer, with the fixture having a window region for enabling heat to be applied to soften the region of the metal layer within the window region. The fixture includes apparatus for cooling the portion of the metal layer outside of the window region and for preventing the temperature of the metal layer outside the window region from rising above predetermined limits.Type: GrantFiled: January 21, 2011Date of Patent: February 3, 2015Assignee: Composecure, LLCInventor: John H. Herslow
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Publication number: 20150024330Abstract: Provided are an apparatus and a method for controlling the heating of the base within a chemical vapour deposition chamber, which apparatus is applicable to an MOCVD reaction chamber.Type: ApplicationFiled: March 21, 2013Publication date: January 22, 2015Applicant: Advanced Mirco-Fabrication Equipment Inc, ShanghaiInventors: Baoxia Tian, Steven Tianxiao Lee, Yingbin Liu, Quanyong Guo
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Publication number: 20150017593Abstract: A heat treatment method of an impeller includes a heat treatment preparation process of arranging the impeller within a vacuum furnace, an impeller covering process of covering an outer peripheral surface of the impeller in a circumferential direction by a heat uniformizing jig made of a radiation conversion material which radiates transferred heat as radiant heat, and a heat treatment process including a heating process and a cooling process in which heat treatment is performed by heating or cooling the impeller covered with the heat uniformizing jig from the periphery using a heater.Type: ApplicationFiled: February 15, 2013Publication date: January 15, 2015Inventors: Kazutoshi Yoko, Hiroko Kitamoto, Shimpei Okayasu, Hiroki Takagi
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Publication number: 20150010875Abstract: Several systems of thermally stable inorganic salts with low melting points are disclosed. These compositions include sodium, potassium, zinc, chloride, and sulfate and can have thermal stability limits greater than 700° C.Type: ApplicationFiled: January 31, 2013Publication date: January 8, 2015Inventors: Justin Raade, John Vaughn, Benjamin Elkin
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Patent number: 8915733Abstract: A method of heating a charge material by controlling heat flux in a tilt rotary furnace is disclosed. Combustion by the burner forms a heat release profile including a high heat flux region. The positioning of the high heat flux region is controllable by providing a controlled amount of secondary or staged oxidant. The burner is configured and controlled to position a region of high heat flux at a position corresponding to an area requiring greater heating, such as the area of maximum charge depth in the furnace to provide substantially uniform melting and heat distribution.Type: GrantFiled: November 11, 2010Date of Patent: December 23, 2014Assignee: Air Products and Chemicals, Inc.Inventors: Jin Cao, Xiaoyi He, Aleksandar Georgi Slavejkov
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Patent number: 8900384Abstract: In a method for heat treating a metal tube or pipe for a nuclear power plant, the tube or pipe being accommodated in a batch-type vacuum heat treatment furnace, when the tube or pipe is laid down on and is subjected to heat treatment on a plurality of metal cross beams arranged along a longitudinal direction of the tube or pipe, it is possible to suppress scratches to be formed on the outer surface of the tube or pipe and attributable to heat treatment, and to reduce the discoloration on the outer surface of the tube or pipe by holding the tube or pipe and the metal cross beams in indirect contact with each other by virtue of a heat resistant fabric having a thickness of 0.1 to 1.2 mm interposed in between.Type: GrantFiled: July 23, 2012Date of Patent: December 2, 2014Assignee: Nippon Steel & Sumitomo Metal CorporationInventors: Shoji Kinomura, Shinichi Takenaka
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Patent number: 8883901Abstract: The current invention relates to a process for stabilizing a hypophosphite salt, comprising the step of heating the hypophosphite salt at a temperature of between 150 and 370° C. during a sufficient period of time to prevent the formation of a dangerous quantity of phosphine in their application as FR in polymers and a flame retardant polymer composition comprising a polymer and 0.1 to 30 weight percent based on the total weight of the composition of the hypophosphite salt thermally stabilized by the above process.Type: GrantFiled: August 24, 2009Date of Patent: November 11, 2014Assignee: Solvay (China) Co., Ltd.Inventors: Floryan De Campo, Annelyse Murillo, Junli Li, Tingting Zhang
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Publication number: 20140323986Abstract: The present invention relates to a method of producing syringes. Said method comprises fixing a needle to a syringe body by use of an adhesive followed by subjecting the syringes thus obtained to heat treatment. The invention further relates to a method of reducing leachables and/or extractables in prefilled syringes, said method comprising heat treating pre-fabricated syringes at a temperature of at least 40° C. before filling.Type: ApplicationFiled: May 13, 2014Publication date: October 30, 2014Applicant: Hexal AGInventor: Peter Skufca
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Patent number: 8858740Abstract: In a method for heat treating a metal tube or pipe for a nuclear power plant, the tube or pipe being accommodated in a batch-type vacuum heat treatment furnace, when the tube or pipe is laid down on and is subjected to heat treatment on a plurality of metal cross beams arranged along a longitudinal direction of the tube or pipe, it is possible to suppress scratches to be formed on the outer surface of the tube or pipe and attributable to heat treatment, and to reduce the discoloration on the outer surface of the tube or pipe by holding the tube or pipe and the metal cross beams in indirect contact with each other by virtue of a heat resistant fabric having a thickness of 0.1 to 1.2 mm interposed in between.Type: GrantFiled: July 23, 2012Date of Patent: October 14, 2014Assignee: Nippon Steel & Sumitomo Metal CorporationInventors: Shoji Kinomura, Shinichi Takenaka
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Publication number: 20140295366Abstract: Preparation of an electrode-active material, which uses a reactor to produce an electrode-active material by using a supercritical hydrothermal synthesis method, and a double-pipe type heat exchanger which cools the product discharged from the reactor to a subcritical range or below it.Type: ApplicationFiled: December 10, 2012Publication date: October 2, 2014Applicant: HANWHA CHEMICAL CORPORATIONInventors: Kyu Ho Song, Sei Ung Park, Seong Jae Lim, Ki Taeg Jung, Kee Do Han
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Publication number: 20140287372Abstract: A post-heat-treatable substrate with a thermochromic film. The post-heat-treatable substrate includes a base substrate, a thermochromic film coating the base substrate, an auxiliary film formed on at least one of the upper surface and the lower surface of the thermochromic film, and a sacrificial film formed between the thermochromic film and the auxiliary film. The sacrificial film is made of metal. Accordingly, the thermochromic material is prevented from agglomerating during post-heat-treatment of the substrate. The auxiliary film prevents oxygen and nitrogen from diffusing into the thermochromic film, so that high-temperature heat treatment, such as a process for tempering the substrate, a process for heat-strengthening the substrate and a process for forming the substrate to become curved, can be conducted on the substrate.Type: ApplicationFiled: June 9, 2014Publication date: September 25, 2014Inventors: Youngsoo JUNG, Donggun MOON, Myungi SHIM, Sangryoun RYU
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Publication number: 20140273294Abstract: A system and method for forming a semiconductor device is provided. The system may measure characteristics of the substrate to determine an amount of induced stress on the substrate. The measured characteristics may include warpage, reflectivity and/or crack information about the substrate. The induced stress may be determined, at least in part, based on the measured characteristics. The system may compare the induced stress on the substrate to a maximum intrinsic strength of the substrate and adjust an anneal for the substrate based on the comparison. The adjustment may reduce or limit breakage of the substrate during the anneal. The system may control at least one of a peak anneal temperature and a maximum anneal duration for an anneal unit, which may perform an anneal on the substrate. The measurements and control may be performed ex-situ or in-situ with the anneal.Type: ApplicationFiled: May 13, 2013Publication date: September 18, 2014Applicant: Taiwan Semiconductor manufacturing Company, Ltd.Inventors: Chun Hsiung Tsai, Ming-Te Chen
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Publication number: 20140255858Abstract: A device to preheat a tape for sealing containing compartments with a sealing tape, operates intervening by heating and tensioning a sealing tape by means of a panel.Type: ApplicationFiled: October 4, 2012Publication date: September 11, 2014Applicant: I.M.A. INDUSTRIA MACCHINE AUTOMATICHE SPAInventor: Massimo Menzolini
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Publication number: 20140255794Abstract: A composite material includes a porous organic polymer and an electrochemically active material, wherein the porous organic polymer contains a plurality of pores having a diameter of from about 0.1 nm to about 100 nm, and the electrochemically active material is disposed within the pores.Type: ApplicationFiled: March 7, 2013Publication date: September 11, 2014Applicant: UCHICAGO ARGONNE LLCInventors: Zhengcheng Zhang, Wei Weng, Shengwen Yuan, Khalil Amine
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Publication number: 20140255638Abstract: An adhesive composition for bonding a wafer and a support for the wafer. The adhesive composition contains an elastomer in which a styrene unit is contained as a constituent unit of a main chain, a content of the styrene unit is 14% by weight to 50% by weight, and a weight average molecular weight of the styrene unit is 10,000 to 200,000.Type: ApplicationFiled: September 20, 2012Publication date: September 11, 2014Inventors: Hirofumi Imai, Toshiyuki Ogata, Atsushi Kubo, Takahiro Yoshioka
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Publication number: 20140242530Abstract: Substrate heat treatment apparatus and method are provided. According to an embodiment of the present invention, there is provided a substrate heat treatment apparatus including an inner shell configured to form a substrate housing space to house at least one substrate, an outer shell configured to cover the inner shell, and having at least one gas hole, and at least one heater configured to heat the substrate, wherein the at least one gas hole is configured to allow a first gas to be injected into a space between the inner shell and the outer shell.Type: ApplicationFiled: July 18, 2013Publication date: August 28, 2014Inventors: Sung Guk An, Jun Heo, Jong Hyun Yun, Kyoung Wan Park, Ho Young Kang, Byung Il Lee
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Publication number: 20140193760Abstract: A coated article, a process of coating an article, and a process of using an article are disclosed. The coated article includes a substrate, a porous coating material, and a thermal barrier coating material. The porous coating material includes a porosity between about 1 percent and about 20 percent, by volume. The thermal barrier coating material has a thermal conductivity that is lower than a thermal conductivity of the substrate. The porous coating material differs in one or both of composition and microstructure from the thermal barrier coating material. Additionally or alternatively, the porous coating material resists at least one of sintering, densification, and phase destabilization for a predetermined period at a predetermined temperature. The process of coating an article includes applying a coating to form the coated article.Type: ApplicationFiled: January 9, 2013Publication date: July 10, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Warren Arthur NELSON, Yuk-Chiu LAU, Tamara Jean RUSSELL, Joshua Lee MARGOLIES
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Publication number: 20140157596Abstract: A gage tool (700) for inspecting tolerances of a gas turbine engine seal plate (430) includes a base plate (710) arid a top plate (720). The base plate (710) includes abase opening (712) and a slot (711) with an annular shape sized to receive a seal plate (430). The top plate (720) Includes a top opening (723). The base opening (712) and top opening (723) each provide access to a portion of a seal plate (430) within the gage tool (700). The gage tool (700) also includes a first gage (750) with a probe tip for measuring a variation in an outer interlacing surface (433) of a seal plate (430) and a seal slide gage (740) for measuring a force required to rotate Ore seal plate (430) within the gage tool.Type: ApplicationFiled: December 12, 2012Publication date: June 12, 2014Applicant: SOLAR TURBINES INCORPORATEDInventors: James Brian Powell, Scott L. Stafford, Luvern John Weber, Terry Toshio Akiyama
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Publication number: 20140154425Abstract: Method for increasing the adhesive power of a pressure-sensitive adhesive layer having an upper and a lower surface, wherein at least one surface of the pressure-sensitive adhesive layer is subjected to a physical process, said physical process being selected from among the group comprising corona discharge, dielectric barrier discharge, preliminary flame treatment, or plasma treatment.Type: ApplicationFiled: May 4, 2012Publication date: June 5, 2014Applicant: TESA SEInventors: Hermann Neuhaus-Steinmetz, Uwe Schümann, Arne Koops, Thomas Schubert, Olga Kirpicenok, Kirstin Weiland, Dennis Perlbach, Sarah Reich
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Publication number: 20140120483Abstract: A method of thermal management includes positioning a first workpiece and a second workpiece in at least one tool having internal cavities, passing a fluid into at least one of the internal cavities to cool portions of the first and second workpieces, welding the first workpiece and the second workpiece in the at least one tool by resistance heating to form a joined workpiece, controlling a rate of cooling of the joined workpiece to slow a rate of cooling through at least one of a resistive heat element or welding electrode of the at least one tool.Type: ApplicationFiled: October 29, 2012Publication date: May 1, 2014Applicant: General Electric CompanyInventors: Timothy J. Trapp, Thomas Froats Broderick, Jeffrey Root, Greg Firestone
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Publication number: 20140087319Abstract: In a device for baking of clinker in a clinker, the heat generated in the furnace can be used in a particularly efficient and versatile manner if heat generated in the furnace is transferred, by means of a first heat exchanger, to a heat carrier fluid, the heated heat carrier fluid is transported through at least one line to at least one second heat exchanger, and the heat is then discharged to a heat sink, for example in order to heat a flow of flue gas to a temperature required for the dentitrifiaction thereof.Type: ApplicationFiled: November 26, 2013Publication date: March 27, 2014Applicant: Südbayerisches Portland-Zementwerk Gebr. Wiesböck & Co. GmbHInventor: Helmut Leibinger
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Publication number: 20140087320Abstract: A method of reheating a rail weld zone after rails were welded, a distance C between a reheating region P of a rail web portion 2 and a welding center Q is set to more than or equal to 0.2 times and less than or equal to three times a HAZ length Lh of the rail weld zone. A length B of the reheating region P may be more than or equal to 0.5 times and less than or equal to five times the HAZ length Lh of the rail weld zone. A height A of the reheating region P may be more than or equal to 0.2 times a height Hw of the rail web portion 2. A temperature Th reached in a reheating process at a center of the reheating region P may be higher than or equal to 400° C. and lower than or equal to 750° C.Type: ApplicationFiled: May 23, 2012Publication date: March 27, 2014Applicant: NIPPON STEEL AND SUMITOMO METAL CORPORATIONInventors: Kenichi Karimine, Masaharu Ueda, Katsuya Iwano, Hideo Tottori, Takeshi Yamamoto
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Publication number: 20140080080Abstract: A method for improving the chemical stability of a vapor transfer membrane includes providing a vapor transfer membrane including an ionomer layer having protogenic groups and then annealing the vapor transfer membrane at a temperature greater than about 100° C. Advantageously, the performance and durability of WVT membranes are markedly improved by thermally annealing the membranes.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Annette M. Brenner, Shawn M. Clapham, Lijun Zou, Timothy J. Fuller, Craig S. Gittleman
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Publication number: 20140045129Abstract: A system and a method are provided for melting solid sulfur and maintaining the resulting molten sulfur in liquid state. The system and the method may be fabricated, installed and operated at low capital costs, with high throughput rates at high operating efficiencies and low maintenance costs. Specific embodiments of the invention include modular and non-modular designs, which may be installed and operated with low to high degrees of automation, allowing the user to tailor the final configuration to meet specific requirements. The system of the invention comprises a specific configuration of a prescribed solid sulfur feed unit, a prescribed high-capacity melting unit, a compartmentalized pump tank assembly, and a heat exchanger located outside the high-capacity melting unit. The method provided follows the configuration of the system.Type: ApplicationFiled: July 22, 2013Publication date: February 13, 2014Applicant: CTI Consulting, LLCInventors: Roy Anthony Pickren, Roger Jacques Maduell, David Brian Singleton
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Publication number: 20140014421Abstract: A thermal management system is provided for a vehicle having an electric traction motor and a battery pack. The thermal management system includes a battery pack heater configured to transfer heat to the battery pack, a second thermal load heater configured to transfer heat to a second thermal load, and a control system. The second thermal load heater is selectively thermally connectable to the battery pack to transfer heat from the second thermal load heater to the battery pack. When the vehicle is connected to an external energy source and the battery pack is at sufficiently low temperature, the control system is configured to control the temperature of the battery pack by activating the second thermal load heater and thermally connecting the second thermal load heater to the battery pack in response to a failure of the battery pack heater.Type: ApplicationFiled: July 9, 2013Publication date: January 16, 2014Inventors: Neil Carpenter, Guangning Gao, Ibrahim Alkeilani
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Publication number: 20130340538Abstract: The invention provides a planar coil (1) of a tube (2), wherein the planar coil (1) has an overall planar shape. The cross-section of the tube (2) can be oval. The invention further provides a heating device comprising one or more of the planar coil (1). The invention further provides a method for heating a sample comprising the step of heating the sample in the heating device of the invention.Type: ApplicationFiled: March 6, 2012Publication date: December 26, 2013Inventors: Holger Eschment, Rudiger Stark
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Publication number: 20130316294Abstract: An apparatus for heating a substrate during die bonding is disclosed. The apparatus comprises: a substrate carrier configured to hold the substrate; a heating device configured to heat the substrate; a first actuator for effecting relative motion between the substrate carrier and the heating device such that the substrate is relatively indexed with respect to the heating device; a second actuator for effecting relative motion between the substrate carrier and the heating device such that the heating device contacts the substrate to heat different portions of the substrate. In particular, the second actuator is operative to separate the heating device from the substrate in order for the first actuator to relatively index the substrate across the heating device. A method of heating a substrate during die bonding is also disclosed.Type: ApplicationFiled: May 25, 2012Publication date: November 28, 2013Inventors: Ming Yeung Luke WAN, Chi Wai CHEUNG, Chin Tung SO
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Publication number: 20130316139Abstract: A method for manufacturing a silicon substrate, including: performing a rapid heat treatment to a silicon substrate with a rapid-heating and rapid-cooling apparatus by maintaining the silicon substrate at a temperature that is higher than 1300° C. and not greater than a silicon melting point for 1 to 60 seconds, the silicon substrate being sliced from a silicon single crystal ingot grown by the Czochralski method; performing a first temperature decrease process down to a temperature in the range of 600 to 800° C. at a temperature decrease rate of 5 to 150° C./sec; and performing a second temperature decrease process in such a mariner that a cooling time of X seconds and a temperature decrease rate of Y° C./sec meet Y?0.15X?4.5 when X<100 and meet Y?10 when X?100.Type: ApplicationFiled: February 2, 2012Publication date: November 28, 2013Applicant: SHIN-ETSU HANDOTAI CO., LTD.Inventors: Tetsuya Oka, Koji Ebara, Shuji Takahashi
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Publication number: 20130299491Abstract: The present invention includes methods for treating a laser-processed material that produces an odor due to the laser processing. The present method includes treating the laser-processed material with heat to dissipate the odor from the material. The method can also include a cooling step after heating of the laser-processed material. Multiple cycles of heating and cooling may also be performed to substantially reduce or eliminate the odor from the laser processed material. The invention also includes an article made according to the method and apparatus for laser processing with the produced article having substantially reduced odor.Type: ApplicationFiled: May 10, 2013Publication date: November 14, 2013Inventors: Daniel B. Miller, Brian Lindahl, Christopher Chow
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Publication number: 20130299492Abstract: The present invention includes methods for treating laser-processed materials having an odor generated during the laser processing. The present method includes treating the laser-processed materials with heat to dissipate the odor from the material. The laser processed material may be secured to avoid curling during the heating process. The method can also include a cooling step after heating of the laser-processed material. Multiple cycles of heating and cooling may also be performed to substantially reduce or eliminate the odor from the laser-processed material. The invention also includes articles made according to the method and apparatus for producing laser processed materials having substantially reduced odor.Type: ApplicationFiled: May 10, 2013Publication date: November 14, 2013Inventors: Daniel B. Miller, Brian Lindahl, Christopher Chow
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Patent number: 8573505Abstract: A method of heating an undercarriage of a machine featuring obtaining a thawing system with a hydraulic system functioning to heat hydraulic fluid and a first high pressure line and a second high pressure line each fluidly connected to the hydraulic system and each adapted to carry hydraulic fluid from the hydraulic system; operatively connecting the hydraulic system to a main engine of the machine; creating channels in the machine to allow passage of the first high pressure line and the second high pressure line from the hydraulic system to the undercarriage of the machine; and activating the system, wherein when the system is activated the hydraulic fluid is delivered to the undercarriage providing heat to the undercarriage for thawing purposes.Type: GrantFiled: April 1, 2010Date of Patent: November 5, 2013Inventor: Dana A. Hennessy
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Publication number: 20130273486Abstract: A layer furnace system for thermal treatment of metal components includes multiple heating levels which arranged on top of each other in vertical direction, and at least one heat source, wherein flat metal components, in particular metal sheets can be inserted into the heat levels and at last one heating level can be closed by a furnace door, wherein the furnace door is can be displaced in vertical direction for opening and closing the heat level located there behind. The present invention also relates to a method for operating the layer furnace system.Type: ApplicationFiled: April 15, 2013Publication date: October 17, 2013Applicant: Benteler Automobiltechnik, GmbHInventors: Borek Dvorak, Radovan Kout
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Publication number: 20130264023Abstract: A latent heat storage device is formed with a carrier substrate formed of expanded graphite material. Phase change material is infiltrated in the graphite material. A thin graphite sheet provides for the functional heat conductivity into and out of the carrier substrate. After the phase change material (PCM) is infiltrated in the carrier substrate, a density of the infiltrated carrier substrate exceeds its starting density by a ratio of at least 3:1 or 4:1 or more. The volume dimensions of the infiltrated the carrier substrate remain substantially unchanged. In the alternative, the latent heat storage device may also have a PCM coating layer on a thin carrier substrate, wherein the phase change material is interspersed in a carrier matrix forming the PCM coating layer. The composite device may be very thin.Type: ApplicationFiled: April 9, 2012Publication date: October 10, 2013Applicant: SGL CARBON SEInventors: BASTIAN HUDLER, RAINER SCHMITT, BRIAN FORD, WERNER LANGER, SYLVIA MECHEN
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Publication number: 20130260328Abstract: A controller of a heat treatment apparatus forms a phosphorous-doped polysilicon film (D-poly film) on a semiconductor wafer, and determines whether the D-poly film satisfies a target heat treatment characteristic. When it is determined that the target heat treatment characteristic is not satisfied, the controller calculates a temperature in a reaction tube and flow rates of process gas supply pipes, which satisfy the target heat treatment characteristic, based on a heat treatment characteristic of the D-poly film and a model indicating relationships between changes in the temperature in the reaction tube and the flow rates of the process gas supply pipes, and a change in a heat treatment characteristic. The controller forms the D-poly film on the semiconductor wafer according to heat treatment conditions including the calculated temperature and the calculated flow rates, so as to satisfy the target heat treatment characteristic.Type: ApplicationFiled: March 13, 2013Publication date: October 3, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Yuichi TAKENAGA, Daisuke KUDO
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Publication number: 20130244192Abstract: A magnetic sensor comprising a first shield and a second shield and a sensor stack between the first and the second shield, the sensor stack having a plurality of layers wherein at least one layer is annealed using in-situ rapid thermal annealing. In one implementation of the magnetic sensor a seed layer is annealed using in-situ rapid thermal annealing. Alternatively, one of a barrier layer, an AFM layer, and a cap layer is annealed using in-situ rapid thermal annealing.Type: ApplicationFiled: March 14, 2012Publication date: September 19, 2013Applicant: SEAGATE TECHNOLOGY LLCInventors: Qing He, Wonjoon Jung, Mark William Covington, Mark Thomas Kief, Yonghua Chen
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Patent number: 8529250Abstract: There is provided a system and method for heating at least one workpiece in a furnace by which the workpiece is heated by heating facilities. An exemplary method comprises heating a complete workpiece with the heating facilities. The exemplary method also comprises moving the workpiece out of the furnace such that a first portion of the workpiece is still inside the furnace while a second portion of the workpiece is outside the furnace and holding the workpiece at this position for a predetermined time period. Finally, the exemplary method comprises moving the complete workpiece out of the furnace.Type: GrantFiled: April 13, 2009Date of Patent: September 10, 2013Inventor: Rolf-Josef Schwartz
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Publication number: 20130230814Abstract: A substrate supporting assembly in a reaction space includes a heater, a substrate support member, and a shim positioned between the heater and the substrate support member. The shim may be removably secured between the heater and the substrate support member. The shim may further include an inner surface defining a perimeter of a gap. The gap may be further defined by a bottom surface of the substrate support member and a top surface of the heater. The substrate support member may further include a shoulder positioned radially outside of a substrate support position and wherein the shim inner surface is radially aligned with the substrate support member shoulder.Type: ApplicationFiled: March 2, 2012Publication date: September 5, 2013Applicant: ASM IP HOLDING B.V.Inventors: Todd Dunn, Carl White, Michael Halpin, Eric Shero, Jerry Winkler
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Publication number: 20130168387Abstract: A wood treatment method and apparatus that utilizes at least two carts for transporting bundles of wood into, out of, and between at least two wood treatment vessels. In certain situations, each of the carts can move along a dedicated path and can be located exterior to the vessels during treatment. As a result, the process can have a minimal cycle time, while maximizing throughput from the facility.Type: ApplicationFiled: November 29, 2012Publication date: July 4, 2013Applicant: Eastman Chemical CompanyInventor: Eastman Chemical Company
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Publication number: 20130171365Abstract: A wood treatment system that includes at least one wood treatment vessel and a bundle lift system for loading and unloading a bundle of wood from a cart used to transport the bundle into and/or out of the treatment vessel. The lift system vertically disengages the bundle of wood from the cart within the interior of the vessel, thereby allowing the cart to be removed from the vessel prior to initiating treatment. The lift system, which can be physically separate from or physically coupled to the cart, is entirely disposed within a lower portion of the interior volume of the wood treatment vessel.Type: ApplicationFiled: November 29, 2012Publication date: July 4, 2013Applicant: Eastman Chemical CompanyInventor: Eastman Chemical Company